A polar modulator transmitter for GSM/EDGE

This 0.5-/spl mu/m SiGe BiCMOS polar modulator IC adds EDGE transmit capability to a GSM transceiver IC without any RF filters. Envelope information is extracted from the transmit IF and applied to the phase-modulated carrier in an RF variable gain amplifier which follows the integrated transmit VCO. The dual-band IC supports all four GSM bands. In EDGE mode, the IC produces more than 1 dBm of output power with more than 6 dB of margin to the transmit spectrum mask and less than 3% rms phase error. In GSM mode, more than 7 dBm of output power is produced with noise in the receive band less than -164 dBc/Hz.     

A direct-conversion receiver IC for WCDMA mobile systems

A prototype design of a 2.7-3.3-V 14.5-mA SiGe direct-conversion receiver IC for use in third-generation wide-band code-division multiple-access (3G WCDMA) mobile cellular systems has been completed and measured. The design includes a bypassable low-noise amplifier (LNA), a quadrature downconverter, a local-oscillator frequency divider and quadrature generator, and variable-gain baseband amplifiers integrated on chip. The design achieves a cascaded, LNA-referred noise figure (including an interstage surface acoustic wave filter) of 4.0 dB, an in-band IIP3 of -18.6 dBm, and local-oscillator leakage at the LNA input of -112 dBm. The static sensitivity performance of the receiver IC is characterized using a software baseband processor to compute link bit-error rate.     

A single-chip quad-band (850/900/1800/1900 MHz) direct conversion GSM/GPRS RF transceiver with integrated VCOs and fractional-n synthesizer

Recent trends in the integration of entire systems on-chip have spurred the development of homodyne radios as alternatives to the more mature yet harder to integrate superheterodyne architectures. This paper presents a monolithic device that integrates all of the functions necessary to implement a multiband homodyne global system for mobile telecommunications (GSM) radio except for the power amplifier (PA) and radio frequency (RF) passives. The single BiCMOS chip includes a quad-band direct conversion receiver that down converts RF to quadrature analog baseband. The front-end circuitry is followed by a low-DC-offset, high-dynamic-range, analog I/Q baseband chain. The transmit section is comprised of a quad-band up-conversion transmit phase-locked loop (PLL) including on chip transmit voltage-controlled oscillators (VCOs). The stringent GSM receive band phase noise specifications are met without the use of surface acoustic wave filters. A single /spl Sigma//spl Delta/ fractional-N synthesizer locking a fully integrated ultrahigh frequency VCO generates the system local oscillator signal.     

5-GHz CMOS radio transceiver front-end chipset

Incorporating the direct-conversion architecture, a 5-GHz band radio transceiver front end chipset for wireless LAN applications is implemented in a 0.25-μm CMOS technology. The 4-mm² 5.25-GHz receiver IC contains a low noise amplifier with 2.5-dB noise figure (NF) and 16-dB power gain, a receive mixer with 12.0 dB single sideband NF, 13.7-dB voltage gain, and -5 dBm input 1-dB compression point. The 2.7-mm² transmitter IC achieves an output 1-dB compression of -2.5 dBm at 5.7 GHz with 33.4-dB (image) sideband rejection by using an integrated quadrature voltage-controlled oscillator. Operating from a 3-V supply, the power consumptions for the receiver and transmitter are 114 and 120 mW, respectively     

RF front-end of direct conversion receiver RFIC for cdma-2000

We report on the front-end of a highly integrated dual-band direct-conversion receiver IC for cdma-2000 mobile handset applications. The RF front-end included a CELL-band low-noise amplifier (LNA), dual-band direct-conversion quadrature I/Q down-converters, and a local-oscillator (LO) signal generation circuit. At 2.7 V, the LNA had a noise figure of 1.2 dB and input third-order intermodulation product (IIP3) of 9 dBm. I/Q down-converters had a noise figure of 4-5 dB and IIP3 of 4-5 dBm and IIP2 of 55 dBm. An on-chip phase-locked loop and external voltage-controlled oscillator generated the LO signal. The receiver RFIC was implemented in a 0.35-/spl mu/m SiGe BiCMOS process and meets or exceeds all cdma-2000 requirements when tested individually or on a handset.     

