井下FBG高压传感器特性的实验研究

在光纤Bragg光栅(FBG)作为敏感器件设计压力传感器时,需要提高FBG的压力灵敏度.实验中,设计了基于应变圆筒的压力变换装置,并对圆筒的轴向应变进行放大.利用高压测试系统对传感器的压力特性进行实验研究,结果表明:该FBG压力传感器的波长灵敏度为27.1 pm/MPa,约为裸光栅的9倍,线性度为0.999.     

基于SMS-FBG结构的温度应变双参数传感特性研究

提出了一种基于单模-多模-单模(SMS)光纤干涉结构级联光纤布拉格光栅(FBG)的光纤微结构温度应变双参数测量传感器,并对其应变特性、温度特性进行了实验研究。通过采用光纤熔接手段将长度为35.5 mm的多模光纤熔接在两段单模光纤之间,构成SMS光纤干涉结构,并通过级联FBG制成温度应变双参数测量传感器。结果证明,在200～2 000με应变范围内,单模-多模-单模干涉结构和FBG的应变灵敏度分别为-2.31和1.22 pm/με,线性度分别达到0.999 2和0.999 4;在580～700℃温度范围内,其温度灵敏度分别为58.79和13.64 pm/℃,线性度分别达到0.996 7和0.998 2,可实现温度、应变双参数的同时测量。     

双栅型轮辐式光纤光栅压力传感器

利用光纤光栅（FBG）作为基本传感元件,研制了一种基于轮辐式压力盒装置的FBG压力传感器。将2根不同波长的FBG粘贴在传感器同一轮辐的正反面上,提高了测量精度,减少了波长随温度漂移带来的影响。在0～30kN的范围内,其测量线性度达到99．98％,灵敏度达到13．89N,且响应速度快。     

基于双光纤光栅温度压力同时区分测量的研究

提出了一种基于薄壁圆柱壳体的压力温度同时区分测量的光纤Bragg光栅(FBG)传感器结构。将双FBG沿着轴向分别粘贴在壁厚度不均匀的柱体外表面,由于两个FBG受到温度影响而引起的波长漂移量是相同的,这时两光栅Bragg波长漂移量之差就完全取决于压力,从而实现对压力温度的区分测量。实验测得,在0～7MPa内传感器的压力响应灵敏度为0.073nm/MPa,在22.6～112.6℃内的温度灵敏度为0.037nm/℃,分别是裸FBG的24倍和3.7倍。结果也表明,这种传感器具有良好的线性度与可重复性。     

基于进口膜片的光纤光栅压力传感器的研究

分析了光纤布喇格光栅(FBG)的压力传感特性,给出了FBG的中心波长与压力的关系以及压力灵敏度系数的表达式,并将FBG纵向粘贴在富士公司生产型号为FBC 20WB2的膜片上进行了压力实验。实验结果表明粘贴在FBC 20WB2型膜片上的FBG压力传感器的灵敏度系数为0.376 nm/MPa左右,其测量精度在满量程范围内为1%,而理论的压力灵敏度系数为0.385 nm/MPa。同时发现粘贴在该膜片上的FBG压力传感器的中心波长与压力变化有着良好的线性关系和很高的相关系数并且迟滞现象较小,说明基于该膜片的FBG压力传感器非常适合于压力测量。     

一种复合式光纤光栅高压传感器的特性研究

提出了一种采用合金材料封装的耐高压光纤布拉格光栅(FBG)压力传感结构,从理论分析了FBG压力传感器的传感机理,实现了压强的0～20 MPa检测。对实验数据进行曲线拟合处理,线性拟合度达到了0.9996,压强响应灵敏度为12.1 pm/MPa,迟滞误差仅有0.185%,重复性误差也仅为0.020%。可实现温度补偿,并达到压力温度的同时区分测量。     

一种实用的光纤Bragg光栅压力传感器

设计了一种弹性圆筒为衬底的光纤Bragg光栅(FBG)压力传感头,采用参考光栅补偿温度变化对FBG测量压力的影响。在温度为20～100℃、压力为0～20MPa的范围内测试了传感器的特性,并给出了修正温度变化后压力引起波长漂移的实验曲线。结果表明,传感器压力灵敏度为-0.0127nm/MPa,其绝对值约是裸FBG压力灵敏度的4倍,实现了压力增敏。传感头采用密封设计,避免了液体和气体的渗漏,通过选择不同的内径和壁厚,可调整传感头的量程和灵敏度。     

高灵敏度稳定光纤光栅温度传感器的研究

为了提高光纤Bragg光栅(FBG)的温度灵敏度,设计了一种双金属FBG温度增敏装置。增敏装置利用不同金属热胀系数的差异和巧妙的增敏结构,大幅度提高了FBG的温度灵敏度。从理论分析了增敏结构的增敏原理,并给出了波长温度响应关系式。使用此增敏装置制作了一种高灵敏度的FBG温度传感器。为了保证FBG长期固定的稳定性,在制作传感器时使用了低熔点玻璃焊接工艺。实验中,测得增敏FBG温度传感器的温度灵敏度系数达到345.9 pm/℃,是裸FBG的35倍,线性度为0.999 89。对增敏前和增敏后的FBG反射谱进行了对比,结果表明,增敏装置对FBG反射光的功率和反射谱的形状影响很小。对增敏FBG温度传感器的稳定性进行了测试,并用裸FBG作为参考,测试结果显示,增敏装置对FBG的稳定性没有造成影响。     

一种温度自补偿的高灵敏度光纤光栅应变传感器

针对光纤光栅(FBG)应变传感器对应变和温度同时 敏感的问题,基于FBG传感原理以及环形结构受力变形特点,提出了 一种圆环式的FBG应变传感器,并进行了理论分析和传感器性能实验。传感器的 敏感结构是圆环,通过将 光栅粘贴在圆环竖向和横向直径方向,实现对被监测对象表面的应变监测。实验结果表明, 传感器的应变灵敏度为 3.76pm/με,线性相关度可达0.999 9,且 温度影响几乎被消除,可适用于受温度影响和精度要求较高的场所,尤其是 冶金铸造起重机的 监测。     

基于光纤光栅的双壁开口模型管桩测试技术研究

针对光纤光栅传感器在模型管 桩试验应用情况, 提出了一种光纤光栅传感器理论灵敏度系数和实验灵敏度系数应变标定方法。结合理论分析 ,在封装FBG 应变传感器前,对模型管桩内、外管进行有限元Abaqus应力分布模拟分析,得到双壁开口模 型管桩对封装 FBG应变传感器没有影响,提高了实验应变测量精度。对模型管桩封装后的FBG应变传感器进 行标定实验, 每次按200逐级加载后并卸载,循环加载5次,得到内外管FBG传感器 应变灵敏度系数分别为2.15 pm/με、2.24 p m/με,且线性度 均达到0.999以上。该方法简单、易操作,可用于光纤光栅应变传感 器在模型管桩试验前的标定,为光纤光栅传感器在试验和工程中应用奠定了基础。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks