The growth of Magnesium-doped GaAs by the Om-Vpe process

Magnesium-doped GaAs has been grown by organometallic vapor phase epitaxy (OM-VPE). Bis (cyclopentadienyl) mag-nesium (Cp₂Mg) is used as the organometallic precursor to Mg. The epitaxial layers have been characterized by resis-tivity and Hall measurements, photoluminescence spectro-scopy and optical microscopy. The material is of high electrical and optical quality; controllable doping over the range 10¹⁵ to 10¹⁹cm^-3 is reproducibly attained. The ionization energy of the Mg acceptor is determined to be 30 ± 2.5 meV at 77K. Negligible compensation is observed, consistent with clean thermolysis of the Cp₂Mg under growth conditions. GaAs diodes have been fabricated using Mg as the p-dopant and either Se, Si, or Sn as the n-dopant. The diodes show very low leakage currents under reverse bias, even at relatively high doping levels. Degenerately-doped junctions for interconnecting monolithic cascade concentrator solar cells have also been successfully grown, displaying forward conductivities as high as 19 amps V⁻¹ cm^-2 at 0.05V forward bias.     

The growth and characterization of uniform Ga1-xInxAs (X ≤.25) by Organometallic VPE

Compositionally uniform Ga_1-xIn_xAs epitaxial layers with 0 ≤ x ≤ 0.2 5 have been grown by organometallic VPE on ◃100▹ GaAs substrates. Compositional uniformities of ±0.25 InAs percentage and ±5% thickness over a 3-cm long wafer have been achieved and are essentially independent of small changes in reactor geometry such as the angle of the susceptor tilt or wafer position on the susceptor. Growth has also been demonstrated at x = 0.52. The Ga_1-xIn_xAs is grown using trimethylgallium (TMGa), triethylindium (TEIn) or trimethylindium (TMIn), and trimethylarsenic (TMAs). The use of TMAs eliminates the roomtemperature gas-phase reaction between AsH₃ and either TEIn or TMIn, and allows one atmospnere pressure growth conditions to be used without any special mixing arrangements in the reactor. The comparative effects of using TEIn or TMIn as the In source are discussed in terms of crystal quality. Data on crystal composition as a function of gas phase composition and growth rate as a function of composition are presented, and n doping and carrier mobilities and p doping of Ga_.80In_.20As ars characterized. The vapor pressure of TMIn at 0°C is determined to be 0.21 mmHg.     

Some characteristics of highly N-doped VPE grown GaAs epilayers

The doping behaviour of S and Se in the VPE growth of GaAs at 760 and 660°C is studied by carrier concentra-tion, mobility, photo and cathodoluminescence measure-ments. The carrier concentration increases linearly with the partial pressure of S or H₂Se up to a solubi-lity limit, the highest value of which is obtained with Se at about 10¹⁹cm^-3. The mobility for Se-doped layers is higher than for S-doped ones when n > 4.10¹⁷cm^-3, and a mobility decrease is observed for both at dopings exceeding the solubility limit. Postgrowth annealing at the growth temperature of highly doped samples decreases their carrier concentration to values corresponding to the bulk solubility limit. The decrease of the room temperature luminescence intensity at high doping levels in tentatively interpreted as due to precipitate for-mation. Finally, the linear dependence on the dopant partial pressure of the impurity incorporation as well as the observed annealing behaviour are interpreted by an incorporation mechanism controlled by the surface states.     

Spinodal decomposition and clustering in III/V alloys

The criteria for clustering and spinodal decomposition in III/V pseudobinary and quaternary solid alloys are examined. A chemical driving force for clustering and phase separation exists in some ternary and most quaternary alloys. However, single crystalline alloys are shown to be stabilized by the coherency strain energy inherent in any clustering or spinodal decomposition in alloys where lattice parameter is a function of composition. Analytical expressions are derived for T_s, the temperature above which no clustering or phase separation should occur. Most III/V pseudobinary and quaternary alloys are stable at all temperatures. Numerical techniques are used to calculate spinodal isotherms. Results are presented for the systems Ga_xIn_1−x As P_1−y, A1_xGa_1−xAs_ySb_1−y, and Ga_xIn_1−x As P_1−y. This work was supported by the Department of Energy, contract No. DE-AT 03-81 ER 10934.     

