基于ANSYS模拟的Bi_4Ti_3O_(12)铁电薄膜残余应力分析

用ANSYS软件对Bi4Ti3O12(BTO)薄膜退火过程中形成的热应力进行了模拟,并研究了BTO薄膜的厚度对热应力的影响。结果表明:BTO薄膜厚度为0.3μm时,薄膜经过退火之后产生的热应力为压应力。当薄膜从0.1μm逐渐变化为1μm时,薄膜表面的热应力从最大的压应力逐渐减小,当厚度为0.8μm时转变为拉应力,且随厚度的增加继续增加。     

新型Hg_3In_2Te_6芯片引线的键合机制

Hg3In2Te6(MIT)晶体是一种新型的短波红外光电探测材料,采用热压超声球焊的方法实现MIT红外探测器与外电路的引线连接,探讨MIT复合电极厚度及结构对键合率的影响规律,研究超声功率和键合压力对第一焊点的外观形貌和键合强度的影响机理。结果表明:在化学抛光后的MIT晶片表面蒸镀0.2μm In、1.0μm Au制备In/Au复合电极时,键合率显著提高,达到100%;MIT与In/Au复合电极间存在一定的互扩散,促进了键合过程的形成;超声功率与键合压力对焊点形貌和键合强度影响最大,当超声功率为0.45~0.55 W、键合压力为0.5~0.6 N时,焊球与引线的直径比约为3.5,焊点变形适中,有效键合面积较大,90%以上的断裂发生在引线位置,表明此种工艺参数下形成的键合强度高、可靠性好。     

基于铜铟微纳米层常温超声辅助瞬态固相键合技术

目的 采用针状形貌铜铟微纳米层和超声能量,在常温下实现键合互连,保证互连的可靠性,从而解决传统回流焊工艺因高温引发的高热应力、信号延迟加剧等问题。方法 将镀有铜铟微纳米层的基板表面作为键合偶,对键合接触区域施加超声能量和一定压力,实现2块铜铟基板的瞬态固相键合。用扫描电子显微镜、透射电子显微镜、X射线衍射(XRD)、焊接强度测试仪等分析键合界面处的显微组织、金属间化合物及剪切强度,并对键合界面进行热处理。结果 在超声作用和较小的压力下,铜铟微锥阵列结构相互插入,形成了稳定的物理阻挡结构。键合界面处的薄铟层在超声能量作用下,其原子快速扩散转变为金属间化合物Cu2In。Cu2In是一种优质相,具有良好的塑性,有利于提高互连强度。当键合界面铟层的厚度为250 nm,键合压力为7 MPa,键合时间为1 s时,获得了相对最佳的键合质量,同时键合界面孔洞消失。热处理实验结果表明,这种固相键合技术无需额外进行热处理,就能获得良好的键合强度。结论 铜铟微纳米针锥的特殊形貌及超声波能量的引入,使键合在室温条件下即可瞬间完成,键合质量良好,可以获得较小的键合尺寸。     

引线键合及键合材料

引线键合是集成电路第一级组装的主流技术，是电子器件迅速发展的一项关键技术。在引线键合前，需要从厚度为0．1～0．3mm的铜合金或镍合金带材上截取引线框架材料(外引线)，用热压法将高纯Si或Ge的半导体元件压在引线框架上所选好的位置，并用导电树脂如银浆料在引线框架表面涂上一层或在其局部镀上一层金；然后借助特殊的键合工具用金属丝将半导体元件(电路)与引线框架键合起来，键合后的电路进行保护性树脂封装。     

铂金丝超声键合正交试验及焊点质量评价

采用正交试验法对直径为20μm的铂金丝进行超声波键合试验,并通过三轴测量显微镜观察键合区域形貌和测量键合点根部高度.结果表明,在研究的4个参数中,键合时间、搜索高度和超声功率的影响都较大,而键合力的影响较小.通过正交试验法可以快速获得较优的键合参数,最佳工艺条件为:键合力0.013 N,键合功率0.325W(W为键合区宽度),键合时间30 ms,搜索高度0.2 mm.键合点质量可以通过测量键合点根部高度进行评价,当根部高度在4~10μm之间时,引线拉力均在0.03 N以上.而且,当键合区接近椭圆形,且当W≈2D(D为引线丝直径)时,引线拉力较高,当键合区形貌为矩形或有裂纹出现时,拉力则较小.     

