Fabrication of high aspect ratio nano gratings using SR lithography

In this paper, the fabrication technique for high-aspect-ratio diffractive optical element (DOE) is introduced. The 500 nm-width and 1,000 nm-width line-and-space pattern has been successfully fabricated. It was fabricated by synchrotron radiation (SR) lithography for the application of nano gratings, and poly-methylmethacrylate (PMMA) was used as X-ray resist. The nanoscale grating with the aspect ratio of 4.4 and 2.2 was achieved. So far, there are a number of reported techniques for fabrication of DOEs yet the height of those gratings is not sufficient. Therefore, we have attempted to investigate the fabrication of high-aspect-ratio nano gratings by a high-resolution X-ray lithography using SR source at Ritsumeikan University, Japan. Nevertheless, the evaluation of various factors influencing the high-aspect-ratio structure fabricated by our recommended technique is discussed. So far the fabricating process, such as, proximity gap of exposure, the exposure dosage, and the development time have been optimized to fabricate the gratings.     

Numerical simulation and experimental analysis of the sintered micro-parts using the powder injection molding process

Microsystem Technologies - This paper discusses in detail the development of numerical simulations capable of simulating structural evolution and macroscopic deformation during a powder injection...     

Correction to: Numerical simulation and experimental analysis of the sintered micro-parts using the powder injection molding process

Microsystem Technologies - Unfortunately, one of the co-author’s family name was incorrect in the original online publication of this article. The correct family name should be:     

Fabrication of high aspect ratio comb-drive actuator using deep X-ray lithography at Indus-2

We report microfabrication of high aspect ratio comb-drive using deep X-ray lithography at Indus-2 synchrotron radiation source. Analysis shows that the comb-drive actuator of aspect ratio 32 will produce nearly 2.5 μm displacement when 100 V DC is applied. The displacement increases as the gap between the comb finger decreases. For fabrication of comb-drive, polyimide–gold X-ray mask using UV lithography is made for the first time in India. To pattern on an 800 μm thick X-ray photoresist (PMMA) exposures are performed using our deep X-ray lithography beamline (BL-07) at Indus-2. Metallization on the selective regions of the developed X-ray photoresist with comb-drive pattern was carried out by RF sputtering. Following this the comb-drive actuator of PMMA was fabricated by one-step X-ray lithography. The comb-drive can also be used as a sensor, energy harvester, resonator and filter.     

Fabrication of compliant high aspect ratio silicon microelectrode arrays using micro-wire electrical discharge machining

This paper reports on the fabrication of high aspect ratio silicon microelectrode arrays by micro-wire electrical discharge machining (μ-WEDM). Arrays with 144 electrodes on a 400 μm pitch were machined on 6 and 10 mm thick p-type silicon wafers to a length of 5 and 9 mm, respectively. Machining parameters such as voltage and capacitance were varied for different wire types to maximize the machining rate and to obtain uniform electrodes. Finite element analysis was performed to investigate electrode shapes with reduced lateral rigidity. These compliant geometries were machined using μ-WEDM followed by a two step chemical etching process to remove the recast layer and to reduce the cross sections of the electrodes.     

Fabrication of a high aspect ratio nanoporous array on silicon

In this study, a simple method for the fabrication of high aspect ratio silicon nanoporous arrays is developed. A N-type silicon wafer is used as the substrate material. A micro-scale pattern of the desired porous array is transferred to the front surface of the silicon wafer by photolithography after which the wafer is placed in a home-made fixture to efficiently expel the etching generated air and promptly hold the back-side illumination light. A halogen lamp is used as the light source for backside illumination to enhance the electron–hole pair generation. An anodization process is then carried out using a new etchant consisting of hydrofluoric acid and mixed EtOH and EMSO surfactant to effectively polish the pore surfaces and sharpen the tips of the etched pores. A nanochannel array with a nano-tip of 61.4?nm is obtained.     

Fabrication of microcoils with narrow and high aspect ratio coil lines

Recently, there has been a growing requirement to reduce their size of actuators. However, the miniaturization of actuators has made little progress since this requires micro-fabrication, processing, and other new techniques that are not compatible with traditional machining technologies. We have forcused on the fabrication of electromagnetic type microactuators that could be driven at low voltage and with high efficiency but it is well known that existing technologies for miniaturization of these devices are unsuitable because the allowable current path would be too small in microscopic applications. Therefore, we have proposed the development of a spiral microcoil with narrow width and high aspect ratio lines that can be fabricated using X-ray lithography and metallization techniques. We have fabricated spiral structures consisting of coil lines with widths of 10 μm and with aspect ratios of over 5. We have also succeeded in electroforming copper onto seed layers and have demonstrated isotropic copper etching in order to form narrow width coil lines to act as current paths. In addition, we have estimated the suction forces that can be generated by electromagnetic actuators fabricated using these coils. These results give rise to the expectation that practical high performance spiral microcoils could be manufactured using these techniques, in spite of their miniature size.     

