A Micropower CMOS-Instrumentation Amplifier

A CMOS switched capacitor instrumentation amplifier is presented. Offset is reduced by an auto-zero technique and effects due to charge injection are attenuated by a special amplifier configuration. The circuit which is realized in a 4-/spl mu/m double poly process has an offset (/spl tau/) of 370 /spl mu/V, an rms input referred integrated noise (0.5 -f/sub c//2) of 79 /spl mu/V, and consumes only 21 /spl mu/W (f/sub c/ = 8 kHz, V/sub DD/ = 3 V).     

A low-voltage micropower JFET/bipolar operational amplifier

A single cell supply (operable down to 1.2 V) micropower operational amplifier using compatible low pinchoff voltage JFET's (V/SUB p/=0.4 V) in conjunction with standard bipolar technology has been developed. The subvolt pinchoff JFET's have proved useful in the common-mode feedback-assisted biasing of a simple p-n-p input stage to permit single supply operation, the design of a low-voltage high-performance current mirror and a differential to single-ended converter. The amplifier exhibits excellent ac performance (unity gain slew rate=0.25 V//spl mu/s, unity gain bandwidth=850 kHz) with low power dissipation (245 /spl mu/W).     

A high speed molybdenum gate MOS RAM

Describes a high speed 16K molybdenum gate (Mo-gate) dynamic MOS RAM using a single transistor cell. New circuit technologies, including a capacitive-coupled sense-refresh amplifier and a dummy sense circuit, enable the achievement of high speed performance in combination with reduced propagation delay in the molybdenum word line due to the low resistivity. The n-channel Mo-gate process was established by developing an evaporation apparatus and by an improved heat treatment to reduce surface charge density. Ultraviolet photolithography for 2 /spl mu/m patterns and HCl oxidation for 400 /spl Aring/ thick gate oxide are used. The 16K word/spl times/1 bit device is fabricated on a 3.2 mm/spl times/4.0 mm chip. Cell size is 16 /spl mu/m/spl times/16 /spl mu/m Access time is less than 65 ns at V/SUB DD/=7 V and V/SUB BB/=-2 V. Power dissipation is 210 mW at 170 ns read-modify-write (RMW) cycle.     

An 8-MHz CMOS subranging 8-bit A/D converter

A 8-bit subranging converter (ADC) has been realized in a 3-/spl mu/m silicon gate, double-polysilicon capacitor CMOS process. The ADC uses 31 comparators and is capable of conversion rates to 8 MHz at V/SUB DD/=5 V. Die size is 3.2/spl times/2.2 mm/SUP 2/.     

A memory-cell array with normally off-type Schottky-Barrier FET's

The potential of the metal-semiconductor field-effect transistor (MESFET) as a device for a dc-stable fixed-address memory-cell array is described. The implementation of dc-coupled circuits with `normally off' MESFET's having 1-/spl mu/m gate lengths yields several inherent advantages: high packing density, low power dissipation, low-power-delay time product, and low number of masking steps for transistors, diodes, and resistors. To demonstrate these advantages a fixed-address memory array with dc-stable cells has been chosen. The integrated cell area is 2.6 mil. For a supply voltage V/SUB s/=0.6 V, a standby power dissipation per cell of 5 /spl mu/W has been achieved. The cell switches within 4 ns. The differential sense current in the digit lines is /spl Delta/I/SUB s/=6 /spl mu/A.     

A high precision monolithic super-beta operational amplifier

A single-chip (67/spl times/90 mil) integrated-circuit operational amplifier using thin-film resistors and super-gain transistors has been designed to achieve dc follower accuracies of 0.001 percent with 100-k/spl Omega/ source resistance. The circuit achieves gains of 140 dB using thermally balanced layout designs for both input and output stages, nulled drifts of 0.3 /spl mu/V//spl deg/C, and offset currents well under 1 nA. All other dc specifications including power-supply variation error (PSRR), common-mode gain error (CMRR), etc., are in the 1-10 ppm error range; and a procedure is given by which long-term drifts of less than 10 /spl mu/V/month can be assured. AC performance is comparable to general-purpose integrated-circuit operational amplifiers, i.e., f/SUB t/=300 kHz and slew rate of 1.2 V//spl mu/s at gain of ten. The circuit is externally compensated for unity gain with a single 390-pF capacitor and is fully input and output protected.     