变形量对铝硅镀层热冲压用钢组织和性能的影响

研究了不同轧制变形量条件下铝硅镀层热冲压用钢在热冲压淬火处理前后组织和力学性能的转变规律。结果表明,随着变形量的增加,试验钢镀层厚度逐渐减少,合金层发生破碎且程度逐渐加大,Al-Si镀层与基体接触面积增大。相同条件下热冲压淬火处理后,随着变形量的增加,镀层厚度逐渐减少,合金层重新连续分布于镀层和基板之间,且合金层厚度增加,基板中发现粗大的马氏体组织。未热处理试验钢拉伸强度、维氏硬度随着变形量增加而逐渐增加,但伸长率急剧减少,热冲压淬火处理后不同厚度试验钢均实现1500 MPa高强化,断裂伸长率随着变形量增加呈现逐渐降低的趋势。     

基于石墨烯阻挡层Cu-In微纳米层超声波键合技术

目的 采用松木状形貌铜铟微纳米层和超声能量，低温下实现键合互连，保证互连的可靠性，从而解决传统回流焊工艺高温引发高热应力、信号延迟加剧的问题。方法 将镀有松木状二级铜铟微纳米层的基板表面作为键合偶一端，另一端为无铅焊料。在键合偶之间加入单层共形石墨烯作为阻挡层，在低温下（温度120℃），对键合接触区域施加超声能量和一定压力便可实现铜铟基板与无铅焊料的瞬态固相键合。用扫描电子显微镜、透射电子显微镜、X射线衍射（XRD）、焊接强度测试仪等分析键合界面处的显微组织、金属间化合物，以及剪切强度，对键合界面进行老化处理。结果 铜微米层具有圆锥状凸起的表面结构，其上镀覆纳米铟层，形成的结构具有巨大的表面积。在超声作用、较小的压力，以及低温条件下，铜铟松木状阵列结构插入较软的锡基焊料中，形成稳定的物理阻挡结构，实现与周围填充挤入的无铅焊料，以进行焊接互连。键合压力过小或者超声时间过长，都会在键合界面处产生线性孔洞或者裂纹，这些孔洞或者裂纹无法通过热处理消失。结论 石墨烯阻挡层避免锡焊料与粗糙表面铜基板之间直接接触，防止脆性金属间化合物的过度生长。铜铟松木状阵列结构的特殊形貌及超声波能量引入，键合在瞬...     

引线尺寸对CPGA翼形引线焊点可靠性的影响

采用有限元法对陶瓷针型棚格阵列（CPGA）翼形引线焊点的应力分布进行了研究,发现在焊点最内侧底面处应力集中较大,是整个焊点最脆弱的部位,易发生破坏;分析了不同尺寸翼形引线与焊点最大应力之间的关系,得到了不同外观形状的翼形引线焊点在受交变热作用时焊点热应力的分布情况。结果表明,翼形引线厚度增加,焊点应力增大;翼形引线高度增加,焊点应力有一个最大值;翼形引线与陶瓷基板接触长度增加,焊点应力减小;翼形引线与焊盘接触长度增加,焊点应力有一个最小值。     

基于正态分布的GCr15轴承钢强化研磨残余应力场数值模拟

目的 探索强化研磨不同工艺参数下定点喷射对GCr15轴承钢残余应力场的影响规律。方法 采用图像处理技术分析了不同工艺参数下强化研磨定点喷射表面覆盖率的分布特征。采用二维正态分布函数描述强化研磨定点喷射下钢珠的分布特征,运用Python/Opencv确定了在不同工艺参数下有限元模型所需的钢珠数量,基于Abaqus/Python构建出强化研磨正态分布有限元模型。运用所建立的正态分布模型分析不同喷射速度、钢珠直径及覆盖率对残余应力场的影响。结果 当喷射速度从45 m/s增加到70 m/s时,表面残余压应力从-683.5 MPa增加到-902.4 MPa,最大残余压应力从-981.6 MPa增加到-1330.6 MPa,残余压力层厚度从89μm增加到151μm,最大残余压应力深度从30μm移动到70μm。当钢珠直径从0.4 mm增加到1.0 mm时,表面残余压应力先增大后减小,最大残余压应力从-1063.5MPa增加到-1240.7MPa,最大残余压应力深度从30μm增加到60μm,残余压应力层厚度从103μm增加到147μm,其中钢珠直径从0.8 mm增加到1.0mm,最大残余压应力保持不变...     

