Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination

 This paper reports a novel way to compensate the air gap between photomask and photoresist for eliminating UV light diffraction on photoresist, which greatly increases the sidewall straightness of high-aspect-ratio resist structures. In this research, SU-8 negative tone photoresist was used for experiments, and glycerol was employed as an index match material for bridging air gap between photomask and photoresist during exposure. Results showed that a high aspect ratio wall structure of 156 μm thick and 25 μm wide had a 45% pattern width error when exposed under 100 μm air gap, while glycerol compensated process accomplished a straight resist wall without appreciable error. This method is simple and cheap to employ, compared to the usage of costly thick-photoresist-film spinner for resist planarization. Numerical simulation on the diffraction effect upon the structure wall has also been conducted. The calculated and experiment wall profiles showed similarity in trend. Received: 10 August 2001/Accepted: 24 September 2001     

Electroplated compliant metal microactuators with small feature sizes using a removable SU-8 mould

In the work presented in this article a fabrication process for high aspect ratio metal microstructures has been developed using photoresist EPON SU-8. A smallest feature size of 2 μm with near vertical sidewalls has been achieved on a routine basis. The SU-8 photoresist has been used as mould for electroplating high aspect ratio metal micro actuators. A removal process has also been developed. The removal of the SU-8 mould after plating is done in a plasma asher using an oxygen or oxygen/fluorine plasma with plasma power as low as 200 W. To demonstrate the fabrication process a 10 μm thick nickel, electro-thermal micro actuator has been fabricated.     

Pneumatically bidirectional microfluidic regulation using Venturi pumps by deep RIE and bonding technology

 A novel design for bidirectional fluidic motion has been demonstrated which is widely used in the biochip or microfluidic component. Two miniaturized Venturi pumps as well as pneumatic servo system are designed to easily control the bidirectional fluidic motion by simple fabrication. The pumping velocity is 0.86 μl/min at a 2.75 slpm (standard liter per minute) air flow read from mass flow controller (MFC) for totally 4.3 μl blue ink in a 300 μm wide by 300 μm deep channel. The higher airflow, the faster fluidic pumping speed. Numerical simulation is performed to correlate the experimental data of fluidic speed and air flow in microchannel. The test chip with two Venturi pumps and channel was batchedly fabricated by silicon deep reactive ion etching (RIE) and glass anodic bonding. The ICP LIGA process is also investigated after deep RIE followed the electroforming and hot embossing. Received: 10 August 2001/Accepted: 24 September 2001     

High-aspect-ratio microstructures fabricated by X-ray lithography of polymethylsilsesquioxane-based spin-on glass thick films

 In this paper, a process for 200 μm high-aspect-ratio micro-optical (HARM) structures fabricated by deep X-ray lithography (DXRL) of polymethylislesuioane-based spin-on glass (SOG) thick films is presented. The SOG material used in the whole procedures is polymethylsilsesquioxane (GR650), which is a kind of sol-gel derived material and can be cured at a reasonable low temperature (75 °C). A technique to cast thick GR650 films was established in the overall process. After consolidation, the GR650 thick films were machined to reach 200 μm uniformly. Then, as negative resists, the GR650 thick films were patterned directly by DXRL. X-ray irradiated regions can be selectively retained with high structural resolution by development in an organic solvent, such as methanol. Parameter screening was done to find minimum and maximum doses needed for patterning/cross-linking, to vary development time, and to explore different film thickness. The whole process is a novel of technique to create HARM structures based on SOG materials without using molds. This technique can be extended to considerably larger structural heights. Surface and bulk compositions of the irradiated films were measured by XPS and Fourier transform infrared spectroscopy. Surface quality by roughness testing system (WYKO RST) was investigated to fabricate the microstructure with a high-accuracy surface. Received: 31 October 2001/Accepted: 23 January 2002 This work was partially supported by NSF/LEQSF (2001-04)-RII-02 grant “Micro/Nanodevices for Physical, Chemical and biological Sensors”.     

