双面印制电路的印刷、吸附、催化加成法制备工艺

开发出了一种双面印制电路板的加成法制备工艺,其具体流程包括：（1）在基板上需要双面导通的部位钻孔,并浸涂离子吸附功能油墨;（2）在基板双面印刷掩膜,暴露出线路图形与通孔部位;（3）基板浸入硝酸银溶液中,吸附银离子至图形和通孔表面;（4）除去掩膜,使用化学镀铜的方法使表面线路和通孔金属化,得到所需双面印制电路板。本工艺可以将双面印制电路线路和通孔一步加成制造,简化了工序,降低了成本,节约了材料。     

文献与摘要（78）

高密度挠性电子的丝网印刷;精细线路的批量化生产——显影液控制;Occam工艺：一种新的印制电路制造方法;刚挠技术成主流应用,但设计更复杂;用有机金属对PCB进行纳米表面处理的新技术;世界上有关环境法规动向的背景及相应状况;高速PCB设计研究;无铅化内层板之铜面处理;绿色法规驱动下的电路板技术趋势透析;无氰化学镀金技术的发展及展望;化学镀锡层表面形貌影响因素的研究;无氰置换镀金工艺研究;化学镀镍废液处理的现状及展望;亚硫酸盐—硫代硫酸盐置换镀金液对Ni^2＋1耐受能力的研究;镀镍废水膜法浓缩回用工艺;化学镀锡预镀工艺对镀层质量的影响;压延铜箔电镀Zn-Ni合金工艺研究     

取代化学镍金用于线宽线距小于30μm高密度印制板的新技术

化学镀镰/金具有优良的性能,已在印制电路板上获得广泛应用。但随着线路的线宽线距越来越小耙催化剂会夹杂在线路之间造成化学镀镖经常出现超镀现象,使化学镀腺/金工艺无法应用。为了解决此问题,我们发现用0.2μm厚的微碱性化学镀银层具有化学镀镖/金层相同的可焊性和打线功能,证明微碱性化学镀银工艺可以取代超高密度PCB的化学镀牒/金工艺。     

印制板化学镀Au

概述了PCB化学镀Au工艺,可以获得线焊接性优良的化学镀Au层,适用于高可靠高密度PCB的化学镀Au.     

基于热转印法电机驱动器的制备和调试

印刷电路板(printed circuit board,PCB)的制备在教学和科研中是必不可少的,但专业的工厂批量加工印刷电路板因为制板费用高、周期长等原因,并不适合个人实验使用。本文给出了一种低成本、快速自制印刷电路板的工艺方法,并依照此工艺实现了电机驱动器的制备以及调试实验。通过制备和调试,加深了电子爱好者以及在校大学生对于电机驱动和制板工艺知识的理解。     

高精度数码喷墨打印技术及在印刷电子上的应用

文章介绍了高精度数码喷墨打印技术的设备,材料和打印工艺及其在印刷电子上的应用。重点介绍了纳米银墨水的结构、性能、烧结条件和电性能以及打印性能及其在制备导电线路上的应用,探讨了喷头孔径及基材的表面性能对打印线路的影响。最后,介绍了挠性PCB的打印。     

柔性基金属互联线路的卷对卷制备工艺

使用以喷墨印刷为基础的印制电子技术来制备柔性金属互联线路时,喷头易堵塞,制备的导体线路精度差,且需要高温处理.针对这些问题,文中提出了一种可靠且低成本的柔性基金属互联线路制备工艺.该方法结合卷对卷印刷工艺和化学沉积技术来制备金属互联线路,使用的柔性基底材料是具有比普通纸更好的强度和耐水性的Teslin纸.使用卷对卷柔版...     

新产品与新技术(74)

低粗化度高结合力和绿色环保的化学镀铜工艺Atotech德国公司和日本公司开发出PCB生产用的低粗化度高结合力和绿色环保的化学镀铜药水:CovaBondTM和Printoganth FFS,适合于半加成法加工10 m以下线路的高密度IC封装载板。CovaBond TM是分子界面技术,用于绝缘树脂化学沉铜前处理。CovaBond TM工艺是经过喷淋、烘烤、氧化、清除过程,达到去除钻污和产生增强结合力的低     

电引发法制作PCB线路的研究

介绍一种电引发化学镀的方法制造印刷电路板(PCB)。首先是在非导电的PET基材上丝印碳粉或碳浆的图形,其次对转移的图形以电引发化学镀的方式沉积上铜或其他金属。电引发过程中,使用直流电源,电压约为3V～5V。以惰性材料作阳极,以导电性良好的材料作阴极,用阴极接触导电图形引发化学镀过程。上述方法的优点有:①起镀速度快,镀层均匀;②工艺简单,容易操作;③镀层与绝缘基材的结合力优良。     

