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1.
本文用瞬态电容、热激电容和热激电流方法测量n型硅中铂和钯的电学性质.n型硅中铂的二个能级是E_c-0.22eV和E_c-0.30eV.掺钯的n型硅中亦存在二个能级为E_c-0.23eV和 E_c-0.29eV.第二个深能级 E_c-0.29eV由于它的位置和浓度与高温淬火引起的能级相仿,所以这一能级的起因尚需进一步研究.  相似文献   

2.
CWCO_2激光在硅中引入的位错深能谱研究   总被引:1,自引:0,他引:1  
用高功率密度的CWCO_2激光扫描在硅中引入了较单纯清洁的位错,并利用DLTS技术对其深能级谱进行了测量.在p型和n型硅中分别测到 E_v+0.33eV和 E_c-0.37eV,E_c-0.50eV三个深能级谱峰.实验结果表明,位错线上的断键是重构的,重构后只有少部分位错态是电活性的.氢等离子体退火对电活性的位错态有显著的钝化作用.  相似文献   

3.
研究了高阻区熔和直拉单晶(扩铝)的P~+n管经电子辐照后产生的缺陷能级和它们的退火特性.区熔单晶中辐照生成的主要缺陷能级为 E:-0.43eV (双空位)和 E_v+ 0.49eV.在300℃退火后,这些能级的浓度与未退火前基本相同.直拉单晶中辐照生成的缺陷能级为E_c-0.18eV (氧空位对)和 E_v+ 0.49eV.在200℃以上退火后,氧空位明显减小并在300℃消失.  相似文献   

4.
通过电学、光学和深能级瞬态谱(DLTS)的测量,研究了硅中“氢-缺陷络合物”施主的行为.测得了同氢有关的三个能级:E_c-0.026eV、E_c-0.037eV,E_c-0.265eV.证实该施主中心的产生,跟材料中硅氢键以及某种结构正在研究的特定缺陷的存在密切相关.还通过多方面实验证实,它同已知的“450℃退火形成的氧施主”完全不同.最后指出,利用在氢气中区熔生长的NTD硅来研究孤立氢原子在硅中的行为,比用其他方法更为有利.这为氢在硅中的电活性提供了新的证据.  相似文献   

5.
龚敏  游志朴 《半导体学报》1987,8(2):207-209
观测到掺铂硅中 E_c-0.23eV能级的 DLTS信号因电子辐照而衰减,而E_v+0.32eV能级则对电子辐照不敏感.这一实验结果使我们认为,掺铂硅中的两个能级不是与同一个深中心有关的.  相似文献   

6.
本文采用多种硅材料,对扩Pd快速淬火在硅中引入的两个与Pd相关的新能级E_A(E_c-0.37eV)、E_B(E_c-0.59eV)进行了系统的实验研究,结果进一步支持了E_A和E_B属于同一缺陷的不同能量状态的看法,但发现缺陷的微观构成与B无直接关联,而很可能同间隙Pd与硅中本征空位缺陷形成的络合物相关.  相似文献   

7.
本文研究了GaAs MESFET的12MeV电子辐照效应.在n型VPE GaAs有源层中电子辐照感生了E_1~'(E_c-0.38eV)、E_2~'(E_c-0.57eV)、E_s~'(E_c-0.74eV)缺陷.研究表明,GaAsMFSFET参数的变化主要是由于载流子去除效应.对器件载流子去除率进行了计算,其值在8-30cm~(-1)范围内.迁移率退化因子是比较小的,在室温大约为10~(-17)cm~2量级.  相似文献   

8.
Si:Pd深能级的研究   总被引:1,自引:0,他引:1  
用三种钯源对p~+nn~+和n~+pp~+硅二极管进行了扩散掺杂,井用深能级电容瞬态谱仪(DLTS)对它们作了测量.在适当的工艺条件下,在各类样品中均观察到能量为E_c-0.37eV和E_c-0.62eV两个浓度居统治地位的新的电子陷阱能级.从实验上证明了以上两个能级确是由进入硅点阵中的钯杂质所引起,并确定了它们和文献报道过的Si:Pd 能级间的相互转化关系.由这些能级的产生条件,退火特性以及电学测量结果来看,这两个新能级应分别与硅中间隙钯所引起的两种不同荷电态的施主中心相对应.  相似文献   

9.
作为本文研究的主要目的,证实了X_α—重叠球方法在研究共价半导体中深能级杂质的适用性.作者利用自旋非极化的X_α—重叠球方法计算了硅中硫、氧和碳的杂质能级,得到了与实验或理论基本一致的结果.中性硫原子在硅中为处于E_c-0.39eV的深施主能级.中性氧原子在硅中的行为与理论预言大体相符,为E_v+0.22eV的深施主能级.本文得到的硅中杂质碳的能级是E_c-0.08eV,它可能为处于较浅部位的深杂质能级.  相似文献   

10.
This paper reports some results in the investigation of deep levels in titaniumdiffusion-doped silicon;there Ti-related doep levels are observed by the DLTS.There are two elettrontraps located at E_c-0.23eV and E_c-0.53eV in n-Si(Ti)and a hole trap located at E_v+0.32eV in p-Si(Ti).Thermal activation energy and the capture cross-section in the range of experimentaltemperature and other related parameters for these traps are obtained by transient capacitance studies.Furthermore,from our experimental results,a brief discussion on the bonding feature of traps and ontheir pinning to which band is given.  相似文献   

11.
DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.  相似文献   

12.
From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.  相似文献   

13.
The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.  相似文献   

14.
The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.  相似文献   

15.
Today, micro-system technology and the development of new MEMS (Micro-Electro-Mechanical Systems) are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.  相似文献   

16.
Waveguide multilayer optical card (WMOC) is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling & processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic (VB) language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.  相似文献   

17.
This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel's.  相似文献   

18.
The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.  相似文献   

19.
Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.  相似文献   

20.
An insert layer structure organic electroluminescent device(OLED) based on a new luminescent material (Zn(salen)) is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn(salen)/Liq/LiF/A1/CuPc/NPD/Zn(salen)/Liq/LiF/A1. Effective insert electrode layers comprising LiF(1nm)/Al(5 nm) are used as a single semitransparent mirror, and bilayer cathode LiF(1 nm)/A1(100 nm) is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.  相似文献   

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