Acceptor and donor doping of AlxGa1−xN thin film alloys grown on 6H-SiC(0001) substrates via metalorganic vapor phase epitaxy

Thin films of Si-doped Al_xGa_1−xN (0.03≤x≤0.58) having smooth surfaces and strong near-band edge cathodoluminescence were deposited at 0.35–0.5 μm/h on on-axis 6H-SiC(0001) substrates at 1100°C using a 0.1 μm AlN buffer layer for electrical isolation. Alloy films having the compositions of Al_0.08Ga_0.92N and Al_0.48Ga_0.52N exhibited mobilities of 110 and 14 cm²/V·s at carrier concentrations of 9.6×10¹⁸ and 5.0×10¹⁷ cm⁻³, respectively. This marked change was due primarily to charge scattering as a result of the increasing Al concentration in these random alloys. Comparably doped GaN films grown under similar conditions had mobilities between 170 and ∼350 cm²/V·s. Acceptor doping of Al_xGa_1−xN for x≤0.13 was achieved for films deposited at 1100°C. No correlation between the O concentration and p-type electrical behavior was observed.     

Growth of (GaAs)1_x(Ge2)x by metalorganic chemical vapor deposition

We report deposition of (GaAs)_{1_x}(Ge₂)_x on GaAs substrates over the entire alloy range. Growth was performed by metalorganic chemical vapor deposition at temperatures of 675 to 750°C, at 50 and 760 Torr, using trimethylgallium, arsine, and germane at rates of 2–10 μ/h. Extrinsic doping was achieved using silane and dimethylzinc in hydrogen. Characterization methods include double-crystal x-ray rocking curve analysis, Auger electron spectroscopy, 5K photoluminescence, optical transmission spectra, Hall-effect, and Polaron profiling. Results achieved include an x-ray rocking curve full-width at half maximum as narrow as 12 arc-s, Auger compositions spanning the alloy range from x = 0.03 to x = 0.94, specular surface morphologies, and 5K photoluminescence to wavelengths as long as 1620 nm. Undoped films are n type, with n ≈ 1 × 10¹⁷ cm⁻³. Extrinsic doping with silane and dimethylzinc have resulted in films which are n type (10¹⁷ to 10¹⁸ cnr⁻³) or p type (5 × 10¹⁸ to 1 × 10²⁰ cm⁻³). Mobilities are generally ≈ 50 cm²/V-s and 500 cm²/V-s, for p and n films, respectively.     

Field Emission and Electric Discharge of Nanocrystalline Diamond Films

Nanocrystalline diamond (NCD) films were produced by microwave plasma-enhanced chemical vapor deposition (MPECVD) using gas mixtures of Ar, H₂, and CH₄. The structural properties, electron emission, and electric discharge behaviors of the NCD films varied with H₂ flow rates during MPECVD. The turn-on field for electron emission at a pressure of 2.66 × 10⁻⁴ Pa increased from 4.2 V μm⁻¹ for the NCD films that were deposited using a H₂ flow rate of 10 cm³ min⁻¹ to 7 V μm⁻¹ for films deposited at a H₂ flow rate of 20 cm³ min⁻¹. The NCD film with a low turn-on field also induced low breakdown voltages in N₂. The grain size and roughness of the NCD films may influence both the electron emission and the electric discharge behaviors of the NCD cathodes.     

Effect of Rapid Thermal Annealing on Sputtered CaCu<Subscript>3</Subscript>Ti<Subscript>4</Subscript>O<Subscript>12</Subscript> Thin Films

Calcium copper titanium oxide (CaCu₃Ti₄O₁₂, abbreviated to CCTO) films were deposited on Pt/Ti/SiO₂/Si substrates at room temperature (RT) by radiofrequency magnetron sputtering. As-deposited CCTO films were treated by rapid thermal annealing (RTA) at various temperatures and in various atmospheres. X-ray diffraction patterns and scanning electron microscope (SEM) images demonstrated that the crystalline structures and surface morphologies of CCTO thin films were sensitive to the annealing temperature and ambient atmosphere. Polycrystalline CCTO films could be obtained when the annealing temperature was 700°C in air, and the grain size increased signifi- cantly with annealing in O₂. The 0.8-μm CCTO thin film that was deposited at RT for 2 h and then annealed at 700°C in O₂ exhibited a high dielectric constant (ε′) of 410, a dielectric loss (tan δ) of 0.17 (at 10 kHz), and a leakage current density (J) of 1.28 × 10⁻⁵ A/cm² (at 25 kV/cm).     