A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications

A 0.13-mum SiGe BiCMOS double-conversion superheterodyne receiver and transmitter chipset for data communications in the 60-GHz band is presented. The receiver chip includes an image-reject low-noise amplifier (LNA), RF-to-IF mixer, IF amplifier strip, quadrature IF-to-baseband mixers, phase-locked loop (PLL), and frequency tripler. It achieves a 6-dB noise figure, -30 dBm IIP3, and consumes 500 mW. The transmitter chip includes a power amplifier, image-reject driver, IF-to-RF upmixer, IF amplifier strip, quadrature baseband-to-IF mixers, PLL, and frequency tripler. It achieves output P_1dB of 10 to 12dBm, P_sat of 15 to 17 dBm, and consumes 800 mW. The chips have been packaged with planar antennas, and a wireless data link at 630 Mb/s over 10 m has been demonstrated     

A 22-mA 3.0-dB NF direct conversion receiver for 3G WCDMA

A 2-GHz single-chip direct conversion receiver achieves a 3.0-dB double-sideband noise figure, -14-dBm IIP3 and +17-dBm IIP2 with 60-mW power consumption from a 2.7-V supply. The receiver is targeted for the third generation UTRA/FDD WCDMA system. The low power consumption has been achieved with a proper partitioning and by avoiding buffering between blocks. In the differential RF front end, current boosted quadrature mixers follow the variable-gain low-noise amplifier. At the baseband, on-chip ac-coupled highpass filters are utilized to implement amplification with variable gain having small transients related to gain steps. The outputs of the analog channel selection filters are sampled directly by the two single-amplifier 6-bit pipeline A/D converters. The spurious tones due to the feedthrough of clock harmonics to the RF input increase the noise figure less than 0.1 dB. The receiver has been fabricated with a 0.35-μm 45-GHz f_T SiGe BiCMOS process     

A fully integrated 0.18-/spl mu/m CMOS direct conversion receiver front-end with on-chip LO for UMTS

This paper presents a 0.18-/spl mu/m CMOS direct-conversion IC realized for the Universal Mobile Telecommunication System (UMTS). The chip comprises a variable gain low-noise amplifier, quadrature mixers, variable gain amplifiers, and local oscillator generation circuits. The solution is based on very high dynamic range front-end blocks, a low-power superharmonic injection-locking technique for quadrature generation and continuous-time dc offset removal. Measured performances are an overall gain variable between 21 and 47 dB, 5.6 dB noise figure, -2 dBm out-of-band IIP3, -10 dBm in-band IIP3, 44.8-dBm minimum IIP2, and -155-dBc/Hz phase noise at 135 MHz from carrier frequency, while drawing 21 mA from a 1.8-V supply.     

A single-chip digitally calibrated 5.15-5.825-GHz 0.18-/spl mu/m CMOS transceiver for 802.11a wireless LAN

The drive for cost reduction has led to the use of CMOS technology in the implementation of highly integrated radios. This paper presents a single-chip 5-GHz fully integrated direct conversion transceiver for IEEE 802.11a WLAN systems, manufactured in 0.18-/spl mu/m CMOS. The IC features an innovative system architecture which takes advantage of the computing resources of the digital companion chip in order to eliminate I/Q mismatch and achieve accurately matched baseband filters. The integrated voltage-controlled oscillator and synthesizer achieve an integrated phase noise of less than 0.8/spl deg/ rms. The receiver has an overall noise figure of 5.2 dB and achieves sensitivity of -75 dBm at 54-Mb/s operation, both referred to the IC input. The transmit error vector magnitude is -33 dB at -5-dBm output power from the integrated power-amplifier driver amplifier. The transceiver occupies an area of 18.5 mm/sup 2/.     

A single-chip tri-band (2100, 1900, 850/800 MHz) WCDMA/HSDPA cellular transceiver

This paper describes the design and performance of the first tri-band (2100, 1900, 800/850 MHz) single-chip 3G cellular transceiver IC for worldwide use. The transceiver has been designed to meet all narrowband blocker, newly proposed Adjacent Channel II, and Category 10 HSDPA (High Speed Downlink Packet Access) requirements. The design is part of a reconfigurable reference platform for multi-band, multi-mode (GSM/EDGE + WCDMA) radios. The zero-IF receiver is comprised of a novel multi-band quadrature mixer, seventh-order baseband filtering, and a novel DC offset correction scheme, which exhibits no settling time or peak switching transients after gain steps. The receiver lineup is designed to optimize HSDPA throughput and minimize sensitivity to analog baseband filter bandwidth variations. The direct-launch transmitter is made up of a third-order baseband filter, an I/Q modulator with variable gain, an integrated transformer, an RF variable gain amplifier, and a power amplifier driver. At +9.5-dBm output power, the transmitter achieves an error vector magnitude (EVM) of 4%. Fractional-N synthesizers achieve fast lock times of 50 /spl mu/s (150 /spl mu/s) within 20 ppm (0.1 ppm). Automatically calibrated, integrated VCOs achieve a 1.6-GHz tuning range to facilitate coverage over all six 3GPP frequency bands. The IC draws 34 mA in receive (18-mA receiver plus 16-mA fractional-N PLL/VCO) and 50 to 62 mA in transmit (-76 dBm to +9.5 dBm), including PLL/VCO, using a 2.775-V supply voltage. The RF transceiver is integrated with the baseband signal processing and associated passives in a 165-pad package, resulting in the first tri-band 3G radio transceiver with a digital interface which requires no external components.     

