Low-temperature joining of SiC ceramics using NITE phase with Al2O3-Ho2O3 additive

In order to avoid the property degradation resulting from high-temperature joining process, nano-infiltrated transient eutectoid (NITE) phase with the Al₂O₃-Ho₂O₃ as the joining adhesives was adopted to join silicon carbide (SiC) ceramics with the attempts to lower down the joining temperature. The liquid-phase-sintered silicon carbide (LPS-SiC) specimens were joined at 1500-1800°C by spark plasma sintering (SPS) under the pressure of 20 MPa. The results of the shear test and microstructure observation showed that the joining process could be finished at a relatively lower temperature (1700°C) compared to other NITE-phase joining. In contrast to the shear strength of 186.4 MPa derived from the SiC substrate, the joint exhibited the shear strength of 157.8 MPa with the fully densified interlayer.     

Low-temperature joining of SiC ceramics with Y2O3-Al2O3 interlayer by SiO2-based liquid phase extrusion strategy

In order to reduce the joining temperature of SiC ceramics by glass-ceramic joining, some oxides were usually introduced into to Y₂O₃–Al₂O₃ for reducing the eutectic temperature. However, the joints might have poor high-temperature resistance due to the low melting point of the joining layer. In the present work, based on novel SiO₂-based liquid phase extrusion strategy, joining of SiC ceramics with Y₂O₃–Al₂O₃ interlayer was carried out by using Y₂O₃–Al₂O₃–SiO₂ as the filler through spark plasma sintering (SPS). The SiO₂-free interlayer of Y₂O₃–Al₂O₃ was used for comparison. It was found that SiC joints using Y₂O₃–Al₂O₃ could be only joined at a high temperature of 1800 °C, and the thickness of the interlayer was about 20 μm. The shear strength of the joint obtained at 1800 °C was 89.62 ± 4.67 MPa and the failure located in the SiC matrix. By contrast, reliable joining of SiC ceramics could be finished at as low as 1550 °C by extrusion of SiO₂-containing liquid phase when using Y₂O₃–Al₂O₃–SiO₂ as the interlayer, alongside the interlayer thickness of only several microns. The joint strengths after joining at 1550 °C was 84.90 ± 3.48 MPa and the failure located in matrix position. The joining mechanism was discussed by combining the detailed microstructure analysis and phase diagram.     

Joining of Silicon Carbide/Silicon Carbide Composites and Dense Silicon Carbide Using Combustion Reactions in the Titanium–Carbon–Nickel System

A new ceramic joining technique has been developed that utilizes an exothermic combustion reaction to simultaneously synthesize the joint interlayer material and to bond together the ceramic workpieces. The method has been used to join SiC/SiC composites and dense SiC ceramics using TiC-Ni powder mixtures that ignite below 1200°C to form a TiC-Ni joining material. Thin layers of the powder reactants were prepared by tape casting, and joining was accomplished by heating in a hot-press to ignite the combustion reaction. During this process, localized exothermic heating of the joint region resulted in chemical interaction at the interface between the TiC-Ni and the SiC ceramic that contributed to bonding. Room-temperature four-point bending strengths of joints produced by this method have exceeded 100 MPa.     

Pressureless joining of SiC ceramics with magnesia-alumina-silica glass ceramics

Liquid phase sintered SiC ceramics were joined using magnesia-alumina-silica (MAS) glass-ceramic fillers without applied pressure. Four different filler compositions with 9.3–25.2 wt.% MgO, 20.7–33.6 wt.% Al₂O₃, and 49.2–68.1 wt.% SiO₂ were studied. The effects of filler composition and joining temperature (1450–1600°C) on the joint strength were investigated. All compositions exhibited an optimum joining temperature at which the maximum joint strength was obtained. A low joining temperature resulted in poor wetting of the SiC substrate due to the high viscosity of the filler. Whereas a high joining temperature caused dewetting and large unfilled sections in the interlayer due to the deleterious interfacial reactions. The joint strength was inversely proportional to the interlayer thickness, which was a function of filler composition and joining temperature. The SiC ceramic joined at 1525°C with MgO-25 wt.% Al₂O₃-60 wt.% SiO₂ filler exhibited a four-point bending strength of 286 ± 40 MPa.     

Joining of silicon carbide ceramics using a silicon carbide tape

This paper reports the joining of liquid-phase sintered SiC ceramics using a thin SiC tape with the same composition as base SiC material. The base SiC ceramics were fabricated by hot pressing of submicron SiC powders with 4 wt% Al₂O₃–Y₂O₃–MgO additives. The base SiC ceramics were joined by hot-pressing at 1800-1900°C under a pressure of 10 or 20 MPa in an argon atmosphere. The effects of sintering temperature and pressure were examined carefully in terms of microstructure and strength of the joined samples. The flexural strength of the SiC ceramic which was joined at 1850°C under 20 MPa, was 343 ± 53 MPa, higher than the SiC material (289 ± 53 MPa). The joined SiC ceramics showed no residual stress built up near the joining layer, which was evidenced by indentation cracks with almost the same lengths in four directions.     

