Synthesis and characterization of bis(4‐cyanato 3,5‐dimethylphenyl) naphthyl methane/epoxy/glass fiber composites

Bis(4‐cyanato 3,5‐dimethylphenyl) naphthylmethane was prepared by treating CNBr with bis(4‐hydroxy 3,5‐dimethylphenyl) naphthylmethane in the presence of triethylamine at −5 to 5°C. The dicyanate was characterized by FT‐IR and NMR techniques. The prepared dicyanate was blended with commercial epoxy resin in different ratios and cured at 120°C for 1 hr, 180°C for 1 hr, and post cured at 220°C for 1 hr using diamino diphenyl methane (DDM) as curing agent. Castings of neat resin and blends were prepared and characterized by FT‐IR technique. The morphology of the blends was evaluated by SEM analysis. The composite laminates were also fabricated from the same composition using glass fiber. The mechanical properties like tensile strength, flexural strength, and fracture toughness were measured as per ASTMD 3039, D 790, and D 5528, respectively. The tensile strength increased with increase in cyanate content (3, 6, and 9%) from 322 to 355 MPa. The fracture toughness values also increased from 0.7671 kJ/m² for neat epoxy resin to 0.8615 kJ/m² for 9% cyanate ester epoxy modified system. The thermal properties were also studied. The 10% weight loss temperature of pure epoxy is 358°C and it increased to 398°C with incorporation of cyanate ester resin. The incorporation of cyanate ester up to 9% loading level does not affect the T_g to a very great extent. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers     

Synthesis and characterization of bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane/epoxy/glass fiber composites

Bis(4‐cyanato‐3,5‐dimethylphenyl)anisylmethane was prepared by treating CNBr with bis(4‐hydroxy‐3,5‐dimethylphenyl)anisylmethane and blended with commercial epoxy resin in different ratios and cured at 120°C for 2 h, 180°C for 1 h, and postcured at 220°C for 1 h using diamino diphenyl methane as curing agent. Castings of neat resin and blends were prepared and characterized. The composite laminates were also fabricated with glass fiber using the same composition. The tensile strength of the composites increased with increase in cyanate content (3, 6, and 9%) from 322 to 355 MPa. The fracture toughness values also increased from 0.7671 kJ/m², for neat epoxy resin, to 0.8615 kJ/m², for 9% cyanate ester‐modified epoxy system. The 10% weight loss temperature of pure epoxy (358°C) was increased to 390°C by the incorporation of cyanate ester resin. The incorporation of cyanate ester up to 9% in the epoxy resin increases the T_g from 143 to 147°C. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Blends of epoxy resin with amine‐terminated polyoxypropylene elastomer: Morphology and properties

A liquid diglycidyl ether of bisphenol A (DGEBA) epoxy resin is blended in various proportions with amine‐terminated polyoxypropylene (POPTA) and cured using an aliphatic diamine hardener. The degree of crosslinking is varied by altering the ratio of diamine to epoxy molecules in the blend. The mixture undergoes almost complete phase separation during cure, forming spherical elastomer particles at POPTA concentrations up to 20 wt %, and a more co‐continuous morphology at 25 wt %. In particulate blends, the highest toughness is achieved with nonstoichiometric amine‐to‐epoxy ratios, which produce low degrees of crosslinking in the resin phase. In these blends, the correlation between G_IC and plateau modulus (above the resin T_g), over a wide range of amine‐to‐epoxy ratios, confirms the importance of resin ductility in determining the fracture resistance of rubber‐modified thermosets. © 1999 John Wiley & Sons, Inc. J Appl Polym Sci 72: 427–434, 1999     