一种2.4GHz正交输出频率综合器

介绍了一种用于bluetooth的基于0.35μm CMOS工艺的2.4GHz正交输出频率综合器的设计和实现.采用差分控制正交耦合压控振荡器实现I/Q信号的产生.为了降低应用成本,利用一个二阶环路滤波器以及一个单位增益跨导放大器来代替三阶环路滤波器.频率综合器的相位噪声为-106.15dBc/Hz@1MHz,带内相位噪声小于-70dBc/Hz,3.3V电源下频率综合器的功耗为13.5mA,芯片面积为1.3mm×0.8mm.     

WCDMA multicarrier receiver for base-station applications

The multicarrier receiver IC described in this paper receives four adjacent WCDMA channels simultaneously in order to reduce the component count of a base-station. The receiver uses low-IF architecture and it is fabricated with a 0.25-/spl mu/m SiGe BiCMOS process to meet the high-performance requirements set by the base-station application. The receiver includes a dual-input low-noise amplifier (LNA), quadrature mixers, a local-oscillator (LO) divider, IIP2 calibration circuits, 10-MHz low-pass filters, and ADC buffers. The receiver noise figures, measured over the downconverted WCDMA channels centered at 2.5-MHz and 7.5-MHz intermediate frequencies, are 3.0 dB and 2.6 dB, respectively. The receiver achieves 47-dB voltage gain and -12-dBm out-of-band IIP3 and consumes 535mW from a 2.5-V supply.     

A 17-mW transmitter and frequency synthesizer for 900-MHz GSM fully integrated in 0.35-/spl mu/m CMOS

A fractional-N phase-locked loop (PLL) serves as a Gaussian minimum-shift keying (GMSK) transmitter and a receive frequency synthesizer for GSM. The entire transmitter/synthesizer is fully integrated in 0.35-/spl mu/m CMOS and consumes 17.4 and 12 mW from 2.5 V in the transmit and receive modes, respectively, including an on-chip voltage-controlled oscillator. The circuit meets GSM specifications on modulation accuracy in transmit mode, and measured phase noise from the closed-loop PLL is -148 dBc/Hz and -162 dBc/Hz, respectively, at 3- and 20-MHz offset. Worst case spur at 13-MHz offset is -77 dBc.     

Improved four-channel direct-conversion SiGe receiver IC for UMTS base stations

This work presents the design and measurement results of an improved four-channel, direct down conversion receiver (DCR) for the application in universal mobile telecommunications system base stations. The whole analog receiver functionality including low noise amplifier, variable gain amplifier, local oscillator frequency divider, in-phase and quadrature DCR mixers and seventh-order active lowpass filter is integrated using Atmel's 50-GHz f/sub t/, 50-GHz f/sub max/ SiGe foundry technology (Atmel, 1998). Important cascaded design parameters of the fully ESD-protected device are a noise figure 1.5 to 2 dB; IIP3 (third-order intercept point) -20.3 to -15.8 dBm and a voltage gain of 51 to 57 dB into a 1000-/spl Omega/ /spl par/ 2.5-pF differential load [analog to digital converter].     

A low-power monolithic CMOS transceiver for 802.11b wireless LANs

A single-chip low-power transceiver IC operating in the 2.4 GHz ISM band is presented. Designed in 0.18 μm CMOS, the transceiver system employs direct-conversion architecture for both the receiver and transmitter to realize a fully integrated wireless LAN product. A sigma-delta (∑△) fractional-N frequency synthesizer provides on-chip quadrature local oscillator frequency. Measurement results show that the receiver achieves a maximum gain of 81 dB and a noise figure of 8.2 dB, the transmitter has maximum output power of-3.4 dBm and RMS EVM of 6.8%. Power dissipation of the transceiver is 74 mW in the receiving mode and 81 mW in the transmitting mode under a supply voltage of 1.8 V, including 30 mW consumed by the frequency synthesizer. The total chip area with pads is 2.7×4.2 mm2.     

