High interfacial thermal resistance induced low thermal conductivity in porous SiC-SiO2 composites with hierarchical porosity

The incorporation of a thermally insulating secondary phase can significantly increase the interfacial thermal resistance attributed to its low intrinsic thermal conductivity and the creation of multiple phonon scattering interfaces between adjacent SiC particles. The newly developed porous SiC-33 wt% SiO₂ composites with SiO₂ as a thermally insulating secondary phase exhibited a very low thermal conductivity (0.047 Wm⁻¹ K⁻¹, 72.4 % porous), which is an order of magnitude lower than the previously reported lowest thermal conductivity (0.14 Wm⁻¹ K⁻¹, 76.3 % porous) for powder processed porous SiC ceramics and is even lower than the thermal conductivity (0.060 Wm⁻¹ K⁻¹, 87.9% porous) of SiO₂ aerogel. The porous SiC-(16–73 wt%) SiO₂ composites processed from nano β-SiC and a 40 wt% carbon template exhibited a hierarchical (meso-/macro-porous) pore structure that transformed to a trimodal (micro-/meso-/macro-porous) porous structure when polysiloxane was added and sintering was performed at 600–1000 °C in air.     

Bimodal microstructure toughens plasma sprayed Al2O3-8YSZ-CNT coatings

Current work pursues generating controlled bimodal microstructure by plasma spraying of micrometer-sized Al₂O₃ and nanostructured spray-dried agglomerate with reinforcement of 20 wt% of 8 mol % yttria stabilized zirconia (8YSZ) and 4 wt% carbon nanotube (CNT) as potential thermal barrier coating (TBC) on the Inconel 718 substrate. Composite coatings exhibit bimodal microstructure of: (i) fully melted and resolidified microstructured region (MR), and (ii) partially melted and solid state sintered nanostructured regions (NR). Reinforcement with 8YSZ has led to an increase in hardness from ∼12.8 GPa (for μ-Al₂O₃) to ∼13.9 GPa in MR of reinforced Al₂O₃-YSZ composite. Further, with the addition of CNT in Al₂O₃-8YSZ reinforced composite, hardness of MR has remained similar ∼13.9 GPa (8YSZ reinforced) and ∼13.5 GPa (8YSZ-CNT reinforced), which is attributed to acquiescent nature and non-metallurgical bonding of CNT with MR. Indentation fracture toughness increased from 3.4 MPam^0.5 (for μ-Al₂O₃) to a maximum of 5.4 MPam^0.5 (8YSZ- CNT reinforced) showing ∼57.7% improvement, which is due to crack termination at NR, retention of t-ZrO₂ (∼3.3 vol%) crack bridging, and CNT pull-out toughening mechanisms. Modified fractal models affirmed that the introduction of bimodal microstructure (NR) i.e., nanometer-sized- Al₂O₃, nanostructured 8YSZ and CNTs in the μ-Al₂O₃ (MR) contributes ∼44.6% and ∼72% towards fracture toughness enhancement for A8Y and A8YC coatings. An enhanced contribution of nanostructured phases in toughening microstructured Al₂O₃ matrix (in plasma sprayed A8YC coating) is established via modified fractal model affirming crack deflection and termination for potential TBC applications.     

Thermal and electrical properties of additive-free rapidly hot-pressed SiC ceramics

The thermal and electrical properties of newly developed additive free SiC ceramics processed at a temperature as low as 1850 °C (RHP0) and SiC ceramics with 0.79 vol.% Y₂O₃-Sc₂O₃ additives (RHP79) were investigated and compared with those of the chemically vapor-deposited SiC (CVD-SiC) reference material. The additive free RHP0 showed a very high thermal conductivity, as high as 164 Wm⁻¹ K⁻¹, and a low electrical resistivity of 1.2 × 10⁻¹ Ω cm at room temperature (RT), which are the highest thermal conductivity and the lowest electrical resistivity yet seen in sintered SiC ceramics processed at ≤1900 °C. The thermal conductivity and electrical resistivity values of RHP79 were 117 Wm⁻¹ K⁻¹ and 9.5 × 10⁻² Ω cm, respectively. The thermal and electrical conductivities of CVD-SiC parallel to the direction of growth were ∼324 Wm⁻¹ K⁻¹ and ∼5 × 10⁻⁴Ω⁻¹ cm⁻¹ at RT, respectively.     