Phthalonitrile‐epoxy blends: Cure behavior and copolymer properties

Binary blends composed of 4,4′‐bis(3,4‐dicyanophenoxy)biphenyl (biphenyl PN) and diglycidyl ether of bisphenol A (epoxy resin) and oligomeric n = 4 phthalonitrile (n = 4 PN) and epoxy resin were prepared. The cure behavior of the blends was studied under dynamic and isothermal curing conditions using differential scanning calorimetry, simultaneous thermogravimetric/differential thermal analysis, infrared spectroscopy, and rheological analysis. The studies revealed that phthalonitrile‐epoxy blends exhibited good processability and that they copolymerized with or without the addition of curing additive. In the absence of curing additive, the blends required higher temperatures and longer cure times. The thermal and dynamic viscoelastic properties of amine‐cured phthalonitrile‐epoxy copolymers were examined and compared with those of the neat epoxy resin. The properties of the epoxy resin improved with increasing biphenyl PN content and with n = 4 PN addition. Specifically, the copolymers exhibited higher glass transition temperatures, increased thermal and thermo‐oxidative stabililty, and enhanced dynamic mechanical properties relative to the commercially available epoxy resin. The results showed that the phthalonitrile‐epoxy blends and copolymers have an attractive combination of processability and high temperature properties. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Synthesis,cure kinetics,and thermal properties of the Bis(3‐allyl‐2‐cyanatophenyl)sulphoxide/BMI blends

A novel allyl functionalized dicyanate ester resin bearing sulfoxide linkage was synthesized. The monomer was characterized by Fourier Transform Infrared (FT‐IR) Spectroscopy, ¹H‐, and ¹³C Nuclear Magnetic Resonance (NMR) spectroscopy and elemental analysis. The monomer was blended with bismaleimide (BMI) at various ratios in the absence of catalyst. The cure kinetics of one of the blends was studied using differential scanning calorimetry [nonisothermal] and the kinetic parameters like activation energy (E), pre‐exponential factor (A), and the order of the reaction (n) were calculated by Coats‐Redfern method and compared with those calculated using the experimental Borchardt‐Daniels method. The thermal stability of the cured dicyanate, BMI, and the blends was studied using thermogravimetric analyzer. The initial weight loss temperature of dicyanate ester is above 380°C with char yield of about 54% at 800°C. Thermal degradation of BMI starts above 463°C with the char yield of about 68%. Inclusion of BMI in cyanate ester increases the thermal stability from 419 to 441°C. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Thermally and mechanically enhanced epoxy resin‐silica hybrid materials containing primary amine‐modified silica nanoparticles

In this article, a series of hybrid materials consisted of epoxy resin matrix and well‐dispersed amino‐modified silica (denoted by AMS) nanoparticles were successfully prepared. First of all, the AMS nanoparticles were synthesized by performing the conventional acid‐catalyzed sol–gel reactions of tetraethyl orthosilicate (TEOS), which acts as acceded sol–gel precursor in the presence of 3‐aminopropyl trimethoxysilane (APTES), a silane coupling agent molecules. The as‐prepared AMS nanoparticles were then characterized by FTIR, ¹³C‐NMR, and ²⁹Si‐NMR spectroscopy. Subsequently, a series of hybrid materials were prepared by performing in situ thermal ring‐opening polymerization reactions of epoxy resin in the presence of as‐prepared AMS nanoparticles and raw silica (RS) particles (i.e., pristine silica). AMS nanoparticles were found to show better dispersion capability in the polymer matrices than that of RS particles based on the morphological observation of transmission electron microscopy (TEM) study. The better dispersion capability of AMS nanoparticles in hybrid materials was found to lead enhanced thermal, mechanical properties, reduced moisture absorption, and gas permeability based on the measurements of thermo gravimetric analysis (TGA), differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), and gas permeability analysis (GPA), respectively. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Toughening of epoxy resin systems using low‐viscosity additives