Low-temperature joining of SiC ceramics by NITE phase using CaO-Al2O3-MgO-SiO2 glass as an additive combined with surface oxidation

Low-temperature joining of SiC ceramics using raw CaO-Al₂O₃-MgO-SiO₂ mixed powders (CAMS-P) and CaO-Al₂O₃-MgO-SiO₂ glass (CAMS-G) as additives for the liquid-phase sintering of SiC nanopowders (NITE phase) in combination with surface oxidation was studied. Using CAMS-P as an additive for SiC joining required 1650 °C and produced a lower shear strength of 77.2 ± 3.5 MPa, compared to untreated SiC (108.2 ± 15.8 MPa). Using CAMS-G as an additive, the compactness of SiC joints obtained at 1550 °C was higher than that of NITE joints obtained at 1650 °C with CAMS-P as an additive. Nonetheless, the low joining temperature resulted in gaps and delaminations at the interface, and the joints strength was only 48.3 ± 5.6 MPa. Incorporating CAMS-G as an additive and surface oxidation achieved reliable NITE phase joining at 1550 °C, with no observed gaps or delaminations at the interface. The resulting joints strength was as high as 100.0 ± 0.8 MPa. The joining mechanism was discussed and compared, involving microstructural analysis.     

Effects of random chopped short carbon fibers on microstructure and mechanical properties of joints for Cf/SiC composites by reaction bonding process

Random chopped short carbon fibers (C_sf)/phenol-formaldehyde resin (PF)/SiC powder mixtures are used as filler for the joining of C_f/SiC composites to obtain SiC interlayer at the joining region. The influences of C_sf on the microstructure and mechanical properties have been investigated. Research shows that the introduction of C_sf can improve the microstructure uniformity of the joint and reduce residual silicon content in the interlayer. The joint achieve a high flexural strength of 232?±?33?MPa as the carbon fiber content is 30?wt.%, which is similar to that of the C_f/SiC composites (220?±?21?MPa). The decrease in residual silicon content and the formation of nano-sized SiC particles are the main reasons for high joining strength.     

Effects of the joining process on the microstructure and properties of liquid-phase-sintered SiC-SiC joints formed with Ti foil

The joining of liquid-phase sintered SiC (LPS-SiC) ceramics was conducted using spark plasma sintering (SPS), through solid state diffusion bonding, with Ti-metal foil as a joining interlayer. Samples were joined at 1400 °C, under applied pressures of either 10 or 30 MPa, and with different atmospheres (argon, Ar, vs. vacuum). It was demonstrated that the shear strength of the joints increased with an increase in the applied joining pressure. The joining atmosphere also affected on both the microstructure and shear strength of the SiC joints. The composition and microstructure of the interlayer were examined to understand the mechanism. As a result, a SiC-SiC joining with a good mechanical performance could be achieved under an Ar environment, which in turn could provide a cost-effective approach and greatly widen the applications of SiC ceramic components with complex shape.     

Joining of SiC ceramics by combining NITE-SiC interlayer and its thickness control

Combined with the thickness control of interlayers (∼10 µm and ∼60 µm), SiC nano-powders with Al₂O₃-Y₂O₃-MgO-CaO additive (NITE-SiC) were used as the joining materials to achieve the low-temperature joining of SiC ceramics. Some residual pores were observed in the interlayer with a thickness of ∼60 µm after joining at 1650 ℃, and the shear strength of SiC joints measured was 39.3 ± 5.5 MPa. Observations showed the fracture of joints occurred at the interlayer. When the thickness of the interlayer decreased to ∼10 µm, no cracks or porosity were observed at the interface region after joining at 1650 ℃. The shear strength of SiC joints increased to 69.5 ± 8.9 MPa, and the fracture originated from the matrix. The results demonstrated using NITE-SiC with Al₂O₃-Y₂O₃-MgO-CaO additive as the joining layer and reducing the thickness of the interlayer could lower the joining temperature and significantly improve the mechanical strength of joints.     