A fault-tolerant 256K RAM fabricated with molybdenum-polysilicon technology

Describes a 256K molybdenum-polysilicon (Mo-poly) gate dynamic MOS RAM using a single transistor cell. Circuit technologies, including a capacitive-coupled sense-refresh amplifier and a redundant circuitry, enable the achievement of high performance in combination with Mo-poly technology. Electron-beam direct writing and dry etching technologies are fully utilized to make 1 /spl mu/m accurate patterns. The 256K word/spl times/1 bit device is fabricated on a 5.83 mm/spl times/5.90 mm chip. Cell size is 8.05 /spl mu/m/spl times/8.60 /spl mu/m. The additional 4K spare cells and the associated circuits, in which newly developed electrically programmable elements are used, occupy less than 10 percent of the whole chip area. The measured access time is 160 ns under V/SUB DD/=5 V condition.     

A 0.85-ns 1-kbit ECL RAM

A 1-kb ECL RAM with an address access time of 0.85 ns is described. This excellent performance is achieved by combining super self-aligned technology (SST) with 1-/spl mu/m design rules and high-speed circuit design. SST provides a narrow emitter stripe width of 0.5 /spl mu/m and a high cutoff frequency of 12.4 GHz at V/SUB CE/=3 V. A two-level metallization process is used. The minimum metallization pitches are 3 /spl mu/m in the first layer and 6 /spl mu/m in the second one. The chip size is 2.5/spl times/2.5 mm/SUP 2/ and the power dissipation is 950 mW. This RAM is promising for use in super computers and/or high-speed digital systems.     

A 64-kbit dynamic MOS RAM

A 64-kbit dynamic MOS RAM is developed by using 2 /spl mu/m rule VLSI fabrication technology and low power circuit technology. The 2 /spl mu/m rule VLSI fabrication technology is achieved by improving various aspects of the ultraviolet photolithographic, thin-gate oxidation, arsenic ion implantation, and multilevel interconnection processes. Microminiaturization of the device structure has made the voltage requirements for its MOST threshold voltage and DC supply voltages low. A highly sensitive and low power dissipating sense circuit has been developed for the VLSI RAM. A new level-detecting circuit with a logic threshold which is independent of MOST threshold voltage is proposed. A dynamic address-buffer circuit is also shown. The fabricated 64K RAM has 200 ns of access time, 370 ns of minimum cycle time, and 150 mW of power dissipation under typical supply voltage conditions of V/SUB DD/=7 V and V/SUB BB/=-2 V.     

A high precision component-tolerant A/D convertor

A pulse transformer is used to double and sum voltages in an A/D encoder that is based on the recursive algorithm V/SUB i+1/=V/SUB REF/-s|V/SUB i/|. As a result of isolating the transformer from the input signal d.c. component, independence of circuit zero drift is achieved. Resistor and V/SUB BE/ mismatch do not affect the encoder accuracy. Automatic zero and gain correction are employed to provide stable adjustment-free operation. A custom analog processor chip carrying both MOS and bipolar transistors was fabricated to implement the algorithm. The 12-bit resolution with a maximum encoder error of 250 /spl mu/V in a temperature range from 0-70/spl deg/C was achieved at 20-kHz sampling rate.     

A CMOS/SOS 4K static RAM

Discusses high density CMOS/SOS technology used to develop a fully static 4096-bit RAM with a five-transistor storage cell. Selection of a five-transistor memory cell has reduced the access to the flip-flop storage element to a single word line transistor and bit line. The word line transistor must be able to prevent data altering currents from entering the memory cell at all times except for the write operation. The write operation is enhanced by reducing the bias voltage across the memory cell, thereby making the current needed to alter the cell smaller. Through the use of a 5 /spl mu/m design rule, the memory cell occupies 2913 /spl mu/m/SUP 2/. The 4096-bit static CMOS/SOS RAM contains 22553 transistors in 20 mm/SUP 2/. Organised as 1024 4-bit words, the RAM has a read cycle time of 350 ns and standby power dissipation of 50 /spl mu/W at V/SUB cc/=5 V and temperature of 27/spl deg/C.     