This study has evaluated three low‐viscosity epoxy additives as potential tougheners for two epoxy resin systems. The systems used were a lower‐reactive resin based upon the diglycidyl ether of bisphenol A (DGEBA) and the amine hardener diethyltoluene diamine, while the second epoxy resin was based upon tetraglycidyl methylene dianiline (TGDDM) and a cycloaliphatic diamine hardener. The additives evaluated as potential tougheners were an epoxy‐terminated aliphatic polyester hyperbranched polymer, a carboxy‐terminated butadiene rubber and an aminopropyl‐terminated siloxane. This work has shown that epoxy‐terminated hyperbranched polyesters can be used effectively to toughen the lower cross‐linked epoxy resins, i.e. the DGEBA‐based systems, with the main advantage being that they have minimal effect upon processing parameters such as viscosity and the gel time, while improving the fracture properties by about 54 % at a level of 15 wt% of additive and little effect upon the T_g. This result was attributed to the phase‐separation process producing a multi‐phase particulate morphology able to initiate particle cavitation with little residual epoxy resin dissolved in the continuous epoxy matrix remaining after cure. The rubber additive was found to impart similar levels of toughness improvement but was achieved with a 10–20 °C decrease in the T_g and a 30 % increase in initial viscosity. The siloxane additive was found not to improve toughness at all for the DGEBA‐based resin system due to the poor dispersion within the epoxy matrix. The TGDDM‐based resin systems were found not to be toughened by any of the additives due to the lack of plastic deformation of the highly cross‐linked epoxy network Copyright © 2003 Society of Chemical Industry     

Preparation and properties of dynamically cured PP/MAH‐g‐EVA/epoxy blends

A method concerning with the simultaneous reinforcing and toughening of polypropylene (PP) was reported. Dynamical cure of the epoxy resin with 2‐ethylene‐4‐methane‐imidazole (EMI‐2,4) was successfully applied in the PP/maleic anhydride‐grafted ethylene‐vinyl acetate copolymer (MAH‐g‐EVA), and the obtained blends named as dynamically cured PP/MAH‐g‐EVA/epoxy blends. The stiffness and toughness of the blends are in a good balance, and the smaller size of epoxy particle in the PP/MAH‐g‐EVA/epoxy blends shows that MAH‐g‐EVA was also used as a compatibilizer. The structure of the dynamically cured PP/MAH‐g‐EVA/epoxy blends is the embedding of the epoxy particles by the MAH‐g‐EVA. The cured epoxy particles as organic filler increases the stiffness of the PP/MAH‐g‐EVA blends, and the improvement in the toughness is attributed to the embedded structure. The tensile strength and flexural modulus of the blends increase with increasing the epoxy resin content, and the impact strength reaches a maximum of 258 J/m at the epoxy resin content of 10 wt %. DSC analysis shows that the epoxy particles in the dynamically cured PP/MAH‐g‐EVA/epoxy blends could have contained embedded MAH‐g‐EVA, decreasing the nucleating effect of the epoxy resin. Thermogravimetric results show the addition of epoxy resin could improve the thermal stability of PP, the dynamically cured PP/MAH‐g‐EVA/epoxy stability compared with the pure PP. Wide‐angle x‐ray diffraction analysis shows that the dynamical cure and compatibilization do not disturb the crystalline structure of PP in the blends. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Cure kinetics and thermal stability of micro and nanostructured thermosetting blends of epoxy resin and epoxidized styrene‐block‐butadiene‐block‐styrene triblock copolymer systems

The compatibility of styrene‐block‐butadiene‐block‐styrene (SBS) triblockcopolymer in epoxy resin is increased by the epoxidation of butadiene segment, using hydrogen peroxide in the presence of an in situ prepared catalyst in water/dichloroethane biphasic system. Highly epoxidized SBS (epoxy content SBS >26 mol%) give rise to nanostructured blends with epoxy resin. The cure kinetics of micro and nanostructured blends of epoxy resin [diglycidyl ether of bisphenol A; (DGEBA)]/amine curing agent [4,4′‐diaminodiphenylmethane (DDM)] with epoxidized styrene‐block‐butadiene‐block‐styrene (eSBS 47 mol%) triblock copolymer has been studied for the first time using differential scanning calorimetry under isothermal conditions to determine the reaction kinetic parameters such as kinetic constants and activation energy. The cure reaction rate is decreased with increasing the concentration of eSBS in the blends and also with the lowering of cure temperature. The compatibility of eSBS in epoxy resin is investigated in detailed by Fourier transform infrared spectroscopy, optical and transmition electron microscopic analysis. The experimental data of the cure behavior for the systems, epoxy/DDM and epoxy/eSBS(47 mol%)/DDM show an autocatalytic behavior regardless of the presence of eSBS in agreement with Kamal's model. The thermal stability of cured resins is also evaluated using thermogravimetry in nitrogen atmosphere. POLYM. ENG. SCI., 2012. © 2012 Society of Plastics Engineers     

