共查询到19条相似文献,搜索用时 156 毫秒
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采用微电子平面工艺,用宽禁带半导体n-4H-SiC和金属Au(或Ni)形成肖特基接触,Ti、Ni、Ag合金在背底作欧姆接触,制备出Au/n-4H-SiC和Ni/n-4H-SiC肖特基紫外光电探测器.测试分析了这两种器件的光谱响应特性及其I-V特性.其光谱响应范围均是200~400 nm,室温无偏压下,Au/n-4H-SiC的光谱响应峰值在310 nm,光谱响应半宽是73 nm,室温7 V偏压下光谱响应峰值86.72 mA/W,量子效率可达37.15%,Ni/n-4H-SiC相应的参数分别为300 nm、83 nm、45.84 mA/W及18.98%.Au/n-4H-SiC室温下正向开启电压0.81 V,Ni/n-4H-SiC是0.52 V,两者反向击穿电压均大于200 V,反向漏电流小于1×10-10 A. 相似文献
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采用Ni/Au作为肖特基接触制备了一维阵列MSM 4H-SiC紫外光电探测器,并测量和分析了阵列器件的Ⅰ-Ⅴ、光谱响应特性.结果表明,阵列探测器性能均匀性好,击穿电压均高于100V.阵列中单器件暗电流小,在偏压为20V的时候,最大暗电流均小于5pA(电流密度为5nA/cm2),光电流比暗电流高3个数量级以上.其光谱响应表明,单器件在电压为20V时的响应度约为0.09A/W,比400nm时的比值均大5000倍,说明探测器具有良好的紫外可见比. 相似文献
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采用Ni/Au作为肖特基接触制备了一维阵列MSM 4H-SiC紫外光电探测器,并测量和分析了阵列器件的Ⅰ-Ⅴ、光谱响应特性.结果表明,阵列探测器性能均匀性好,击穿电压均高于100V.阵列中单器件暗电流小,在偏压为20V的时候,最大暗电流均小于5pA(电流密度为5nA/cm2),光电流比暗电流高3个数量级以上.其光谱响应表明,单器件在电压为20V时的响应度约为0.09A/W,比400nm时的比值均大5000倍,说明探测器具有良好的紫外可见比. 相似文献
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采用微电子平面工艺,高真空电子束蒸发金属Au做肖特基接触,多层金属Ni、Ti、Ag合金在背底上做欧姆接触,制作出Au/n-4H-SiC肖特基势垒紫外光电二极管(UV-SBD).测试并分析了在不同温度下该器件的I-V特性及光谱响应特性.实验表明:器件高温下有较低的反向漏电流,正向开启电压下降速度为-1.2 mV/℃;波长响应范围为200~400 nm,在23℃和260℃时,光谱响应峰值分别出现在320 nm和330 nm,每100℃波长红移约4 nm;响应灵敏度随温度升高而降低,平均每100℃降低2倍. 相似文献
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Al0.3Ga0.7N MSM紫外探测器研究 总被引:1,自引:0,他引:1
用MOCVD生长的未掺杂的n-Al0.3Ga0.7N制备了MSM结构紫外探测器.器件在5.3 V偏压时暗电流为1 nA,在315nm波长处有陡峭的截止边,在1 V偏压下305 nm峰值波长处探测器的电流响应率为0.023 A/W,要进一步提高器件的响应率,方法之一是优化器件的结构参数,尽量减小叉指电极的宽度.为了检验Au/n-Al0.3Ga0.7N肖特基接触特性,电击穿MSM右边结,由正向I-V特性曲线计算出理想因子n~1.05,零偏势垒高度φB0~1.16eV,表明形成的Au/n-Al0.3Ga0.7N肖特基结较为理想. 相似文献
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金属-半导体-金属(MSM)结构4H-SiC紫外光电探测器的研制 总被引:5,自引:2,他引:3
MSM结构探测器具有结构与工艺简单、制备成本低、量子效率高等特点而在探测器应用中得到重视。本文制备了采用镍作为肖特基接触形成的MSM4H—SiC紫外光电探测器,并测量和分析了在不同的偏压下其光电特性。结果表明,该探测器的暗电流非常小,在偏压为15V的时候,漏电流密度约为70nA/cm^2,光电流比暗电流高约2个数量级,其光谱响应表明,其最高光谱响应与380nm的比值约为1000倍,说明该探测器具有良好的紫外可见比。 相似文献
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高响应度GaN肖特基势垒紫外探测器的性能与分析 总被引:1,自引:1,他引:1
制作了反向饱和电流为5.5×10-14 A/cm2,势垒高度为1.18eV的GaN肖特基势垒紫外探测器.测量了探测器分别在零偏压及反向偏压下的光谱响应度,响应度随反向偏压无显著变化,零偏压下峰值响应度在波长358.2nm处达到了0.214A/W.利用波长359nm光束横向扫描探测器的光敏面,测量了探测器在不同偏压下的空间响应均匀性,相应偏压下的光响应在光敏面中央范围内响应幅值变化不超过0.6%.光子能量在禁带边沿附近的光束照射下,GaN肖特基势垒紫外探测器存在势垒高度显著降低现象,这种现象在肖特基透明电极边沿及其压焊电极附近表现得更为突出.探测器在368和810nm波长光一起照射时的开路电压比只有368nm光照射时的开路电压大,而零偏压下两者的光电流近似相等.利用这种开路电压变化效应估算了探测器在368nm光照射下,表面被俘获空穴的面密度变化量约为8.4×1010 cm-2. 相似文献
