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介质薄膜的透射光谱测量及其光学参数的分析 总被引:7,自引:1,他引:6
介绍介质薄膜透射光谱的测量以及基于分析薄膜透射光谱的计算薄膜光学参数的方法。对制备在玻璃基板上的二氧化钛,二氧化硅和氧化锌薄膜进行了可见光谱区的透射比测量,并用包络线方法和最优化方法对这些透明薄膜的光学参数进行了计算和分析。 相似文献
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采用PECVD技术,以Pb(C2H5)、HiCl4和O2为反应源,在170℃温度下沉积了PbTiO3功能薄膜,分别对薄膜进行了X射线荧光光谱、X光电子能谱、X射线衍射光谱和扫描电镜的化学组成及形貌等分析。 相似文献
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带本征薄层的异质结(HIT)太阳能电池要求本征非晶硅薄膜具有生长速率低,暗电导大,光学带隙宽的特点。采用等离子增强化学气相沉积(PECVD)制备符合HIT太阳能电池要求的本征非晶硅薄膜,并通过分析薄膜的透射光谱,采用Tauc法计算了薄膜的光学带隙,为约1.87eV,衬底温度为180℃,放电功率为80W时获得的薄膜性能最佳。 相似文献
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TiB2超硬薄膜的合成及性能 总被引:7,自引:0,他引:7
采用离子束溅射方法制备了TiB2硬质薄膜,AFM观察表明薄膜表面非常光谱,AES、XRD和XPS分析证明薄膜中主要是B、Ti比为1.8,六方结构的TiB2多晶体、且呈现强烈的(101)择优取向,由超显微压痕测量系统测得的加载、卸载曲线计算得到的薄膜的显微硬度比高达48GPa 相似文献
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具有可见光活性的TiO2薄膜的制备及光催化性能 总被引:4,自引:0,他引:4
运用磁控溅射技术在浸渍-提拉法制得的TiO2薄膜上溅射三氧化钨层得到光催化薄膜。采用SEM、XRD、AES、UV-vis漫反射光谱等方法表征催化剂薄膜的厚度、晶相结构、化学元素组成及光吸收性能。以甲基橙的光催化降解为反应模型,高压汞灯为光源,溅射有三氧化钨薄膜的光催化活性低于纯TiO2薄膜;滤过紫外光后,溅射有三化钨的薄膜光催化活性明显高于纯TiO2薄膜。本实验提供了一种制备高可见光活性的TiO2薄膜的方法。 相似文献
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Thin films of silicon carbide nitride (SiCN) have been prepared by reactive radioactive frequency (r.f.) sputtering using SiC target and nitrogen as the reactant gas. Deposition rates are studied as a function of deposition pressures and argon-nitrogen flow ratios. The optical absorption studies indicated the band edge shifting of the films when the nitrogen ratios are increased during deposition. Fourier transform infrared spectroscopy (FTIR) analysis on the films indicated several stretching modes corresponding to SiC, SiN and CN compositions. 相似文献
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磁控溅射参数对CNx薄膜成分,化学结合状态和硬度的影响 总被引:4,自引:0,他引:4
应用直流非平衡磁控溅射系统在不同实验条件下制备了CNx薄膜材料,其最大氮原子百分含量为37%,通过傅里叶变换红外光变。X光光电子能谱以及显微压痕法的测量和分析,对得到的CNx薄膜材料中的原子化学结合状态,硬度等性质进行了表征。 相似文献
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Carbon nitride CN. thin films have been deposited on polycrystalline β-Si3N4 substrates by un-balanced magnetron sputtering in a nitrogen discharge. Both the film deposition rate and the nitrogen concentration decrease with substrate temperature increase in the range of 100~400℃The maximum of nitrogen content is 40 at. pct. Raman spectroscopy and atomic force mi-croscopy were used to characterize the bonding, microstructure and surface roughness of the films. Nanoindentation experiments exhibit a higher hardness of 70 GPa and an extremely elas-tic recovery of 85% at higher substrate temperature. 相似文献
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A CN/diamond composite structure on silicon substrate was obtained by a two-step technique in preparing polycrystalline diamond layers by microwave plasma assisted chemical vapor deposition and then CN films by reactive rf magnetron sputtering. The samples were annealed at different temperatures in the range of 200 to 800 °C, respectively. All the as-grown and annealed CN films, which fully covered the diamond underlayer with the formation of a rather adhesive interface, exhibited amorphous nature uniquely. X-ray photoelectron spectroscopy and energy-dispersive x-ray studies both revealed that the nitrogen concentration of the films decreases after annealed at high temperature. Infrared spectra also suggested the thermal modifications on the content and structure of the CN films. The electric resistivity varies in a large range as the annealing temperature increasing, and confirmed the bonding configuration in favor of a graphite-like structure at high temperature. 相似文献
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The adhesion improvement of biocompatible thin films on medical metal alloy substrates commonly used for joint replacement implants is studied. Diamond-like carbon (DLC) and carbon nitride (CN) thin films are, because of their unique properties such as high hardness, wear resistance and low friction coefficient, candidates for coating of medical implants. However, poor adhesion on substrates with high thermal expansion coefficient limits their application. We deposited CN films by pulsed DC discharge vacuum sputtering of graphite target on CoCrMo and Ti6Al4V substrates. Surface nitridation of the substrate, changing the deposition parameters and use of interlayer led to improved adhesion properties of the films. Argon and nitrogen gas flow, thickness of the film and frequency of the deposition pulses had significant influence on the adhesion to the substrate. Properties of deposited films were analyzed using Scanning Electron Microscopy, Raman spectroscopy and tribology tests. 相似文献
