石墨表面化学镀Cu对天然鳞片石墨/Al复合材料热物理性能的影响

对天然鳞片石墨（GF）进行化学镀Cu的表面处理,对化学镀Cu石墨（Cu-GF）和Al粉采用真空热压的工艺制备出镀Cu石墨/Al（Cu-GF/Al）复合材料。研究了Cu-GF/Al复合材料的微观结构和微观界面,同时也研究了Cu-GF对Cu-GF/Al复合材料热导率和抗弯性能的影响。结果表明,GF上的Cu层能抑制界面脆弱相Al₄C₃的产生,使Cu-GF/Al复合材料的抗弯性能有了显著提升。当Cu-GF体积分数从50%增加到70%时,Cu-GF/Al复合材料的抗弯强度也从104 MPa降低到74 MPa。当GF体积分数为70%时,Cu-GF/Al复合材料的热导率达到最高值为522 W/（m·K）。     

碳化硅颗粒增强石墨/铝复合材料的热物理性能

片层石墨/铝复合材料具有低密度、高热导率的优点,但力学性能较差,目前无法作为一种可商业化应用的电子封装材料。为了改善片层石墨/铝复合材料的热物理性能,采用真空热压法制备了碳化硅颗粒增强石墨/铝复合材料,研究了碳化硅的含量对复合材料热导率、热膨胀系数和抗弯强度的影响。结果表明,经过高频振荡工艺,碳化硅-石墨/铝复合材料中石墨的排列取向良好。添加碳化硅颗粒能明显降低复合材料的热膨胀系数,提高抗弯强度,略微降低热导率。随着碳化硅颗粒体积分数增加,碳化硅-石墨/铝复合材料内部会逐渐出现孔洞缺陷,相对密度下降。当碳化硅和石墨的体积分数分别为15vol%、50vol%时,碳化硅-石墨/铝复合材料具有最优热物理性能,此时x-y方向热导率为536 W/(m·K)、热膨胀系数为6.4×10^-6m/K,抗弯强度为102 MPa,是一种十分具有商业前景的电子封装材料。     

中间相碳微球/氰酸酯树脂复合材料的导电导热性能

选取M22、M15和M23三种不同粒径中间相碳微球（MCMBs）作为填料,分别以10vol%、25vol%、40vol%和50vol%体积分数填充氰酸酯树脂（CE）制备了MCMBs/CE复合材料,通过SEM、XRD、拉曼光谱仪、导热仪、体积电阻仪分析了不同粒径的MCMBs/CE复合材料的性能。结果表明:三种球形粉体都具有石墨化结构,其中M22粉体球形度最好、石墨化程度最高（I_D/I_G=0.23）、体积电阻率最小。三种MCMBs粉体制备的MCMBs/CE复合材料的吸水性、导热性和导电性均随填充量的增加而增大,冲击强度则先增大后减小。其中以M22在40vol%填充率下所得MCMBs/CE复合材料的综合性能最优,吸水率为0.45%,冲击强度为23.6 kJ/m2,热导率达1.28 W/（m·K）,体积电阻率达1.5 Ω·cm。      

石墨表面镀Si对石墨/Al复合材料热物理性能的影响

研究了石墨粒径及表面镀Si处理对石墨/Al复合材料热物理性能的影响。结果表明:在盐浴过程中石墨表面形成了SiC层,这不仅增强了石墨-Si/Al复合材料的界面结合力,而且抑制了Al4C3相的产生。随着石墨鳞片体积分数从50%增加到70%,复合材料X-Y方向的热导率从492 W/(m·K)增加到654 W/(m·K),而且体积分数为50%的镀Si石墨/Al复合材料抗弯强度达到了81 MPa,相比未镀覆的提高了53%,是理想的定向导热电子封装材料。随着石墨粒径从500μm减小到150μm,石墨-Si/Al复合材料X-Y面方向的热导率由654 W/(m·K)降低到445 W/(m·K),但Z方向的热导率和复合材料抗弯强度变化不明显。     

压力浸渗制备石墨/铝复合材料及其热学性能

采用压力浸渗法制备了石墨/铝复合材料,研究了不同体积分数鳞片石墨对复合材料热学性能和组织的影响。结果表明,加入石墨片明显提高复合材料水平热导率,同时降低复合材料热膨胀系数和密度。当复合材料中石墨体积分数从23.9%增加到73.4%,复合材料水平热导率从234 W/(m·K)提高到402 W/(m·K),同时热膨胀系数降低至5×10-6/K,兼顾高热导率和低热膨胀系数的特点。     