Thermal conductivity of yttria-stabilized zirconia thin films grown by plasma-enhanced atomic layer deposition

Zirconia doped with yttrium, widely known as yttria-stabilized zirconia (YSZ), has found recent applications in advanced electronic and energy devices, particularly when deposited in thin film form by atomic layer deposition (ALD). Although ample studies reported the thermal conductivity of YSZ films and coatings, these data were typically limited to Y₂O₃ concentrations around 8 mol% and thicknesses greater than 1 μm, which were primarily targeted for thermal barrier coating applications. Here, we present the first experimental report of the thermal conductivity of YSZ thin films (∼50 nm), deposited by plasma-enhanced ALD (PEALD), with variable Y₂O₃ content (0–36.9 mol%). Time-domain thermoreflectance measures the effective thermal conductivity of the film and its interfaces, independently confirmed with frequency-domain thermoreflectance. The effective thermal conductivity decreases from 1.85 to 1.22 W m⁻¹ K⁻¹ with increasing Y₂O₃ doping concentration from 0 to 7.7 mol%, predominantly due to increased phonon scattering by oxygen vacancies, and exhibits relatively weak concentration dependence above 7.7 mol%. The effective thermal conductivities of our PEALD YSZ films are higher by ∼15%–128% than those reported previously for thermal ALD YSZ films with similar composition. We attribute this to the relatively larger grain sizes (∼23–27 nm) of our films.     

Evaluation of alumina reinforced oil fly ash composites prepared by spark plasma sintering

The thermomechanical behavior of micro/nano-alumina (Al₂O₃) ceramics reinforced with 1-5 wt.% of acid-treated oil fly ash (OFA) was investigated. Composites were sintered using spark plasma sintering (SPS) technique at a temperature of 1400°C by applying a constant uniaxial pressure of 50 MPa. It was evaluated that the fracture toughness of micro- and nanosized composites improved in contrast with the monolithic alumina. Highest fracture toughness value of 4.85 MPam^1/2 was measured for the nanosized composite reinforced with 5 wt.% OFA. The thermal conductivity of the composites (nano-/microsized) decreased with the increase in temperature. However, the addition of OFA (1-5 wt.%) in nanosized alumina enhanced the thermal conductivity at an evaluated temperature. Furthermore, a minimum thermal expansion value of 6.17 ppm*K⁻¹ was measured for nanosized Al₂O₃/5 wt.% OFA composite. Microstructural characterization of Al₂O₃-OFA composites was done by x-ray diffraction and Raman spectroscopy. Oil fly ash particles were seen to be well dispersed within the alumina matrix. Moreover, the comparative analysis of the nano-/microsized Al₂O₃/OFA composites shows that the mechanical and thermal properties were improved in nanosized alumina composites.     

Electrical,thermal, and mechanical properties of porous SiC-nitride composites

The effects of nitride (AlN, BN, TiN) addition on the electrical, thermal, and mechanical properties of porous SiC-nitride composites were investigated within a porosity range of 40–74 %. The electrical conductivity was predominantly controlled by chemistry rather than porosity, whereas the thermal conductivity was more susceptible to changes in porosity. These results suggest that the electrical conductivity of porous SiC ceramics can be tuned independently from the thermal conductivity by nitride addition. At constant thermal conductivity (∼5 Wm⁻¹ K^-1), the electrical conductivity of the baseline specimen (6.3 × 10^-3 Ω^-1 cm^-1) could be: (1) increased by an order of magnitude (8.3 × 10^-2 Ω^-1 cm^-1) by adding AlN and (2) decreased by an order of magnitude (7.0 × 10^-4 Ω^-1 cm^-1) by adding BN. Typical electrical conductivity and thermal conductivity values of the porous SiC-10 vol% TiN composite were 5.3 × 10^-1 Ω^-1 cm^-1 and ∼14.0 Wm⁻¹ K^-1, respectively, at 51 % porosity.     

Conductive and radiative heat transfer inhibition in YSZ photonic glass

A high temperature stable ceramic photonic structure is demonstrated with low thermal conductivity and suppressed external radiative heat transfer. The structure is based on a disordered arrangement of yttria-stabilized zirconia (YSZ) microparticles, called photonic glass (PhG). The prepared YSZ-PhG film exhibits low thermal conductivity of 0.03 Wm⁻¹K⁻¹ comparable to that of the air. The small point contacts of the adjacent YSZ particles are the main cause of such low thermal conductivity. After annealing at 1400 °C for 5 h, the solid thermal conductivity increased to 0.3 Wm⁻¹K⁻¹ at room temperature due to the thermally induced neck formation, associated with an increased contact area between adjacent particles. This thermal conductivity is still much lower than that of conventional YSZ thermal barrier coatings (TBCs) with approximately 1 Wm⁻¹K⁻¹. At the same time, the PhG structure is an efficient scatterer for thermal radiation in the wavelength range between 1 and 6 μm. In an only 100 μm thick structure an average reflection of 84% was obtained. At 1400 °C, the effective thermal conductivity is 0.2 Wm⁻¹K⁻¹. The presented structure is applicable to other oxides with even lower bulk thermal conductivity and can be considered for future TBCs.     

