Investigation of various surface passivation schemes for silicon solar cells

In this work, we have investigated three different surface passivation technologies: classical thermal oxidation (CTO), rapid thermal oxidation (RTO) and silicon nitride by plasma enhanced chemical vapor deposition (PECVD). Eight different passivation properties including SiO₂/SiN_x stacks on phosphorus diffused (100 and 40 Ω/Sq) and non-diffused 1 Ω cm FZ silicon were compared. Both types of SiO₂ layers, CTO and RTO, yield a higher effective lifetime on the emitter surface than on the non-diffused surface. For the SiN_x layers the situation is reverted. On the other hand, with SiO₂/SiN_x stacks high lifetimes are obtained not only non-diffused surface but also on the diffused surface. Thus, we have chosen the RTO/SiN_x stack layers as front and rear surface passivation in solar cells, which passivate relatively good on the surface and has very low-weighted reflection. On planar cells passivated with RTO/SiN_x a very high V_oc of 675.6 mV and a J_sc of 35.1 mA/cm² was achieved. Compared to a planar cell using CTO the efficiency of RTO/SiN_x cell is 0.8% higher (4.5% relative). It can be concluded that the RTO/SiN_x layers are the optimal passivation for the front and rear surface. On the other hand, for textured cells, the J_sc and FF of RTO/SiN_x cells are lower than those of CTO cells. The main reasons of these J_sc and FF losses were also discussed systematically.     

Growth of Zn1−xMgxO films with single wurtzite structure by MOCVD process and their application to Cu(InGa)(SSe)2 solar cells

The effect of the growth temperature and Mg/(Mg+Zn) molar flow rate ratio of metal organic sources on the crystalline structure of Zn_1−xMg_xO (ZMO) films is investigated in thin films prepared by metal organic chemical vapor deposition (MOCVD) process on fused silica in order to obtain the wide-bandgap ZMO films with single wurtzite structure, which is very important to achieve high-efficiency chalcopyrite solar cells. Based on the measurements and analysis of the fabricated samples, the ZMO films with the controllable bandgap from 3.3 to 3.72 eV can exhibit a single wurtzite phase depending on the growth temperature and Mg content. Furthermore, the resistivity of ZMO films is comparable to that of ZnO film. It is a good indication that ZMO film is superior to CdS or ZnO films as buffer and window layers mainly due to its controllable bandgap energy and safety. As a result, the solar cells with ZMO buffer were fabricated without any surface treatment of Cu(InGa)(SSe)₂ (CIGSSe) absorber or antireflection coating, and the efficiency of 10.24% was obtained.     

New trends to grow the n-CdZn (S1−xSex)2/p-CuIn(S1−xSex)2 heterojunction thin films for solar cell applications

The n-CdZn(S_1−xSe_x) and p-CuIn(S_1−xSe_x)₂ thin films have been grown by the solution growth technique (SGT) on glass substrates. Also the heterojunction (p–n) based on n-CdZn (S_1−xSe_x)₂ and p-CuIn (S_1−xSe_x)₂ thin films fabricated by same technique. The n-CdZn(S_1−xSe_x)₂ thin film has been used as a window material which reduced the lattice mismatch problem at the junction with CuIn (S_1−xSe_x)₂ thin film as an absorber layer for stable solar cell preparation. Elemental analysis of the n-CdZn (S_1−xSe_x)₂ and p-CuIn(S_1−xSe_x)₂ thin films was confirmed by energy-dispersive analysis of X-ray (EDAX). The structural and optical properties were changed with respect to composition ‘x’ values. The best results of these parameters were obtained at x=0.5 composition. The uniform morphology of each film as well as the continuous smooth thickness deposition onto the glass substrates was confirmed by SEM study. The optical band gaps were determined from transmittance spectra in the range of 350–1000 nm. These values are 1.22 and 2.39 eV for CuIn(S_0.5Se_0.5)₂ and CdZn(S_0.5Se_0.5)₂ thin films, respectively. J–V characteristic was measured for the n-CdZn(S_1−xSe_x)₂/p-CuIn(S_1−xSe_x)₂ heterojunction thin films under light illumination. The device parameters V_oc=474.4 mV, J_sc=13.21 mA/cm², FF=47.8% and η=3.5% under an illumination of 85 mW/cm² on a cell active area of 1 cm² have been calculated for solar cell fabrication. The J–V characteristic of the device under dark condition was also studied and the ideality factor was calculated which is equal to 1.9 for n-CdZn(S_0.5Se_0.5)₂/p-CuIn(S_0.5Se_0.5)₂ heterojunction thin films.     