Joining of Silicon Carbide to Ferritic Stainless Steel Using a W–Pd–Ni Interlayer for High-Temperature Applications

For silicon carbide (SiC) ceramics to be used either as structural materials or as functional components, combinations of SiC with metals are frequently encountered. Joining of SiC to ferritic stainless steel has been successfully realized using W–Pd–Ni as an interlayer for high-temperature applications (∼600°C). A two-step joining experiment was performed using the powder metallurgical method. Microstructural evaluation revealed that both the SiC/W–Pd–Ni and the W–Pd–Ni/steel interfaces are bonded well, and interdiffusions as well as chemical interfacial reactions occur in the reaction zone. The microstructural evolution and formation mechanism of the reaction layers were analyzed. The apparent shear strength and hardness of the joints were measured. The effects of joining temperature and holding time on the interfacial microstructure development and the strength of the joints were also investigated.     

用有机聚合物连接碳化硅陶瓷及陶瓷基复合材料

用陶瓷先驱体有机聚合物连接陶瓷及陶瓷基复合材料是一种成本低廉、工艺新颖、可满足特殊高温条件下连接件要求的新型连接技术。介绍了近年来采用先驱体有机聚合物连接SiC及其复合材料的研究现状，重点对影响连接强度的因素进行分析，并提出相应的改进措施。由于该技术具有连接温度较低、连接过程简单、接头热应力小，连接件的热稳定性高等特点，因此它是陶瓷及其复合材料最有前途的连接方法之一。     

Pressure-less joining of alumina ceramics by the reaction-bonded aluminum oxide (RBAO) method

The present work demonstrates a pressure-less and reliable joining technique for alumina ceramics through a reaction-bonded aluminum oxide (RBAO) method. Effective joining relies on the RBAO mechanism, in which Al particles are converted to alumina through oxidation and bond with alumina particles from the parts to be joined upon sintering. Alumina ceramics in a green state were successfully joined with the use of an Al/Al₂O₃ powder mixture as an interlayer. The oxidation behavior of the Al particles was confirmed by thermogravimetry and X-ray diffraction analyses. Joining was performed in ambient air at 1650 °C for 2 h without applying any external pressure. Microstructural observations at the joining interfaces indicated a compact joining. The joining strengths were assessed by determining the biaxial strengths at room temperature, and the joined samples exhibited no fractures at the joining interfaces. Moreover, the joints had a strength of almost 100 % when compared with those of the parent alumina ceramics.     

Microstructure and joining strength evaluation of SiC/SiC joints brazed with SiCp/Ag–Cu–Ti hybrid tapes

SiC particulates were mixed with Ag–Cu–Ti powders to fabricate SiC_P/Ag–Cu–Ti (SICACT) sheets by tape casting process, which were used to braze the sintered SiC ceramics with the structure of SiC/Ag–Cu–Ti foil/SICACT sheet/Ag–Cu–Ti foil/SiC. Microstructure and joining strength both at room temperature and at high temperature were characterized by electron probe X-ray microanalyzer, electron dispersive spectroscopy, transmission electron microscopy, and flexural strength test. The SiC particulates from the SICACT sheets were randomly distributed in the filler alloy matrix and reacted with Ti from the filler alloy. Reaction products TiC and Ti₅Si₃ were found in the interfacial reaction layer. With the increase in SiC particulates volume fraction, the joining strength at room temperature first increased, and then decreased, which was affected by both CTE mismatch and the thickness of the reaction layer. In addition, the joining strength of joints brazed using SICACT sheets at 600?°C can reach 197 MPa, which was obviously higher than that brazed using Ag–Cu–Ti filler alloy.     

Electric current–assisted direct joining of silicon carbide

Conventional direct joining technologies are difficult to use with silicon carbide (SiC) materials, especially for fiber composite forms of SiC, because of the harsh conditions required. To reduce the temperature and/or process time required for the direct joining process, an electric current–assisted joining (ECAJ) method was studied. Joining of low–resistivity grade, nitrogen doped β-SiC was demonstrated at a relatively low nominal temperature of 1750 °C with a 10 min hold by enhancing the passage of current through the material. The joining mechanism is discussed in terms of localized overheating and accelerated self-diffusion at the interface. In the case of joining at 2160 °C for 1 min, rapid crystal growth of textured SiC was found at the interface. This study indicates that rapid ECAJ-based direct joining is a practical and appropriate method for joining SiC-based materials.     

Microstructure and mechanical properties of SiC-SiC joints joined by spark plasma sintering

The development of reliable joining technology is of great importance for the full use of SiC. Ti₃SiC₂, which is used as a filler material for SiC joining, can meet the demands of neutron environment applications and can alleviate residual stress during the joining process. In this work, SiC was joined using different powders (Ti₃SiC₂ and 3Ti/1.2Si/2C/0.2Al) as filler materials and spark plasma sintering (SPS). The influence of the joining temperature on the flexural strength of the SiC joints at room temperature and at high temperatures was investigated. Based on X-ray diffraction and scanning electron microscopy analyses, SiC joints with 3Ti/1.2Si/2C/0.2Al powder as the filler material possess high flexural strengths of 133 MPa and 119 MPa at room temperature and at 1200 °C, respectively. The superior flexural strength of the SiC joint at 1200 °C is attributed to the phase transformation of TiO₂ from anatase to rutile.     