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T. Vandevelde T. D. Wu C. Quaeyhaegens J. Vlekken M. DOlieslaeger L. Stals 《Thin solid films》1999,340(1-2):159-163
The mechanisms of nitrogen incorporation in diamond are still an unsolved riddle. This is mainly due to the complexity of the processes involved as they not only depend on empirical parameters (e.g. vessel pressure, substrate temperature, the gas phase composition, type and concentration of the nitrogen containing compound used), but also on the plasma chemistry and the surface chemical reactions. In this study, small quantities (ppm range) of diatomic nitrogen are added to a conventional hydrogen-methane feed gas mixture in order to investigate the effect of nitrogen incorporation in diamond films prepared by microwave plasma assisted chemical vapour deposition (CVD). Optical emission spectroscopy (OES) is used to survey the plasma composition during deposition. The intensities of the CN, CH and C2 emitting radicals and the Balmer atomic hydrogen emission lines are correlated to the Raman film quality and to the nitrogen content in the film measured by secondary ion mass spectrometry (SIMS). 相似文献
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1. IntroductionThansparellt conducting zinc oxide films have beenextensively studied in recede years, because of theirlow material cost, relatively low deposition temperature and stability in hydrogen plasma compared withITO and SnOZ films[1]. These adVatages are of considerable interest for electrrvoptical conversion device.Compared with undoped ZnO, Al-doped ZnO filmshave lobed resistivity and better stability. nansparellt conducting films deposited on organic substrateshave many lments… 相似文献
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Adhesion and delamination behavior of amorphous carbon nitride (a-CN(x)) is critical to development of wear resistant materials and protective coatings. Here, the composition and delamination behavior of a-CN(x) films was explored utilizing BrCN, CH?CN, and CH? as film precursors, either alone or in combination with one another. Film delamination depends on film thickness and plasma composition as well as post deposition treatment conditions. Delamination is not observed with films deposited from 100% CH?CN discharges, whereas films of similar thickness deposited from 100% BrCN plasmas delaminate almost immediately upon exposure to atmosphere. Exploration of these differences in delamination behavior is discussed relative to contributions of humidity, hydrocarbon species, and ion bombardment during deposition in conjunction with compositional studies using X-ray photoelectron spectroscopy (XPS). 相似文献
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We examined the atomic layer deposition (ALD) of silicon dioxide thin films on a silicon wafer by alternating exposures to tetrakis(ethylamino)silane [Si(NHC2H5)4] and O3. The growth kinetics of silicon oxide films was examined at substrate temperatures ranging from 325 to 514 degrees C. The deposition was governed by a self-limiting surface reaction, and the growth rate at 478 degrees C was saturated at 0.17 nm/cycle for Si(NHC2H5)4 exposures of 2 x 10(6) L (1 L = 10(-6) Torr x s). The films deposited at 365-404 degrees C exhibited a higher deposition rate of 0.20-0.21 nm/cycle. However, they contained impurities, such as carbon and nitrogen, and showed poor film qualities. The concentration of impurities decreased with increasing substrate temperature. It was found that the films deposited in the high-temperature regime (478-514 degrees C) showed excellent physical and electrical properties equivalent to those of LPCVD films. 相似文献