433MHz ASK接收机射频前端电路设计

设计了一款应用在433MHz ASK接收机中的射频前端电路。在考虑了封装以及ESD保护电路的寄生效应的同时,从噪声、匹配、增益和线性度等方面详细讨论了低噪声放大器和下混频器的电路设计。采用0.18μm CMOS工艺,在1.8V的电源电压下射频前端电路消耗电流10.09 mA。主要的测试结果如下:低噪声放大器的噪声系数、增益、输入P1dB压缩点分别为1.35 dB、17.43 dB、-8.90dBm;下混频器的噪声系数、电压增益、输入P1dB压缩点分别为7.57dB、10.35dB、-4.83dBm。     

一种高线性度CMOS有源混频器的设计

设计了一个用于数字电视ZERO-IF结构接收机射频前端的CMOS下变频混频器。基于对有源混频器的噪声机制及线性度的物理理解,对传统的有源混频器电路采用电流注入技术,实现了增益,噪声和线性度折中。电路采用UMC0.18RFCMOS工艺实现,SSB噪声系数为18dB,1/f噪声拐角频率100kHz。电压转换增益为5dB和8dB两档增益,输入1dB压缩点为0dBm,IIP3为15dBm（5dB增益）,7dBm（8dB增益）。全差分电路在1.8V供电电压下的功耗不到7mW,可以满足数字电视零中频结构射频前端对高线性度、低闪烁噪声和可变增益的要求。     

一种新型超高频射频识别射频前端电路设计

设计了一种低功耗高线性度的新型超高频射频识别射频前端电路.在LNA的设计中,通过在输入端采用二阶交调电流注入结构以提高线性度,在输出端采用开关电容结构以实现工作频率可调;在混频器的设计中,在输入端采用同LNA相同的方法以提高线性度,而在输出端采用动态电流注入结构以降低噪声.该电路采用0.18μmCMOS工艺,供电电压为1.2V,仿真结果如下:输入阻抗S11为-23.98dB,IIP3为5.05dBm,整个射频前端电路的增益为10dB.     

一种低噪声高线性度射频前端电路设计

介绍了超高频接收系统射频前端电路的芯片设计。从噪声匹配、线性度、阻抗匹配以及增益等方面详细讨论了集成低噪声放大器和下变频混频器的设计。电路采用硅基0.8μm B iCM O S工艺实现,经过测试,射频前端的增益约为18 dB,双边带噪声系数2.5 dB,IIP 3为+5 dBm,5 V工作电压下的消耗电流仅为3.4 mA。     

2.4GHz带片上非平衡变压器射频前端的设计与优化

本文介绍了一种工作在2.4GHz频段的低功耗、低噪声、高线性射频接收机前端电路,该接收前端电路使用新型的带三种增益模式的LNA,并提出一种新的片上非平衡变压器优化技术。前端电路采用了直接变频结构,使用片上非平衡变压器实现低噪声放大器与下变频混频器之间的单端-差分转换,优化设计以提高前端电路的噪声性能。本文使用锗硅0.35um BiCMOS工艺,所采用的技术同样适用于CMOS工艺。前端电路总的最大转换增益为36dB;在高增益模式下的双边带噪声系数为3.8dB;低增益模式下,输入三阶交调点位12.5dBm。为了获得最大的输入动态范围,低噪声放大器采用三种可调增益模式,低增益模式使用by-pass结构,大大提高了大信号输入下接收前端的线性度。下变频混频器在输出端使用可调R-C tank,滤除带外高频杂波。混频器输出使用射极跟随器作为输出极驱动片外50ohm负载。该接收前端在2.85-V电源供电下,功耗为33mW,芯片面积为0.66mm2。     

一种用于软件无线电的接收机射频前端电路设计与实现

设计了一种用于软件无线电的射频前端电路,该电路可工作于短波、超短波频段（3～89MHz）。电路将天线接收的信号经过前端滤波、AGC、放大处理后,将输出信号稳定到2V,直接送给下级进行A/D采样及基带处理。设计的核心是宽带AGC电路,采用了一种级联VGA的形式,较大地提高了AGC电路的动态范围和线性范围。经过硬件实测,该接收电路灵敏度能够达到-90dBm,动态范围为70dB,并且具有线性度高、噪声系数小等特点。     

一个应用于卫星导航接收机的低功耗可配置双频多模射频前端

本文给出了一个应用于GPS、北斗、伽利略和Glonass四种卫星导航接收机的高性能双频多模射频前端。该射频前端主要包括有可配置的低噪声放大器、宽带有源单转双电路、高线性度的混频器和带隙基准电路。详细分析了寄生电容对源极电感负反馈低噪声放大器输入匹配的影响,通过在输入端使用两个不同的LC匹配网络和输出端使用开关电容的方法使低噪声放大器可以工作在1.2GHz和1.5GHz频带。同时使用混联的有源单转双电路在较大的带宽下仍能获得较好的平衡度。另外,混频器采用MGTR技术在低功耗的条件下来获得较高的线性度,并不恶化电路的其他性能。测试结果表明：在1227.6MHz和1557.42MHz频率下,噪声系数分别为2.1dB和2.0dB,增益分别为33.9dB和33.8dB,输入1dB压缩点分别0dBm和1dBm,在1.8V电源电压下功耗为16mW。     

