大面积柔性硅基薄膜电池集成串联组件

采用卷对卷工艺制备了叠层非晶硅/非晶硅锗(a-Si/a-SiGe)电池,采用激光刻划与丝网印刷实现集成串联,形成柔性薄膜电池集成串联组件。研究了SiGe电池渐变带隙、柔性衬底nip倒结构激光刻划、反向脉冲电治疗,并用以改善柔性薄膜电池集成内联组件性能。集成组件有5个子电池内部串联而成,有效面积转换效率达5.424%(AM0,100.1cm2),开路电压达7.156V。     

聚酰亚胺衬底柔性非晶硅薄膜电池集成串联组件的研究

研究了柔性Si基薄膜太阳电池集成串联组件的制备与关键技术。对导电栅线在柔性薄膜太阳电池集成串联组件中的重要性进行了模拟计算,对柔性薄膜太阳电池激光刻蚀进行了理论分析与实验优化,并对柔性Si基薄膜太阳电池集成串联组件进行了设计与研制。在聚酰亚胺(PI)衬底上,通过卷对卷磁控溅射与卷对卷等离子增强化学气相沉积(PECVD)依次沉积复合背反射层Ag/ZnO、Si基薄膜层和透明导电膜层,采用激光刻蚀与丝网印刷工艺相结合实现集成串联,制备了柔性非晶Si(a-Si)薄膜太阳电池集成串联组件。柔性单结集成串联组件有效面积转换效率达到了4.572%(AM0),开路电压Voc=5.065V,填充因子FF=0.552。     

柔性薄膜收发组件技术研究

采用有源相控阵技术的薄膜合成孔径雷达因其全天候、大范围、高精度的探测能力,受到各国广泛重视。柔性薄膜T/ R 组件,由于其重量轻、厚度薄、可弯曲的特性,可以满足天基预警雷达柔性薄膜天线的需要。柔性 薄膜收发组件作为薄膜合成孔径雷达的核心部件,成为薄膜合成孔径雷达(SAR)的关键。文中对柔性薄膜T/ R 组件的接收和发射电路、弯曲特性进行了仿真分析,并对该T/ R 组件样机进行测试验证,获得了工作频段为L 波段,接收增益大于24dB,噪声系数小于2dB,发射功率大于1W,弯曲对带内的损耗影响小于0. 1dB,对带内的相位影响小于2°的结果,其在噪声和接收性能上具有先进性,并对工程应用具有一定的实际参考意义。     

PI衬底柔性透明硅薄膜太阳能电池的制备及性能

利用硬质玻璃为载板,采用传统硅薄膜太阳能电池生产设备,在聚酰亚胺(PI)塑料薄膜衬底上沉积了B掺杂的ZnO(BZO)薄膜,并以此作为前电极制备了单节电池结构及多节串联一体结构的非晶硅(a-Si)太阳能电池;研究了PI衬底上BZO薄膜的光学及电学性能。结果表明,PI衬底上沉积BZO薄膜后在300~1 200 nm波长范围的透光率为76.63%,方块电阻19.7?/□。所制备的单节和多节串联一体结构的a-Si薄膜太阳能电池的转化效率分别达到6.45%和5.1%,封装后电池组件具有一定的透光性,透光率约达到30.2%。     

柔性衬底硅基太阳电池ZAO透明导电膜的研究

采用孪生对靶直流磁控溅射的方法,在室温下制备了ZnO:Al(ZAO)薄膜材料,将其应用于柔性衬底非晶硅薄膜太阳电池的窗口电极。通过调整Ar气流量(1.67×10-7 m3/s～8.33×10-7 m3/s),优化了ZAO薄膜的结构、成份及光电性能。得到如下结论:理想的Ar气流量为3.33×10-7 m3/s,此时ZAO薄膜具有较高的晶化率和C轴择优取向,薄膜的霍尔电阻率达为4.26×10-4Ω.cm,载流子浓度达到1.8×1021cm-3,可见光波长范围内的光学透过率达到85%以上。将优化后的ZAO薄膜用于柔性衬底非晶硅薄膜太阳电池的窗口电极,转化效率达到了4.26%。     