Antireflection and surface passivation behaviour of SiO2/Si/SiO2 quantum wells on silicon

Quantum wells (QWs) consisting of Si and Si-related materials (such as SiO₂) are of interest for solar cell work because they can possibly be used as a surface passivating antireflection (AR) coating or as the top cell in an all-silicon tandem solar cell. In this study, we fabricate SiO₂/Si/SiO₂ QW layers by RF magnetron sputtering and thermal oxidation. On high-resistivity (300 Ω cm) n-type silicon wafer substrates, the effective surface recombination velocity provided by our SiO₂/Si/SiO₂ QWs is around 4 cm/s for 13 Å Si thickness and 480 cm/s for 150 Å Si thickness. The parasitic optical absorption in the well-passivating QWs is negligible for terrestrial photovoltaic applications. However, they have very poor AR properties on Si wafers and hence would have to be covered by an additional reflection reducing dielectric film.     

Sputtered Cd1−xZnxTe films for top junctions in tandem solar cells

Cd_1−xZn_xTe alloy films with 1.6 and 1.7 eV band gaps were deposited by RF magnetron sputtering from targets made either of mixed powders or alloys of CdTe and ZnTe (25% and 40%). High-quality polycrystalline films with the (1 1 1) preferred orientation were obtained. The films were characterized using X-ray diffraction (XRD), scanning electron microscopy, resistivity, optical absorption, Raman, and photoluminescence. The EDS, XRD, and optical absorption analysis indicated that the x-value of the as-grown films were typically 0.20 and 0.30 for films sputtered from 25% and 40% ZnTe containing targets, respectively. The as-deposited alloy films exhibit quite low photovoltaic performance when used to make cells with CdS as the hetero-junction partner. Therefore, we have studied various post-deposition treatments with vapors of chlorine-containing materials, CdCl₂ and ZnCl₂, in dry air or H₂/Ar ambient at 390 °C. The best performance of a Cd_1−xZn_xTe cell (, ) was found for treatment with vapors of the mixed CdCl₂+0.5%ZnCl₂ in an H₂/Ar ambient after pre-annealing at 520 °C in pure H₂/Ar.     

Improved CIGS thin-film solar cells by surface sulfurization using In2S3 and sulfur vapor

Surface sulfurization of Cu(In,Ga)Se₂ (CIGS) thin films was carried out using two alternative techniques that do not utilize toxic H₂S gas; a sequential evaporation of In₂S₃ after CIGS deposition and the annealing of CIGS thin films in sulfur vapor. A Cu(In,Ga) (S,Se)₂ thin layer was grown on the surface of the CIGS thin film after sulfurization using In₂S₃, whereas this layer was not observed for CIGS thin films after sulfurization using sulfur vapor, although a trace quantity of S was confirmed by AES analysis. In spite of the difference in the surface modification techniques, the cell performance and process yield of the ZnO:Al/CdS/CIGS/Mo/glass thin-film solar cells were remarkably improved by using both surface sulfurization techniques.     

Low cost surface passivation for p-type mc-Si based on pseudobinary alloys (Al2O3)x(TiO2)1−x

The conventional process for back side passivation with full face Al screen printing layer is not suitable for very thin multicrystalline (mc-Si) solar cells and approaches to new technological processes are searched for. More investigations have been concentrated on local aluminum contacts and passivation coatings with different layers on mc-Si wafers. The aim of this work is to prove that (Al₂O₃)_x(TiO₂)_1−x is one promising candidate to be applied as passivation layer on multicrystalline Si. Investigations were performed on dielectric films of pseudobinary alloy (PBA) (Al₂O₃)_x(TiO₂)_1−x, prepared by chemical solution deposition known initially as sol–gel method. It was determined that their optical, dielectric and electrophysical properties are suitable for applications of these layers as back side surface passivation for thin multicrystalline silicon cells.     