Low-voltage high-gain differential OTA for SC circuits

A new differential operational transconductance amplifier (OTA) for SC circuits that operates with a supply voltage of less than two transistor threshold voltages is presented. Its simplicity relies on the use of a low-voltage regulated cascode circuit, which achieves very high output impedance under low-voltage restrictions. The OTA has been designed to operate with a supply voltage of V/sub DD/=1.5 V, using a 0.6 /spl mu/m CMOS technology with transistor threshold voltages of V/sub TN/=0.75 V and V/sub TP/=-0.85 V. Post-layout simulation results for a load capacitance (C/sub L/) of 2 pF show a 75 MHz gain-bandwidth product and 100 dB DC gain with a quiescent power consumption of 750 /spl mu/W.     

A low-noise high-precision operational amplifier

A low-noise high-precision operational amplifier has recently been fabricated in monolithic form with dielectric isolation. The amplifier exhibits a V/SUB OS/ of 10 /spl mu/V, V/SUB OS/T/SUB c/ of 0.3 /spl mu/V//spl deg/C, voltage gain of 140 dB with a 600 /spl Omega/ load, and an input noise voltage of 9 nV//spl radic/Hz. The settling time to within 0.01 percent of final value is 15 /spl mu/s for a 10 V pulse.     

InGaAs-InP mesa DHBTs with simultaneously high f/sub /spl tau// and f/sub max/ and low C/sub cb//I/sub c/ ratio

We report an InP-InGaAs-InP double heterojunction bipolar transistor (DHBT), fabricated using a conventional triple mesa structure, exhibiting a 370-GHz f/sub /spl tau// and 459-GHz f/sub max/, which is to our knowledge the highest f/sub /spl tau// reported for a mesa InP DHBT-as well as the highest simultaneous f/sub /spl tau// and f/sub max/ for any mesa HBT. The collector semiconductor was undercut to reduce the base-collector capacitance, producing a C/sub cb//I/sub c/ ratio of 0.28 ps/V at V/sub cb/=0.5 V. The V/sub BR,CEO/ is 5.6 V and the devices fail thermally only at >18 mW//spl mu/m/sup 2/, allowing dc bias from J/sub e/=4.8 mA//spl mu/m/sup 2/ at V/sub ce/=3.9 V to J/sub e/=12.5 mA//spl mu/m/sup 2/ at V/sub ce/=1.5 V. The device employs a 30 nm carbon-doped InGaAs base with graded base doping, and an InGaAs-InAlAs superlattice grade in the base-collector junction that contributes to a total depleted collector thickness of 150 nm.     

A practical micropower programmable bandpass filter for use in bionic ears

Subthreshold Gm-C filters offer the low power and wide tunable range required for use in fully implantable bionic ears. The major design challenge that must be met is increasing the linear range. A capacitive-attenuation technique is presented and refined to allow the construction of wide-linear-range bandpass filters with greater than 1 V/sub pp/ swings. For a 100-200 Hz fully differential filter with second-order roll off slopes and greater than 60 dB dynamic range, experimental results from a 1.5-/spl mu/m, 2.8-V BiCMOS chip yield only 0.23 /spl mu/W power consumption; for a 5-10 kHz filter with the same specifications the power only increased to 6.36 /spl mu/W. Fully differential filters with first-order slopes had a dynamic range of 66 dB and power consumptions of 0.12 and 3.36 /spl mu/W in the 100-200 Hz and 5-10 kHz cases, respectively. We show that our experimental results of noise and linear range are in good accord with theoretical estimates of these quantities.     