Fabrication of Fresnel zone plates with high aspect ratio by soft X-ray lithography

High focusing efficiency Fresnel zone plates for hard X-ray imaging is fabricated by electron beam lithography, soft X-ray lithography, and gold electroplating techniques. Using the electron beam lithography, Fresnel zone plates which has an outermost zone width of 100 nm and thickness of 250 nm has been fabricated. Fresnel zone plates with outermost zone width of 150 nm and thickness of 660 nm has been fabricated by using soft X-ray lithography.     

Fabrication of two dimensional high aspect ratio polymer photonic crystal laser

Photonic crystals have attracted much attention from researchers because of the control over the propagation and emission of light and particular optical properties. In this paper, we reported on the design, fabrication and test of a two-dimensional polymer photonic crystal laser. First of all, a two-dimensional polymer photonic crystal laser with a triangle-lattice structure was described. Rhodamine 6G doped in PMMA was chosen as the gain material. Then, plane wave method based on the Maxwell equations was utilized to calculate the distribution of the photonic band gap. We calculated the band structure of a triangle lattice photonic crystal with a low refractive index. High resolution electron beam lithography combined with electroplating was used to fabricate the silicon nitride mask. A high aspect ratio two-dimensional photonic crystal laser was fabricated by X-ray lithography in one-step process to overcome the limitation of the thickness by the conventional methods to realize a real two-dimensional laser. Meanwhile, processes of sample preparations and fabrication were optimized in order to avoid the oxidation of the gain material and reduce the diffraction effect on the structures.     

Fabrication of micro gear by micro powder injection molding

Micro components made from polymers can be easily processed but they may not be suitable for all applications. One example is where good mechanical properties are required. Thus, the fabrication of micro components from non-polymeric materials such as metals and ceramics is essential. In this paper, the fabrication of 316L stainless steel micro gear by micro powder injection molding is reported. The specifications of the green micro gear were: 10 teeth, module of 0.08, outer diameter of 1 mm and a length of 1 mm. Injection molding was conducted on a conventional injection molding machine with a small screw diameter of 14 mm. The green micro gear was well replicated. The debound micro gear retained its shape and the teeth were well defined. After sintering, the shape was also retained but with some surface irregularities. The process differences between μPIM and PIM, such as the use of smaller particle size and higher mold temperature are also highlighted.     

Fabrication of the plastic component for photonic crystal using micro injection molding

In this decade, many techniques have been introduced to fabricate photonic crystal in optical applications. Most of the processes used to fabricate the photonic crystal are time consuming and not cost effective. This study demonstrates an efficient method to fabricate photonic crystals. A polymer-based photonic crystal slab has been developed by embedding mixture with a high dielectric constant. Photonic crystals have patterned structures in which periodicity of dielectric properties can manipulate electromagnetic waves. The operation wavelength is about half of the characteristic dimension. Technique of injection molding is applied to make polymer parts with the photonic crystal pattern. Then mixture of barium titanate powder and epoxy is embedded on the patterned structure of the polymer part. The contrast of dielectric coefficients between mixture and polymer can constitute a structure with some photonic band gap. By means of polymer processing, mass production of photonic crystal devices like optical switch, optical waveguide, optical filter and so forth can be realized in a cost effective way.     

Production issues for high aspect ratio Lobster-eye optics using LIGA

 A square packed array of square-channels with long channel axis aligned radially is a useful structure for condensing grazing incidence flux to a focus. These devices, known as Lobster-eye optics for their similarity to the eyes of the macruran crustaceans, show great promise as the focusing optic in the next generation of X-ray all-sky monitors. At X-ray wavelengths the optimal Lobster-eye structure requires an aspect ratio of channel length to width of greater than 30:1. Following recent success in fabricating a low aspect ratio Lobster-eye structure, we discuss some of the parameters for, and production issues involved in making, a useful Lobster-eye prototype using LIGA. We report on our initial attempts to produce high aspect ratio Lobster-eye optics using the LIGA process with a graphite substrate. Received: 10 August 2001/Accepted: 24 September 2001 AGP gratefully acknowledges receipt of an ARC post-doctoral fellowship. This work was supported by the Australian Synchrotron Research Program, which is funded by the Commonwealth of Australia under the Major National Research Facilities Program. Use of the Advanced Photon Source was supported by the U.S. Department of Energy, Basic Energy Sciences, Office of Energy Research, under Contract No. W-31-109-Eng-38. This paper was presented at the Fourth International Workshop on High Aspect Ratio Microstructure Technology HARMST 2001 in June 2001.     