NOx formation and reduction mechanisms in staged O2/CO2 combustion

The purpose of this study was to investigate the NO_x formation and reduction mechanisms in staged O₂/CO₂ combustion and in air combustion. A flat CH₄ flame doped with NH₃ for fuel-N was formed over the honeycomb, and NO_x formation characteristics were investigated. In addition, chemiluminescence of OH^* distribution was measured, and CHEMKIN-PRO was used to investigate the detailed NO_x reduction mechanism. In general, the NO_x conversion ratio decreases with decreasing primary O₂/CH₄ ratio, whereas NH₃ and HCN, which are easily converted to NO_x in the presence of O₂, increases rapidly. Therefore, a suitable primary O₂/CH₄ ratio exists in the staged combustion. Our experiments showed the primary O₂/CH₄ ratio, which gave the minimum fixed nitrogen compounds in O₂/CO₂ combustion, was lower than in air combustion. The NO_x conversion ratio in O₂/CO₂ combustion was lower than in air combustion by 40% in suitable staged combustion. This could be explained by high CO₂ concentrations in the O₂/CO₂ combustion. It was shown that abundant OH radicals were formed in O₂/CO₂ combustion through the CO₂ + H → CO + OH, experimentally and numerically. OH radicals produced H and O radicals through H₂ + OH → H + H₂O and O₂ + H → OH + O, because a mass of hydrogen source exists in the CH₄ flame. O and OH radicals formed in the fuel-rich region enhanced the oxidation of NH₃ and HCN. NO_x formed by the oxidation of NH₃ and HCN was converted to N₂ because the oxidation occurred in the fuel-rich region where the NO_x reduction effect was high. In fact, the oxidation of NH₃ and HCN in the fuel-rich region was preferable to remaining NH₃ and HCN before secondary O₂ injection in the staged combustion. A significant reduction in NO_x emission could be achieved by staged combustion in O₂/CO₂ combustion.     

Enhanced electrical properties of pulsed laser-deposited CuIn0.7Ga0.3Se2 thin films via processing control

Polycrystalline CuIn_0.7Ga_0.3Se₂ thin films were prepared on soda-lime glass substrates using pulsed laser deposition (PLD) with various process parameters such as laser energy, repetition rate and substrate temperature. It was confirmed that there existed a limited laser energy, i.e. less than 300 mJ, to get phase pure CIGS thin films at room temperature. Particularly, even at room temperature, distinct crystalline CIGS phase was observed in the films. Crystallinity of the films improved with increasing substrate temperature as evidenced by the decrease of FWHM from 0.65° to 0.54°. Slightly Cu-rich surface with Cu_2−xSe phase was confirmed to exist by Raman spectra, depending on substrate temperature. Improved electrical properties, i.e., carrier concentration of ∼10¹⁸ cm⁻³ and resistivity of 10⁻¹ Ω cm at higher substrate temperature for the optimal CIGS films are assumed to be induced by the potential contributions from highly crystallized thin films, existence of Cu_2−xSe phase and diffusion of Na from substrates to films.     

Study of the composition of hydrogenated silicon nitride SiNx:H for efficient surface and bulk passivation of silicon

This work is a contribution towards the understanding of the properties of hydrogenated silicon nitride (SiN_x:H) that lead to efficient surface and bulk passivation of the silicon substrate. Considering the deposition system used (low-frequency plasma-enhanced chemical vapour deposition (PECVD)), we report very low values of surface recombination velocity S_eff. As-deposited Si-rich SiN_x:H leads to the best results (n-type Si: S_eff=4 cm/s - p-type Si: S_eff=14 cm/s). After annealing, the surface passivation quality is drastically deteriorated for Si-rich SiN_x:H whereas it is lightly improved for low refractive index SiN_x:H (n∼2-2.1). The chemical analysis of the layers highlighted a high hydrogen concentration, regardless the SiN_x:H stoichiometry. However, the involved H-bond types as well as the hydrogen desorption kinetics are strongly dependent on the SiN_x:H composition. Furthermore, “N-rich” SiN_x:H appears to be denser and thermally more stable than Si-rich SiN_x:H. When subjected to a high-temperature treatment, such a layer is believed to induce the release of hydrogen in its atomic form, which consequently leads to an efficient passivation of surface and bulk defects of the Si substrate. The results are discussed and compared with the literature data reported for the different configurations of PECVD reactors.     

