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Tuning of polypropylene wettability by plasma and polyhedral oligomeric silsesquioxane modifications
Cesar Henrique Wanke Luiz Gustavo Barbosa Ricardo Vinicius Bof de Oliveira Flavio Horowitz 《Polymer》2011,52(8):1797-18054
In this work, we have exposed polypropylene (PP) to plasma treatment and then reactively coated with polyhedral oligomeric silsesquioxane-isothiocyanate (POSS-NCS) in order to modify both of its surface characteristics: chemical composition and roughness. The results of scanning electron microscopy (SEM), atomic force microscopy (AFM), and attenuated total reflectance-Fourier transform infrared spectroscopy (ATR-FTIR) showed a strong relation between plasma exposure time and PP roughness, as expected. On the other hand, the POSS-coating promoted the reduction of surface roughness, but induced a substantial increase in the water contact angle (WCA), probably due to the modification of the surface chemical nature. Besides, the surface tuning method discussed here is a fast, industrial-suitable procedure which can be applied to different polymers. 相似文献
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Guojun Ding Jifang Fu Xing Dong Liya Chen Haisen Jia Yu Wenqi Liyi Shi 《Polymer Composites》2013,34(10):1753-1760
Octaaminophenyl polyhedral oligomeric silsesquioxane (OAPS) was synthesized using three‐step method and used to modify o‐cresol‐novolac epoxy resin (ECN) for printed circuit board. The influence of OAPS on the reactivity and the final properties of the hybrid networks were evaluated. The intercrosslinking reaction between ECN and OAPS was confirmed by Fourier transform infrared spectra. The ECN/OAPS hybrids have better impact strength, higher electrical resistivity and thermal stability, lower water absorption than the unmodified ECN. The volume resistivity and surface resistivity of the hybrids increase by an order of magnitude or more compared to the neat epoxy. The thermal stability of the hybrids improves by the incorporation of OAPS; the initial decomposition temperature and char yield show an increasing tendency up to 4 wt% loading of OAPS. The hybrids exhibit higher storage modulus and glass transition temperature (Tg) than the neat epoxy. The Tg of the hybrids greatly improves up to 153.3°C at 3 wt% content, much higher than 119.4°C of the neat epoxy. POLYM. COMPOS., 34:1753–1760, 2013. © 2013 Society of Plastics Engineers 相似文献
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采用溶液共混法制备了笼状硅氧烷低聚物(POSS)/硅橡胶复合材料,用差示扫描量热仪在不同降温速率下研究了POSS/硅橡胶复合材料的非等温结晶性能,考察了POSS质量分数分别为5%(试样P5)、10%(试样P10)和30%(试样P30)时对复合材料非等温结晶参数和活化能的影响,并选用Ozawa及Ozawa-Avrami联合法对POSS/硅橡胶的非等温结晶性能进行了分析。结果表明,Ozawa-Avrami联合方法适合描述POSS/硅橡胶的非等温结晶现象;POSS/硅橡胶复合材料成核速率的大小依次为P5、P15和P30,生长速率则相反,而结晶速率大小依次为P30、P5和P15。 相似文献
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Multilayer hyperbranched polyimide/polyhedral oligomeric silsesquioxane (POSS) nanocomposites were synthesized by the reaction of a bromide‐hyperbranched polyether/POSS and a main‐chain polyimide containing hydroxyl‐functional groups. The first layer was formed through the direct reactions of the main‐chain hydroxyl groups with monochloroisobutyl polyhedral oligomeric silsesquioxane (POSS–Cl). The second and third layers were prepared by the repeated reactions of bromine ether branches that incorporated POSS–Cl with 3,5‐dihydroxybenzyl alcohol. Regardless of the fixed amount of POSS, the higher layers yielded lower dielectric constants. Even when the amount of the POSS loading was reduced 4‐fold, the third layer still had the lowest dielectric constants. The lowest dielectric constant of 2.54 was found in the third layer of the hyperbranched polyimide/POSS nanocomposite because of the large free volume and loose polyimide structures. The densities of the hyperbranched polyimide/POSS nanocomposite corresponded to the dielectric constants. The lower the density was, the higher the free volume was and the lower the dielectric constant was. The experimental results indicated that the hyperbranched polyimide/POSS nanocomposite exhibited increased solubility in comparison with pure polyimide. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 相似文献
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The synthesis and properties of novel hybrid silsesquioxane‐containing urethane polymers using octakis(hydroxypropyldimethylsiloxy)octasilsesquioxane (OHPOSS) as a crosslinker and a hydroxyl‐terminated polybutadiene were studied. Mixing of the OHPOSS with polyurethane prepolymer and chain extenders in solution was found to be successful when tetrahydrofuran was used as the solvent. Thin films of hybrid polyurethanes were obtained. The hybrid materials were elastomers with improved water and solvent resistivity and good thermal stability. The studied OHPOSS appeared to be an effective crosslinker of polyurethanes suitable for, for example, surface coatings applications. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 130: 2023–2030, 2013 相似文献
