共查询到19条相似文献,搜索用时 140 毫秒
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差值取样数对氧化层电流弛豫谱分辨率与灵敏度的影响* 总被引:2,自引:2,他引:0
本文讨论了差值取样数对氧化层电流弛豫谱(OCRS)分辨率与灵敏度的影响,给出了差值取样数七在实际分析过程中的最佳选择原则,研究了用计算机技术改善氧化层电流弛豫谱的灵敏度问题。 相似文献
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随着器件尺寸的迅速减小,直接隧穿电流将代替FN电流而成为影响器件可靠性的主要因素.根据比例差值算符理论和弛豫谱技术,针对直接隧穿应力下超薄栅MOS结构提出了一种新的弛豫谱--恒压应力下的直接隧穿弛豫谱(DTRS).该弛豫谱保持了原有弛豫谱技术直接、快速和方便的优点,能够分离和表征超薄栅MOS结构不同氧化层陷阱,提取氧化层陷阱的产生/俘获截面、陷阱密度等陷阱参数.直接隧穿弛豫谱主要用于研究直接隧穿注入的情况下超薄栅MOS结构中陷阱的产生和复合,为超薄栅MOS结构的可靠性研究提供了一强有力工具. 相似文献
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超薄栅MOS结构恒压应力下的直接隧穿弛豫谱 总被引:1,自引:1,他引:0
随着器件尺寸的迅速减小 ,直接隧穿电流将代替 FN电流而成为影响器件可靠性的主要因素 .根据比例差值算符理论和弛豫谱技术 ,针对直接隧穿应力下超薄栅 MOS结构提出了一种新的弛豫谱——恒压应力下的直接隧穿弛豫谱 (DTRS) .该弛豫谱保持了原有弛豫谱技术直接、快速和方便的优点 ,能够分离和表征超薄栅 MOS结构不同氧化层陷阱 ,提取氧化层陷阱的产生 /俘获截面、陷阱密度等陷阱参数 .直接隧穿弛豫谱主要用于研究直接隧穿注入的情况下超薄栅 MOS结构中陷阱的产生和复合 ,为超薄栅 MOS结构的可靠性研究提供了一强有力工具 . 相似文献
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使用双曲函数拟合描绘出从应力偏置转换到测试偏置后,不同时刻的表面电势、电场强度和电场梯度的动态弛豫过程。计算出这一偏置转换引发的亚稳态能带。亚稳态能带的弛豫过程描绘出沟道夹断后的异质结充电过程。亚稳态能带计算证明外沟道中的强场峰、电场梯度峰、能带谷和能带峰都由局域电子气电荷引起,局域电子气的慢输运行为延缓了异质结充电过程,拉长了偏置转换中的亚稳态能带转换弛豫。当负应力栅压向空间电荷区注入电子给陷阱充电时,陷阱电荷叠加在局域电子气电荷上,强化了能带畸变和电流崩塌。由此提出涉及异质结能带转换的新虚栅模型。在新虚栅模型下异质结能带变化引发的电子气状态变化比旧虚栅模型中的电子耗尽作用强得多,据此能够解释从漏控DLTS测得的外沟道陷阱密度比栅控DLTS测得的内沟道陷阱密度大1~2个数量级的实验结果。使用涉及能带转换的新虚栅模型讨论了GaN HFET研究中的电流崩塌、3 mm场效应管及可靠性难题。提出二维异质结构用异质结鳍来研制场效应管的新课题。 相似文献
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Numerical simulations are performed to demonstrate that a new SOI power MOSFET structure, namely buried oxide step structure (BOSS), introduces a high electric field peak near the buried oxide step and that this peak reduces the height of the other electric field peaks within thin silicon layer. The relaxation of these peaks results in higher breakdown voltages at much higher impurity concentrations than those in the conventional structure 相似文献
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本文的实验结果表明,从6MV/cm到14MV/cm的外加电场范围内,在氮氧化硅膜的漏电机理与常规方法生长的氧化硅的不同,氮氧化硅膜漏电机理可分为三种,当电小于8MV/cm时,漏电是由于注入电子的直接隧穿填充绝缘体中的浅陷阱而引起的。在高场范围(>10MV/cm)Fowler-Nordheim(FN)效应占支配地位。这些机理与介质膜的制备条件有关。在中等电场区域,注入电子能通过FN电流和直接隧穿到达 相似文献
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M. Toledano-Luque B. KaczerE. Simoen Ph. J. RousselA. Veloso T. GrasserG. Groeseneken 《Microelectronic Engineering》2011,88(7):1243-1246
Quantized threshold voltage (VTH) relaxation transients are observed in nano-scaled field effect transistors (FETs) after bias temperature stress. The abrupt steps are due to trapping/detrapping of individual defects in the gate oxide and indicate their characteristic emission/capture times. Individual traps are studied in n-channel SiO2/HfSiO FETs after positive gate stress to complement previous studies performed on SiO(N). Similarly to single SiO(N) traps, strong thermal and bias dependences of the emission and capture times are demonstrated. The high-k traps have a higher density but a reduced impact on VTH due to their separation from the channel. 相似文献
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The spatial profiles of hot-carrier-induced interface traps in MOSFETs with abrupt arsenic junctions and oxide thickness of 10-38 nm are determined using charge pumping both in the conventional manner and with a modified constant-field approach. For the thinnest oxides the damage is highly localized in a very sharp peak that is located inside the drain at the point of maximum lateral electric field. In thicker oxides, the damage peak is broader and is shifted toward the edge of the drain junction. Two-dimensional device simulations using the measured profiles are in qualitative agreement with measured I -V characteristics after degradation. However, the magnitude of the predicted degradation is underestimated, suggesting that significant electron trapping occurs also 相似文献