Fabrication of support structures to prevent SU-8 stiction in high aspect ratio structures

We have previously demonstrated that it is possible to fabricate densely-packed high aspect ratio structures in SU-8 by means of a top-plate support member which stiffens the overall structure and prevents pattern collapse. In this work we have computed the tensile stresses induced in the top-plate structures due to the capillary forces that arise between the columns due to the surface tension of the drying liquid. We have further studied the dynamic behavior of the structure after an instantaneous force. Based on these results, we have shown that the predicted optimal thickness of the top-plate structure is sufficient to maintain structural integrity.     

Production of metallic high aspect ratio microstructures by microcasting

Microcasting is a competitive process for the production of metallic microparts. The remarkable suitability of this technique especially for extreme aspect ratio microsamples made of metal alloys will be shown. Based on the well known process of investment casting it is possible to produce microstructures by a gold basis alloy called Stabilor G^® with an aspect ratio of up to 90. Basic investigations on the ability of form filling and flow length show that microcasting can be improved by a increasing of the molding pressure to about 25 bar. Basic results will be presented as well as a testing structure for estimating the quality of the casting process in regard of its suitability for microcasting of high aspect ratio parts.     

Manufacturing of microstructures with high aspect ratio by micromachining

The development of micromachining plays an important role in miniaturization of microsystems. Micromachining is a very flexible and compared to EDM or ECM a very fast machining process with a high material removal rate. A wide range of materials like polymers, metals and alloys as well as some sorts of ceramics can be machined. Also 3D-structures can be easily manufactured. Additionally, big advances have been made concerning the realization of high aspect ratios for small diameter end mills. Whereas end mills below 100 μm diameter are limited to an aspect ratio of 1.5, end mills of 100 μm diameter are available up to an aspect ration of ten now. A few years ago, end mills in this diameter range were uncoated. Nowadays, there was a big progress in the coating technology so that these end mills can be coated with layers as thin as 0.5 μm.     

Process research of high aspect ratio microstructure using SU-8 resist

SU-8 is a negative, epoxy type, near-UV photoresist. This resist has been specifically developed for ultrathick, high-aspect-ratio MEMS-type applications using standard lithography equipment. However, in practice, SU-8 has shown to be very sensitive to process parameter variation. The orthogonal array was used in our experiments in order to improve the lithography quality and analyze the interaction among the parameters. The analyses show that the interaction between the exposure dose and post exposure bake has played an important role in adhesion between SU-8 resist and the substrate. The proposed process conditions are given. The output structure has straight sidewall profile, fine line and good space resolution. The aspect ratio is larger than 20. Moreover, several metallic films are used as substrates. The Ti film with oxidation treatment was found to have the strongest adhesion to the resist. The result will help to open possibilities for low-cost LIGA-type process for MEMS applications.     

High aspect ratio fabrication method using O2 RIE and electroplating

A polyimide-based process for the fabrication of vertical structures with high aspect ratio has been developed. O₂ reactive ion etching (O₂ RIE) has been employed in the polyimide processing. Achieved etching characteristics of the O₂ RIE system are: 4.0 m/min etching rate, 15 aspect ratio, 75 m etching depth. Polyimide has excellent chemical and thermal properties which makes it a good building material for micromachines. Polyimide could be also used as molds for electroplating. Electroplated copper structures were formed in the polyimide molds and metal gears were fabricated by these fabrication technologies. New possibilities for micromachining were opened by the use of O₂ RIE and electroplating.This work was supported by Japanese ministry of Education Science and Culture under a grant-in-Aid No. 03102001.     

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. The cross section of a PCB via is fabricated in PMMA to allow optical access to the sample. Fluid flow within two 1:1 aspect ratio blind micro-vias, one with straight side walls and the other with tapered side walls were compared. Flow is also analysed in a 1:1 aspect ratio through via. Flow rates measured using micro-PIV are used to validate simulated flow models. The results show that there are increased flow rates within the blind via with tapered side walls. This goes some way to explaining the improved electroplating results obtained in industry when tapered vias are used. Initial experimental results using megasonic streaming to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition are also reported.     

Fabrication of micro-trench structures with high aspect ratio based on DRIE process for MEMS device applications

The micro-trench structures with high aspect ratio based on the single crystal silicon substrate are fabricated via the deep reactive ion etching (DRIE) process at different etching patterns. The relationship between the micro-trench structures and the DRIE etching patterns is investigated by simulating and processing. The micro-trench structures are obtained to meet the requirements of some MEMS devices for special applications. The profile roughness and micro-trench structures are observed by the atomic force-microscope and the field emission scanning electron microscopy. The verticality (V) of micro-trench structures is average 0.19 in the oxygen environment. The micro-trench structures exhibit better verticality, less roughness and better stability than that of no oxygen. The scalloping effects gradually decreased and the profile becomes more and more polished.