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1.
The high-temperature flexural strength of hot-pressed silicon nitride (Si3N4) and Si3N4-whisker-reinforced Si3N4-matrix composites has been measured at a crosshead speed of 1.27 mm/min and temperatures up to 1400°C in a nitrogen atmosphere. Load–displacement curves for whisker-reinforced composites showed nonelastic fracture behavior at 1400°C. In contrast, such behavior was not observed for monolithic Si3N4. Microstructures of both materials have been examined by scanning and transmission electron microscopy. The results indicate that grain-boundary sliding could be responsible for strength degradation in both monolithic Si3N4 and its whisker composites. The origin of the nonelastic failure behavior of Si3N4-whisker composite at 1400°C was not positively identified but several possibilities are discussed.  相似文献   

2.
[(Trimethylsilyl)amino]titanium trichloride, (CH3)3-SiNHTiClj, was isolated as a red-orange crystalline solid in 58% yield from the reaction of TiCl4 with [(CH3)3Si]2NH in 1:1 molar ratio in dichloromethane at —78°C. Pyrolysis of (CH3)3SiNHTiCl3 at 600°C furnished titanium nitride. This precursor is suitable for the preparation of composites and was employed to prepare Si3N4-TiN and Ti-TiN powders by adding Si3N4 particles or titanium powders to a solution of (CH3), SiNHTiCl3 in dichloromethane, drying and pyrolyzing the resulting solid. This precursor also has been used as a binder to prepare Si3N4-TiN and Ti-TiN bodies. High-resolution transmission electron microscopic studies of the Si3N4-TiN composite showed that titanium nitride is concentrated on the surface of the Si3N4 particles.  相似文献   

3.
The phase relations in the Si3N4-rich portion of the Si3N4–AlN–Y2O3 rystem were investigated using hot-pressed bodies. The one-phase fields of β3 and α, the twophase fields of β+α, β+M (M=melilite), and α+M, and the three-phase fields of β+α+M were observed in the Si3N4-rich portion. The α- and β-sialons are not two different compounds but an allotropic transformation phase of the Si–Al–O–N system, and an α solid solution expands and stabilizes with increasing Y2O3 content. Therefore, the formulas of the two sialons should be the same.  相似文献   

4.
Detailed microstructural analysis of a 10 mol% Y2O3 fluxed hot-pressed silicon nitride reveals that, in addition to the yttrium-silicon oxynitride phase located at the multiple Si3N4 grain junctions, there is a thin boundary phase 10 to 80 Å wide separating the silicon nitride and the oxynitride grains. Also, X-ray microanalysis from regions as small as 200 Å across demonstrates that the yttrium-silicon oxynitride, Y2Si(Si2O3N4), phase can accommodate appreciable quantities of Ti, W, Fe, Ni, Co, Ca, Mg, Al, and Zn in solid solution. This finding, together with observations of highly prismatic Si3N4 grains enveloped by Y2Si(Si2O3N4), suggests that densification occurred by a liquid-phase "solution-reprecipitation" process.  相似文献   

5.
Polycrystalline Si3N4 samples with different grain-size distributions and a nearly constant volume content of grain-boundary phase (6.3 vol%) were fabricated by hot-pressing at 1800°C and subsequent HIP sintering at 2400°C. The HIP treatment of hot-pressed Si3N4 resulted in the formation of a large amount of ß-Si3N4 grains ∼10 µm in diameter and ∼50 µm long, and the elimination of smaller matrix grains. The room-temperature thermal conductivities of the HIPed Si3N4 materials were 80 and 102 Wm−1K−1, respectively, in the directions parallel and perpendicular to the hot-pressing axis. These values are slightly higher than those obtained for hot-pressed samples (78 and 93 Wm−1K−1). The calculated phonon mean free path of sintered Si3N4 was ∼20 nm at room temperature, which is very small as compared to the grain size. Experimental observations and theoretical calculations showed that the thermal conductivity of Si3N4 at room temperature is independent of grain size, but is controlled by the internal defect structure of the grains such as point defects and dislocations.  相似文献   

6.
Impurity phases in commercial hot-pressed Si3N4 were investigated using transmission electron microscopy. In addition to the dominant, β-Si3N4 phase, small amounts of Si2N2O, SiC, and WC were found. Significantly, a continuous grain-boundary phase was observed in the ∼ 25 high-angle boundaries examined. This film is ∼ 10 Å thick between, β-Si3N4 grains and ∼ 30 Å thick between Si2N2O and β-Si3N4 grains.  相似文献   