Novel flame retardant thermosets from nitrogen‐containing and phosphorus‐containing epoxy resins cured with dicyandiamide

A novel phosphorus‐containing epoxy resin (EPN‐D) was prepared by addition reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene 10‐oxide (DOPO) and epoxy phenol‐ formaldehyde novolac resin (EPN). The reaction was monitored by epoxide equivalent weight (EEW) titration, and its structure was confirmed by FTIR and NMR spectra. Halogen‐free epoxy resins containing EPN‐D resin and a nitrogen‐containing epoxy resin (XT resin) were cured with dicyandiamide (DICY) to give new halogen‐free epoxy thermosets. Thermal properties of these thermosets were studied by differential scanning calorimeter (DSC), dynamic mechanical analysis (DMA), thermal mechanical analyzer (TMA) and thermal‐gravimetric analysis (TGA). They exhibited very high glass transition temperatures (T_gs, 139–175°C from DSC, 138–155°C from TMA and 159–193°C from DMA), high thermal stability with T_{d,5 wt %} over 300°C when the weight ratio of XT/EPN‐D is ≥1. The flame‐retardancy of these thermosets was evaluated by limiting oxygen index (LOI) and UL‐94 vertical test. The thermosets containing isocyanurate and DOPO moieties showed high LOI (32.7–43.7) and could achieve UL‐94 V‐0/V‐1 grade. Isocyanurate and DOPO moieties had an obvious synergistic effect on the improvement of the flame retardancy. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007     

Effect of organo‐phosphorus and nano‐clay materials on the thermal and fire performance of epoxy resins

The results of flame retardance and thermal stability of a reactively modified organo‐phosphorus diglycidylether of bisphenol‐A and an organo‐phosphorus tetraglycidyl diaminodiphenylmethane are reported here. The organo‐phosphorus epoxy resins were synthesized by the reaction of 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and diglycidyl ether of bisphenol‐A and tetraglycidyl diaminodiphenylmethane, respectively, and then cured with a mixture of 3,5‐diethyltoluene‐2,4‐diamine and 3,5‐diethyltoluene‐2,6‐diamine. In addition to this, between 5 and 7.5% of organically modified polymeric layered silicate nano‐clay was also added to neat epoxy resin or to the phosphorus‐modified epoxy resin to investigate any synergies, or otherwise, a combination of clay and phosphorus on the flame, degradation, and thermal properties are also reported. The reaction kinetics of phosphorus‐modified and epoxy cure were studied by FTIR, ¹H‐NMR, and DSC. Thermal properties and morphology of the final product were analyzed by thermogravimetric analysis, dynamic mechanical thermal analysis, X‐ray diffraction, and cone calorimetry. Improvement in flame retardance by cone calorimetry was demonstrated by the addition of only 3% phosphorus or 7.5% clay into the epoxy compared with unmodified epoxy resins, whereas no evidence of synergy for a phosphorus and clay combination was found. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 91: 1233–1253, 2004     

Synthesis and properties of a novel bismaleimide resin containing 1,3,4‐oxadiazole moiety and the blend systems thereof with epoxy resin