Electrical properties of sputtered (Ba, Sr)TiO3 thin films prepared by two-step deposition method

The influence of two-step deposition on the electrical properties of sputtered (Ba,Sr)TiO₃ thin films was investigated. BST thin films with thickness 40 nm were deposited by a simple two-step radio frequency-magnetron sputtering technique, where the BST thin film consisted of a seed layer and a main layer. The dielectric constant was strongly dependent on the thickness of seed layer, but there was no dependence on deposition temperature of the seed layer. For a 2 nm seed layer, the dielectric constants were higher by about 29% than those of single-step BST thin films due to higher crystallinity and the leakage current was nearly the same as that of a single-step sample in bias voltage from −2 to 2.5 V. However, an improvement of the dielectric constant was not observed for samples having above 4 nm thick seed layers. A 40 nm thick BST film with 2 nm thick seed layer deposited by a two-step method exhibited a SiO₂ equivalent thickness of 0.385 nm and a leakage current density of 2.74 × 10⁻⁸A/cm²at+1.5V after post-annealing under an atmosphere of flowing N₂ for 30 min at 750°C.     

Structural and electrical properties of plasma-deposited silicon nitride from SiH4-N2 gas mixture

Plasma-deposited silicon nitride films were produced from SiH₄-N₂ gas mixture. Their composition, chemical bonds, and electrical properties were investigated by varying the deposition conditions. The silicon nitride films from SiH₄-N₂ gas mixture exhibit (i) less hydrogen, (ii) higher thermal endurance, (iii) higher density, and (iv) smaller etching rate than those of the films deposited from SiH₄, and NH₃ gas mixture. These results can be partly attributed to lower hydrogen concentration. As the Si/N ratio approaches the stoichiometric value, 0.75, the resistivity and the breakdown strength are increased. They are 10¹⁵Ωcm and 9MV/cm, respectively, at Si/N≃0.85. Interface state density between silicon and silicon nitride layers is as low as 1& #x223C; 5xl0¹¹cm⁻² eV⁻¹. On leave from The Northwest Telecommunication Engineering Institute, Xi’an, The People’s Republic of China.     

Preparation of (Pb0.88La0.12)TiO3 thin films for dynamic random access memory by low pressure-metalorganic chemical vapor deposition

La-modified lead titanate (PLT) thin films were prepared by hot-wall type low pressure-metalorganic chemical vapor deposition method. Pb(dpm)₂, La(dpm)₃, and titanium tetraisopropoxide were used as source materials. The films were deposited at 500°C under the low pressure of 1000 mTorr and then annealed at 650°C for 10 min in oxygen ambient. Sputter-deposited platinum electrodes and 180 nm thick PLT thin films were employed to form MIM capacitors with the best combination of high charge storage density (26.7 μC/cm² at 3V) and low leakage current density (1.5 × 10^-7 A/cm² at 3V). The measured dielectric constant and dielectric loss were 1000∼1200 and 0.06∼0.07 at zero bias and 100 kHz, respectively.     

Deposition of tantalum oxide films by dual spectral source assisted metalorganic chemical vapor deposition (MOCVD)

Dual spectral source assisted metalorganic chemical vapor deposition (MOCVD) is an ideal technique for the deposition of high dielectric constant materials. Tungsten halogen lamps and a deuterium lamp are used as the sources of optical and thermal energy. In this paper, we have reported the deposition and characterization of tantalum penta oxide films. Ta₂O₅ films were deposited at 660°C for 15 min and annealed at 400°C for 1 h. The leakage current densities of 10.6 nm thick films are as low as 10₋₁₀ A/cm² for gate voltage under 4V. To the best of our knowledge, these are the best results reported to date by any researcher. The high energy photons used in the in-situ cleaning and deposition process play an important role in obtaining high quality films of Ta₂O₅.     