激光刻蚀柔性薄膜太阳电池复合背反射层的研究

柔性聚酯膜衬底薄膜电池通过激光刻蚀等工艺形成集成串联,激光刻蚀柔性薄膜太阳电池复合背反射层(Ag/ZnO)是其中的重要工艺。首先对聚酰亚胺(PI)、Ag、ZnO材料的光学特性进行了分析,然后采用1 064nm脉冲激光与532nm脉冲激光分别对柔性薄膜太阳电池复合背反射层进行刻蚀研究。通过改变重复频率、激光功率、扫描速度和焦点位置等参数,分析了激光刻蚀物理机制,获得了好的刻蚀效果。结果表明,1 064nm纳秒脉冲激光更适合刻蚀柔性PI衬底复合背反射层Ag/ZnO,在激光功率860mW、刻蚀速度800mm/s和重复频率50kHz下,获得了底部平整、两侧无尖峰的刻线,刻线宽为32μm,满足柔性薄膜太阳电池集成串联组件的制备工艺要求。     

柔性低压驱动电加热薄膜升温特性的研究

柔性电加热膜是电加热器领域的研究热点之一,选用银基浆料在柔性透明的PET衬底上制备图形化薄膜电阻,经低温烧结获得柔性电加热膜。在5V直流电压驱动下,分别测试了室温26℃与低温0℃条件下薄膜的表面温度变化及温度分布,研究了丝印浆料种类、图形分布等对柔性电加热膜温升特性的影响。结果表明,基于碳银浆的柔性电加热膜在低功耗下,实现了20摄氏度以上的温升,为其在解决液晶/OLED等器件低温环境使用的瓶颈问题奠定了基础。     

柔性基金属互联线路的卷对卷制备工艺

使用以喷墨印刷为基础的印制电子技术来制备柔性金属互联线路时,喷头易堵塞,制备的导体线路精度差,且需要高温处理.针对这些问题,文中提出了一种可靠且低成本的柔性基金属互联线路制备工艺.该方法结合卷对卷印刷工艺和化学沉积技术来制备金属互联线路,使用的柔性基底材料是具有比普通纸更好的强度和耐水性的Teslin纸.使用卷对卷柔版...     

聚酰亚胺衬底CIGS薄膜附着性的改善

为改善聚酰亚胺(PI)衬底Cu(In,Ga)Se2(CIGS)薄膜的附着性,提出在NaF沉积前预先在Mo层上蒸发沉积100nm厚的In-Ga-Se(IGS)薄膜的新掺Na工艺。结果表明:这种IGS-NaF-CIGS式新工艺可显著改善CIGS薄膜的附着,而且CIGS薄膜材料和器件特性没有显著退化;新工艺促进了NaInSe2的生成,减少了In-Se二元相的残余,但也造成薄膜电阻率的升高和电池填充因子的下降,进而导致制备的PI衬底CIGS电池的转换效率由9.8%降至9.0%。综合考虑附着性的改善和器件效率的轻微下降,新工艺利大于弊,有很好的应用前景。     

On the fabrication of thin film MICs from substrate cleaning to pattern delineation

The processing technology for fabricating thin film MICs is discussed. All the process steps starting from the ceramic substrate cleaning, the substrate metallization with NiCr-Cu-Au sputtered layers, photolithography and the chemical etching are described. The practical problems, important precautions and the optimized processing parameters for the development of reproducible MICs is presented.     

