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AuCuNi合金常用在各种低电压轻负荷的滑动电接触环境中做电刷、导电环材料,在时效过程中发生无序-有序相变使得合金硬度显著提高。通过显微硬度测试、X射线衍射分析(XRD)以及透射电镜(TEM)显微分析等方法,研究了不同温度和不同时间时效条件下Au-32Cu-13Ni合金的微观结构及力学性能的变化规律。结果表明,200~250℃温度范围内合金获得的时效硬化效果最佳;250℃时效处理1.5 h后,合金发生α0→AuCuI有序相变,且随着时效时间增加,有序相持续析出,晶格畸变减低,基体α0峰位回归Au(200)的标准峰位附近;经TEM分析确认,合金在250℃下时效5天后析出了具有四方结构的AuCuI(L10)有序相,且在有序化的过程中可能形成孪晶。 相似文献
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为满足对高力学性能钨合金的需求,抑制钨晶粒的生长,制备细晶钨合金是发展趋势。向钨合金复合粉末中添加合金元素或氧化物,将引起细晶强化、固溶强化或弥散强化,有利于改善钨合金的强度和硬度。从添加难熔金属元素、稀土元素及其氧化物等方面入手,并结合本文作者对放电等离子烧结含Mo细晶钨合金的研究,介绍细晶高密度W-Ni-Fe合金的合金元素强化技术。最后,基于目前该领域存在的一些主要问题,对未来研究方向提出了若干建议。 相似文献
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制备Mg-5Bi-xCu(x=0,0.2,0.5,1.0,质量分数,%)合金铸锭,研究其铸态组织和沉淀硬化行为。结果表明:铸态Mg-Bi-Cu合金主要由α-Mg枝晶、Mg3Bi2相、MgCu2相和Mg2Cu相组成,Mg3Bi2相和α-Mg基体的取向关系为■,Mg2Cu相和Mg3Bi2相之间的取向关系为■。铸态合金硬度随Cu添加量提高先增大后减小,添加0.5%Cu时硬度最高,为(50.9±1.2)HV。固溶态Mg-5Bi-0.5Cu合金硬度为(49.8±0.9)HV。在175℃时效64 h后,硬度达到峰值(56.1±0.7)HV。时效硬度的提高主要是由于高密度Mg3Bi2相的沉淀强化作用,且由于Cu元素的添加,长杆状Mg3Bi2沉淀相转变为颗粒状和短棒状Mg3Bi2 相似文献
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张鸣鹤;王东涛;长海博文;伍复发 《热加工工艺》2024,(24):11-16+21
Al-Si系铸造铝合金因其较好的铸造性能在汽车上广泛应用。为了进一步提高Al-Si铸造合金的强韧性,一般主要采用T6(固溶+时效)热处理的方式,而其中的时效处理十分关键。时效硬化过程异常复杂,合金成分、时效参数以及微量元素的引入都会对时效强化的效果产生影响。归纳总结了Al-Si-Cu、Al-Si-Mg以及Al-Si-Cu-Mg合金复杂的沉淀序列,分析了微量元素对时效析出行为的影响,最后指出了目前所面临的挑战以及未来的发展趋势。 相似文献
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弥散强化型铂基高温合金 总被引:1,自引:0,他引:1
弥散强化Pt合金的成功开发与应用是20世纪铂合金材料发展最重要的成就。评述了以碳化物和氧化物弥散强化Pt和Pt合金的发展和制备技术、弥散强化Pt合金的结构特征以及弥散强化Pt合金的室温和高温性能,讨论了弥散强化Pt合金的强化机制。 相似文献
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IC-218合金在不同变形量冷扎后,表现出不同的退火行为。在500℃以下退火时,60%冷轧试样表现出时效硬化,而20%冷轧试样则呈现单调软化。结合热分析和X光射峰展宽量分析,发现这种硬化与软化理与有序恢复进程相关。在600℃以上,两种变形试样都表现出回复软化,但在温度不太高时,60%冷轧试样的回复程度远低于20%冷轧试样,随着温度进一步升高,两种试样的回复程度趋于相同。实验结果定性地支持Cahn关于有序合金时效硬化的半有序判据和相关的机理模型。 相似文献
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通过硬度测试、X射线衍射(XRD)分析、扫描电镜(SEM)观察研究了Pd-Ag-Sn-In-Zn合金时效强化行为及相关的微观结构变化,从而很好地解释了该合金的时效强化机制。结果表明,时效前期合金硬度的增加与在晶界处形成中间过渡相有关。通过扫描电镜观察,可以清楚地看到基体相以及等温时效过程中在晶界处有类似珠光体的析出相。随着稳定第二相的长大,硬度持续下降。 相似文献
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铂族金属高温固溶强化型合金 总被引:2,自引:3,他引:2
讨论了高温固溶强化机制和合金元素对Pt固溶强化效应.介绍了铂族金属和Pt-Rh、Pt-Ir和Pt-Pd-Rh固溶型合金的的高温力学性能.借助不同的强化机制,在Pt-Rh或Pt-Pd-Rh合金中添加少量Ir、Ru、Mo、Au等组元,或微量稀有金属Zr、Hf或稀土金属,可以提高合金的高温强度性质和改善抗蠕变能力. 相似文献
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The influence of carbon addition on the aging response of quenched Ti-13wt. % Cr has been investigated using hardness tests,
tensile tests, optical microscopy, scanning electron microscopy, and transmission electron microscopy. The addition of carbon
improves the homogeneity of α precipitation, reduces the growth rate of α, and greatly reduces grain boundary α precipitation.