7.
High-density Si3N4+6% CeO2 composites with 5 to 50% BN were fabricated by hot-pressing. BN remained as a discrete phase. Dielectric constants were 4 to 8 and loss tangents were 0.0008 to 0.06 for the room temperature to 1100°C range for compositions with 10 to 50% BN. Thermal-expansion values perpendicular to the hot-pressing direction were somewhat less than those of hot-pressed Si3N4+6% CeO2. Flexure strengths at room temperature were considerably lower than those of hot-pressed Si3N4+6% CeO2 but values at 1000°, 1250°, and 1400°C in air were only slightly lower. Young's modulus values were found to decrease with increasing BN content at all temperatures. Better thermal shock resistance was found than for commercial hot-pressed Si3N4.  相似文献   

8.
The synthesis and structure of a monodispersed spherical Si3N4/SiC nanocomposite powder have been studied. The Si3N4/SiC nanocomposite powder was synthesized by heating under argon a spherical Si3N4/C powder. The spherical Si3N4/C powder was prepared by heating a spherical organosilica powder in a nitrogen atmosphere and was composed of a mixture of nanosized Si3N4 and free carbon particles. During the heat treatment at 1450°C, the Si3N4/C powder became a Si3N4/SiC composite powder and finally a SiC powder after 8 h, while retaining its spherical shape. The composition of the Si3N4/SiC composite powder changed with the duration of the heat treatment. The results of TEM, SEM, and selected area electron diffraction showed that the Si3N4/SiC composite powder was composed of homogeneously distributed nanosized Si3N4 and SiC particles.  相似文献   

9.
The creep rate in MgO-fluxed hot-pressed Si3N4 is calculated by means of a model which assumes a solution-precipitation mechanism, and by using the kinetic data for the dissolution rate of β-Si3N4 in an Mg-Si-O-N glass (which was obtained in independent experiments). Despite simplifying assumptions, the predictions match quite favorably with experimental measurements of creep in hot-pressed Si3N4.  相似文献   

10.
The 1780°C isothermal section of the reciprocal quasiternary system Si3N4-SiO2-BeO-Be3N2 was investigated by the X-ray analysis of hot-pressed samples. The equilibrium relations shown involve previously known compounds and 8 newly found compounds: Be6Si3N8, Be11Si5N14, Be5Si2N6, Be9Si3N10, Be8SiO4N4, Be6O3N2, Be8O5N2, and Be9O6N2. Large solid solubility occurs in β-Si3N4, BeSiN2, Be9Si3N10, Be4SiN4, and β-Be3N2. Solid solubility in β-Si3N4 extends toward Be2SiO4 and decreases with increasing temperature from 19 mol% at 1770°C to 11.5 mol% Be2SiO4 at 1880°C. A 4-phase isotherm, liquid +β-Si3N4 ( ss )Si2ON2+ BeO, exists at 1770°C.  相似文献   

11.
Thin films of amorphous Si3N4 were prepared by the rf-sputtering method, and the effects of titanium and chlorine additives on its crystallization were examined. When Ti-doped amorphous Si3N4 was heated, TiN precipitated at >1100°C; the TiN precipitates promoted the conversion of amorphous Si3N4 to β-Si3N4. Chlorine led to preferential conversion of amorphous Si3N4 to α-Si3N4.  相似文献   

12.
Details of the fabrication and microstructures of hot-pressed MoSi2 reinforced–Si3N4 matrix composites were investigated as a function of MoSi2 phase size and volume fraction, and amount of MgO densification aid. No reactions were observed between MoSi2 and Si3N4 at the fabrication temperature of 1750°C. Composite microstructures varied from particle–matrix to cermet morphologies with increasing MoSi2 phase content. The MgO densification aid was present only in the Si3N4 phase. An amorphous glassy phase was observed at the MoSi2–Si3N4 phase boundaries, the extent of which decreased with decreased MgO level. No general microcracking was observed in the MoSi2–Si3N4 composites, despite the presence of a substantial thermal expansion mismatch between the MoSi2 and Si3N4 phases. The critical MoSi2 particle diameter for microcracking was calculated to be 3 μm. MoSi2 particles as large as 20 μm resulted in no composite microcracking; this indicated that significant stress relief occurred in these composites, probably because of plastic deformation of the MoSi2 phase.  相似文献   

13.
Composite powders were hot-pressed to determine the phase relations in the Si3N4-SiO2-Y2O3 pseudoternary system. Four quaternary compounds, Si3Y2O3N4, YSiO2N, Y10Si7O23N4, and Y4Si2O7N2, were identified. Studies of polyphase and single-phase materials in this system showed that these 4 compounds are unstable under oxidizing conditions. Materials within the Si3N4-Si2N2O-Y2Si2O7 compatibility triangle precluded the unstable compounds, and are extremely resistant to oxidation.  相似文献   