Highly electrically and thermally conductive silicon carbide-graphene composites with yttria and scandia additives

Dense silicon carbide/graphene nanoplatelets (GNPs) and silicon carbide/graphene oxide (GO) composites with 1 vol.% equimolar Y₂O₃–Sc₂O₃ sintering additives were sintered at 2000 °C in nitrogen atmosphere by rapid hot-pressing technique. The sintered composites were further annealed in gas pressure sintering (GPS) furnace at 1800 °C for 6 h in overpressure of nitrogen (3 MPa). The effects of types and amount of graphene, orientation of graphene sheets, as well as the influence of annealing on microstructure and functional properties of prepared composites were investigated. SiC-graphene composite materials exhibit anisotropic electrical as well as thermal conductivity due to the alignment of graphene platelets as a consequence of applied high uniaxial pressure (50 MPa) during sintering. The electrical conductivity of annealed sample with 10 wt.% of GNPs oriented parallel to the measuring direction increased significantly up to 118 S·cm⁻¹. Similarly, the thermal conductivity of composites was very sensitive to the orientation of GNPs. In direction perpendicular to the GNPs the thermal conductivity decreased with increasing amount of graphene from 180 W·m⁻¹ K⁻¹ to 70 W·m⁻¹ K⁻¹, mainly due to the scattering of phonons on the graphene – SiC interface. In parallel direction to GNPs the thermal conductivity varied from 130 W·m⁻¹ K⁻¹ up to 238 W·m⁻¹ K⁻¹ for composites with 1 wt.% of GO and 5 wt.% of GNPs after annealing. In this case both the microstructure and composition of SiC matrix and the good thermal conductivity of GNPs improved the thermal conductivity of composites.     

Effects of yttria and magnesia on densification and thermal conductivity of sintered reaction-bonded silicon nitrides

A variety of combinations of Y₂O₃ and MgO were used as additives in preparing Si₃N₄ ceramics by the sintering of reaction-bonded silicon nitride (SRBSN) method. By varying the amount of Y₂O₃ in the range of 0-5 mol% and that of MgO in the range of 0-8 mol%, the effects of Y₂O₃ and MgO additives on nitridation and sintering behaviors as well as thermal conductivity were studied. It was found that appropriate amount and combination of Y₂O₃ and MgO additives were essential for attaining full densification and achieving high thermal conductivity. The sample doped with 2.5 mol% of Y₂O₃ and 5 mol% of MgO attained a thermal conductivity of 128 Wm⁻¹K⁻¹ when sintered at 1900°C for 6 hours, and the sample doped with 2 mol% of Y₂O₃ and 4 mol% of MgO achieved a thermal conductivity of 156 Wm⁻¹K⁻¹ when sintered for 24 hours.     

Low thermal conductivity of atomic layer deposition yttria-stabilized zirconia (YSZ) thin films for thermal insulation applications

Thermal insulation applications have long required materials with low thermal conductivity, and one example is yttria (Y₂O₃)-stabilized zirconia (ZrO₂) (YSZ) as thermal barrier coatings used in gas turbine engines. Although porosity has been a route to the low thermal conductivity of YSZ coatings, nonporous and conformal coating of YSZ thin films with low thermal conductivity may find a great impact on various thermal insulation applications in nanostructured materials and nanoscale devices. Here, we report on measurements of the thermal conductivity of atomic layer deposition-grown, nonporous YSZ thin films of thickness down to 35 nm using time-domain thermoreflectance. We find that the measured thermal conductivities are 1.35–1.5 W m⁻¹ K⁻¹ and do not strongly vary with film thickness. Without any reduction in thermal conductivity associated with porosity, the conductivities we report approach the minimum, amorphous limit, 1.25 W m⁻¹ K⁻¹, predicted by the minimum thermal conductivity model.     