Silicon IC compatible LIGA mask-fabrication process

 This paper describes a technique for fabricating a LIGA mask that offers good compatibility with the silicon IC process. X-ray exposure can be eliminated from the LIGA mask-fabrication process, so that LIGA masks can be fabricated with existing silicon IC process equipment. A gold absorber pattern, 2 μm wide and 10 μm thick, has been successfully fabricated by combining a three-layer resist-patterning process with the electroplating process. Improvements in both the mask structure and fabrication process alleviate the problems of dust in a cleanroom and contamination in the etching chamber. Received: 25 August 1997/Accepted: 23 September 1997     

The fabrication of LIGA mask using photolithography and synchrotron radiation lithography

 The fabrication of LIGA mask is a very important step in LIGA process. Usually an intermediate mask with gold absorber pattern of 2 μm thickness is fabricated firstly using gold electroplating for absorber pattern in the resist structure written by Electron Beam (e-Beam), then the LIGA mask can be copied from the intermediate mask using synchrotron radiation lithography and gold electroplating. Recently, we use photolithography (instead of e-beam) to make the primary structure, and produce the intermediate mask with gold absorber pattern of 1.5 μm thickness produced by etching gold film with 1.5 μm thickness under the photoresist structure using Ar⁺. The LIGA mask with absorber pattern of 13 μm thickness is copied from the intermediate mask using synchrotron radiation lithography and gold electroplating. Received: 30 October 1995/Accepted: 9 December 1995     

Angle effect of ultrasonic agitation on the development of thick JSR THB-430N negative UV photoresist

 A novel method by using adjusted ultrasonic agitation to improve the developing depth, developing time, surface roughness, and undercut problem of thick JSR-430N negative UV photoresist is proposed. This method has been successfully employed to fabricate ultra-thick microstructures of thickness more than 1.4 mm and aspect ratio at least of 5 by JSR THB-430N negative UV photoresist. With the improved ultrasonic developing procedure, the resist can potentially be a replacement of SU-8 resist for the application of high aspect ratio plating mold, due to its good stripping property [1]. The power and angle of ultrasonic agitation have also been studied and characterized. The development of thick JSR-430N resist under different ultrasonic agitation angles has been verified to have different effects on developing time, resist sidewall profile, and surface roughness. Received: 10 August 2001/Accepted: 24 September 2001     

Two-dimensional metallic photonic band-gap crystals fabricated by LIGA

 Two-dimensional metallic photonic band-gap crystals, consisting of square and triangular lattices of nickel pillars, were fabricated by the LIGA process. In particular, PMMA slabs with a thickness of up to 800 μm were irradiated with synchrotron radiation and the holes produced were then filled with nickel via electroforming. The lattice constant, i.e., the center-to-center distance between the pillars, is either 60 μm or 40 μm for the square and triangular structures respectively. The metal filling ratio is 10% for the square and 20% for the triangular structures. Transmission and reflection measurements demonstrate that the metallic photonic band-gap crystals show a cutoff frequency in the far infrared regime between 2 and 5 THz. It is concluded that LIGA is a promising method for the fabrication of 2-D metallic photonic band-gap structures, which could be potentially used as passive filters in THz devices. Received: 10 August 2001/Accepted: 24 September 2001     

In-situ fabrication of polymer microsieves for ��TAS by slanted angle holography

We present a simple, versatile method for the in-situ fabrication of membranes inside a microfluidic channel during a chip manufacturing process using only two extra slanted angle holographic exposure steps. This method combines the strengths of both inclined UV exposure and holographic lithography to produce micrometer-sized three-dimensional sieving structures. Using a common chip material, the photoresist material SU-8, together with this method, a leak-free membrane-channel connection is obtained. The resulting membranes are monodisperse, with a very well-defined pore geometry (i.e., microsieves with a pore diameter between 500 nm and 10 μm) that is easily controllable with the holographic set-up. The selectivity of in-situ fabricated microsieves with a pore diameter of 2 μm will be demonstrated using polystyrene beads of 1 and 3 μm.     