InP-on-CdS thin film heterostructures

Thin films of InP were deposited on single crystals and thin films of CdS by the planar reactive deposition technique. Good local epitaxy was observed on single crystals of CdS as well as InP and GaAs. The electrical evaluation of unintentionally doped films on semi-insulating InP substrates show them to be n-type with room temperature electron concentrations ranging from 5 × 1016 cm⁻³ to 5 × 10¹⁷ cm⁻³ and mobilities up to 1350 cm²/Vsec. For films intentionally doped with Mn and Be, p-type films were obtained. For Mn doping (deep acceptor level), room temperature mobilities as high as 140 cm²/Vsec and free carrier concentrations as low as 5 × 10¹⁶ cm⁻³ (with dopant level of 3 × 10¹⁸ cm⁻³) were obtained. For Bedoped films, free carrier concentrations of about 5 × 10¹⁸ cm⁻³ and mobilities of 20 cm²/Vsec were found. Scanning electron microscope and microprobe pictures show appreciable interdiffusion between the InP/CdS thin-film pair for InP deposited at 450°C. The loss of Cd from the CdS and the presence of an indium-cadmium-sulfur phase at the InP/CdS interface were observed. Interdiffusion is alleviated for InP deposition at lower temperatures. Supported in part by ERDA and AFOSR.     

Dielectric properties of low loss Ba<Subscript>6−3x</Subscript>Nd<Subscript>8+2x</Subscript>Ti<Subscript>18</Subscript>O<Subscript>54</Subscript> thin films prepared by pulsed laser deposition for microwave applications

Ba_6−3xNd_8+2xTi₁₈O₅₄ with x=0.25 (BNT-0.25, or simply, BNT) dielectric thin films with a thickness of 320 nm have been prepared on Pt-coated silicon substrates by pulsed laser deposition (PLD) at the substrate temperature of 650°C in 20 Pa oxygen ambient. X-ray analysis showed that the as-deposited films are amorphous and the films remain amorphous after a postannealing at 750°C for 30 min. The dielectric constant of the BNT films has been determined to be about 80 with a low loss tan δ of about 0.006 at 1 MHz. The capacitance-voltage (C-V), capacitance-frequency, and capacitance-temperature characteristics of a BNT capacitor with Pt top electrode were measured. A low leakage-current density of 4×10⁻⁶ A/cm² at 6 V was measured, and a preliminary discussion of the leakage-current mechanism is also given. It is proposed that amorphous BNT-0.25 thin films will be a potential dielectric material for microwave applications.     

Synthesis and characterization of Pb(Zr0.54Ti0.46)O3 thin films on (100)Si using textured YBa2Cu3O7−δ and yttria-stabilized zirconia buffer layers by laser physical vapor deposition technique

We have fabricated high-quality <001> textured Pb(Zr_0.54Ti_0.46)O₃ (PZT) thin films on (00l)Si with interposing <001> textured YBa₂Cu₃O_7−δ (YBCO) and yttria-stabilized zirconia (YSZ) buffer layers using pulsed laser deposition (KrF excimer laser, λ, = 248 nm, τ = 20 nanosecs). The YBCO layer provides a seed for PZT growth and can also act as an electrode for the PZT films, whereas YSZ provides a diffusion barrier as well as a seed for the growth of YBCO films on (001)Si. These heterostructures were characterized using x-ray diffraction, high-resolution transmission electron microscopy, and Rutherford backscattering techniques. The YSZ films were deposited in oxygen ambient (∼9 × 10⁻⁴ Torr) at 775°C on (001)Si substrate having <001>YSZ // <001>Si texture. The YBCO thin films were deposited in-situ in oxygen ambient (200 mTorr) at 650°C. The temperature and oxygen ambient for the PZT deposition were optimized to be 530°C and 0.4-0.6 Torr, respectively. The laser fluence to deposit this multilayer structure was 2.5-5.0 J/cm². The <001> textured perovskite PZT films showed a dielectric constant of 800-1000, a saturation polarization of 37.81 μC/cm², remnant polarization of 24.38 μC/cm² and a coercive field of 125 kV/cm. The effects of processing parameters on microstructure and ferroelectric properties of PZT films and device implications of these structures are discussed.     

Electrophysical characteristics of HfO<Subscript>2</Subscript> gate structures formed by electron-beam evaporation

Electrophysical studies of Me/HfO₂/Si(100) structures formed by the electron-beam evaporation method are carried out. The layers of a subgate dielectric are characterized by low values of the state density at the interfaces with silicon (∼10¹¹ cm⁻²) as compared with values given for films formed by vapor deposition. It is shown that the structures are characterized by small leakage currents and high breakdown voltages.     