A novel fabrication process of MEMS devices on polyimide flexible substrates

Micro-electro-mechanic-system (MEMS) devices on flexible substrate are important for non-planar and non-rigid surface applications. In this paper, a novel and cost-effective fabrication process for an 8 × 8 MEMS temperature sensor array with a lateral dimension of 2.5 mm × 5.5 mm on a polyimide flexible substrate is developed. A 40 μm thick polyimide substrate is formed on a rigid silicon wafer using as a mechanical carrier throughout the fabrication by four successive spin coating liquid polyimide. The arrayed temperature sensing elements made of 1200 Å sputtered platinum thin film on polyimide substrate show excellent linearity with a temperature coefficient of resistance of 0.0028/°C. The purposed sensor obtains a high sensitivity of 0.781 Ω/°C at 8 mA at constant drive current. Because of the low heat capacity and excellent thermal isolation, the temperature sensing element shows excellent high sensitivity and a fast thermal response. The finished devices are flexible enough to be folded and twisted achieving any desired shape and form. Employing spin-coated liquid polyimide substrate instead of solid polyimide sheet minimizes the thermal cycling as well as improves the production yield. This fabrication technique first introduces the spin-coated PDMS (Polydimethylsiloxane) interlayer between the silicon carrier and the polyimide substrate and makes the polyimide-based devices separate much easier and greatly simplifies the fabrication process with a high production yield. A non-successive two-stage cure procedure for the polyimide precursor is developed to meet low-temperature requirement of the PDMS interlayer. The fabrication procedure developed in this research is compatible with conventional MEMS technology through an optimized integration process. The novel flexible MEMS technology can benefit the development of other new flexible polyimide-based devices.     

旋磁基片DC-10GHz微波功率电阻器设计制作

基于旋磁基片设计并通过光刻工艺制作DC-10 GHz微波电阻器。通过HFSS仿真设计制作DC-10 GHz电阻器,采用磁控反应溅射制作TaN薄膜,电压驻波比VSWR均小于1.25。旋磁基片微波电阻器相对于应用广泛的氧化铝基片微波电阻器,可直接集成于同样以旋磁为基片的结环行器中,从而能制作出更加小型化的微波隔离器,有效减小器件体积,符合现代通信产品小型化、集成化的发展要求。     

Structural and the optical dispersion parameters of nano-CdTe thin film/flexible substrate

CdTe thin films of different thicknesses were deposited on polymer substrates for flexible optical devices applications. X-ray diffractogram of different thicknesses for CdTe films are measured and their patterns exhibit polycrystalline nature with a preferential orientation along the (111) plane. The optical constants of CdTe films were calculated based on the measured transmittance spectral data using Swanepoel's method in the wavelength range 400–2500 nm. The refractive index n and absorption index k were calculated and the refractive index exhibits a normal dispersion. The refractive index dispersion data followed the Wemple–DiDomenico model based on single oscillator. The oscillator dispersion parameters and the refractive index no. at zero photon energy were determined. The possible optical transition in these films is found to be allowed direct transition with energy gap increase from 1.46 to 1.60 eV with the increase in the film thickness. CdTe/flexible substrates are good candidates in optoelectronic devices     

Benzocyclobutene (BCB) dielectrics for the fabrication of high density,thin film multichip modules

A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (>90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures.     

Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

Integral nickel–phosphorus (NiP) resistors were fabricated on flexible polyimide (PI) substrates by electroless NiP deposition. The deposition process was first set up for standard rigid epoxy substrates and then modified for the flexible substrates. The effects of the PI surface modifications on the interfacial adhesion (NiP/PI) were measured experimentally by the pull-off method. The process parameters were optimised to give good adhesion. The mechanical durability of the electrolessly deposited thin film NiP resistors was tested by measuring the electrical resistance during cyclic loading. The results showed the resistors to be mechanically stable. The electrical resistance was also monitored continuously during exposure to corrosive gas environment. The corrosive environment had no significant effect on the resistance of either the electrolessly deposited resistors or the commercial integral resistors used as a reference. The results show that resistors can be fabricated on flexible PI substrate by the described method.