Tri-layer antireflection coatings (SiO2/SiO2–TiO2/TiO2) for silicon solar cells using a sol–gel technique

Antireflection coatings (ARCs) have become one of the key issues for mass production of Si solar cells. They are generally performed by vacuum processes such as thermal evaporation, reactive sputtering, and plasma-enhanced chemical vapor deposition. In this work, a sol–gel method has been demonstrated to prepare the ARCs for the non-textured monocrystalline Si solar cells. The spin-coated TiO₂ single-layer, SiO₂/TiO₂ double-layer and SiO₂/SiO₂–TiO₂/TiO₂ triple-layer ARCs were deposited on the Si solar cells and they showed good uniformity in thickness. The measured average optical reflectance (400–1000 nm) was about 9.3, 6.2 and 3.2% for the single-layer, double-layer and triple-layer ARCs, respectively. Good correlation between theoretical and experimental data was obtained. Under a triple-layer ARC condition, a 39% improvement in the efficiency of the monocrystalline Si solar cell was achieved. These indicate that the sol–gel ARC process has high potential for low-cost solar cell fabrication.     

Scanning tunneling microscopy of electrodeposited CuInSe2 nanoscale multilayers

We have investigated the electrochemical deposition of modulated thin films based on the Cu_xIn_2−xSe₂ system. CuInSe₂ is a leading alternative to silicon for use in thin film photovoltaic solar cells due to its optical absorption and electrical characteristics. Alternating layers of two different compositions based on the Cu_xIn_2−xSe₂ system were potentiostatically deposited. These nanometer-scale layers are used to form reduced-dimensionality structures such as superlattices that can be used in concentrator solar cells. We have used X-ray diffraction, energy-dispersive spectroscopy, and scanning tunneling microscopy to characterize our asdeposited thin films. The ability of the scanning tunneling microscope to resolve the individual nanoscale layers of our multilayered thin films is shown and is used to determine modulation wavelengths.     

Preparation of CuIn1−xGaxSe2 thin films by sputtering and selenization process

CuIn_1−xGa_xSe₂ polycrystalline thin films were prepared by a two-step method. The metal precursors were deposited either sequentially or simultaneously using Cu–Ga (23 at%) alloy and In targets by DC magnetron sputtering. The Cu–In–Ga alloy precursor was deposited on glass or on Mo/glass substrates at either room temperature or 150°C. These metallic precursors were then selenized with Se pellets in a vacuum furnace. The CuIn_1−xGa_xSe₂ films had a smooth surface morphology and a single chalcopyrite phase.     

Excellent thermal stability of remote plasma-enhanced chemical vapour deposited silicon nitride films for the rear of screen-printed bifacial silicon solar cells

In this work the thermal stability of the electronic surface passivation of remote plasma-enhanced chemical vapour deposited (RPECVD) silicon nitride (SiN) films is investigated with the aim to establish a cost-effective screen-printing and firing-through-the-SiN process for bifacial silicon (Si) solar cells. As a key result, RPECVD SiN films provide an excellently thermally stable surface passivation quality if they feature a refractive index in the range between 2.0 and 2.2. After a short anneal above 850°C the surface recombination velocity on 1.5 Ωcm p-type float-zone (FZ) Si remains at a very low level of about 20 cm/s. First bifacial silicon solar cells with screen-printed rear contacts on 1.5 Ωcm p-type FZ Si yield a very promising rear efficiency of 13.4%.     

Pyrite (FeS2) thin films prepared by spray method using FeSO4 and (NH4)2Sx

A simple spray method for the preparation of pyrite (FeS₂) thin films has been studied using FeSO₄ and (NH₄)₂S_x as precursors for Fe and S, respectively. Aqueous solutions of these precursors are sprayed alternately onto a substrate heated up to 120°C. Although Fe–S compounds including pyrite are formed on the substrate by the spraying, sulfurization of deposited films is needed to convert other phases such as FeS or marcasite into pyrite. A single-phase pyrite film is obtained after the sulfurization in a H₂S atmosphere at around 500°C for 30 min. All pyrite films prepared show p-type conduction. They have a carrier concentration (p) in the range 10¹⁶–10²⁰ cm⁻³ and a Hall mobility (μ_H) in the range 200–1 cm²/V s. The best electrical properties (p=7×10¹⁶ cm⁻³, μ_H=210 cm²/V s) for a pyrite film prepared here show the excellence of this method. The use of a lower concentration FeSO₄ solution is found to enhance grain growth of pyrite crystals and also to improve electrical properties of pyrite films.     