Direct bonding of silicon carbide ceramics sintered with yttria

SiC ceramics sintered with yttria were successfully joined without an interlayer by conventional hot pressing at lower temperatures (2000–2050 °C) compared to those of the sintering temperatures (2050–2200 °C). The joined SiC ceramics sintered with 2000 ppm Y₂O₃ showed almost the same thermal conductivity (˜198 Wm⁻¹ K⁻¹), fracture toughness (3.7 ± 0.2 MPa m^1/2), and hardness (23.4 ± 0.8 GPa) as those of the base material, as well as excellent flexural strength (449 MPa). In contrast, the joined SiC ceramics sintered with 4 wt% Y₂O₃ showed very high thermal conductivity (˜204 Wm⁻¹ K⁻¹) and excellent flexural strength (˜505 MPa). Approximately 16–22% decreases in strength compared to those of the base SC materials were observed in both joined ceramics, due to the segregation of liquid phase at the interface. This issue might be overcome by preparing well-polished and highly flat surfaces before joining.     

Processing and properties of silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity

Silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity were prepared by sintering nano-SiC powder-carbon black template compacts at 600–1200 °C for 2 h in air. The microstructure of the silica-bonded porous nano-SiC ceramics consisted of SiC core/silica shell particles, a silica bonding phase, and hierarchical (meso/macro) pores. The porosity and thermal conductivity of the silica-bonded porous nano-SiC ceramics can be controlled in the ranges of 8.5–70.2 % and 0.057–2.575 Wm⁻¹ K⁻¹, respectively, by adjusting both, the sintering temperature and template content. Silica-bonded porous nano-SiC ceramics with extremely low thermal conductivity (0.057 Wm⁻¹ K⁻¹) were developed at a very low processing temperature (600 °C). The typical porosity, average pore size, compressive strength, and specific compressive strength of the porous nano-SiC ceramics were ∼70 %, 50 nm, 2.5 MPa, and 2.7 MPa·cm³/g, respectively. The silica-bonded porous nano-SiC ceramics were thermally stable up to 1000 °C in both air and argon atmospheres.     

A study of phase evolution and crystal growth for nano-sized monoclinic Y4Al2O9 as a novel thermal barrier coatings

Nano-sized monoclinic Y₄Al₂O₉ was produced by sol-gel process as a novel potential candidate material for thermal barrier coatings. The thermal behavior, structural evolution of the products and the morphological characteristics of the compacted bodies were investigated by Thermogravimetric analysis and differential scanning calorimeter (TG-DSC), X-ray diffraction (XRD), Fourier transform infrared spectroscopy (FT-IR), and Field emission scanning electron microscopy (FESEM). Qualitative analyses indicate that monoclinic Y₄Al₂O₉ was formed at about 1000 °C, and exhibited good phase stability throughout the annealing temperature ranging from 1000 °C to 1400 °C. The thermophysical properties of Y₄Al₂O₉ ceramics were also evaluated compared with 8YSZ and La₂Zr₂O₇. The determined activation energy of crystal growth is about 72.71 ± 0.31 kJ mol⁻¹. Meanwhile, Y₄Al₂O₉ represents low thermal conductivity (1.71 W m⁻¹ K⁻¹), moderate thermal expansion coefficient (8.73 × 10⁻⁶ K⁻¹), and high sintering-resistance ability. Such results reveal that nano-sized Y₄Al₂O₉ is favorable for the application of TBCs.     

Thermal conductivities of YSZ/Al2O3 composites

The thermal conductivities/diffusivities of YSZ/Al₂O₃ composites have been investigated by a laser flash technique. The thermal conductivity of the composite increases with an increase in the Al₂O₃ volume fraction, and it can be fitted well to the Maxwell theoretical model. The consistency of the thermal conductivities of the composites with the predicted values indicates the absence of obvious interfacial thermal resistances in the composites. The negligible thermal resistance effect from the YSZ and Al₂O₃ grain boundaries is due to the much lower phonon mean free path compared with the grain size in the composite. The low Kapitza resistance of the YSZ/Al₂O₃ interface is discussed in terms of the “clean” and coherent nature of the YSZ/Al₂O₃ interface, together with the small difference between the elastic properties of YSZ and Al₂O₃.     