A new bismaleimide monomer, 2‐((4‐maleimidophenoxy)methyl)‐5‐(4‐maleimidophenyl)‐1,3,4‐oxadiazole (Mioxd), was designed and synthesized. The chemical structure of the monomer was confirmed by means of Fourier transform infrared (FTIR) spectroscopy, proton nuclear magnetic resonance (¹H NMR) spectroscopy and elemental analysis, and its thermal properties were characterized using differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA). Mioxd as a reactive modifier was blended with epoxy resin based on bisphenol A diglycidyl ether (DGEBA) in weight ratio of 5, 10, and 15%, using 4,4′‐diaminodiphenyl sulfone (DDS) as hardener. The effect of Mioxd addition on the cure behavior and thermal properties of the blend resins was studied by DSC, TGA, and dynamic mechanical analysis (DMA). DSC investigations showed that the main exothermic peak temperature (T_p) of the blend systems did not obviously shift with increasing Mioxd content whereas a new shoulder appeared and gradually grew on the high temperature side of the exothermic peak. The results of DMA measurements exhibited the glassy storage modulus (G') and glass transition temperatures (T_g) increased as the Mioxd content was increased, the cured blends investigated were miscible and no phase separation occurred. Further, the thermal decomposition temperature first decreased and then increased, but the char yield at 600°C increased with an increase in Mioxd content. POLYM. ENG. SCI., 2011. © 2011 Society of Plastics Engineers     

In situ development of bio‐based polyurethane‐blend‐epoxy hybrid materials and their nanocomposites with modified graphene oxide via non‐isocyanate route

We developed a series of sunflower oil‐based non‐isocyanate polyurethane (NIPU)‐blend‐epoxy hybrid materials (HNIPUs) and their nanocomposites with amine‐functionalized graphene oxide (AF‐GO). Firstly, carbonated sunflower oil (CSFO) containing five‐membered cyclocarbonate groups was synthesized by the reaction of epoxidized sunflower oil with carbon dioxide (CO₂) at a pressure of 50 bar and temperature of 110 °C. Then, a series of HNIPUs were synthesized using a mixture of CSFO and a commercially available epoxy resin in various amounts (10, 20 and 30 wt% with respect to CSFO) using isophorone diamine as the curing agent. The HNIPU with 30 wt% epoxy showed the best mechanical properties. Finally, nanocomposites of 30 wt% HNIPU‐based composition were prepared with various amounts of AF‐GO (0.3, 0.6 and 1.0 wt%) and were characterized using Fourier transform infrared and ¹H NMR spectroscopies, X‐ray diffraction and scanning electron microscopy. These results emphasize the potentiality of this environmentally friendly approach for preparing renewable HNIPU and nanocomposite materials of high performances. © 2018 Society of Chemical Industry     

13C‐NMR study on cure‐accelerated phenol‐formaldehyde resins with carbonates

Both liquid‐ and solid‐state carbon‐13–nuclear magnetic resonance (¹³C‐NMR) spectroscopies were used to investigate the cure acceleration effects of three carbonates (propylene carbonate, sodium carbonate, and potassium carbonate) on liquid and cured phenol‐formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure acceleration mechanism in the propylene carbonate‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, whereas the addition of both sodium carbonate and potassium carbonate into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C cross polarization/magic‐angle spinning NMR spectroscopy was smaller for the cure‐accelerated PF resins than that of the control PF resin. The result indicated that the cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 1284–1293, 2000     

Soybean and linseed oil‐based composites reinforced with wood flour and wood fibers

Composites consisting of a conjugated linseed or soybean oil‐based thermoset reinforced with wood flour and wood fibers have been prepared by free radical polymerization. The thermoset resin consists of a copolymer of conjugated linseed oil (CLO) or conjugated soybean oil (CSO), n‐butyl methacrylate (BMA), divinylbenzene (DVB), and maleic anhydride (MA). The composites were cured at 180°C and 600 psi and postcured for 2 h at 200°C under atmospheric pressure. The effect of varying filler load, time of cure, filler particle size, origin of the fillers, and resin composition has been assessed by means of tensile tests, DMA, TGA, Soxhlet extraction followed by ¹H‐NMR spectroscopic analysis of the extracts, and DSC. The best processing conditions have been established for the pine wood flour composites. It has been observed that the addition of MA to the resin composition improves the filler‐resin interaction. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