Structural analysis of Ge x Si1−x /Si layers by remote plasma-enhanced chemical vapor deposition on Si (100)

In this work, remote plasma-enhanced chemical vapor deposition (RPCVD) has been used to grow Ge _x Si_1−x /Si layers on Si(100) substrates at 450° C. The RPCVD technique, unlike conventional plasma CVD, uses an Ar (or He) plasma remote from the substrate to indirectly excite the reactant gases (SiH₄ and GeH₄) and drive the chemical deposition reactions. In situ reflection high energy electron diffraction, selected area diffraction, and plan-view and cross-sectional transmission electron microscopy (XTEM) were used to confirm the single crystallinity of these heterostructures, and secondary ion mass spectroscopy was used to verify abrupt transitions in the Ge profile. XTEM shows very uniform layer thicknesses in the quantum well structures, suggesting a Frank/ van der Merwe 2-D growth mechanism. The layers were found to be devoid of extended crystal defects such as misfit dislocations, dislocation loops, and stacking faults, within the TEM detection limits (∼10⁵ dislocations/cm²). Ge _x Si_1−x /Si epitaxial films with various Ge mole fractions were grown, where the Ge contentx is linearly dependent on the GeH₄ partial pressure in the gas phase for at leastx = 0 − 0.3. The incorporation rate of Ge from the gas phase was observed to be slightly higher than that of Si (1.3:1).     

An Initial Investigation of Nitrogen Doping of Wide-Bandgap HgCdTe During Molecular-Beam Epitaxy Using Ar/N Plasmas

An initial investigation of the use of atomic nitrogen for controlled p-type doping of wide-bandgap Hg_0.3Cd_0.7Te (x = 0.7) is reported. Mixtures of argon and nitrogen, ranging in nitrogen concentration from 0.1% to 100%, have been utilized to demonstrate well-controlled nitrogen incorporation in the 10¹⁶ cm⁻³ to 10²⁰ cm⁻³ range using total gas flow rates of 0.3 sccm to 4.0 sccm and radiofrequency (RF) powers of 100 W to 400 W. Nitrogen doping exhibits several desirable attributes including abrupt turn-on and turn-off and minimal sensitivity to variations in growth temperature and HgCdTe composition, with no negative effects on HgCdTe dislocation density and morphology. Preliminary electrical measurements indicate primarily n-type behavior in the 10¹⁴ cm⁻³ to 10¹⁵ cm⁻³ range in as-grown x = 0.7 HgCdTe and CdTe films doped with nitrogen at 10¹⁸ cm⁻³ to 10²⁰ cm⁻³ concentrations, while ZnTe films have exhibited p-type electrical activity with hole concentrations approaching 10²⁰ cm⁻³.     

Formation of aluminum oxide films from aluminum hexafluoroacetylacetonate at 350–450° c

A study of the thermally activated decomposition of Al(hfa)₃ (aluminum hexafluoroacetylacetonate) from the gas phase to form Al₂O₃ on silicon substrates is reported. The decomposition process was carried out in an open tube atmospheric pressure reactor in either argon or oxygen/argon mixtures in the temperature range, 350–450° C. The chemical vapor deposition process resulted in the formation of aluminum oxide films in all instances. The dielectric strength of Al/Al₂O₃/Si capacitors which received a post-metal anneal, but did not receive a high temperature annealing treatment, with aluminum oxide films prepared from Al(hfa)₃ in argon, was found to be in the range 2–6 MV/cm. The difference between the flatband voltage of the MOS structures and the metal-silicon work function difference was positive, indicative of a net negative oxide charge with a density of approximately 3 × 10¹¹ – 3 × 10¹² cm^-2, assuming the charge is located at the oxide-silicon interface. Decomposition of Al(hfa)₃ was also carried out in oxygen/argon mixtures with the oxygen concentration in the range 10–60 vol %. This process led to the deposition of aluminum oxide films with breakdown fields in the range 8–9 MV/cm. However, the flatband voltages of the Al/Al₂O₃/Si capacitors were even more positive than those obtained with Al₂O₃ formed in pure argon. High temperature (800–1000° C) oxygen or nitrogen annealing treatments of alumina films deposited in either argon or oxygen/argon mixtures were evaluated from the point of view of their influence on the oxide film properties. In particular, an annealing process in oxygen at 1000° C for 15 min was found to result in a reduction of the net negative oxide charge, and an improvement of the dielectric strength of films deposited in argon. Films formed in oxygen/argon mixtures did not change appreciably following oxygen annealing, as far as breakdown fields are concerned, but the oxide net negative charge was reduced. As in an earlier study by the authors, of copper film deposition from Cu(hfa)₂, it was found that essentially carbon free films could be obtained under appropriate conditions.     