Ni/Au产量最大化

概述了化学镀Ni/浸镀Au精饰工艺程序、工艺控制和解决产品缺陷的方法,以求PCB化学镀Ni/浸镀Au精饰的产量最大化。     

Low temperature fabrication of Ni–P metallic patterns on ITO substrates utilizing inkjet printing

A low temperature process to fabricate high resolution metallic lines on indium tin oxide (ITO) substrates using inkjet printing and subsequent electroless plating is described in this study. In this method, a thermo-sensitive (styrene-co-NIPAAm)/Pd (St-co-NIPAAm/Pd) nanoparticle-based ink was printed onto ITO substrates to create patterned catalytic sites, where nickel is subsequently deposited by electroless plating to form metal lines with desired width and conductivity. The inkjet printing variables such as droplet spacing and printing voltage, as well as the Ni electroless deposition variables such as deposition time and temperature were systematically investigated to obtain the optimum parameters. The adhesion of the deposited Ni–P coating to the ITO substrate was evaluated by a scotch tape test method. Optical microscope observation shows that a continuous pattern was formed with a printing voltage of 37 V and a droplet spacing of 50 μm. The irritating coffee ring effect was significantly suppressed by raising the substrate temperature to 50 °C and increasing the electroless plating temperature to 75 °C. High-resolution conductive metal lines can be easily and successfully fabricated using our method, which shows good potential for preparing the metallic lines as front or back electrodes in solar cells.     

高Tg多层印制板孔壁微裂纹的改善

在印制板的化学沉铜过程中,用于中Tg基板的工艺流程和配方,在加工高Tg基板时会出现非钻孔腻污等常见现象引起的孔壁微裂纹。实验表明,在不改变溶液体系的情况下,通过改善化学沉铜工艺流程和优化配方两种方法,可以极大的改善高他印制板的孔壁微裂纹情况,其中化学沉铜槽的配方对孔壁微裂纹起到决定性的影响。     

PCB高稳定性中速化学镀铜工艺研究

主要研究微量添加剂对化学镀铜镀液沉积速率及镀液稳定性的影响,通过试验筛选合适的微量添加剂,在不改变化学镀铜镀液主反应物质含量的情况下实现镀速提高和镀液稳定性增加。开发出的高稳定性中速化学镀铜工艺,其性能满足PCB工业化生产。     

印制电路板直接电镀技术

印制电路板（PCB）是绝大多数电子产品实现电子器件互联的基板。传统的印制板制造要用到化学镀铜等化学工艺。这些工艺中要用到一些对人体和环境有影响的化学品,同时要使用和排放大量的水,其中含有致癌物甲醛等各种化学物质,因而带来严重环境问题。为此,开发了替代这些对环境有严重污染的工艺的新技术,这就是印制板直接电镀技术。其关键是采用了导电聚合物来替代化学镀铜。     

Polymer Grafting by Inkjet Printing: A Direct Chemical Writing Toolset

Among all the patterning techniques, inkjet printing has lately become a reliable technique at micrometer scale to produce localized modifications on material surfaces. Printing of polymer on material surface however leads to adsorbed patterns with poor adhesion. To overcome this drawback, a new process combining for the first time inkjet printing and an efficient covalent polymer grafting method was developed. This latter method is based on a photo‐assisted reduction of aryldiazonium salt/acrylate monomer ink, derived from the already published GraftFast process. In order to demonstrate its versatility, this new localized polymer grafting process is here combined as an example with the ligand induced electroless plating (LIEP) process to obtain metal interconnects onto flexible and transparent substrates with excellent mechanical and electrical properties for applications in flexible electronics devices.     

PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法研究

文章研究了在PCB基材上化学镀Ni-P合金层用于埋置电阻的工艺方法。基于埋入电阻在挠性及刚性PCB板中的应用,分别研究了Ni-P合金在无卤的FR-4、无卤的PI两种PCB基材上镀层厚度与试验时间之间的关系,初步得出了在两种不同基材上化学沉积Ni-P合金的规律,该规律对后期的试验具有重要的指导作用。     

PCB表面处理技术的最新动向

概述了PCB表面处理技术的最新动向：PCB制造工艺和特性;铜和树脂的粘结;微细图形电镀;堆积导通孔构造和无芯积层板;化学镀铜用催化剂等。     

Direct metallization of gold patterns on polyimide substrate by microcontact printing and selective surface modification

Patterned gold microstructures were fabricated on a polymer substrate by a novel method involving selective electroless plating and microcontact printing. The micro-sized gold patterns were made by the site-selective chemical modification of polyimide substrate films using aqueous potassium hydroxide solution and microcontact printing with a pitch size in the range of 20-200 μm. The base-treated area of the polyimide film became hydrophilic in the regions where the ion-exchange reactions took place for the subsequent metallization. The hydrophilic patterns were sensitized by placing the film in a solution of PdCl₂ and, subsequently, the activated substrate was immersed in an electroless plating solution of Ni and Au to provide well-developed gold patterns on polyimide substrate films.