V_2O_5与Al_2O_3复合改性CaSiO_3陶瓷的烧结性能与微波介电性能

为降低CaSiO3陶瓷的烧结温度,通过在CaSiO3粉体中添加1wt%的Al2O3以及不同量的V2O5,探讨了V2O5添加量对CaSiO3陶瓷烧结性能、微观结构及微波介电性能的影响规律。结果表明:适量地添加V2O5除了能将V2O5-Al2O3/CaSiO3陶瓷的烧结温度从1 250℃降低至1 000℃外,还能抑制CaSiO3陶瓷晶粒异常长大并细化陶瓷晶粒。在烧结过程中,V2O5将熔化并以液相润湿作用促进CaSiO3陶瓷的致密化进程;同时,部分V2O5还会挥发,未挥发完全的V2O5将与基体材料反应生成第二相,第二相的出现将大幅降低陶瓷的品质因数。综合考虑陶瓷的烧结性能与微波介电性能,当V2O5添加量为6wt%时,V2O5-Al2O3/CaSiO3陶瓷在1 075℃下烧结2h后具有良好的综合性能,其介电常数为7.38,品质因数为21 218GHz。     

(1-x)(Mg0.9Co0.1)TiO3-x(Ca0.61La0.26)TiO3陶瓷的微波介电性能（英文）

研究了(1-x)(Mg0.9Co0.1)TiO3-x(Ca0.61La0.26)TiO3(MCT-CLT)体系陶瓷的微波介电性能.目的是通过(Ca0.61La0.26)TiO3(CLT)协调(Mg0.9Co0.1)TiO3(MCT)陶瓷的谐振频率温度系数.实验发现,烧结温度和陶瓷组成对微波介电性能影响显著,当烧结温度为1300℃时,可以获得良好的致密度,当烧结温度超过1300℃时,陶瓷致密度和介电性能下降.此外,随着CLT含量的增加,材料的介电常数增大,品质因数减小.当CLT含量为13%,烧结温度为1300℃,保温2h,(MCCLT)陶瓷具有优良微波介电性能,εr=22.4,Q×f=35000 GHz,τf=-8.7×10-6/℃,从而达到实用要求.     

碳源及添加比例对固相烧结碳化硅陶瓷微观结构及性能的影响

研究了碳的添加量为6wt%条件下, 添加碳源的种类及添加比例对制备的无压固相烧结碳化硅陶瓷的微观结构和性能的影响。结果表明: 采用纯无机碳源(碳黑), 制备的碳化硅陶瓷具有较为细小的碳化硅晶粒结构, 但致密度较低; 添加有机碳源(酚醛树脂)时, 随着其裂解碳添加量的增加, 碳化硅的晶粒逐步长大, 碳在材料中的分布更加均匀, 材料的致密度提高, 力学性能增强。当有机碳源裂解碳添加量达3wt%时, 材料的致密度最高, 并具有最大的弹性模量468 GPa, 断裂韧性达4.65 MPa·m^1/2。当有机碳源裂解碳添加量大于3wt%时, 碳化硅晶粒发生局部异常长大现象, 材料的弯曲强度与断裂韧性进一步增加。同时, 对材料的热扩散系数随碳源添加种类和比例变化的规律也进行了分析与讨论。     

(1-x)(Mg0.7Zn0.3)TiO3-xCa0.61La0.26TiO3系陶瓷的微波介电性能研究（英文）

本实验研究了(1-x)(Mg0.7Zn0.3)TiO3-x(Ca0.61La0.26)TiO3(MZT-CLT)系陶瓷的微观结构和微波介电性能,通过(Ca0.61La0.26)TiO3来协调(Mg0.7Zn0.3)TiO3陶瓷的谐振频率温度系数.MZT-CLT陶瓷的主晶相为(Mg0.7Zn0.3)TiO3,第二相为Ca0.61La0.26TiO3和(Mg0.7Zn0.3)Ti2O5.烧结温度和陶瓷组成对微波介电性能影响显著,当烧结温度为1275℃时,可以获得良好的致密度,当烧结温度超过1300℃时,Zn的蒸发导致陶瓷致密度和介电性能下降.随着(Ca0.61La0.26)TiO3含量的增大,材料的介电常数增大,品质因数减小.当x=0.13,烧结温度为1275℃保温4h,(MZT-CLT)陶瓷具有优良微波介电性能,εr=26,Q.f=86000 GHz,τf=-6×10-6/℃.     