A Universal UHF RFID Reader IC in 0.18-µm CMOS Technology

A highly integrated UHF RFID reader IC in 0.18-m CMOS process covering the entire 860 MHz to 960 MHz RFID band supporting the EPCglobaltrade Class-1 Generation-2 and ISO-18000-6A/B/C standards is presented. The IC features a transmitter with an output of 10 dBm and a receiver with sensitivity of 96 dBm in listen-before-talk mode (LBT) and 85 dBm in talk-mode. Direct-conversion architecture is used for the receiver for a high level of integration and low power consumption. On-chip dual-loop synthesizer generates high-purity LO signal with frequency resolution of 50 kHz and phase noise of 101 dBc/Hz at 100 kHz offset over the entire 860 to 960 MHz band. The IC integrates 10-bit DACs, pulse-shaping filters, an IQ modulator and a power amplifier in the transmit chain and a low-noise amplifier (LNA), an IQ downconverter, channel-select filters, variable-gain amplifiers and 10-bit ADCs in the receive chain. On-chip ASK demodulator provides demodulated I and Q raw data outputs. The chip has a die area of 6 mm times 6 mm. It operates over a wide range of voltage and temperature, from 1.6 V to 2.0 V and from C to C and consumes 540 mW from a 1.8 V supply at C.     

An auto-I/Q calibrated CMOS transceiver for 802.11g

The CMOS transceiver IC exploits the superheterodyne architecture to implement a low-cost RF front-end with an auto-I/Q calibration function for IEEE 802.11g. The transceiver supports I/Q gain and phase mismatch auto tuning mechanisms at both the transmitting and receiving ends, which are able to reduce the phase mismatch to within 1/spl deg/ and gain mismatch to 0.1dB. Implemented in a 0.25 /spl mu/m CMOS process with 2.7 V supply voltage, the transceiver delivers a 5.1 dB receiver cascade noise figure, 7 dBm transmit, and a 1 dB compression point.     

A 71-MHz CMOS IF-baseband strip for GSM

An intermediate-frequency (IF) baseband strip for a superheterodyne GSM receiver developed in a 0.25-μm CMOS technology is presented. It contains a 71-MHz IF amplifier, programmable between -20 and +60 dB in 2-dB steps; a quadrature demodulator; and two low-pass output filters for channel selection. Measurements show an overall maximum gain of 89 dB and a noise figure of 3.8 dB. Phase and amplitude mismatches of the demodulator are below 10 and 0.1 dB, respectively. The high linearity required by the blocking and intermodulating signals, which are not completely suppressed by the IF filter, has been achieved using 4.7 mA from the 2,5-V power supply     

A 0.25-/spl mu/m CMOS quad-band GSM RF transceiver using an efficient LO frequency plan

This paper describes a single-chip CMOS quad-band (850/900/1800/1900 MHz) RF transceiver for GSM/GPRS applications. It is the most important design issue to maximize resource sharing and reuse in designing the multiband transceivers. In particular, reducing the number of voltage-controlled oscillators (VCOs) required for local oscillator (LO) frequency generation is very important because the VCO and phase-locked loop (PLL) circuits occupy a relatively large area. We propose a quad-band GSM transceiver architecture that employs a direct conversion receiver and an offset PLL transmitter, which requires only one VCO/PLL to generate LO signals by using an efficient LO frequency plan. In the receive path, four separate LNAs are used for each band, and two down-conversion mixers are used, one for the low bands (850/900 MHz) and the other for the high bands (1800/1900 MHz). A receiver baseband circuit is shared for all four bands because all of their channel spaces are the same. In the transmit path, most of the building blocks of the offset PLL, including a TX VCO and IF filters, are integrated. The quad-band GSM transceiver that was implemented in 0.25-/spl mu/m CMOS technology has a size of 3.3/spl times/3.2 mm/sup 2/, including its pad area. From the experimental results, we found that the receiver provides a maximum noise figure of 2.9 dB and a minimum IIP3 of -13.2dBm for the EGSM 900 band. The transmitter shows an rms phase error of 1.4/spl deg/ and meets the GSM spectral mask specification. The prototype chip consumes 56 and 58 mA at 2.8 V in the RX and TX modes, respectively.