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《Solid-state electronics》1987,30(10):991-1003
A method for separation and calculation of gate oxide and surface state charges in CMOS transistors have been developed, leading to a significant improvement of the analysis of CMOS integrated circuit instabilities. In order to demonstrate the usefulness of the method, an analysis of instabilities in transistors subject to high electric field and high temperature-bias stress has been carried out. Four instability mechanisms associated with high electric field stress are observed. Successively we consider a positive gate oxide charge increase due to hole tunneling from the silicon valence band into oxide hole traps (in case of negative gate bias), electron tunneling from oxide electron traps into the oxide conduction band (in case of positive gate bias), and a surface state charge increase due to tunneling of electrons from the metal to the silicon (in case of negative gate bias) or from the silicon to the metal (in case of positive gate bias). In addition instabilities associated with high temperature-bias stress are observed: drift of mobile ions in the gate oxide, increase of positive trapped charge in the gate oxide and simultaneous increase of the surface state and negative gate oxide charges. 相似文献
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《Electron Device Letters, IEEE》1987,8(5):234-236
Aging studies on NMOS transistors with dry oxides at room temperature have revealed that the creation of interface traps and the trapping of positive charge in the oxide associated with hot-electron effects are not permanent, but can be reversed to some extent if the transistor drain is grounded and left for some time. The relaxation is a substantial fraction of the original degradation at low degradation values and suggests that there is an annealing of some of the traps created by stressing. This annealing follows first-order kinetics for both created interface traps and trapped oxide charge, and is characterized by relaxation times τr of 600-900 s. 相似文献
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Neugroschel A. Chih-Tang Sah Carroll M.S. Pfaff K.G. 《Electron Devices, IEEE Transactions on》1997,44(5):792-800
The base current relaxation transient following reverse emitter-base (EB) bias stress and its effect on time-to-failure (TTF) determination are examined in self-aligned and nonself-aligned silicon bipolar junction transistors (BJTs) with thermal and deposited base oxide. A quantitative model indicates that the transient is due to a reduction of the stress-generated positive charge trapped in the oxide layer near the emitter-base junction due to holes tunneling from oxide hole traps to silicon band states or SiO2/Si interface traps. The neutral oxide hole traps may be quickly recharged through hole tunneling or hole injection into the oxide during further reverse-bias stress. A delay time of ~10-3 s was observed after the termination of stress before base current relaxation begins, which affects the extraction of the ac operation TTF from dc stress measurements 相似文献