掺杂Bi_2Ti_2O_7对Y_2O_3-2TiO_2系微波介质陶瓷材料性能的影响

目前国内外对εr范围在40～80左右的中介电常数微波介质陶瓷体系的研究还很缺乏。为适应现代微波通讯技术发展需求,本实验研究开发了新型中介电常数Y2O3-2TiO2系微波介质陶瓷,并在此基础上添加Bi2Ti2O7陶瓷粉料进行复相掺杂。利用网络分析仪,阻抗分析仪,XRD,SEM等方法,本文重点研究了不同Bi2Ti2O7掺杂量对Y2O3-2TiO2系微波介质陶瓷材料烧结性能和介电性能的影响。通过分析发现适量掺杂能够有效降低材料的烧结温度,并使材料致密化。同时由于Bi3+置换主晶相中的Y3+形成了固溶体,材料主晶相为烧绿石结构并未改变。当添加质量分数为8wt%时获得介电性能较好的陶瓷材料,烧结温度从未掺杂的1460℃降低到1320℃。在1M下:εr≈62.14,tanδ≈1.22×10-3,微波频率(4.55GHz)下εr≈62.85,Q.f=4122.8GHz,τf=-7ppm/℃。     

掺杂改性在微波介质陶瓷中的应用

综述了近年来微波介质陶瓷研究中掺杂改性的应用概况.掺加烧结助剂多用来降低微波介质陶瓷的烧结温度,取代常常用来调整材料的介电性能和温度系数.根据以往所得出的掺杂改性对陶瓷的影响,调节材料的性能以满足使用的需要是研究的热点.     

Bi2O3掺杂对Mg4Nb2O9陶瓷的微结构及微波介电性能的影响

采用固相反应法制备了Mg4Nb2O9基微波介质陶瓷,研究了Bi2O3掺杂对Mg4Nb2O9陶瓷烧结行为、相结构、显微结构及微波介电性能的影响。实验结果表明:Mg4Nb2O9陶瓷烧结温度随Bi2O3掺杂量的增加而减小,添加2.0wt%Bi2O3,烧结温度从1350℃降低至1175℃;随Bi2O3添加量从0.0wt%增大到3.0wt%,最强峰(104)晶面间距d值由2.756nm增大至2.769nm;Mg4Nb2O9陶瓷的微波介电性能随Bi2O3掺杂量增加而变化;掺杂2.0wt%Bi2O3的Mg4Nb2O9陶瓷在1175℃保温2小时烧结,获得亚微米级陶瓷,且具有最佳的微波介电性能,εr为12.58,Q×f为71949.74GHz。     

SiC(N)/LAS吸波材料吸波性能研究

研究了由SiC(N)纳米吸收剂制备的SiC(N)/LAS吸波材料的介电性能,对影响介电性能的吸收剂的含量、吸波材料烧结温度和碳界面层等因素进行了较为全面的研究。结果表明,在1080℃以下烧结温度对陶瓷致密度的影响较大而对陶瓷介电常数的影响较小;在1080℃以上烧结温度对烧结致密度的影响较小,对陶瓷介电常数的影响较大,吸波材料介电常数的实测值与计算值之间存在很大的差异,这种差异是吸波材料制备过程中纳米级的SiC(N)促进了碳界面层形成,导致了在较高温度烧结时吸波材料介电常数对温度的敏感性,使吸波材料介电常数的实测值与计算值之间出现了很大的差异,形成的碳界面层复介电常数的虚部较高,使吸波材料对电磁波的损耗进一步升高,从而使吸波材料的吸波性能得到增强。     

ZBL低温助烧CaCu3Ti4O12高介电陶瓷的研究

采用固相合成CaCu_3Ti_4O_(12)(CCTO)微波介质陶瓷基体粉体,通过XRD衍射仪、SEM扫描电镜表征掺杂ZnO-B_2O_3-La_2O_3(ZBL)低软化点玻璃助烧剂的(CCTO)陶瓷的物相组成及结构特点,研究ZBL玻璃的掺杂量对CCTO样品烧结性能及微波介电性能的影响。研究表明:添加10%(质量分数)ZBL玻璃的CCTO陶瓷在960℃烧结3h,能够获得较好的介电性能:εr=112,tanδ=0.0027,τf=-2×10-6/℃。     

含先驱体聚合物浆料浇注成型制备SiC多孔陶瓷

采用SiC粉体与聚碳硅烷(PCS)为原料浇注成型低温烧结制备SiC多孔陶瓷,研究了PCS含量对SiC多孔陶瓷性能的影响。结果表明,PCS含量大于2wt%时可浇注成型,PCS经烧结后生成裂解产物将SiC颗粒粘结起来。所得SiC多孔陶瓷孔径呈单峰分布、孔径分布窄、热膨胀系数低、烧结过程中线收缩率小。随着PCS含量的增大烧成SiC多孔陶瓷的孔隙率降低,但强度显著提高。PCS含量为6wt%时多孔陶瓷的孔隙率、弯折强度和线收缩率分别为36.2%、33.8MPa和0.42%。     