OMVPE growth of p-AlGaAs/GaAs heterojunctions using diethylberyllium

We report on the OMVPE growth of modulation doped p-type Al_0.43Ga_0.57As(Be)/GaAs heterojunctions which exhibit a two-dimensional hole gas (2DHG). Hole mobilities de-termined by Hall or cyclotron resonance measurements at 300, 77, and 4 K were 394, 3750, and 21200 cm²/V bs s respectively for a sheet carrier density of about 4.5 × 10¹¹ cm^s−2. Beryllium doping of Al_xGa_1−xAs using diethylberyllium is characterized by Hall measurements, secondary ion mass spectrometry, and photoluminescence. The depen-dence of free carrier concentrationvs AlAs% forp ⁺ layers of Al_xGa_1−xAs_x,x = 0–0.5, is determined. A free carrier concentration greater than 1 × 10¹⁸ cm^s−3 is achieved forx = 0–0.43 with no carrier freeze-out down to 77 K.     

The use of a metalorganic compound for the growth of InP-epitaxial layers

InP epitaxial layers have been grown by the pyro-lysis of a new metalorganic compound, a trimethyl-indium trimethyl-phosphene adduct. The formation of unwanted polymer products during epitaxial growth could be avoided in this way. The layers were grown at 500°C with a growth rate of about 1 μmh_-1. Net carrier concentrations of n≏5-10^l5cm^-3 could be achieved.     

On the carrier profiling of GaAsSb/GaAs heterostructures

Carrier profiles of MBE grown Ga(As,Sb)/GaAs heterostructures were studied. In low Sb content samples of Ga(As,Sb)/GaAs grown by MBE the experimentally measured carrier profiles exhibit double dips in concentration, whereas a single large dip is ob-tained for higher Sb content with larger lattice-mismatched samples. The capacitance voltage(C-V) carrier profile of a Schottky barriern- N heterojunction of Au/n-GaAsSb/N-GaAs has been modeled and double dips occur when nonuniform doping is present which may explain the experimentally observed double dips in a GaAs_0.95Sb_0.05/GaAs specimen. For large lattice mismatch and therefore large heterointerface charge density in the model, the accumulation peak due to ΔE_c is shown to be overwhelmed by a pro-nounced single dip as observed in higher Sb content samples such as GaAs_0.91Sb_0.09/ GaAs and GaAs/GaAs_0.9Sb_0.1.     

The role of the V/III ratio in the growth and structural properties of metalorganic vapor phase epitaxy GaAs/Ge heterostructures

GaAs epitaxial layers have been grown on (001) 6† off-oriented toward (110) Ge substrates by metalorganic vapor phase epitaxy. In order to study the influence of V/III ratio on the growth mechanisms and the structural properties of the layers, the input flow of arsine was changed over a wide range of values, while keeping constant all other experimental settings. Optical microscopy in the Nomarski contrast mode, x-ray topography and high resolution diffractometry, transmission electron microscopy and Rutherford backscattering have been used to investigate the epilayers. It has been found that the growth rate increases and the surface morphology worsens with increasing V/III ratio. The abruptness of the layer-substrate interface has also been found to strongly depend on the V/III ratio, the best results being obtained under Ga-rich conditions. The main structural defects within the layers are stacking faults and misfit dislocations. Layers grown under As-rich conditions only contain stacking faults, probably originated by a growth island coalescence mechanism, whereas layers grown under Ga-rich conditions contain both misfit dislocations and stacking faults generated by dissociation of threading segments of interfacial dislocations. In spite of the different defects, the strain relaxation has been found to follow the same trend irrespective of the V/III ratio. Finally, the relaxation has been found to start at a thickness exceeding the theoretical critical value.     