Feasibility research of Yb3Al5O12 garnet as environmental barrier coating materials

In this work, Yb₃Al₅O₁₂ (YbAG) garnet, as a new material for environment barrier coating (EBC) application, was synthesized and prepared by atmospheric plasma spraying (APS). The phases and microstructures of the coatings were characterized by XRD, EDS and SEM, respectively. The thermal stability was measured by TG-DSC. The mechanical and thermal-physical properties, including Vickers hardness (H_v), fracture toughness (K_IC), Young's modulus (E), thermal conductivity (κ) and coefficient of thermal expansion (CTE) were also measured. The results showed that the as-sprayed coating was mainly composed of crystalline Yb₃Al₅O₁₂ and amorphous phase which crystallized at around 917 °C. Moreover, it has a hardness of 6.81 ± 0.23 GPa, fracture toughness of 1.61 ± 0.18 MPa m^1/2, as well as low thermal conductivity (0.82–1.37 W/m·K from RT-1000 °C) and an average coefficient of thermal expansion (CTE) (∼6.3 × 10⁻⁶ K⁻¹ from RT to 660 °C). In addition, the thermal shock and water-vapor corrosion behaviors of the Yb₃Al₅O₁₂-EBC systems on the SiC_f/SiC substrates were investigated and their failure mechanisms were analyzed in details. The Yb₃Al₅O₁₂ coating has an average thermal shock lifetime of 72 ± 10 cycles as well as an excellent resistance to steam. These combined properties indicated that the Yb₃Al₅O₁₂ coating might be a potential EBC material. Both the thermal shock failure and the steam recession of the Yb₃Al₅O₁₂-EBC systems are primarily associated with the CTE mismatch stress.     

Structure,thermal properties and hot corrosion behaviors of Gd2Hf2O7 as a potential thermal barrier coating material

In this work, Gd₂Hf₂O₇ ceramics were synthesized and investigated as a potential thermal barrier coating (TBC) material. The phase composition, microstructure and associated thermal properties of Gd₂Hf₂O₇ ceramics were characterized systematically. Results show that the thermal conductivity of Gd₂Hf₂O₇ ceramics is 1.40 Wm⁻¹K⁻¹ at 1200 °C, ~25% lower than that of 8 wt% yttria partially stabilized zirconia (8YSZ). Gd₂Hf₂O₇ ceramics also present large thermal expansion coefficients, which decrease from 12.0 × 10⁻⁶ K⁻¹ to 11.3 × 10⁻⁶ K⁻¹ (300–1200 °C). Besides, the hot corrosion behaviors of Gd₂Hf₂O₇ ceramics exposed to V₂O₅ and Na₂SO₄ + V₂O₅ salts at temperatures of 900–1200 °C were discussed in great detail. We pay much attention on the corrosion process, corrosion mechanism and corrosion damage of Gd₂Hf₂O₇ ceramics subjected to molten V₂O₅ and Na₂SO₄ + V₂O₅ salts at different temperatures.     

Heat transport enhancement of thermal energy storage material using graphene/ceramic composites

Graphene/ceramic composites are proposed by directly depositing graphene on the insulating Al₂O₃ particles by chemical vapor deposition without any metal catalysts. Carbothermic reduction occurring at the Al₂O₃ surface is vital during the initial stage of graphene nucleation and the graphene sheet can connect with neighboring sheets to completely cover Al₂O₃ particles. The quality and layer number of graphene on Al₂O₃ can be finely tailored by changing the growth temperature and gas ratio. Graphene coated Al₂O₃ (G-Al₂O₃) composites are used as effective fillers of stearic acid (SA) to increase the thermal transport property. By the optimization of the layer number of graphene, size of Al₂O₃ particles and ratio of G-Al₂O₃/SA in a quantitative, their thermal conductivities significantly increase up to 11 folds from 0.15 to 1.65 W m⁻¹ K⁻¹. The great improvement is attributed to the high thermal transfer performance of graphene and excellent wettability between graphene and SA. When the G-Al₂O₃/SA composites with the graphene coated porous Al₂O₃ foam, the thermal conductivity further reaches to 2.39 W m⁻¹ K⁻¹, and the corresponding latent heat is 38 J g⁻¹. It demonstrates the potential applications of graphene in thermal transport and thermal energy storage devices.     