The carbon addition accelerates the rate at which hardening occurs during aging, increases the peak hardness of aged samples,
and also increases the room temperature tensile strength and ductility of aged samples. The factors giving rise to the improvements
in properties will be discussed in terms of the microstructural observations.
This paper was presented at the Beta Titanium Alloys of the 00’s Symposium sponsored by the Titanium Committee of TMS, held
during the 2005 TMS Annual Meeting & Exhibition, February 13–16, 2005 in San Francisco, CA. 相似文献
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首饰用开金合金的研究与发展(2):首饰用开金合金的冶金学特性及强化机制 总被引:4,自引:0,他引:4
开金合金强度、硬度高,色彩丰富,可满足人们对首饰色彩多样性和饰品耐用性的要求,因而广泛用于首饰行业。作者综述了Au-Ag-Cu、Au-Ag-Pd和Au-Cu-Ni等首饰用主要合金系统的冶金学特性,重点评述了首饰用Au-Ag-Cu系开金合金的强化机制和强化途径的研究现状及发展,包括晶粒尺寸控制的强化、冷加工硬化、合金元素固溶强化、热处理强化以及微合金化强化等。 相似文献
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Electronic structure of Au-Cu alloys 总被引:2,自引:0,他引:2
By studying the correlativity between energy, volume and electronic structure of characteristic crystals and bound conditions of OA theory, the potential energy function, atomic volume interactive function and electronic structure of Au-Cu alloys have been determined. Then following the general Vegard‘s law in characteristic theory, the electronic structure and properties of disordered continue solid solution and three ordered alloys with the maximum ordering degree are calculated. It is found that the non-bonding electrons and near-free electrons in outer shell will transform to covalent electrons during alloying. By analyzing the variation of electronic structure and cohesion of ordering and disordered alloys, the transformation of order-disorder transition Au-Cu alloy has been studied. 相似文献
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The microstructure and strengthening mechanisms of as-cast Mg-6Al-6Nd alloy were studied. The results show that the addition of 6 wt.% Nd into Mg-6Al alloy leads to the precipitation of Al11Nd3 and Al2Nd phases and decrease in the content of Al solid soluted in Mg-Al matrix. The volume fractions of Al11Nd3 and Al2Nd phases are 3.64% and 0.34%, respectively. Compared with Mg-6Al alloy, the ultimate strength, yielding strength, and elongation of Mg-6Al-6Nd alloy at room temperature and 175°C are enhanced in some degrees. The strengthening mechanisms of Mg-6Al-6Nd alloy are mainly composed of solid solution strengthening of Al solid soluted in Mg-Al matrix and grain refinement strengthening, dispersion strengthening, and composite strengthening brought by the precipitation of Al11Nd3 phase. The composite strengthening includes the load transfer from the matrix to Al11Nd3 phase and the enhancement of dislocation density due to the geometrical mismatch and thermal mismatch between the matrix and Al11Nd3 phase. 相似文献
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使用粉末冶金工艺制备了不同体积分数稀七氧化镧颗粒掺杂的钼合金。观察了该合金的显微组织并测试了其力学性能。结果表明,稀士氧化镧掺杂钼合金由于其细小的氧化镧颗粒和细小的晶粒的作用而具有较高的屈服强度。对稀士氧化镧掺杂钼合金强化机制的分析结果表明,钼合金的屈服强度主要来源于三个部分:变形前基体强度、细小稀士氧化镧颗粒贡献的强度和细小钼合金晶粒贡献的强度,并给出了稀土氧化镧掺杂钼合金屈服强度与稀土氧化镧颗粒尺寸、体积分数以及晶粒尺寸之间的定量解析关系。 相似文献
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James EilertsenJun Li Sergei RouvimovM.A. Subramanian 《Journal of Alloys and Compounds》2011,509(21):6289-6295
This study reports the synthesis and characterization of polycrystalline indium-filled InxRh4Sb12 (0 ≤ x ≤ 0.2) skutterudites. The structural response to indium filling was monitored by whole pattern fitting of the powder X-ray diffraction data. Indium occupation of the oversized void-sites was verified by its unusually large thermal displacement parameter. The indium solubility limit approached 0.15. The principal thermoelectric properties were measured from 300 to 600 K. All samples are semiconducting. Indium void-site occupation reduced the lattice thermal conductivity of In0.15Rh4Sb12 30% at 300 K; however, the effect was subverted at elevated temperatures due to a coincident increase in bipolar thermal diffusion. The high-temperature thermoelectric figure of merits (ZT's) are low compared to the isostructural indium-filled InxCo4Sb12 skutterudites due to a striking sign change in the Seebeck coefficients at 400 K and relatively high thermal conductivities. 相似文献