Design and fabrication of SU-8 micro optic fiber holder with cantilever-type elastic microclips

The optic alignment module containing out-of-plane 3D micro lenses, and micro optic fiber holders have been fabricated using tilted UV lithography technique in water with SU-8 photoresist (Ling and Lian in Proc SPIE 4979:402–409, 2007). Each holder is a circumscribed quadrilateral formed by a V-groove and pairs of fixed microclips, which will hold the fiber in position through the elastic deformation when the fiber is inserted. Since these microclips were fixed cantilever beams and its effective beam length, the distance between the fixed end of the beam and beam–fiber contact point, is very short (~62.5 μm), the stress on the beam is high even under a small (few microns) deformation. The inserted optical fiber was either too loose to lose its alignment accuracy, or too tight causing the clips to break because of dimensional tolerance. It becomes very difficult, if not impossible, to use them in practical applications. Therefore, the key issue of fabricating optical alignment module is to have a suitable stiffness of microclips with an appropriate deformation during the fiber insertion, which can provide enough force to hold the fiber for accurate alignment and avoid introducing neither significant viscous deformation nor the damage to the clips. In this paper, a novel technique to fabricate SU-8 cantilever beam as elastic clamping device in optical fiber holder is proposed. Simulation based on SU-8 material properties indicates that for a 250-μm-long, 50-μm-thick SU-8 beam the clamping force per unit beam width will range from 10 to 100 Newton/m as the deflection increased from 1.4 to 14 μm. This predicted performance is comparable to or even better than that of existing silicon nitride microclips in optical fiber holding application [Bostock et al. in J Micromech Microeng 8(4):343–360, 1998]. By using a two-mask process, we have fabricated free-end cantilever beams as fiber holding clips. In order to have longer beams over V-groove, the slots in the V-groove were introduced, which allow the beams extended deeper into the sloped V-groove walls. The micro alignment module with 250-μm-length cantilever beams as microclips for housing 125-μm-diameter optical fibers has been successfully fabricated using a 300-μm-thick SU-8 photoresist layer by a two-mask UV lithography processes. This approuch offers significant advantages over other techniques with respect to costs of material, simple in equipment, and easy in manufacture. These optical fiber holders with elastic microclips combined with pre-aligned out-of-plane 3D micro lenses make it possible that to build an integrated micro optic system with precise alignment accuracy on a wafer-scale.     

Numerical simulation of thermal distortions in deep and ultra deep X-ray lithography

 One major process step in deep X-ray lithography is the exposure of the resist with synchrotron radiation. High energy photons are absorbed in mask, resist and substrate. About 95% of this energy is deposited as thermal heat [Schweizer (1997)]. This may lead to a temperature rise in the system and result in thermal distortions during the patterning process. A sample layout is used to determine the distortions during irradiation. Typical radiation parameters of the ELSA storage ring at Bonn University (2.7 GeV, 35 mA) and material properties are applied to simulate the heat effects. Mask membranes made of titanium or beryllium are modeled to irradiate PMMA layers of 200 and 2500 μm thickness. Copper is used as substrate material. Mask support and the bottom of the substrate are cooled to 21 °C as the system is scanned through the synchrotron beam. In the case of 200 μm PMMA and titanium mask membranes, mask temperatures increase to 40.1 °C, whereas only 22.3 °C are reached if beryllium masks are simulated. Maximum distortions are 0.74 μm for Ti-masks and 0.03 μm for Be-masks. With increasing resist thickness, the incident synchrotron radiation power as well as the temperature rise are reduced. In the case of 2500 μm thick PMMA, temperatures of 21.45 °C are simulated. Received: 10 August 2001/Accepted: 24 September 2001 This paper was presented at the Fourth International Workshop on High Aspect Ratio Microstructure Technology HARMST 2001 in June 2001.     