高定向石墨/铜复合材料的制备和热物理性能

为了制备出具有优良热物理性能的石墨/铜复合材料,采用流延法将天然鳞片石墨定向排列在铜箔表面,并使用真空热压法制备具有层状结构的高定向石墨/铜复合材料。使用XRD和SEM等表征方法分析样品的微观形貌和成分,结果表明,在高温的作用下,流延所使用的溶剂充分挥发,热压后石墨仍高定向排列在相邻的两层铜箔之间,并相互搭接;部分熔化的铜在压力作用下渗透到石墨层的孔隙处,铜层之间相互贯穿。这种结构使石墨/铜复合材料具有优良的热物理性能。当石墨体积分数为20vol%~70vol%时,石墨/铜复合材料在高导热平面内热导率高达402~743 W/(m·K),抗弯强度达到126~48 MPa。深入讨论了石墨/铜复合材料的热传导机制,并建立了导热预测模型。      

热压烧结制备SiC增强石墨复合材料及其性能

以天然鳞片石墨为起始原料,SiC颗粒为增强相,采用热压烧结工艺制备了SiC增强石墨复合材料。研究了SiC含量对SiC增强石墨复合材料微观结构、力学性能和摩擦性能的影响。结果表明:SiC颗粒均匀分布在石墨基体中,降低了基体中的孔隙率;随着SiC含量增加,SiC增强石墨复合材料的相对密度和弯曲强度相应增加,开孔率显著降低,当SiC含量达到40vol%时,SiC增强石墨复合材料中形成了SiC网络骨架结构,相对密度达到了94.2%,比商品高强纯石墨材料提高了11.8%,弯曲强度达到了146 MPa,比商品高强纯石墨材料提高了147%;基体石墨保持了层状结构;SiC含量低于40vol%时,SiC增强石墨复合材料的摩擦系数随SiC含量的增加轻微增加,与纯石墨材料的摩擦系数相当,具有良好的摩擦性能。     

石墨表面TiC涂层对高定向石墨/Cu复合材料热导率和抗弯强度的影响

以高温盐浴法对天然鳞片石墨粉体(GF)进行表面TiC镀层处理,然后采用真空热压烧结法制备TiCGF/Cu复合材料,研究了粉体表面涂层和GF体积分数对复合材料微观结构、热导率及抗弯强度的影响。系列测试结果表明:随着GF体积分数的降低以及粉体表面TiC镀层的形成,TiC-GF/Cu复合材料平行于GF片层方向的热导率有所降低,抗弯强度有所提升。其中在GF的体积分数占TiC-GF/Cu复合材料70%时,这种变化最为明显,平行于GF片层方向的TiC-GF/Cu复合材料热导率下降幅度最大,从676W/(m·K)下降到526 W/(m·K)。同时,TiC-GF/Cu复合材料的微观结构进一步说明,GF表面的TiC涂层对GF/Cu复合材料的断裂模型起着重要的作用。     

石墨鳞片-碳纤维协同增强铜基复合材料的制备与热物理性能

采用真空热压技术制备了石墨鳞片-碳纤维协同增强铜基复合材料,研究了碳纤维含量对复合材料的组织结构、抗弯强度与热导率的影响.结果表明,石墨鳞片-碳纤维/铜基复合材料界面结合良好;当碳纤维体积分数为0.5vol％～1.5vol％时,碳纤维能够均匀分散在基体中,并有效提升复合材料的抗弯强度.当碳纤维体积分数为1.5vol％时...     