应用于无线传感器网络低噪声放大器的设计

本文给出一种应用于无线传感器网络射频前端低噪声放大器的设计,采用SMIC0．18μmCMOS工艺模型。在CadenceSpectre仿真环境下的仿真结果表明：该低噪声放大器满足射频前端的系统要求,在2．45GHz的中心频率下增益可调,高增益时,噪声系数为2．9dB,输入P1dB压缩点为-19．8dBm,增益为20．5dB;中增益时,噪声系数为3．6dB,输入P1dB压缩点为-15．8dBm,增益为12．5dB;低增益时,噪声系数为6．0dB,输入P1dB压缩点为-16．4dB,增益为2．2dB。电路的输入输出匹配良好,在电源电压1．8V条件下,工作电流约为6mA。     

低噪声和高增益CMOS下变频混频器设计

设计并实现了一个用于GPS接收机射频前端的CMOS下变频混频器.基于对有源混频器的噪声机制的物理理解,电路中采用了噪声消除技术,以减少Gilbert型混频器中开关管的闪烁噪声,并引入一个额外的电感与开关对共源节点的寄生电容谐振,改善整个电路的噪声系数和转换增益等关键性能指标.电路采用TSMC 0.25 μm RF CMOS工艺实现,SSB噪声系数为7 dB,电压转换增益为10.4 dB,输入1 dB压缩点为-22 dBm,且输入阻抗匹配良好,输入反射系数为-17.8 dB.全差分电路在2.5 V供电电压下的功耗为10 mW,可满足GPS接收机射频前端对低噪声、高增益的要求.     

一款应用于GPS的CMOS低功耗高增益LNA

针对当前应用于GPS射频前端的LNA存在的不足,设计了一种新型的LNA.从电路结构、噪声匹配、线性度、阻抗匹配、电压增益以及功耗等方面详细讨论了该低噪声放大器的设计.电路采用CMOS 0.18μm工艺实现,经过测试,低噪声放大器的增益为40.8dB,噪声系数为0.525dB,PldB为-29.5dBm,1.8V电压下的消耗电流仅为1.4mA.电路性能充分满足应用要求.     

A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver

A low voltage CMOS RF front-end for IEEE 802.11b WLAN transceiver is presented. The problems to implement the low voltage design and the on-chip input/output impedance matching are considered, and some improved circuits are presented to overcome the problems. Especially, a single-end input, differential output double balanced mixer with an on-chip bias loop is analyzed in detail to show its advantages over other mixers. The transceiver RF front-end has been implemented in 0.18 um CMOS process, the measured results show that the Rx front-end achieves 5.23 dB noise figure, 12.7 dB power gain (50 ohm load), −18 dBm input 1 dB compression point (ICP) and −7 dBm IIP3, and the Tx front-end could output +2.1 dBm power into 50 ohm load with 23.8 dB power gain. The transceiver RF front-end draws 13.6 mA current from a supply voltage of 1.8 V in receive mode and 27.6 mA current in transmit mode. The transceiver RF front-end could satisfy the performance requirements of IEEE802.11b WLAN standard. Supported by the National Natural Science Foundation of China, No. 90407006 and No. 60475018.     

一种宽带接收射频前端设计与实现

本文设计了一种超外差架构的超宽带接收射频前端,工作频段覆盖400MHz~2000MHz,接收增益50dB,噪声系数小于6dB,中频输出频率70MHz,输出1dB压缩点大于18dBm,输出三阶交调节点大于30dBm,瞬时态范围大于55dB,测试结果和仿真结果基本一致,符合设计预期.     

A dual-band RF front-end for WCDMA and GSM applications

An RF front-end for dual-band dual-mode operation is presented. The front-end consumes 22.5 mW from a 1.8-V supply and is designed to be used in a direct-conversion WCDMA and GSM receiver. The front-end has been fabricated in a 0.35-μm BiCMOS process and, in both modes, can use the same devices in the signal path except the LNA input transistors. The front-end has a 27-dB gain control range, which is divided between the LNA and quadrature mixers. The measured double-sideband noise figure and voltage gain are 2.3 dB, 39.5 dB, for the GSM and 4.3 dB, 33 dB for the WCDMA, respectively. The linearity parameters IIP3 and IIP2 are -19 dBm, +35 dBm for the GSM and -14.5 dBm and +34 dBm for the WCDMA, respectively     

