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研究了加石墨片导热层的层压封装COB LED光源的热性能和水下环境运行的可靠性。采用COB技术制备了COB LED光源,并在COB LED光源和平面铝基板散热器之间加石墨片进行真空层压封装,然后对层压封装的COB LED光源模组进行了光谱和热性能实验。在900 mA恒流驱动条件下,测得COB LED光源的电压温度系数为-0.3 mV/K;对石墨片导热层层压封装的COB LED光源模组和未加石墨片的模组在水温25℃水环境下进行了运行对比实验,结果发现运行结温分别为49.28℃和63.67℃。实验结果表明,层压封装COB LED光源用石墨片导热层能有效降低运行结温,并适合在常温水下照明应用。 相似文献
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针对当前视觉检测系统LED光源照度优化研究中存在的照度效果评价因素单一、照度优化方法通用性不足等问题,以芯片封装质量视觉检测为例,提出一种基于改进樽海鞘算法的LED光源照度优化方法。该方法在单个LED光源照度数学模型基础上,建立标准条形LED阵列光源照度数学模型,获取条形LED阵列在任意空间位姿与被测面的照度值;基于照度均匀度、照度梯度变化与对中度、平均照度、目标与背景区分度等因素建立平面照度效果评价函数;提出改进樽海鞘算法,通过改进算法收敛系数、速度、领导者与追随者位置等更新策略,增强区域搜索的多样性;应用改进樽海鞘算法对平面照度效果评价函数进行优化求解,获取具有最优照度效果的空间位姿参数。实验结果表明:考察优化区域的相对照度分布,文中提出的LED光源照度优化方法所得照度分布与实际测量所得照度分布结果基本一致,目标区域理论照度均匀度在98.78%以上,误差在5.57%以内。因此文中提出方法优化目标合理,可用于视觉检测系统具有最优照度效果时光源位姿信息参数的获取。 相似文献
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阐述了多芯板上芯片(CoB)封装结构,构建了多芯片LED封装模型,将88颗单电极小功率LED芯片直接封装在直径为65 mm的圆形镀铝陶瓷基板上,研制成了一种基于CoB封装技术的自检测LED模组,并使用高低温实验箱对11组样品进行了可靠性试验。高低温实验箱温度设定为85℃,试验周期为1 000 h。试验结果表明:随时间变化多芯片模组的光通量呈下降变化趋势,衰减比例平均变化4.64%,幅度较小,失效数为0;正向电压有上升也有下降,表明该模组具有较高的光转换率,散热性较好,衰减值为-0.25%;相关色温(CCT)在69~205 K内下降,变化比例2.58%。该多芯片LED模组可实现故障芯片自检测,其稳定性和可靠性满足照明灯具指标要求。 相似文献
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以COB形式封装的白光LED平面光源为研究对象,系统研究了平面封装结构中荧光层对白光LED平面光源发光特性的影响.采用丝网印刷法制备了不同浓度与印刷层数的荧光层,并采用平面封装的LED蓝光光源作为激发光源,以类比法研究分析了不同发光层膜厚对白光平面光源平均照度、色坐标和光通量等参数的影响,系统地阐述了发光层对平面光源发光性能的决定因素及工艺优化条件.结果表明,当荧光粉浆料浓度为46%~53.6%,厚度为20~38 μm时,结合平面蓝光LED激发可以获得照度大、颜色纯正的白光LED光源,且白光LED平面光源具有较高的光通量值,表现出优良的光学特性. 相似文献
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1平价LED照明灯的设计思考以平价LED球泡灯为例,系统组成如图1所示。由LED光源模组、恒流驱动电源和灯头、外壳、散热器、灯罩组成。LED日光灯的整体构成也基本如此。如何选择每一个零部件是设计此平价LED照明灯具成败的关键。LED光源选用以光效高、发热低、散热好、性价比好为准则;恒流驱动电源选用以采用原边控制(PSR)隔离电路、周边零件少、功率因数较高、效率较高、性价比好的为准则。1.1LED光源模组的选择LED光源模组(或称LED光源模块),常见的是COB封装,最近发展的有COF、LEDs,LEDs是高压LED的模组(HVLEDs)。 相似文献
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A new type application specific light emitting diode(LED) package(ASLP) with freeform polycarbonate lens for street lighting is developed,whose manufacturing processes are compatible with a typical LED packaging process.The reliability test methods and failure criterions from different vendors are reviewed and compared.It is found that test methods and failure criterions are quite different.The rapid reliability assessment standards are urgently needed for the LED industry.85℃/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h,showing no visible degradation in optical performance for our modules,with two other vendors showing significant degradation.Some failure analysis methods such as C-SAM,Nano X-ray CT and optical microscope are used for LED packages.Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing.The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging.One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing. 相似文献
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以中大尺寸侧入光式LED背光源的应用开发为目的,对3种不同厚度导光板在经裁切和抛光机械加工、印刷网点、高温试验后3种条件下得最大翘曲变形量进行了实验研究。实验温度为60±2 ℃,湿度为50%±10%RH,实验时间为24 h,实验中所用导光板的样品与量产导光板一致。实验结果表明,导光板越薄其翘曲变形受温度影响越大,但薄型导光板变形后易恢复。 相似文献
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用高低温循环加速试验评估光源模块长期贮存寿命的研究 总被引:1,自引:0,他引:1