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《合成纤维工业》2017,(5):51-56
介绍了多面体低聚倍半硅氧烷(POSS)的分类、结构和性能,POSS是基于化学键合作用而形成的一种分子水平上的纳米有机/无机杂化体,具有规整的立体结构、纳米尺度、优良的相容性和修饰性,其独特的纳米笼形结构使之成为分子结构设计和材料改性的最佳选择。综述了POSS的合成方法及研究进展,如三官能度硅烷或四官能度硅烷在酸、碱或有机盐催化下通过水解缩合反应合成POSS;以POSS为母体,通过封角闭环法和官能团转化衍生法合成POSS;点击化学法制备POSS等。比较了各种方法的优点和存在的问题,指出目前国内POSS的研究重点是合成带有高活性的POSS单体,改进合成路线及工艺,为其工艺化提供技术支持。 相似文献
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溶液共混法笼状硅氧烷低聚物/硅橡胶复合材料的分散性 总被引:1,自引:0,他引:1
通过溶液共混法制备了笼状硅氧烷低聚物(POSS)/硅橡胶复合材料,用X射线衍射仪和透射电子显微镜研究了该材料的分散状况,考察了POSS质量分数以及烘干温度、溶剂含量对POSS在硅橡胶中分散状况的影响。结果表明,POSS质量分数越低,烘干温度越高,越有利于抑制POSS的结晶.进而有利于制备POSS精细分散的P0ss/硅橡胶复合材料;而溶剂含量越少时,更多的POSS以晶体形式从溶剂中析出,从而使得POSS的结晶程度更显著。 相似文献
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Thermal and mechanical properties of polyhedral oligomeric silsesquioxane (POSS)/polycarbonate composites 总被引:2,自引:0,他引:2
Yiqiang Zhao 《Polymer》2005,46(25):11640-11647
A series of composite materials were produced incorporating polyhedral oligomeric silsesquioxane (POSS) derivatives into polycarbonate (PC), by melt blending. Significant differences in compatibility were observed depending on the nano-scale filler's specific structure: trisilanol POSS molecules generally provided better compatibility with PC than fully-saturated cage structures, and phenyl-substituted POSS grades were shown to be more compatible with PC than fillers with other functional groups. Trisilanolphenyl-POSS/PC composites possess the best overall performance among the POSS materials tested. The high compatibility between the trisilanolphenyl-POSS and polycarbonate matrix results in generation of transparent samples up to 5 wt% POSS content. Slightly enhanced mechanical properties including tensile and dynamic mechanical modulus are observed with the increase of trisilanolphenyl-POSS loading at the cost of decreasing ductility of the nanocomposites. Importantly, upon orientation of the PC/POSS nanocomposite, crystallization of POSS within the oriented material results—this observation is consistent with a growing number of observations which suggest that ‘bottom-up’ formation of structures incorporating multiple POSS cages result from orientation of these nanocomposites, and that the hybrid organic-inorganic inclusions may be at the heart of observed nano-scale reinforcement. 相似文献
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Polyimide and polyhedral oligomeric silsesquioxane nanocomposites for low-dielectric applications 总被引:1,自引:0,他引:1
A novel polyimide (PI) hybrid nanocomposite containing polyhedral oligomeric silsesquioxane (POSS) with well defined architecture has been prepared by copolymerization of octakis(glycidyldimethylsiloxy)octasilsesquioxane (Epoxy-POSS), 4,4′-oxydianiline diamine (ODA), and 4,4′-carbonyldiphthalic anhydride (BTDA). In these nanocomposite materials, the equivalent ratio of the Epoxy-POSS and ODA are adjustable, and the resultant PI-POSS nanocomposites give variable thermal and mechanical properties. More importantly, we intend to explore the possibility of incorporating POSS moiety through the Epoxy-POSS into the polyimide network to achieve the polyimide hybrid with lower dielectric constant (low-k) and thermal expansion. The lowest dielectric constant achieved of the POSS/PI material (PI-10P) is 2.65 by incorporating 10 wt% Epoxy-POSS (pure PI, k=3.22). In addition, when contents of the POSS in the hybrids are 0, 3, 10 wt% (PI-0P, PI-3P, PI-10P), and the resultant thermal expansion coefficients (TEC) are 66.23, 63.28, and 58.25 ppm/°C, respectively. The reduction in the dielectric constants and the resultant thermal expansion coefficients of the PI-POSS hybrids can be explained in terms of creating silsesquioxane cores of the POSS and the free volume increase by the presence of the POSS-tethers network resulting in a loose PI structure. 相似文献
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A new hybrid material consisting of a polyhedral oligomeric silsesquioxane (POSS) and carbon nanotube (CNT) was synthesized
by a simple and versatile approach entailing click coupling between azide moiety-functionalized POSS and alkyne-functionalized
multi-walled CNTs. This approach provides a simple and convenient route to efficiently functionalize a wide variety of nanoscale
nanostructure materials on the surface of CNTs. 相似文献