Deep lithography with a low energy synchrotron source: fabrication of X-ray refractive single lenses

 Lithography as deep as 400 μm has been carried out to fabricate X-rays refractive lenses using a low energy synchrotron source (AURORA-2 S, 0.7 GeV). The lens made of PMMA has two parabolic curvatures with radii R=4 μm and apertures A=2(2Rz)^1/2=179 μm, thus the aspect ratio z/R=250 for its curvatures, which is too great for traditional techniques to achieve. Upon fabrication of the lenses, precision of the curvatures has been evaluated by digital imaging analysis. The lens can singly focus a beam of hard X-rays into several microns at a reasonable focal length F=1.5 m. Advantages of using a low energy source for the LIGA process will be discussed regarding problems such as thick absorbers demanded by the LIGA mask and heat-load occurring in thick resist layers. Received: 10 August 2001/Accepted: 24 September 2001     

3D electroplated microstructures fabricated by a novel height control method

 A 3D electroplating process by means of pixel-wise, step height control of selective electroplating has been successfully demonstrated. A total of eight rectangular pixels of 80 × 20 μm² in area and 1.1–9.3 μm in height have been fabricated with a height difference of 1 μm in adjacent pixels. The process requires only two masks in a single electroplating process. Nickel electroplating is selected as the demonstrating material and is performed at 50 °C with current density of 400 A/m² for 30 min. A theoretical model in electroplating process is discussed to assist the design of 3D microstructures and verified with the experimental data. As such, this process has potential applications in making pixel-wise, 3D microstructures with precise height control. Received: 10 August 2001/Accepted: 24 September 2001     

Fabrication of sub-micron structures for MEMS using deep X-ray lithography

Fabrication techniques of microstructures with high resolution and high aspect ratio are necessary for practical microelectromechanical systems (MEMS) that have high performance and integration. In order to fabricate microstructures with sub-micron resolution and high aspect ratio, deep X-ray lithography has been investigated using the compact synchrotron radiation (SR) light source called “AURORA”. An X-ray mask for sub-micron deep X-ray lithography, which is composed of 1 μm thick Au as absorbers, 2 μm thick SiC as a membrane and 625 μm thick Si as a frame, was designed. In preliminary experiments, the following results were achieved: EB resist microstructures with an aspect ratio of 22 corresponding with 0.07 μm width and 1.3 μm height were formed; a 10 μm thick PMMA resist containing no warp was formed by direct polymerization, enabling more precise gap control.     

Optical DUV-lithography for high microstructures

 A new technology called 3D UV-Microforming consisting of an advanced resist preparation process, a UV lithographic step, resist development, a moulding procedure by electrodeposition, and finally stripping and cleaning for finishing the structures was developed for application in microsystem technology. It enables the low-cost fabrication of a wide variety of micro components for many different users. During resist preparation, layers up to two hundred μm thickness were obtained until now. By using a standard UV mask aligner as an exposure tool followed by immersion development, thick resist layers up to 100  μm could be patterned in a single step on pre-processed silicon wafers. Repeated exposure and development were successfully used for structuring resist layers of up to 200  μm thickness. High aspect ratios of more than 10 as well as steep edges of more than 88° could be fabricated. The resist patterns were moulded by using pulse or DC electroplating. For microsystem applications some metals and alloys were deposited, Three-dimensional micro components were fabricated as demonstrators for the new technique. It allows the use of materials with interesting properties which could not be provided by standard processes. Received: 30 October 1995 / Accepted: 9 December 1995     

Metallic micro displacement capacitive sensor fabricated by laser micromachining technology

This paper presents design, fabrication and performance testing results of the micro displacement capacitive microsensor fabricated by femtosecond laser machining technology. The microsensor having overall dimensions of 1,275 (W)×1,153 (L) μm consisted of 20 pairs of comb fingers of 24 (W)×300 (L) μm with a gap between the fingers of 6 μm, suspension springs, inertial mass and support anchors. The sensor structure was fabricated from a 25 μm thick tungsten foil. The fabricated microsensor was able to deliver 230 fF capacitance variations for measured displacements up to 25 μm. The results on the performance testing and geometry evaluation under pins the laser micromachining technology as an effective tool to fabricate miniature functional components and mechanisms. The developed microsensor can be used for micro/nano scale displacement measurements in MEMS applications.     