Effects of boron incorporation on the strain and photoluminescence properties of GaAsSb/GaAs quantum wells

Boron-containing GaAsSb/GaAs quantum wells (QWs) with different antimony (Sb) mole fractions were grown by low-pressure metal–organic chemical vapor deposition for the first time. The effects of boron incorporation on the performance of GaAsSb/GaAs QWs are discussed. For samples with low compressive strain, injection of triethylboron can enhance the Sb content and increase the compressive strain, although boron incorporation can lead to a reduction in strain. This effect was less for strained GaAsSb/GaAs QWs, so the compressive strain of these QWs did not vary. Room-temperature photoluminescence emission at 1116 nm with a full-width at half-maximum (FWHM) value of 56 meV was obtained for strained BGaAsSb/GaAs QWs.     

Role of GaAs bounding layers in improving OMVPE growth and performance of strained-layer inGaAs/AIGaAs quantum-well diode lasers

In the growth of organometallic vapor phase epitaxy of InGaAs/AIGaAs single-quan-tum-well heterostructures for strained-layer diode lasers, the growth temperature is 100 to 200° C lower for the InGaAs quantum-well layer than for the AlGaAs cladding layers. Earlier studies showed that laser performance is greatly improved by sandwiching the InGaAs layer between lower and upper GaAs bounding layers that are grown during the times before and after InGaAs growth when the substrate temperature is decreased and increased, respectively. In this investigation, it has been found that laser performance is influenced mainly by the upper bounding layer rather than the lower one. By using Auger analysis in combination with Ar-ion sputtering to determine the composition depth profile of In_0.2Ga_0.8As/GaAs test structures layer without AlGaAs layers, it has been shown that the role of the upper bounding layer is to prevent the evaporation of In from the InGaAs quantum-well layer during the interval before the deposition of the upper AlGaAs cladding layer.     

Analysis of V/III incorporation in nonstoichiometric GaAs and InP films using SIMS

Using secondary ion mass spectrometry (SIMS), we have investigated the excess group V content in GaAs and InP films grown by molecular beam epitaxy at low temperature. Using the inherent depth profiling capability of SIMS, we investigated the V/III ratio in films grown at nominally constant temperatures and also in films grown with stepped temperature profiles. Thickness profiles of the V/III ratio show the effects of intentional temperature changes and of an unintentional drift in the actual substrate temperature during growth. The ability to measure as little as 0.1% excess As and about 0.2% excess P indicates excellent measurement resolution. SIMS analysis is also used to identify a narrow growth temperature range over which InP can be grown with appreciable nonstoichiometry yet remain monocrystalline.     

Domain epitaxial growth of TiN/Si(001), TiN/GaAs(001), and Si/TiN/Si(001) heterostructures by laser physical vapor deposition: Theory and experiment

We have successfully deposited epitaxial titanium nitride films on (001) silicon and (001) gallium arsenide substrates and multilayer Si/TiN/Si(001) epitaxial heterostructures using pulsed laser (KrF: λ = 248 nm, τ = 25 ns) physical vapor deposition. The deposition of TiN was carried out at a substrate temperature of 600°C on Si(001) and 400°C on GaAs(00l). The interfaces were sharp without any indication of interfacial reaction. The epitaxial relationships were found to be <001> TiN ‖<001> Si on the silicon substrate, <001> Si ‖<001> TiN |<001> Si on the heterostructure, and [1-10] TiN‖[110] GaAs and [001] TiN ‖[110] GaAs on the GaAs substrate. The growth in these large-mismatch systems is modeled and the various energy terms contributing to the growth of these films are determined. The domain matching epitaxy provides a mechanism of epitaxial growth in systems with large lattice mismatch.The epitaxial growth is characterized by domain epitaxial orientation relationships with m lattice constants of epilayer matching with n of the substrate and with a small residual domain mismatch present in the epilayer. This residual mismatch is responsible for a coherent strain energy. The magnitude of compression of Ti-N bond in the first atomic layer, contributing to the chemical free energy of the interface during the initial stages of growth, is found to be a very important factor in determining the orientation relationship. This result was used to explain the differences in the orientaion relationships between TiN/Si and TiN/GaAs systems. The various energy terms associated with the domain epitaxial growth are evaluated to illustrate that the domain epitaxial growth is energetically favorable compared to the lattice mismatched epitaxial growth. The results of this analysis illustrate that the observed variations in the epitaxial growth are consistent with the minimum energy configurations associated with the domain epitaxial growth.     