Microstructure and properties of spark plasma sintered AlN ceramics

Spark plasma sintering (SPS) is a newly developed technique that enables poorly sinterable aluminum nitride (AlN) powder to be fully densified. It is addressed that pure AlN sintered by SPS has relatively low thermal conductivity. In this work, SPS of AlN ceramic was carried out with Y₂O₃, Sm₂O₃ and Li₂O as sintering aids. Effects of additives on AlN densification, microstructure and properties were investigated. Addition of sintering aids accelerated the densification, lowered AlN sintering temperature and was advantageous to improve properties of AlN ceramic. Thermal conductivity and strength were found to be greatly improved with the present of Sm₂O₃ as sintering additive, with a thermal conductivity value about 131 Wm⁻¹K⁻¹ and bending strength about 330 MPa for the 2 wt% Sm₂O₃-doped AlN sample SPS at 1,780 °C for 5 min. XRD measurement revealed that additives had no obvious effect on the AlN lattice parameters. Observation by SEM showed that AlN ceramics prepared by SPS method manifested quite homogeneous microstructure. However, AlN grain sizes and shapes, location of secondary phases varied with the additives. The thermal conductivity of AlN ceramics was mainly affected by the additives through their effects on the growth of AlN grain and the location of liquid phases.     

添加Y-Li-Ca系统的AlN陶瓷的低温烧结

本文探索了以自蔓延高温（SHS）法合成并经抗水化处理的AlN粉为原料,添加YLiO₂－CaF₂／YLiO₂－CaCO₃的AlN陶瓷的低温烧结.研究表明,YLiO₂－CaF₂／YLiO₂－CaCO₃是有效的低温烧结助剂,添加5wt％YLiO₂和0．5wt％CaF₂。,在1675℃下保温6h可得到密度为3．29g／cm³、热导率为97w／m.K的中等性能的AlN陶瓷.同时对YLiO₂-CaF₂、YLiO₂－CaCO₃两种添加剂系统进行了对比研究．结果表明,在同样的烧结条件下,前者对AlN陶瓷的低温烧结更为有利．     

微波烧结制备ZrO2-AlN复合陶瓷的微观结构与性能研究

氧化锆(ZrO₂)陶瓷具有出色的机械性能, 但其应用受到低热导率(Thermal Conductivity, TC)的限制。本研究设计并通过微波烧结制备了高热导率氧化锆-氮化铝(AlN)复合陶瓷, 优化制备条件后, 抑制了两种物质之间的反应, 获得了致密的复合陶瓷(相对密度>99%), 详细研究了该复合陶瓷的组织演变、热学性能和力学性能。研究结果表明, 随着AlN含量的增加, 复合陶瓷的室温下热导率、热扩散系数和热容增加, 分别达到41.3 W/(m·K)、15.2 mm²/s和0.6 J/(g·K)。这种具有高热导率和抗热震性的ZrO₂-AlN复合复合陶瓷在能源系统的高温热交换材料领域具有广阔的应用前景。     

Ca0.3(Li1/2Sm1/2)0.7TiO3微波介质陶瓷的低温烧结研究

采用传统陶瓷制备工艺, 制备了掺杂Na₂O-CaO-B₂O₃(NCB)氧化物的Ca_0.3(Li_1/2Sm_1/2)_0.7TiO₃(CLST)陶瓷, 研究了NCB掺杂量与晶相组成、显微结构、烧结性能及微波介电性能的关系. 研究结果表明: 复合氧化物NCB掺杂量在1wt%～15wt%范围内没有杂相生成, 晶相仍呈斜方钙钛矿结构. 随着NCB添加量的增加, 陶瓷致密化温度和饱和体积密度降低, 介电常数ε_r、无载品质因数与谐振频率乘积Qf值也呈下降趋势, 频率温度系数τ_f向正方向增大. NCB氧化物掺杂能有效地将CLST陶瓷的烧结温度由1300℃降低至900℃. 添加12.5wt% NCB的CLST陶瓷在低温900℃烧结5h仍具有良好的微波介电性能: ε_r=73.7, Qf=1583GHz, τ_f=140.1×10-6/℃, 满足高介多层微波器件的设计要求.     