化学镀铜聚酰亚胺基板的导电性与电磁屏蔽效能分析

目的通过化学镀铜技术,在聚酰亚胺基板表面沉积电导率高且致密均匀的薄铜层。方法采用以硫酸铜为铜源的甲醛溶液体系,在预处理后的聚酰亚胺薄膜表面沉积铜层。通过原子力显微镜和接触角测试仪对预处理前后的聚酰亚胺基板表面粗糙度进行分析,通过扫描电子显微镜对铜层表面微观形貌进行观察,通过四探针测试仪和法兰同轴测试仪分别测试所制备铜层的方阻及屏蔽效能。结果聚酰亚胺基板与水的接触角由预处理前的38°减小至预处理后的27°,化学镀铜层微观形貌致密、均匀。方阻随镀层厚度增加而减小,具有优异的导电性。屏蔽效能测试表明,在100 k Hz~12 GHz时,镀铜聚酰亚胺基板最高屏蔽效能达到55 d B。结论通过简单基板预处理与控制镀铜时间,可以在聚酰亚胺基板上沉积综合性能优良的薄铜层,且屏蔽效能可达商用标准。     

What is the future of bonding wire? Will copper entirely replace gold?

Thermosonic ball bonding is a major interconnect process in microelectronics packaging and is positioned to remain one of the key process technologies available to package designers in the near future. However, the main wire material used in fine pitch (FP) and ultra-fine pitch (UFP) ball bonding is gold and with significant increases in gold price, gold ball bonding has become a more costly process that has a considerable economic effect on the assembly of packages used in consumer electronics. An alternative wire material to gold is copper, which is much cheaper and has several technical benefits including better electrical conductivity and has been widely used in discrete and power devices with wire diameters typically larger than 30μm in diameter for many years. However, copper wire behaves quite differently than gold due to its different physical properties, some of which are beneficial and others detrimental to bonding performance. In this article, we briefly review some of the advantages and difficulties with using copper wire advanced packaging and explain why copper cannot replace gold in many applications and why gold offers significant benefits.     

镀银的铜引线与PCB焊盘平行微隙焊时的界面行为

研究了平行微隙焊过程中镀银的铜引线分别与PCB板上的裸铜焊盘及镀锡铜焊盘的接头特性.结果表明,对于Ag/Cu接头,接头的界面处两侧的Cu向中间的Ag处扩散较多.对于Ag/Sn/Cu接头,由于界面处Sn的分布受两侧的Cu向中间的Ag处扩散的影响,造成了Sn在界面处顶部和底部含量较高,中间含量低的分布.虽然Sn膜很薄,但是Sn的局部熔化导致了引线周围裂纹的产生,对接头的强度影响很大.Ag/Sn/Cu接头的拉伸强度低于Ag/Cu接头.因此利用平行微隙焊将镀银引线焊接到PCB板上时,建议采用裸铜焊盘而尽量不要采用镀锡焊盘.     

Properties of welded joints made of Weldox 1100 steel

This study evaluated both the joint strength of copper wire on a copper substrate with tin plating and the joint reliability of copper wire bonding after heat treatment. The suitable tin thickness and bonding conditions, which are stage temperature, wire bonding power and bonding time, were chosen by the peel test after copper wire bonding. Tin thickness of 10 m showed a high bonding rate under the conditions of stage temperature 373 K, bonding power 500–700 mW and bonding time 30 50 ms. Before heat treatment, the peel strength of the copper wire on the copper substrate with tin plating conditions was weaker than that of gold wire on a gold substrate. After heat treatment for more than 70 h at 298 K, the peel strength of the copper wire became higher than that of the gold wire and twice as high as the initial bonding strength. The tin layer remained between the copper wire and copper substrate before heat treatment. When the samples were held at 298 K, tin reacted with copper and turned into a Cu–Sn intermetallic compound. Upon completion of this reaction at 298 K for over 70 h, the soft tin layer between the copper wire and copper substrate disappeared. Therefore, the peel strength of copper wire after heat treatment increased. These results were observed by scanning electron microscope images of the interface between the copper wire and copper substrate before and after heat treatment.     

Effect of coating material and lubricant on forming force and surface defects in wire drawing process

A pilot wire drawing machine as well as wire end-pointing roller was developed. Using these machines, a wire drawing test for four different coating materials and two different lubricants was performed as the reduction ratio increased from 10% to 30%. Materials used for a substrate in this study are plain carbon steel (AISI1045) and ultra low carbon bainite steel. To compute the friction coefficient between the coating layer of wire and the surface of die for a specific lubricant, a series of finite element analyses were carried out. SEM observations were also conducted to investigate the surface defects of wire deformed. Results show that the behavior of drawing force varies with the lubricant-type at the initial stage of drawing. The powder-typed lubricant with a large particle causes the retardation of full lubrication on the entire contact surface and the local delamination of coating layer on the wire surface. As the flow stress of a substrate increases, the delamination becomes severe.     