Very low surface recombination velocities on p-type silicon wafers passivated with a dielectric with fixed negative charge

Surface recombination velocities as low as 10 cm/s have been obtained by treated atomic layer deposition (ALD) of Al₂O₃ layers on p-type CZ silicon wafers. Low surface recombination is achieved by means of field induced surface passivation due to a high density of negative charges stored at the interface. In comparison to a diffused back surface field, an external field source allows for higher band bending, that is, a better performance. While this process yields state of the art results, it is not suited for large-scale production. Preliminary results on an industrially viable, alternative process based on a pseudo-binary system containing Al₂O₃ are presented, too. With this process, surface recombination velocities of 500–1000 cm/s have been attained on mc-Si wafers.     

Control of conduction band offset in wide-gap Cu(In,Ga)Se2 solar cells

The effects of conduction band offset of window/Cu(In,Ga)Se₂ (CIGS) layers in wide-gap CIGS based solar cells are investigated. In order to control the conduction band offset, a Zn_1−xMg_xO film was utilized as the window layer. We fabricated CIGS solar cells consisting of an ITO/Zn_1−xMg_xO/CdS/CIGS/Mo/glass structure with various CIGS band gaps (E_g≈0.97–1.43 eV). The solar cells with CIGS band gaps wider than 1.15 eV showed higher open circuit voltages and fill factors than those of conventional ZnO/CdS/CIGS solar cells. The improvement is attributed to the reduction of the CdS/CIGS interface recombination, and it is also supported by the theoretical analysis using device simulation.     

Analysis of the effect of hydrogen-radical annealing for SiO2 passivation

The effect of hydrogen-radical annealing for SiO₂ passivation was examined. The annealing effect was analyzed by measuring effective lifetime and C-V characteristics and was compared with the effects of forming gas annealing (FGA) and hydrogen RF plasma annealing. The effect of hydrogen-radical annealing is much higher than those of FGA and hydrogen RF plasma annealing. It was also confirmed that both changes of surface recombination velocity and interface state density showed the same tendency. Furthermore, the investigations of hydrogen-radical density showed that by using microwave afterglow method, hydrogen-radicals could be generated much more than that by RF plasma. Accordingly, more interface trap density could be terminated and surface recombination velocity was effectively decreased by using microwave afterglow method.     

CuIn1−xGaxSe2-based photovoltaic cells from electrodeposited precursor films

We have developed an electrodeposition bath based on a buffer solution so that the stability of the electrodeposition process is enhanced and no metal oxides or hydroxides precipitate out of solution. The buffer-solution-based bath also deposits more gallium in the precursor films. As-deposited precursors are stoichiometric or slightly Cu-rich CuIn_1−xGa_xSe₂. Only a minimal amount of indium was added to the electrodeposited precursor films by physical vapor deposition to obtain a 9.4%-efficient device.     

Reduction of defects of polycrystalline silicon thin films by heat treatment with high-pressure H2O vapor

An improvement of electrical properties of pulsed laser crystalllized silicon films was achieved by simple heat treatment with high-pressure H₂O vapor. The electrical conductivity of 7.4×10¹⁷ cm⁻³ phosphorus-doped 50-nm-thick pulsed laser crystallized silicon films was markedly increased from 1.6×10⁻⁵ S/cm (as crystallized) to 2 S/cm by heat treatment at 270°C for 3 h with 1.25×10⁶ Pa H₂O vapor because of reduction of density of defect states localized at grain boundaries. Spin density was reduced from 1.7×10¹⁸ cm⁻³ (as crystallized) to 1.2×10¹⁷ cm⁻³ by heat treatment at 310°C for 3 h with 1.25×10⁶ Pa H₂O vapor.