Effects of carbon nanotubes and carbon fiber reinforcements on thermal conductivity and ablation properties of carbon/phenolic composites

The ablation properties and thermal conductivity of carbon nanotube (CNT) and carbon fiber (CF)/phenolic composites were evaluated for different filler types and structures. It was found that the mechanical and thermal properties of phenolic-polymer matrix composites were improved significantly by the addition of carbon materials as reinforcement. The concentrations of CF and CNT reinforcing materials used in this study were 30 vol% and 0.5 wt%, respectively. The thermal conductivity and thermal diffusion of the different composites were observed during ablation testing, using an oxygen–kerosene (1:1) flame torch. The thermal conductivity of CF mat/phenolic composites was higher than that of random CF/phenolic composites. Both CF mat and CNT/phenolic composites exhibited much better thermal conductivity and ablation properties than did neat phenolic resin. The more conductive carbon materials significantly enhanced the heat conduction and dissipation from the flame location, thereby minimizing local thermal damage.     

Microstructure and thermal conductivity of spark plasma sintering AlN ceramics

Abstract

Dense aluminium nitride ceramics were prepared by spark plasma sintering at a lower sintering temperature of 1700°C with Y₂O₃, Sm₂O₃ and Dy₂O₃ as sintering additives respectively. The effects of three kinds of sintering additives on the phase composition, microstructure and thermal conductivity of AlN ceramics were investigated. The results showed that those sintering additives not only facilitated the densification via the liquid phase sintering mechanism, but also improved thermal conductivity by decreasing oxygen impurity. Sm₂O₃ could effectively improve thermal conductivity of AlN ceramics compared with Y₂O₃ and Dy₂O₃. Observation by scanning electron microscopy showed that AlN ceramics prepared by spark plasma sintering method manifested quite homogeneous microstructures, but AlN grain sizes and shapes and location of secondary phases varied with the sintering additives. The thermal conductivity of AlN ceramics was mainly affected by the additives through their effects on the growth of AlN grain and the location of secondary phases.     

Effects of LiF addition on the sintering behavior and microwave dielectric properties of Li<Subscript>2</Subscript>Mg<Subscript>3</Subscript>SnO<Subscript>6</Subscript> ceramics

Li₂Mg₃SnO₆ (abbreviation for LMS) ceramics doped with 1–4 wt% lithium fluoride (LiF) were prepared by the conventional solid-state reaction method. The effects of LiF addition on the phase compositions, sintering behaviors and microwave dielectric properties of LMS ceramics were investigated. A small amount of LiF addition could effectively decrease the sintering temperatures due to the liquid phase in the sintering process and induced no apparent degradation of the microwave dielectric properties. The optimized quality factor values for each composition firstly increased and then decreased with the increase of the LiF content. Whereas, the optimized dielectric permittivity increased with increasing of the LiF content. Distinguished microwave dielectric properties with a dielectric constant (ε _r) of 11.13, a quality factor (Q·f) of 104,750 GHz, and a temperature coefficient of resonant frequency (τ _f ) of ?10.83 ppm/°C were obtained for LMS ceramics sintered at 950?°C doped with 3 wt% LiF, which showed that the materials were suitable for the low temperature co-fired ceramics applications (LTCC).     

温度对高压烧结氮化铝陶瓷热导率的影响

以直接氮化法合成的AlN微米粉为原料,添加3%(质量分数)的CaC2为烧结助剂,在5GPa的压力下烧结30min,考察不同烧结温度对AlN陶瓷热导率的影响。用阿基米德排水法、XRD、SEM等技术手段对AlN烧结体进行性能检测。研究表明,在1500～1800℃范围内,温度的升高能促使AlN陶瓷内部晶粒长大,晶型饱满,尺寸均一,晶界相减少,实现烧结致密化,利于热导率的提高。     

(YCa)F3助烧AlN陶瓷的显微结构和热导率

采用（ＣａＹ）Ｆ_３为助烧结剂，低温烧结（１６５０℃， ６ｈ）制备出热导率为２０８Ｗ／ｍ·Ｋ的ＡＩＮ陶瓷，在烧结过程中，热导率随保温时间的变化服从方程：λ（ｔ）＝λ∞－△λ（０）·ｅ~（－ｔ／ｒ）·用ＳＥＭ、 ＳＴｈＭ、 ＴＥＭ和 ＨＲＥＭ对 ＡＩＮ陶瓷的显微结构及其对热导率的影响进行了研究，结果表明，晶粒尺寸对ＡＩＮ陶瓷热导率的影响可以忽略，而分隔在ＡＩＮ晶粒之间的晶界相会降低热导率。