Low Leakage Current Transport and High Breakdown Strength of Pulsed Laser Deposited HfO<Subscript>2</Subscript>/SiC Metal-Insulator-Semiconductor Device Structures

Hafnium oxide (HfO₂) thin films were deposited by the pulsed laser deposition (PLD) method on SiC substrates. The bandgap of HfO₂ thin films was observed to be 5.8 eV. The chemical nature and stoichiometry of the films were analyzed by x-ray photoelectron spectroscopy (XPS). Metal-insulator-semiconductor (MIS) structures with Ni as a top electrode and TiN as a bottom electrode were fabricated to study the leakage current properties. The devices exhibited leakage current density of 50 nA/cm². The dielectric constant of these films is estimated to be in the range 17–24 from capacitance-voltage (C-V) measurements. The frequency dependence of the interface trapped charges is studied.     

Epitaxial Growth and Characterization of p-Type ZnO

N-doped p-type ZnO thin films were grown on c-sapphire substrates, semi-insulating GaN templates, and n-type ZnO substrates by metal organic chemical vapor deposition (MOCVD). Diethylzinc and oxygen were used as precursors for Zn and O, respectively, while ammonia (NH₃) and nitrous oxide (N₂O) were employed as the nitrogen dopant sources. X-ray diffraction (XRD) studies depicted highly oriented N-doped ZnO thin films. Photoluminescence (PL) measurements showed a main emission line around 380 nm, corresponding to an energy gap of 3.26 eV. Nitrogen concentration in the grown films was analyzed by secondary ion mass spectrometry (SIMS) and was found to be on the order of 10¹⁸ cm⁻³. Electrical properties of N-doped ZnO epilayers grown on semi-insulating GaN:Mg templates were measured by the Hall effect and the results indicated p-type with carrier concentration on the order of 10¹⁷ cm⁻³.     

Hf-O-N and HfO2 barrier layers for Hf-Ti-O gate dielectric thin films

Hf-O-N and HfO₂ thin films were evaluated as barrier layers for Hf-Ti-O metal oxide semiconductor capacitor structures. The films were processed by sequential pulsed laser deposition at 300 °C and ultra-violet ozone oxidation process at 500 °C. The as-deposited Hf-Ti-O films were polycrystalline in nature after oxidation at 500 °C and a fully crystallized (o)-HfTiO₄ phase was formed upon high temperature annealing at 900 °C. The Hf-Ti-O films deposited on Hf-O-N barrier layer exhibited a higher dielectric constant than the films deposited on the HfO₂ barrier layer. Leakage current densities lower than 5 × 10 A/cm² were achieved with both barrier layers at a sub 20 Å equivalent oxide thickness.     

Growth and characterization of OMVPE grown (In,Mn)As diluted magnetic semiconductor

In_1−xMn_xAs diluted magnetic semiconductor (DMS) thin films with x 0.14 have been grown using organometallic vapor phase epitaxy. Tricarbonyl-(methylcyclopentadienyl)manganese was successfully used as the Mn source. Single phase, epitaxial films were achieved for compositions as high as x=0.14 using growth temperatures ≥475°C. For lower growth temperatures or x>0.14, nanometer scale MnAs precipitates were observed within the In_1−xMn_xAs matrix. Transport properties were investigated using the Hall effect. All Mn doped films were p-type with single phase films exhibiting hole concentrations 2≤×10¹⁹ cm⁻³. Magnetization was measured as a function of temperature and applied field for a single phase film with x=0.1. Ferromagnetic ordering was observed at 5 K with a saturation magnetization of M_s=68 emu/cm³, a remnant magnetization, M_r=10 emu/cm³, and a coercive field H_c=400 Oe.     

Magnetron Deposition of In Situ Thermoelectric Mg2Ge Thin Films

Thin films of the semiconducting compound Mg₂Ge were deposited by magnetron cosputtering from source targets of high-purity Mg and Ge onto glass substrates at temperatures T _s = 300°C to 700°C. X-ray diffraction shows that the Mg₂Ge compound begins to form at a substrate temperature T _s ≈ 300°C. Films deposited at T _s = 400°C to 600°C are single-phase Mg₂Ge and have strong x-ray peaks. At higher T _s the films tend to be dominated by a Ge-rich phase primarily due to the loss of magnesium vapor from the condensing film.␣At optimum deposition temperatures, 550°C to 600°C, films have an electrical conductivity σ _600 K = 20 Ω⁻¹ cm⁻¹ to 40 Ω⁻¹ cm⁻¹ and a Seebeck coefficient α = 300 μV K⁻¹ to 450 μV K⁻¹ over a broad temperature range of 200 K to 600 K.