一种3.5 GHz频段双通道射频前端设计

随着5G商用网络的快速建设,国内5G网络测试设备存在大量空缺。为此,设计了一种适用于5G终端模拟器的3.5 GHz频段双通道射频前端。该射频前端结合了ADRV9009芯片,可同时支持双通道收发,具有器件数少、设计复杂度低的特点。实测结果表明,该射频前端性能稳定,接收灵敏度为-85 d Bm,噪声系数小于2.6 dB,256QAM调制下发射信号的误差矢量幅度为1.43%,达到了5G终端模拟器的设计要求。     

基于LTCC技术的WLAN射频前端的研制

采用低温共烧陶瓷(LTCC)集成技术,设计和制作了具有立体化新型结构的无线局域网(WLAN)射频前端,并对制得的产品模块进行了测试。结果表明:采用LTCC技术制得的WLAN射频前端的外形尺寸仅为29 mm×18 mm×5 mm,远小于传统同类型WLAN射频前端的尺寸。在2.4～2.5 GHz的工作频率范围内,所制WLAN射频前端的最大输出功率为27 dBm,噪声系数小于1.7 dB,接收增益大于15 dB,发射增益大于20 dB。     

A low noise CMOS RF front-end for UWB 6-9 GHz applications

An integrated fully differential ultra-wideband CMOS RF front-end for 6-9 GHz is presented.A resistive feedback low noise amplifier and a gain controllable IQ merged folded quadrature mixer are integrated as the RF front-end. The ESD protected chip is fabricated in a TSMC 0.13μm RF CMOS process and achieves a maximum voltage gain of 23-26 dB and a minimum voltage gain of 16-19 dB,an averaged total noise figure of 3.3-4.6 dB while operating in the high gain mode and an in-band IIP3 of-12.6 dBm while in th...     

A 1-GHz BiCMOS RF front-end IC

An RF front-end IC containing a low-noise amplifier and mixer is described. On-chip temperature and supply-voltage compensation is used to stabilize circuit performance. Realized in a BiCMOS process, the circuit consumes 13.0-mA total current from a 5-V supply. The amplifier gain at 900 MHz is 16 dB, the noise figure is 2.2 dB, and the input third-order intermodulation intercept is -10 dBm. The mixer input third-order intermodulation intercept is +6 dBm with 15.8 dB noise figure     

A Wideband CMOS RF Front-End Using AC-Coupled Current Mirrored Technique for Multiband Multistandard Mobile TV Tuners

In this paper, a wideband CMOS radio frequency (RF) front-end for various terrestrial mobile digital TV applications such as digital video broadcasting-handheld, terrestrial digital multimedia broadcasting, and integrated services digital broadcasting-terrestrial is proposed. To cover VHF III, UHF, and L bands and reduce the silicon area simultaneously, it employs three low-noise amplifiers and single-to-differential transconductors and shares the rest of the RF front-end. By applying ac-coupled current mirrored technique, the proposed RF front-end has good wideband performance, high linearity, and precise gain control. It is fabricated in 0.18 mum CMOS process and draws 15 mA~20 mA from a 1.8 V supply voltage for each band. It shows a gain of more than 29 dB, noise figure of lower than 2.5 dB, IIP2 of more than 30 dBm, IIP3 of more than -10 dBm for entire bands.     

应用于IEEE 802.11b无线局域网系统的2.4GHzCMOS单片收发机射频前端

实现了一个应用于IEEE 802.11b无线局域网系统的2.4GHz CMOS单片收发机射频前端,它的接收机和发射机都采用了性能优良的超外差结构.该射频前端由五个模块组成:低噪声放大器、下变频器、上变频器、末前级和LO缓冲器.除了下变频器的输出采用了开漏级输出外,各模块的输入、输出端都在片匹配到50Ω.该射频前端已经采用0.18μm CMOS工艺实现.当低噪声放大器和下变频器直接级联时,测量到的噪声系数约为5.2dB,功率增益为12.5dB,输入1dB压缩点约为-18dBm,输入三阶交调点约为-7dBm.当上变频器和末前级直接级联时,测量到的噪声系数约为12.4dB,功率增益约为23.8dB,输出1dB压缩点约为1.5dBm,输出三阶交调点约为16dBm.接收机射频前端和发射机射频前端都采用1.8V电源,消耗的电流分别为13.6和27.6mA.     

RF front-end of direct conversion receiver RFIC for cdma-2000

We report on the front-end of a highly integrated dual-band direct-conversion receiver IC for cdma-2000 mobile handset applications. The RF front-end included a CELL-band low-noise amplifier (LNA), dual-band direct-conversion quadrature I/Q down-converters, and a local-oscillator (LO) signal generation circuit. At 2.7 V, the LNA had a noise figure of 1.2 dB and input third-order intermodulation product (IIP3) of 9 dBm. I/Q down-converters had a noise figure of 4-5 dB and IIP3 of 4-5 dBm and IIP2 of 55 dBm. An on-chip phase-locked loop and external voltage-controlled oscillator generated the LO signal. The receiver RFIC was implemented in a 0.35-/spl mu/m SiGe BiCMOS process and meets or exceeds all cdma-2000 requirements when tested individually or on a handset.