Al_xGa_(1-x)As/GaAs调制掺杂结构的生长研究

用分子束外延生长Al_xGa_(1-x)As/GaAs调制掺杂结构。范德堡法、光荧光谱和电化学C—V等方法测量了电学和光学特性。连续波电光检测证明材料有较好的均匀性。用该结构材料制作的HEMT器件在12GHz下,噪声系数0.76dB,相关增益6.5dB。     

Characterization of InP grown by OMVPE using trimethylindium and tertiarybutylphosphine (TBP) at low V/III ratios and reduced TBP partial pressures

We report an OMVPE growth process for InP using trimethylindium (TMI) and tertiarybutylphosphine (TBP), a V/III ratio of 15, and a TBP partial pressure of 0.5 Torr. Growth is initiated with a 0.1 μm buffer layer employing a ramped TBP flow. Results are presented for InP grown with two different samples of both TMI and TBP and compared to previous experimental results and theoretical predictions. Good surface morphology is obtained from 540 to 600° C. The net carrier concentrations, N_d-N_a, decrease with increasing growth temperature—but never fall below 1.3 × 10¹⁶ cm^-3. Mobilities of 3990 and 11200 cm²/V.sec are observed at 300 and 77 K, respectively. At 77 K, we infer a compensation ratio of ∼0.4, independent of N_d-N_a. Photoluminescence measurements at 6 K show intense near bandgap emission with a full width half maximum proportional to N_d-N_a. Weak emission is also observed from carbon acceptors, independent of growth temperature. Secondary ion mass spectroscopy measurements are performed on an InP wafer grown with four different temperatures. The observed sulfur concentration drops from 1 × 10¹⁸ to 6 × 10¹⁶ cm^-3 with increasing growth temperature. This confirms that sulfur is an important residual impurity in TBP. The observed carbon concentration is 4–6 × 10¹⁶ cm^-3, regardless of growth temperature.     

The growth of GaAs,AIGaAs, InP and InGaAs by chemical beam epitaxy using group III and V alkyls

The growth kinetics of chemical beam epitaxy (CBE) were investigated with the growth of GaAs, AIGaAs, InP, and InGaAs. Results obtained with epilayers grown by using trimethylarsine (TMAs) and triethylphosphine (TEP) instead of arsine (AsH3) and phosphine (PH₃) were reviewed with some additional results. The CBE grown epilayers have similar optical quality to those grown by molecular beam epitaxy (MBE). Superlattices of GaAs/AlGaAs with abrupt interfaces have been prepared. Since trimethylindium (TMIn) and triethylgallium (TEGa) used in the growth of InGaAs emerged as a single mixed beam, spatial composition uniformity was automatically achieved without the need of substrate rotation in the InGaAs epilayers grown. Lattice-mismatch Δα/α< 1 x 10^-3 have been reproducibly obtained. For epilayers grown with high purity TMAs source, room-temperature electron mobility as high as 9000 cm²/V sec and concentrations of ˜7 x 10¹⁵ cm^-3 were produced. In general, the electron mobilities were as good as those obtained from low-pressure metalorganic chemical vapor deposition. (MO-CVD). Unlike MBE, since the In and Ga were derived by the pyrolysis of TMIn and TEGa molecules at the heated substrate surface, respectively, oval defects observed in MBE grown epilayers due to Ga splitting from Ga melt were not present in CBE grown epilayers. This is important for integrated circuit applications. Unlike MO-CVD, the beam nature of CBE allows for selective area growth of epilayers with well-defined smooth edges using mask shadowing techniques. Typically, growth rates of 2-5μm/h for InP, 2-6μm/h for GaAs and AIGaAs, and 2-5μm/h for InGaAs were used.     