Thermophysical properties and cyclic lifetime of plasma sprayed SrAl12O19 for thermal barrier coating applications

About 6-8 wt% yttria-stabilized zirconia (YSZ) is the industry standard material for thermal barrier coatings (TBC). However, it cannot meet the long-term requirements for advanced engines due to the phase transformation and sintering issues above 1200°C. In this study, we have developed a magnetoplumbite-type SrAl₁₂O₁₉ coating fabricated by atmospheric plasma spray, which shows potential capability to be operated above 1200°C. SrAl₁₂O₁₉ coating exhibits large concentrations of cracks and pores (~26% porosity) after 1000 hours heat treatment at 1300°C, while the total porosity of YSZ coatings progressively decreases from the initial value of ~18% to ~5%. Due to the contribution of porous microstructure, an ultralow thermal conductivity (~1.36 W m⁻¹ K⁻¹) can be maintained for SrAl₁₂O₁₉ coating even after 1000 hours aging at 1300°C, which is far lower than that of the YSZ coating (~1.98 W m⁻¹ K⁻¹). In thermal cyclic fatigue test, the SrAl₁₂O₁₉/YSZ double-ceramic-layer coating undertakes a thermal cycling lifetime of ~512 cycles, which is not only much longer than its single-layer counterpart (~163 cycles), but also superior to that of YSZ coating (~392 cycles). These preliminary results suggest that SrAl₁₂O₁₉ might be a promising alternative TBC material to YSZ for applications above 1200°C.     

CNT-induced TiC toughened Al2O3/Ti composites: Mechanical,electrical, and room-temperature crack-healing behaviors

This study addressed novel multiphase composite of Al₂O₃/Ti/TiC that exhibited enhanced fracture toughness and room-temperature crack-healing function. Al₂O₃/Ti/TiC composites were fabricated through hot-press sintering of CNT, TiH_2, and Al₂O₃ mixed powders, where the TiC was in-situ formed by reaction of CNT and Ti. The effects of CNT (TiC) content on mechanical and electrical properties were studied. Electrochemical anodization process at room temperature was attempted to these composites to heal cracks introduced in the surface of composites. Results indicated that added CNT was invisible while metal Ti and reaction product TiC coexisted in all samples. The reaction between CNT and Ti[O] representing dissolved active oxygen into Ti was considered as the main formation route of TiC. The toughening mechanism was demonstrated as crack deflection and bridging due to the presence of TiC. In spite of the increase in electrical resistivity because of the higher resistivity of TiC than Ti, the present Al₂O₃/Ti/TiC composites still remain high enough electrical conductivity (8.0 × 10⁻³ Ωcm ~1.8 × 10⁻² Ωcm for 0-2 vol% CNT addition) which could be regarded as conductors; it allowed to heal cracks in the composites by electrochemical anodization that formed titanium dioxide phase at room temperature. It was found that crack-healing ability in 1 vol% CNT added composite exhibited higher strength recovery ratio of 95.6% to the crack-free sample than that of Al₂O₃/Ti composite (the recovery ratio of 89.6%). After crack-healing process, mechanical strength of samples increased by 52.3% compared to cracked composites. It was concluded that the formed TiC could contribute to the appropriate electrical conduction as well as interface strengthening in the Al₂O₃/Ti composites. Furthermore, it was firstly speculated that the TiC could be electrochemically anodized to form an oxide like Ti metal. These characteristics enable Al₂O₃/Ti/TiC composites as the crack-healing materials at room temperature.     

Synergistic thermal conductivity enhancement of PC/ABS composites containing alumina/magnesia/graphene nanoplatelets

Graphene nanoplatelets (GNPs) have attracted considerable attention in the field of thermal management materials due to their unique structure and exceptional thermal conductive properties. In this work, we demonstrate a significant synergistic effect of GNPs, alumina (Al₂O₃), and magnesia (MgO) in improving the thermal conductivity of polycarbonate/acrylonitrile‐butadiene‐styrene polymer alloy (PC/ABS) composites. The thermal conductivity of the composites prepared through partial replacement of Al₂O₃ and MgO with GNPs could increase dramatically compared with that without GNPs. The maximum thermal conductivity of the composite is 3.11 W mK⁻¹ at total mass fraction of 70% with 0.5 wt% GNPs loading. It increases 60% compared with that without GNPs (1.95 W mK⁻¹). The synergistic effect results from the compact packing structure formed by Al₂O₃/MgO and the bridging of GNPs with Al₂O₃/MgO, thus promoting the formation of effective thermal conduction pathways within PC/ABS matrix. More importantly, together with the intrinsically high thermal conductivity of GNPs, boosted and effective pathways for phonon transport can be created, thus decrease the thermal resistance at the interface between fillers and PC/ABS matrix and increase the thermal conductivity of composites. POLYM. COMPOS., 38:2221–2227, 2017. © 2015 Society of Plastics Engineers