微/纳B4C增强6061Al复合材料微观结构及力学性能

采用先进粉末冶金技术(放电等离子烧结+热挤压)制备了三种体积分数(3vol%、5vol%、7vol%)的微/纳B₄C增强6061Al复合材料,对不同制备阶段复合材料的微观组织(SEM、TEM、EBSD)进行观察分析,对复合材料的纳米压痕行为及拉伸性能进行测试。结果表明:烧结后B₄C颗粒在基体中呈“网状”分布;挤压变形后B₄C颗粒在基体实现弥散均匀分布。挤压变形后,纳米B₄C在晶内及晶界均有分布,纳米B₄C对位错的钉扎作用使得基体积累大量位错,提供驱动力并越过动态回复,使内部再结晶比例高达74%。当B₄C体积分数为3vol%时,挤压态B₄C/6061Al复合材料的抗拉强度、屈服强度及延伸率为219 MPa、88 MPa和22.5%,断裂形貌中呈现大量韧窝。      

热循环对片层石墨/铝复合材料的强度和热导率的影响

采用粉末冶金法制备片层石墨增强Al基复合材料(50vol%G_f/6061Al),G_f与Al基体结合紧密,界面处无裂纹、孔洞等缺陷。复合材料在?50~120℃温度范围内分别循环10次、50次、100次和200次,研究不同的循环次数对材料组织和性能的影响。结果表明,循环不同次数时材料的密度没有明显的变化,但随着循环次数的增加,在热应力的作用下G_f发生破裂,材料的强度和热导率均有所下降,当循环次数达到100次时,性能下降速度最快,与未循环样品相比,抗弯强度降低27.4%,热导率下降11.5%。进一步增加循环次数,破碎的G_f和开裂的界面可以有效缓解冷热循环导致的热应力,G_f破坏程度减缓,当循环次数为200次时,与未循环样品相比抗弯强度降低32%,热导率下降13.1%,性能降低趋于平缓。      

Highly thermal-conductive graphite flake/Cu composites prepared by sintering intermittently electroplated core-shell powders

Graphite flake/Cu composite has attracted tremendous attention as a promising heat sinks materials owing to its easy machinability and superior thermal properties. However, its preparation process still faces several technological limitations including complex, time-consuming and costly synthetic approaches. In this work, a facile and scalable intermittently electroplated method is applied to prepare Cu-coated graphite flake composite powders, which are subsequently sintered into dense composite bulks. The results show that the graphite flake is successfully coated with a uniform and compact Cu shell,which effectively inhibits the segregation accumulation of graphite flakes and contributes to homogeneous distribution of graphite in the sintered graphite flake/Cu composites. The as-sintered composites exhibit an excellent thermal conductivity of 710 W·m-1·K-1and an outstanding bending strength of 93 MPa. Such performance, together with the simple, efficient powder-preparation process, suggests that the present strategy may open up opportunities for the development of thermal management materials.     

Preparation and mechanical properties of Al2O3 reinforced by submicrometer Co particles

Al2O3/Co composites were fabricated by vacuum hot-pressing a mixture of -Al2O3 powder and a fine cobalt powder. Submicron-sized cobalt particles were uniformly dispersed into the Al2O3 matrix, and the dispersed type was a more inter-/intragranular one with increases of cobalt content up to 40 wt% Co addition. The growth of cobalt particles occurred with increasing cobalt content. At 50 wt% Co addition, however, the growth as well as coalescence of cobalt particles occurred. The phases formed in the Al2O3/Co composites were f-Co(fcc), h-Co(hcp), -Al2O3, and a small amount of graphite. Significant improvements in bending strength (from 341 to 771 MPa) and fracture toughness (from 3.7 to 6.7 MPam1/2) of the Al2O3/40 wt% Co(23 vol% Co) composite compared to monolithic Al2O3 were achieved by dispersing submicron-sized Co particles into the Al2O3 matrix. The improvement in bending strength was attributed to the compressive thermal residual stress in the matrix Al2O3 induced by the mismatch of the coefficients of thermal expansion (CTE) between the matrix Al2O3 grains and cobalt particles during cooling from hot-pressing temperature. The fracture toughness of the composite was enhanced by crack bridging, crack deflection, and compressive thermal residual stress.     

热压与放电等离子体烧结两种工艺制备Al2O3/Cu复合材料

由机械合金化法(MA)制得纳米级Al₂O₃颗粒弥散镶嵌于微米级Cu颗粒表面的复合粉末, 利用球形化工艺改善所制得复合粉的形貌及粒度范围, 分别采用热压法(HP)和放电等离子体烧结(SPS)法制备Al₂O₃/Cu复合材料。通过测试密度、 电导率、 抗弯强度及SEM复合粉形貌和烧结体断口分析、 微区成分分析, 对比研究了Al₂O₃质量分数分别为0%、 0.5%、 1.0%、 1.5%时Al₂O₃/Cu复合材料的物理、 力学和电学性能。结果表明: 不同制备工艺下随着Al₂O₃含量增加, 材料的抗弯强度先增后降, 电导率除受杂质影响外, 还受材料缺陷的影响, 故变化规律不明显, 对于Al₂O₃含量相同的Al₂O₃/Cu复合材料, 采用SPS法制备的复合材料的致密度、 抗弯强度及电导率均高于HP法; 在弯曲应力下两种制备方法所得复合材料均发生延性断裂。      