14.
Combustion synthesis (CS) of α-silicon nitride (Si3N4) powders was accomplished at a nitrogen pressure lower than 3 MPa. The combination of mechanical activation and chemical stimulation was effective in enhancing the reactivity of Si powder reactants, which was responsible for the reduction of the minimum nitrogen pressure normally required for the CS of Si3N4. This breakthrough indicates that nitriding combustion of silicon in pressurized nitrogen could be promoted by activating the solid reactants instead of by increasing the nitrogen pressure. The phase content of α-Si3N4 in the as-synthesized product is over 90 wt%. Scanning electronic microscopy observation showed that the combustion-synthesized Si3N4 powders are submicron-sized particles with spherical morphologies.  相似文献   

15.
Si3N4/MoSi2 and Si3N4/WSi2 composites were prepared by reaction-bonding processes using as starting materials powder mixtures of Si-Mo and Si-W, respectively. A presintering step in an At-base atmosphere was used before nitriding for the formation of MoSi2 and WSi2; the nitridation in a N2-base atmosphere was followed after presintering with the total stepwise cycle of 1350°C × 20 h +1400°C × 20 h +1450°C × 2 h. The final phases obtained in the two different composites were Si3N4 and MoSi2 or WSi2; no free elemental Si and Mo or W were detected by X-ray diffraction.  相似文献   

16.
The results of two-step oxidation experiments on chemically-vapor-deposited Si3N4 and SiC at 1350°C show that a correlation exists between the presence of a Si2N2O interphase and the strong oxidation resistance of Si3N4. During normal oxidation, k p for SiC was 15 times higher than that for Si3N4, and the oxide scale on Si3N4 was found by SEM and TEM to contain a prominent Si2N2O inner layer. However, when oxidized samples are annealed in Ar for 1.5 h at 1500°C and reoxidized at 1350°C as before, three things happen: the oxidation k p increases over 55-fold for Si3N4, and 3.5-fold for SiC; the Si3N4 and SiC oxidize with nearly equal k p's; and, most significant, the oxide scale on Si3N4 is found to be lacking an inner Si2N2O layer. The implications of this correlation for the competing models of Si3N4 oxidation are discussed.  相似文献   

17.
The effects of fabrication variables on the high-temperature strength of hot-pressed Si3N4 containing 5 wt% Y2O3 were studied. Materials containing a crystalline grain-boundary phase, formed as a consequence of a high-temperature presintering heat treatment and identified as Si3N4·Y2O3, had high-temperature strengths significantly superior to those observed for materials containing a glass phase.  相似文献   

18.
Full-density Si3N4-SiO2-Ce2O3 compositions were prepared by sintering with 2.5 MPa nitrogen pressure at temperatures of 1900° and 2090°C. Room-temperature flexural strengths near 700 MPa for sintered material compared favorably with the strength of hot-pressed material. At 1370°C, where flexural strengths as high as 363 MPa were obtained, it was observed that the coarsest structure was the strongest and the finest structure was the weakest. One of the compositions tested, Si3N4-8.7 wt% SiO2-8.3 wt%-Ce2O3, was found to have excellent 200-h oxidation resistance at 700°, 1000°, and 1370°C, without incidence of 700° to 1000°C phase instability and cracking.  相似文献   

19.
The nitrogen solubility in the SiO2-rich liquid in the metastable binary SiO2-Si3N4 system has been determined by analytical TEM to be 1%–4% of N/(O + N) at 1973–2223 K. Analysis of the near edge structure of the electron energy loss peak indicates that nitrogen is incorporated into the silicate network rather than being present as molecular N2. A regular solution model with a positive enthalpy of mixing for the liquid was used to match the data for the metastable solubility of N in the presence of crystalline Si3N4 and to adjust the computed phase diagram. The solubility of Si3N4 in fused SiO2 is far less than reported in liquid silicates also containing Al, Mg, and/or Y. Apparently, these cations act as modifiers that break anion bridges in the silicate network and, thereby, allow further incorporation of Si3N4 without prohibitive amounts of network cross-linking. Finally, indications emerged regarding the diffuse nature of the Si3N4-SiO2 interface that leads to amorphous regions of higher N content.  相似文献   

20.
An isothermal section of the system AlN-Si3N4-Be3N2 was investigated at 1760°C. The equilibrium relations involve the previously known compounds of the system Si3N4-Be3N2 and a newly found complete solid solution between AlN and BeSiN2.  相似文献   

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