Micro-electroforming metallic bipolar electrodes for mini-DMFC stacks

This paper describes the development of metallic bipolar plate fabrication using micro-electroforming process for mini-DMFC (direct methanol fuel cell) stacks. Ultraviolet (UV) lithography was used to define micro-fluidic channels using a photomask and exposure process. Micro-fluidic channels mold with 300 μm thick and 500 μm wide were firstly fabricated in a negative photoresist onto a stainless steel plate. Copper micro-electroforming was used to replicate the micro-fluidic channels mold. Following by sputtering silver (Ag) with 1.2 μm thick, the metallic bipolar plates were completed. The silver layer is used for corrosive resistance. The completed mini-DMFC stack is a 3.5 × 3.5 cm² fuel cell stack including a 1.5 × 1.5 cm² MEA (membrane electrode assembly). Several MEAs were assembly into mini-DMFC stacks using the completed metallic bipolar plates. All test results showed the metallic bipolar plates suitable for mini-DMFC stacks. The maximum output power density is 9.3 mW/cm² and current density is 100 mA/cm² when using 8 vol.% methanol as fuel and operated at temperature 30°C. The output power result is similar to other reports by using conventional graphite bipolar plates. However, conventional graphite bipolar plates have certain difficulty to be machined to such micro-fluidic channels. The proposed micro-electroforming metallic bipolar plates are feasible to miniaturize DMFC stacks for further portable 3C applications.     

Fabrication of RF MEMS variable capacitors by deep X-ray lithography and electroplating

Radio frequency micro electro-mechanical systems (RF MEMS) vertical cantilever variable capacitors fabricated using deep X-ray lithography and electroplating are presented. Polymethylmethacrylate (PMMA) layers of 100 μm and 150 μm have been patterned and electroplated with 70 μm and 100 μm thick nickel. A 3 μm thick titanium layer was used as plating base as well as etch time-controlled sacrificial layer for the release of the cantilever beam. The parallel plate layout includes narrow gaps and cantilever beams with an aspect ratio in nickel of up to 60 for 1 mm long features. Auxiliary structures support the beams and gaps during the processing. Room temperature electroplating significantly reduces the risk of deformations compared to the standard process temperature of 52°C. The capacitors operate in the 1–5 GHz range, and demonstrate good RF performance, with quality factors on the order of 170 at 1 GHz for a 1 pF capacitance.     

Roll manufacturing of flexible microfluidic devices in thin PMMA and COC foils by embossing and lamination

Microfluidics on foil is gaining momentum due to a number of advantages of employing thin films combined with the capability of cost-effective high-volume manufacturing of devices. In this work, ultra-thin, flexible Y-microreactors with microchannels of 100 μm width and 30 μm depth were fabricated in thermoplastic polymer foils. The fluidic pattern was hot roll embossed in 125 μm thick poly-methyl-methacrylate (PMMA) and 130 μm thick cyclic-olefin-copolymer (COC) films using a dry-etched microstructured silicon wafer as a flat embossing tool in a laminator. The sealing of the channels was performed with two different techniques, one based on lamination of SU8 dry film resist (DFR) and the other one based on spin-coated poly-dimethylsiloxane (PDMS). Testing of the interconnected microreactor was carried out using two dye colorant solutions to demonstrate mixing.     

A piezoelectric micro-cantilever bio-sensor using the mass-micro-balancing technique with self-excitation

A biosensor was developed for using in a Lab-On-a-Chip (LOC). The sensor detects the change in the resonance frequency of a micro-cantilever with a piezoelectric film. This is the mass micro-balancing technique, which has been successfully used for detecting bio-materials in the quartz crystal microbalance (QCM). The PZT film, a piezoelectric film, is designed to act as both sensor and actuator. The geometry of the micro cantilever is optimized to maximize the sensitivity and minimize the environmental effects such as viscous damping and added mass effect in liquid. The fabricated sensor is composed of a 100 μm long, 30 μm wide, and 5 μm thick cantilever with a 2.5 μm thick piezoelectric (PZT) layer on it. The ratio of thickness to length of the micro cantilever is very high compared to others in micro cantilever-based studies. This high aspect ratio is the key to maximize the sensitivity and minimize the environmental effects. The fabricated micro sensor was tested by detecting the mussel gluing protein, the insulin-anti insulin binding protein and the poly T-sequence DNA.