分子束外延生长Al_xGa_(1-x)As/GaAs超晶格及结构、光学特性研究

报道了分子束外延生长80个周期的Al_xGa_(1-x)As/GaAs超晶格,X射线衍射和透射电镜的结果表明超晶格样品有良好的结构特性,光反射光谱观察到阱内的电子跃迁过程,其结果与理论计算相符。     

不同V/III族元素比对m面GaN薄膜性能的影响

摘要：采用分子束外延（MBE）方法在蓝宝石衬底上外延生长m面GaN薄膜。利用原子力显微镜(AFM)、扫描电子显微镜(SEM)分析了薄膜表面形貌,对比分析结果,发现V/III族元素比从1:80降低到1:90时,外延膜表面均方根粗糙度从13.08nm降低到9.07nm。利用光谱型椭偏仪研究m面GaN薄膜,通过物理模型建立和光谱拟合得到了m面GaN薄膜的厚度、折射率和消光系数。拟合结果显示,GaN样品厚度和理论值一致,且V/III族元素比为1:90时,所得外延膜折射率较低,透射率大。两种测试方法的结果表明,V/III族元素比较小的样品晶体质量高。     

添加Sb和LaB6对Sn3.0Ag0.5Cu/Cu界面IMC生长的影响

研究了Sb和稀土化合物的添加对Sn3.0Ag0.5Cu无铅焊料焊接界面金属间化合物层生长的影响。研究结果表明,固态反应阶段界面化合物层的生长快慢排序如下:v(SAC0.4Sb0.1LaB6/Cu)v(SAC0.4Sb/Cu)v(SAC0.1LaB6/Cu)v(SAC/Cu)。计算各种界面IMC生长的激活能Q结果表明,Sn3.0Ag0.5Cu/Cu界面IMC生长的激活能最高,为92.789 kJ,其他焊料合金Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu,Sn3.0Ag0.5Cu0.1LaB6/Cu和Sn3.0Ag0.5Cu0.4Sb/Cu界面IMC生长的激活能分别为85.14,84.91和75.57 kJ。在老化温度范围内(≤190℃),Sn3.0Ag0.5Cu0.4Sb0.1LaB6/Cu的扩散系数(D)最小,因而其界面化合物的生长速率最慢。     

Effect of post-growth annealing on the structural,optical and electrical properties of V2O5 nanorods and its fabrication,characterization of V2O5/p-Si junction diode

We report the synthesis of V₂O₅ nanorods by utilizing simple wet chemical strategy with ammonia meta vanadate (NH₄VO₃) and polyethylene glycol (PEG) exploited as precursor and surfactant agent, respectively. The effect of post-annealing on structural, optical and electrical properties of V₂O₅ nanorods was characterized by XRD, HRSEM-EDX, TEM, FT-IR, UV (DRS), PL, TG–DTA and DC conductivity studies. The X-ray diffraction analysis revealed that the prepared sample annealed at 150 °C for 5 h which exhibited anorthic phase of V₅O₉ and annealed at 300–600 °C showed the anorthic phase change to orthorhombic phase of V₂O₅ due to the post-annealing effect. The surface morphology results indicated that increasing temperature caused a change from microrods to a nanorods shape in the morphology of V₂O₅. FT-IR spectrum confirmed that the presence of V₂O₅ functional groups and the formation of V–O bond. The optical band gap was found in the range 2.5–2.48 eV and observed to decreases with various annealed temperature. The DC electrical conductivity was studied as a function of temperature which indicated the semiconducting nature. Further, the potential of V₂O₅ nanostructures were grown on the p-Si substrate using the nebulizer spray technique. The junction properties of the V₂O₅/p-Si diode were evaluated by measuring current (I)–voltage (V) and AC characteristics.