13C‐NMR study on cure‐accelerated phenol–formaldehyde resins with carbonates

Both liquid‐ and solid‐state ¹³C‐NMR spectroscopies were employed to investigate the cure‐acceleration effects of three carbonates [propylene carbonate (PC), sodium carbonate (NC), and potassium carbonate (KC)] on liquid and cured phenol–formaldehyde (PF) resins. The liquid‐phase ¹³C‐NMR spectra showed that the cure‐acceleration mechanism in the PC‐added PF resin seemed to be involved in increasing reactivity of the phenol rings, while the addition of both NC and KC into PF resin apparently resulted in the presence of ortho–ortho methylene linkages. Proton spin‐lattice rotating frame relaxation time (T_1ρH) measured by solid‐state ¹³C‐CP/MAS‐NMR spectroscopy was smaller for the cure‐accelerated PF resins than for that of the control PF resin. The result indicated that cure‐accelerated PF resins are less rigid than the control PF resin. © 2000 John Wiley & Sons, Inc. J Appl Polym Sci 77: 841–851, 2000     

Relationship between viscoelastic properties and gelation in the epoxy/phenol‐novolac blend system with N‐benzylpyrazinium salt as a latent thermal catalyst

A study of viscoelastic properties and gelation in epoxy/phenol‐novolac blend system initiated with 1 wt % of N‐benzylpyrazinium hexafluoroantimonate (BPH) as a latent cationic thermal initiator was performed by analysis of rheological properties using a rheometer. Latent behavior was investigated by measuring the conversion as a function of curing temperature using traditional curing agents, such as ethylene diamine (EDA) and nadic methyl anhydride (NMA) in comparison to BPH. In the relationship between viscoelastic properties and gelation of epoxy/phenol‐novolac blend system, the time of modulus crossover was dependent on high frequency and cure temperature. The activation energy (E_c) for crosslinking from rheometric analysis increased within the composition range of 20–40 wt % phenol‐novolac resin. The 40 wt % phenol‐novolac (N40) to epoxy resin showed the highest value in the blend system, due to the three‐dimensional crosslinking that can take place between hydroxyl groups within the phenol resin or epoxides within the epoxy resin involving polyaddition of the initiator with BPH. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 79: 2299–2308, 2001     

Synthesis of EP‐POSS mixture and the properties of EP‐POSS/epoxy,SiO2/epoxy,and SiO2/EP‐POSS/epoxy nanocomposite

The hybrid material of EP‐POSS mixture was synthesized by the hydrolysis and condensation of (γ‐glycidoxypropyl) trimethoxysilane. A series of binary systems of EP‐POSS/epoxy blends, epoxy resin modified by silica nanoparticles (SiO₂/epoxy), and ternary system of SiO₂/EP‐POSS/epoxy nanocomposite were prepared. The dispersion of SiO₂ in the matrices was evidenced by transmission electron micrograph, and the mechanical properties, that is, flexural strength, flexural modulus, and impact strength were examined for EP‐POSS/epoxy blends, SiO₂/epoxy, and SiO₂/EP‐POSS/epoxy, respectively. The fractured surface of the impact samples was observed by scanning electron micrograph. Thermogravimetry analysis were applied to investigate the different thermal stabilities of the binary system and ternary system by introducing EP‐POSS and SiO₂ to epoxy resin. The results showed that the impact strength, flexural strength, and modulus of the SiO₂/EP‐POSS/epoxy system increased around by 57.9, 14.1, and 44.0% compared with the pure epoxy resin, T_i, T_max and the residues of the ternary system were 387°C, 426°C, and 25.2%, increased remarkably by 20°C, 11°C and 101.6% in contrast to the pure epoxy resin, which was also higher than the binary systems. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 810‐819, 2013