High thermal conductivity of flexible polymer composites due to synergistic effect of multilayer graphene flakes and graphene foam

Research on flexible thermal interface materials (TIMs) has shown that the interconnected network of graphene foam (GF) offers effective paths of heat transportation. In this work, a variant amount of multilayer graphene flakes (MGFs) was added into 0.2 vol% GF/polydimethylsiloxane (PDMS) composite. A remarkable synergistic effect between MGF and GF in improving thermal conductivity of polymer composites is achieved. With 2.7 vol% MGFs, the thermal conductivity of MGF/GF/PDMS composite reaches 1.08 W m⁻¹ K⁻¹, which is 80%, 184% and 440% higher than that of 2.7 vol% MGF/PDMS, GF/PDMS composites and pure PDMS, respectively. The MGF/GF/PDMS composite also shows superior thermal stability. The addition of MGFs and GF decreases slightly the elongation at break, but observably increases the Young’s modulus and tensile strength of composites compared with pure PDMS. The good performance of MGF/GF/PDMS composite makes it a good TIM for possible application in thermal management of electronics.     

A comparative study of the coated filler method and the admixture method of powder metallurgy for making metal–matrix composites

Copper–matrix composites were made by powder metallurgy (PM). The reinforcements were molybdenum particles, silicon carbide whiskers and titanium diboride platelets. The coated filler method, which involves a reinforcement coated with the matrix metal, was used. In contrast, conventional PM uses the admixture method, which involves a mixture of matrix powder and reinforcement. For all the composite systems, the coated filler method was found to be superior to the admixture method in providing composites with lower porosity, greater hardness, higher compressive yield strength, lower coefficient of thermal expansion (CTE), higher thermal conductivity and lower electrical resistivity, though the degree of superiority was greater for high than low reinforcement contents. In the coated filler method, the coating on the reinforcement separated reinforcement units from one another and provided a cleaner interface and stronger bond between reinforcement and matrix than the admixture method could provide. The highest reinforcement content attained in dense composites (<5% porosity) made by the coated filler method was 70 vol% Mo, 60 vol% TiB2 and 54 vol% SiC. The critical reinforcement volume fraction above which the porosity of composites made by the admixture method increases abruptly is 60% Mo, 42% TiB2 and 33% SiC. This fraction increases with decreasing aspect ratio of the reinforcement. Among Cu/Mo, Cu/TiB2 and Cu/SiC at the same reinforcement volume fraction (50%), Cu/Mo gave the lowest CTE, highest thermal conductivity and lowest electrical resistivity, while Cu/SiC gave the greatest hardness and Cu/TiB2 and Cu/SiC gave the highest compressive yield strength. Compared to Cu/SiC, Cu/TiB2 exhibited much higher thermal conductivity and much lower electrical resistivity. This revised version was published online in November 2006 with corrections to the Cover Date.     

Cu/Ti3SiC2 composite: a new electrofriction material

 Cu/Ti₃SiC₂ composite, a new electrofriction material, was prepared, for the first time, by PM method. The microstructure, mechanical and electrical properties of the Cu/Ti₃SiC₂ composites were investigated and were compared with those of Cu/graphite composites. The results demonstrated that Cu/Ti₃SiC₂ composites had superior mechanical properties over Cu/graphite composites. At filer content of less than 20 vol%, the electrical conductivity for Cu/Ti₃SiC₂ composites was higher than that for Cu/graphite composites; at high filer content, the electrical conductivity for Cu/Ti₃SiC₂ composites was lower than that for Cu/graphite composites because of the presence of residual pores. It was found that like Cu/graphite composite, Cu/Ti₃SiC₂ was a self-lubricated material. The compressive yield strength, Brinell hardness, relative ratio of compressive for Cu-30 vol% Ti₃SiC₂ composites are 307 MPa, 140, 15.7% respectively. Received: 29 December 1998/Accepted: 15 February 1999