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采用电子束蒸发法在4H-SiC表面制备了Ti/Au肖特基电极,研究了退火温度对Au/Ti/4H-SiC肖特基接触电学特性的影响.对比分析了不同退火温度下样品的电流密度-电压(J-V)和电容-电压(C-V)特性曲线,实验结果表明退火温度为500℃时Au/Ti/4H-SiC肖特基势垒高度最大,在.J-V测试和C-V测试中分别达到0.933 eV和1.447 eV,且获得理想因子最小值为1.053,反向泄漏电流密度也实现了最小值1.97×10-8 A/cm2,击穿电压达到最大值660 V.对退火温度为500℃的Au/Ti/4H-SiC样品进行J-V变温测试.测试结果表明,随着测试温度的升高,肖特基势垒高度不断升高而理想因子不断减小,说明肖特基接触界面仍然存在缺陷或者横向不均匀性,高温下的测试进一步证明肖特基接触界面还有很大的改善空间. 相似文献
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在n型4H-SiC单晶导电衬底上制备了具有MPS(merged p-i-n Schottky diode)结构和JTE(junction termination extension)结构的肖特基势垒二极管。通过高温离子注入及相应的退火工艺,进行了区域性p型掺杂,形成了高真空电子束蒸发Ni/Pt/Au复合金属制备肖特基接触,衬底溅射Ti W/Au并合金做欧姆接触,采用场板和JTE技术减小高压电场集边效应。该器件具有良好的正向整流特性和较高的反向击穿电压。反向击穿电压可以达到1300V,开启电压约为0.7V,理想因子为1.15,肖特基势垒高度为0.93eV,正向电压3.0V时,电流密度可以达到700A/cm2。 相似文献
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报道了4H-SiC混合PN/Schottky二极管的设计、制备和特性.该器件用镍作为肖特基接触金属,使用了结终端扩展(JTE)技术.在肖特基接触下的n型漂移区采用多能量注入的方法形成P区而组成面对面的PN结,这些PN结将肖特基接触屏蔽在高场之外,离子注入的退化是在1500℃下进行了30min.器件可耐压600V,在600V时的最小反向漏电流为1×10-3A/cm2.1000μm的大器件在正向电压为3V时电流密度为200A/cm2,而300μm的小尺寸器件在正向电压为3.5V电流密度可达1000A/cm2. 相似文献
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Edge-terminated high-voltage Ti/4H-SiC Schottky rectifiers were successfully fabricated by using highly resistive layers at the periphery of Schottky contacts. The highly resistive layers were formed by B+ implantation followed by a heat treatment to improve the crystallinity of implanted layers. Utilizing these layers for the edge termination of 4H-SiC Schottky rectifiers, the reverse blocking characteristics were significantly improved in comparison with the rectifiers without edge termination, and a high-blocking voltage over 1100 V (the maximum: 1750 V) was achieved. The temperature dependence of the reverse-blocking characteristics was investigated, and high temperature operation even at 150°C was demonstrated with a blocking voltage over 1100 V 相似文献
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High performance of high-voltage 4H-SiC Schottky barrier diodes 总被引:1,自引:0,他引:1
High performance of high-voltage rectifiers could be realized utilizing 4H-SiC Schottky barrier diodes. A typical specific on-resistance (Ron) of these devices was 1.4×103 Ω cm3 at 24°C (room temperature) with breakdown voltages as high as 800 V. These devices based on 4H-SiC had R on's lower than 6H-SiC based high-power rectifiers with the same breakdown voltage. As for Schottky contact metals, Au, Ni, and Ti were employed in this study. The barrier heights of these metals for 4H-SiC were determined by the analysis of current-voltage characteristics, and the reduction of power loss could be achieved by controlling the barrier heights 相似文献