Temperature effect in thermosonic wire bonding

1 Introduction Currently, thermosonic wire bonding and flip chip bonding are the main electrical packaging types in first level IC chip manufacture domain. Wire bonding is simple and somewhat mature, and nowadays it holds 75% in all electrical packaging …     

Cratering on thermosonic copper wire ball bonding

Copper wire bonding offers several mechanical and electrical advantages as well as cost saving compared to its gold wire predecessor. Despite these benefits, silicon cratering, which completes the fracture and removal of bond pad underlayers, has been a major hurdle to overcome in copper wire bonding. Copper wire is harder than gold, and thus needs greater ultrasonic power and bond force to bond it onto metal pads such as aluminum. This paper reports a study on the influence of wire materials, bond pad hardness, and bonding-machine parameters (i.e., ultrasonic power and bond force) on silicon cratering phenomenon. Ultrasonic power and z-axis bond force were identified as the most critical bonding machine parameters in silicon cratering defects. A combination of greater bond force and lower ultrasonic power avoids silicon cratering and gives the desired effects. Results also show that a harder bond pad provides relatively good protection from silicon cratering.     

The a.c.-induced corrosion of copper neutrals

Electrochemical behaviour of tin-coated copper electrodes in a model soil environment was studied by means of electrochemical impedance spectroscopy (EIS), d.c. polarization, and long-term exposure testing. Comparison of EIS spectra, modelled as a simple R(RC) circuit, taken over a period of time at rest potential, with those taken under anodic and cathodic bias potentials, shows an increase in the electron transfer resistance under conditions of anodic bias or a.c. polarization. This indicates that the tin coating is passivated by the a.c. signal through oxide formation during the anodic half cycle. This observation is supported by rest potential measurements. Without an a.c. signal the potential of tin-coated wire stabilizes at a more negative potential than that of bare copper wire and provides cathodic protection to copper exposed through coating flaws. However, when an a.c. signal is added, the potential of the tincoated wire shifts to a more positive potential than that of the bare wire, passivating the tin coating and rendering it cathodic to the underlying copper. The large area of the tin cathode relative to the small area of exposed copper substrate leads to rapid pit initiation in the copper, resulting in premature failure of the cable in the soil environment.     

Effect of coating material and lubricant on forming force and surface defects in wire drawing process

A pilot wire drawing machine as well as wire end-pointing roller was developed. Using these machines, a wire drawing test for four different coating materials and two different lubricants was performed as the reduction ratio increased from 10% to 30%. Materials used for a substrate in this study are plain carbon steel (AISI1045) and ultra low carbon bainite steel. To compute the friction coefficient between the coating layer of wire and the surface of die for a specific lubricant, a series of finite element analyses were carried out. SEM observations were also conducted to investigate the surface defects of wire deformed. Results show that the behavior of drawing force varies with the lubricant-type at the initial stage of drawing. The powder-typed lubricant with a large particle causes the retardation of full lubrication on the entire contact surface and the local delamination of coating layer on the wire surface. As the flow stress of a substrate increases, the delamination becomes severe.     

A study of high-velocity combustion wire molybdenum coatings

In this paper, coatings manufactured using the high-velocity combustion wire (HVCW) spray process have been studied. Molybdenum coatings were prepared in this study, and wavelength dispersive x-ray analysis (WDX) investigations were carried out to ascertain the oxygen content of the coating and its distribution. The x-ray diffraction (XRD) analysis of the coating was also carried out to determine the phases present in the coating. Based on the above data, the authors explain the HVCW-sprayed molybdenum coating microstructure properties. These coatings were also sprayed using a modified aircap design. The parameters varied for the molybdenum coatings by HVCW and were (1) the distance of the substrate from the spray gun and (2) the wire feed rate of the gun. The wear test and coefficient of friction measurements were also carried out for the coatings. Air plasma spraying of Mo-25% NiCrBSi coatings was carried out, and these coatings were further checked for wear friction properties.     

基于数值模拟的铜铝接触线拉拔成形工艺优化

采用DEFORM-3D有限元分析软件对铜铝接触线拉拔加工过程进行三维数值模拟,得到拉拔过程中等效应力、等效应变及流动速度分布,分析了接触线复合界面产生缝隙的原因以及实际生产中接触线弯曲的原因。通过改变铜线坯断面形状,使铜铝接触线界面结合良好,调整铝侧定径带长度为2mm、铜侧定径带长度为5mm,使接触线保持平直,并分析了拉拔模角对拉拔加工工艺的影响。