Light source modules are the most crucial and fragile devices that affect the life and reliability of the interferometric fiber optic gyroscope (IFOG). While the light emitting chips were stable in most cases, the module packaging proved to be less satisfactory. In long-term storage or the working environment, the ambient temperature changes constantly and thus the packaging and coupling performance of light source modules are more likely to degrade slowly due to different materials with different coefficients of thermal expansion in the bonding interface. A constant temperature accelerated life test cannot evaluate the impact of temperature variation on the performance of a module package, so the temperature cycling accelerated life test was studied. The main failure mechanism affecting light source modules is package failure due to solder fatigue failure including a fiber coupling shift, loss of cooling efficiency and thermal resistor degradation, so the Norris-Landzberg model was used to model solder fatigue life and determine the activation energy related to solder fatigue failure mechanism. By analyzing the test data, activation energy was determined and then the mean life of light source modules in different storage environments with a continuously changing temperature was simulated, which has provided direct reference data for the storage life prediction of IFOG. 相似文献
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Chun-Chih Chuang Tsung-Fu Yang Jin-Ye Juang Yin-Po Hung Chau-Jie Zhan Yu-Min Lin Ching-Tsung Lin Pei-Chen Chang Tao-Chih Chang 《Microelectronics Reliability》2008,48(11-12):1875-1881
A flip chip package was assembled by using 6-layer laminated polyimide coreless substrate, eutectic Sn37Pb solder bump, two kinds of underfill materials and Sn3.0Ag0.5Cu solder balls. Regarding to the yield, the peripheral solder joints were often found not to connect with the substrate due to the warpage at high temperature, modification of reflow profile was benefit to improve this issue. All the samples passed the moisture sensitive level test with a peak temperature of 260 °C and no delamination at the interface of underfill and substrate was found. In order to know the reliability of coreless flip chip package, five test items including temperature cycle test (TCT), thermal shock test (TST), highly accelerated stress test (HAST), high temperature storage test (HTST) and thermal humidity storage test (THST) were done. Both of the two underfill materials could make the samples pass the HTST and THST, however, in the case of TCT, TST and HAST, the reliability of coreless flip chip package was dominated by underfill material. A higher Young’s modules of underfill, the more die crack failures were found. Choosing a correct underfill material was the key factor for volume production of coreless flip chip package. 相似文献
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针对LED车灯芯片照明过程中结温过高的问题,文中对影响芯片结温高低的两种关键因素:LED车灯芯片内部发光源间距和芯片排布间距进行研究,以求有效降低芯片结温。通过ANSYS Workbench16.0软件进行芯片热仿真模拟,随后利用恒温测试平台对仿真结果可靠性进行了验证。验证结果表明,合理设置LED车灯芯片内部发光源之间的间距能有效降低芯片结温,最高可降低8.249 ℃;同时,适当增加LED车灯芯片之间排布间距亦可有效降低结温0.5 ℃。 相似文献
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介绍了一种应用远程激发技术的大功率集成LED光转换光源,通过使用固晶区无绝缘层的镜面铝基板进行集成封装蓝光LED光源,即COB光源。所制蓝光光源与远程激发荧光粉模块结合制成LED光转换光源。利用镜面铝基板的高导热系数,解决多种LED封装形式下芯片点亮温度过高、光源衰减快的问题。采用LED荧光高分子模块与蓝光芯片分离结合的远程激发技术制成白光光源,解决荧光粉分布不均、热老化、色偏移问题。通过与传统粉胶封装方式制得的大功率集成LED器件比较测试,该种光源具有防眩光、光色均匀度高、长寿命、节能和环保的优点,从而具有更广泛的用途。 相似文献
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电流、温度的改变都会影响LED光谱分布,从而影响光源的视觉和非视觉参数。文中从基于LED芯片发光材料中光子能级分布规律的光谱模型出发,对RGBY四色LED建立电流、温度模型,拟合的R-square可达到0.99。在此基础上,通过遗传算法对昼夜节律因子和辐射发光效率进行多目标优化,在照度为300 lx时,设计8组兼顾视觉参数(显色指数和蓝光危害效率)以及非视觉参数(昼夜节律刺激)的照明方案,通过这些方案验证了该模型的可行性。接着,探究两种非视觉参数和温度的关系,结果表明昼夜节律因子均随温度的增加而升高,但昼夜节律刺激却随温度的增加而减小。这种情况的原因是两种参数受照度的影响不同,对照度补偿后,发现两种非视觉参数均随温度的升高而增大,二者呈现一定的正相关性。该研究从光源光谱的角度入手,为LED照明光源设计中非视觉效应的考量提供参考依据。 相似文献
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一种面向LED扩展光源的道路配光设计 总被引:3,自引:3,他引:0
在多车道的道路照明中,需要非对称矩形配光。本文根据非成像光学理论,建立点光源空间与目标照明面之间的拓扑关系,采用合适的反馈优化方法,获得面向扩展光源且在路面上形成均匀非对称矩形光斑的反射器,仿真结果表明,配光后光源的能量基本上被限制在20m×12m的矩形区域内,且实现了非对称的配光,横向照度均匀度达到了85%,纵向照度均匀度达到了80%,满足道路照明要求;并且通过开模实际测试出整体的照度均匀度为80.13%,验证仿真结果以及证明了设计方案的可行性和反射器在路灯灯具中的实用性。 相似文献