Green State Joining of SiC without Applied Pressure

External pressure (uniaxial or isostatic) is usually necessary to form a thin and defect-free joint in green state joining of SiC ceramics. A successful method of joining SiC in the green state using a liquid polymer precursor, allylhydridopolycarbosilane (AHPCS), without applied pressure, is described. The thermal decomposition behavior of the polymer was examined, and defect formation during joint evolution was investigated by interrupting the heat treatment at various stages. Cracks and pores were observed in the joints formed by pure AHPCS during the pyrolysis of the polymer precursor. Adding SiC powder to the joining paste eliminated defect formation. Optimum SiC loading in the paste was determined to be in the range of 25–35 vol%. Joints formed by AHPCS + (SiC + 5 wt% B) paste were essentially indistinguishable from the matrix and had an average strength of 323 MPa, comparable to that of the control sample.     

Pressure‐less joining of C/SiC and SiC/SiC by a MoSi2/Si composite

A MoSi₂/Si composite obtained in situ by reaction of silicon and molybdenum at 1450°C in Ar flow is proposed as pressure‐less joining material for C/SiC and SiC/SiC composites. A new “Mo‐wrap” technique was developed to form the joining material and to control silicon infiltration in porous composites. MoSi₂/Si composite joining material infiltration inside coated and uncoated C/SiC and SiC/SiC composites, as well as its microstructure and interfacial reactions were studied. Preliminary mechanical strength of joints was tested at room temperature and after aging at service temperatures, resulting in interlaminar failure of the composites in most cases.     

Porous SiC ceramics with dendritic pore structures by freeze casting from chemical cross-linked polycarbosilane

In this study, a commercial polycarbosilane (PCS) and divinylbenzene (DVB) were used as the preceramic polymer precursor and crosslinking agent, respectively to form porous silicon carbide (SiC) ceramics by freeze casting DVB/camphene/PCS solutions. Porous silicon carbide (SiC) with a dendritic pore structure and connecting bridges was obtained after pyrolysis at 1200 °C. The effects of DVB and PCS content on the rheological properties of the solution and the morphological characteristics and the compressive strengths of SiC ceramics were investigated. The use of DVB and the resulting chemical cross-linking yielded modified pore characteristics and much lower oxygen content in pyrolyzed SiC compared to the conventional thermal curing method. A compressive strength of 18.7 MPa was obtained for pyrolyzed SiC prepared with 20 wt% PCS and a 0.2 DVB/PCS mass ratio.     

Preparation,structural evolution,and performance of heat-resistant organosilicon polymer adhesives for joining SiC ceramics

There is an urgent need for heat-resistant adhesives with high bonding strength in order to able to fabricate large and complex SiC components for aeronautical and astronautical applications. In this study, heat-resistant organic adhesives prepared using an organosilicon polymer and inorganic additives (B₄C and SiO₂) were used successfully to bond SiC ceramics. The prepared adhesives were characterised through shear strength tests as well as using thermogravimetry-differential scanning calorimetry, Fourier-transform infrared spectroscopy, X-diffraction analysis, and scanning electron microscopy. The adhesives exhibited high room-temperature shear strengths (greater than 15 MPa) after being subjected to heat treatments at 200–1200°C. Further, the high-temperature shear strengths of the adhesives at 200, 400, 600, 800, and 1000°C were 10.5, 10.1, 7.7, 8.6, and 8.4 MPa, respectively. The high performance of the adhesives indicated that they should be suitable for joining SiC-based materials for use in high-temperature applications.     

Direct bonding of silicon carbide ceramics sintered with yttria

SiC ceramics sintered with yttria were successfully joined without an interlayer by conventional hot pressing at lower temperatures (2000–2050 °C) compared to those of the sintering temperatures (2050–2200 °C). The joined SiC ceramics sintered with 2000 ppm Y₂O₃ showed almost the same thermal conductivity (˜198 Wm⁻¹ K⁻¹), fracture toughness (3.7 ± 0.2 MPa m^1/2), and hardness (23.4 ± 0.8 GPa) as those of the base material, as well as excellent flexural strength (449 MPa). In contrast, the joined SiC ceramics sintered with 4 wt% Y₂O₃ showed very high thermal conductivity (˜204 Wm⁻¹ K⁻¹) and excellent flexural strength (˜505 MPa). Approximately 16–22% decreases in strength compared to those of the base SC materials were observed in both joined ceramics, due to the segregation of liquid phase at the interface. This issue might be overcome by preparing well-polished and highly flat surfaces before joining.