A micropower fourth-order elliptical switched-capacitor low-pass filter

A micropower fourth-order elliptical switched-capacitor (SC) low-pass filter for biomedical applications has been designed and measured. The charge transfer error of an SC integrator using a transconductance amplifier is discussed. Also first-order noise and PSRR calculations are performed and compared with the results of simulations and measurements. The measurements show that by careful optimization of the gain bandwidth, slew rate, and gain of the amplifiers, high-performance low-power SC filters can be constructed. The cutoff frequency of the filter is 5 kHz, the ripple in the passband is 0.27 dB, and stopband rejection is 49 dB. The power consumption of the filter is 190 /spl mu/W with /spl plusmn/2.5-V power supplies. The dynamic range of the filter is 75 dB, and the total harmonic distortion over the whole passband range is below 0.25% for a 2-V/SUB pp/ input signal. The PSRR of the filter is above 40 dB at frequencies below 3 kHz.     

InGaAs/InP DHBTs with 120-nm collector having simultaneously high f/sub /spl tau//, f/sub max//spl ges/450 GHz

InP/In/sub 0.53/Ga/sub 0.47/As/InP double heterojunction bipolar transistors (DHBT) have been designed for increased bandwidth digital and analog circuits, and fabricated using a conventional mesa structure. These devices exhibit a maximum 450 GHz f/sub /spl tau// and 490 GHz f/sub max/, which is the highest simultaneous f/sub /spl tau// and f/sub max/ for any HBT. The devices have been scaled vertically for reduced electron collector transit time and aggressively scaled laterally to minimize the base-collector capacitance associated with thinner collectors. The dc current gain /spl beta/ is /spl ap/ 40 and V/sub BR,CEO/=3.9 V. The devices operate up to 25 mW//spl mu/m/sup 2/ dissipation (failing at J/sub e/=10 mA//spl mu/m/sup 2/, V/sub ce/=2.5 V, /spl Delta/T/sub failure/=301 K) and there is no evidence of current blocking up to J/sub e//spl ges/12 mA//spl mu/m/sup 2/ at V/sub ce/=2.0 V from the base-collector grade. The devices reported here employ a 30-nm highly doped InGaAs base, and a 120-nm collector containing an InGaAs/InAlAs superlattice grade at the base-collector junction.     

A nonvolatile eight-bit asynchronous counter and its applications

This paper is concerned with an interesting application of p-channel MNOS on silicon-on-sapphire (SOS) technology: a nonvolatile eight-bit asynchronous counter. This circuit has two count modes: binary and decimal (or BCD). It is fully TTL compatible and needs two power supplies: V/SUB CC/=+5 V/spl plusmn/5 percent and V/SUB DD/=-12 V to -35 V. Maximum count frequency is 1 MHz. Data storage necessitates two pulses, each being 100 ms long. Data retention is expected to be about five years, in the -55 to +125/spl deg/C temperature range. A nonvolatile time counter, which can be used to totalize operating time of a system or a particular device, up to 10000 h, is described as an example of application of such a circuit.     

A 35 ns 2K /spl times/ 8 HMOS static RAM

This paper describes the circuit design and process techniques used to produce a 35-ns 2K /spl times/ 8 HMOS static RAM aimed at future high-end microprocessor applications. The circuit design uses predecoding of the row and column decoder/driver circuits to reduce active power, address-transition detection schemes to equalize internal nodes, and dynamic depletion-mode configurations for increased drive and speed. The technology is 2.5-3.0-/spl mu/m design rule HMOS employing an L/SUB eff/ of 1.7 /spl mu/m, t/SUB ox/=400 /spl Aring/, double-poly resistor loads, RIE and plasma etching, and wafer-stepper lithography. Using these techniques an access time of 35 ns, dc active power of 65 mA, standby power of 14 mA, and die size of 37.5K mil/SUP 2/ has been achieved. The cell size is 728 /spl mu/m/SUP 2/.     

Low-power low-voltage differential class-AB OTAs for SC circuits

Two new differential class-AB operational transconductance amplifiers (OTAs) for SC circuits that operate with a supply voltage of less than two transistor threshold voltages are introduced. They make use of a new class-AB pseudodifferential pair to generate signal currents much larger than quiescent currents. Both OTAs have been designed to operate with a supply voltage of V/sub DD/=1.1 V, using a 0.35 /spl mu/m CMOS technology. Simulation results for a load capacitance (C/sub L/) of 1 pF show 15 MHz gain-bandwidth product with a quiescent power consumption of 10 /spl mu/W.