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The novel characteristics of a new Schottky rectifier structure, known as the lateral merged double Schottky (LMDS) rectifier, on 4H-SiC are explored theoretically and compared with those of the compatible conventional 4H-SiC Schottky rectifiers. The anode of the proposed lateral device utilizes the trenches filled with a high barrier Schottky (HBS) metal to pinch off a low barrier Schottky (LBS) contact during reverse bids. Numerical simulation of any such SiC structure is complicated by the fact that the thermionic emission theory predicts the reverse leakage current to be orders of magnitude smaller than the measured data. We, therefore, first propose a simple empirical model for barrier height lowering to accurately estimate the reverse leakage current in a SiC Schottky contact. The accuracy of the empirical model is verified by comparing the simulated reverse leakage current with the reported experimental results on different SiC Schottky structures. Using the proposed empirical model, the two-dimensional (2-D) numerical simulations reveal that the new LMDS rectifier demonstrates about three orders of magnitude reduction in the reverse leakage current and two times higher reverse breakdown voltage when compared to the conventional lateral low barrier Schottky (LLBS) rectifier while keeping the forward voltage drop comparable to that of the conventional LLBS rectifier 相似文献
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采用磁控溅射的方法在4H-SiC样品上分别沉积四种金属薄膜(Ag,Cu,Ni,Cr)形成Schottky接触,研究了不同温度退火对Schottky势垒高度的影响.通过对样品的I-V测试结果的拟合,得到各金属/4H-SiC Schottky接触的势垒高度以及理想因子.在反向偏压100V下,样品的反向漏电流小于10-10A,说明样品的反向特性良好.样品经过不同温度的退火后,发现Cu、Ni与4H-SiC的势垒高度(SBH)随退火温度的升高而提高,超过某一温度,其整流特性变差;Ag、Cr的SBH在退火后降低.SBH与金属功函数呈线性关系(Cr金属除外),斜率为0.11. 相似文献
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The influence of high temperature (up to 800C) annealing on the current-voltage characteristics of n-type 6H-SiC Schottky
diodes is presented. Our experimental results indicate that high-temperature annealing can result in the improvement of the
forw ard and reverse electrical characteristics of SiC Schottky diodes by repairing any leaky low barrier secondary diode
parallel to the primary diode that may be present due to the barrier inhomogeneities at the Schottky contact interface. 相似文献