Nitride-based LEDs with an SPS tunneling contact Layer and an ITO transparent contact

The indium-tin-oxide [ITO(80 nm)] and Ni(5 nm)-Au(10 nm) films were separately deposited on glass substrates, p-GaN layers, n/sup +/-InGaN-GaN short-period-superlattice (SPS) structures, and nitride-based light-emitting diodes (LEDs). It was found that ITO on n/sup +/-SPS structure could provide us an extremely high transparency (i.e., 93.2% at 465 nm) and also a reasonably small specific contact resistance of 1.6/spl times/10/sup -3//spl Omega//spl middot/cm/sup 2/. Although the forward voltage which corresponds to 20-mA operating current for LED with ITO on n/sup +/-SPS upper contact was slightly higher than that of the LED with Ni-Au on n/sup +/-SPS upper contact, a 30% higher output intensity could still be achieved by using ITO on n/sup +/-SPS upper contact. Moreover, the output power of packaged LED with ITO was about twice as large as that of the other conventional Ni-Au LEDs.     

Nitride-based light-emitting diodes with Ni/ITO p-type ohmic contacts

The optical and electrical properties of Ni(5 nm)-Au(5 nm) and Ni(3.5 nm)-indium tin oxide (ITO) (60 nm) films were studied. It was found that the normalized transmittance of Ni/ITO film could reach 87% at 470 nm, which was much larger than that of the Ni-Au film. It was also found that the specific contact resistance was 5 /spl times/ 10/sup -4/ /spl Omega/ /spl middot/ cm/sup 2/ and 1 /spl times/ 10/sup -3/ /spl Omega/ /spl middot/ cm/sup 2/, respectively, for Ni-Au and Ni/ITO on p-GaN. Furthermore, it was found that the 20 mA output power of light-emitting diode (LED) with Ni-Au p-contact layer was 5.26 mW. In contrast, the output power could reach 6.59 mW for the LED with Ni/ITO p-contact layer.     

Highly reliable nitride-based LEDs with SPS+ITO upper contacts

Nitride-based blue light emitting diodes (LEDs) with an n/sup +/-short period superlattice (SPS) tunnel contact layer and an indium tin oxide (ITO) transparent contact were fabricated. Compared with conventional nitride-based LEDs with Ni/Au upper contacts, it was found that we could achieve a 60% increase in electroluminescence (EL) intensity by using ITO upper contacts. However, it was also found that the lifetime of ITO LEDs were much shorter. Furthermore, it was found that we could achieve a longer lifetime and a smaller reverse leakage current (I/sub R/) by the deposition of a SiO/sub 2/ layer on top of the ITO LEDs.     

Rapid thermal annealed InGaN/GaN flip-chip LEDs

Nitride-based flip-chip (FC) light-emitting diodes (LEDs) emitting at 465 nm with Ni transparent ohmic contact layers and Ag reflective mirrors were fabricated. With an incident light wavelength of 465 nm, it was found that transmittance of normalized 300/spl deg/C rapid thermal annealed (RTA) Ni(2.5 nm) was 93% while normalized reflectance of 300/spl deg/C RTA Ni(2.5 nm)/Ag(200 nm) was 92%. It was also found that 300/spl deg/C RTA Ni(2.5 nm) formed good ohmic contact on n/sup +/ short-period-superlattice structure with specific contact resistance of 7.8/spl times/10/sup -4/ /spl Omega//spl middot/cm/sup 2/. With 20-mA current injection, it was found that forward voltage and output power were 3.15 V and 16.2 mW for FC LED with 300/spl deg/C RTA Ni(2.5 nm)/Ag(200 nm). Furthermore, it was found that reliabilities of FC LEDs were good.     

Highly Reliable High-Brightness GaN-Based Flip Chip LEDs

The properties of indium-tin-oxide (ITO)/Ni films as transparent ohmic contacts of nitride-based flip chip (FC) light emitting diodes (LEDs) were studied. It was found that 300degC rapid thermal annealed (RTA) ITO(15 nm)/Ni(1 nm) could provide good electrical and optical properties for FC LED applications. It was also found that 20-mA operation voltage and output power of the 465-nm FC LEDs with ITO/Ni/Ag reflective mirror were 3.16 V and 21 mW, respectively. Furthermore, it was found that output intensity of the proposed LED only decayed by 5% after 1200 h under 30-mA current injection at room temperature.     

Improvement of the luminous intensity of light-emitting diodes by using highly transparent Ag-indium tin oxide p-type ohmic contacts

We have investigated Ag-indium tin oxide (ITO) scheme for obtaining high-quality p-type ohmic contacts for GaN-based light-emitting diodes (LEDs). The Ag(1 nm)-ITO(200 nm) contacts exhibit greatly improved electrical characteristics when annealed at temperatures in the range 400/spl deg/C-600/spl deg/C for 1 min in air, yielding specific contact resistances of /spl sim/10/sup -4/ /spl Omega//spl middot/cm/sup 2/. In addition, the contacts give transmittance of about 96% at 460 nm, which is far better than that of the conventionally used oxidized Ni-Au contacts. It is shown that the luminous intensity of blue LEDs fabricated with the Ag-ITO contacts is about three times higher than that of LEDs with oxidized Ni-Au contacts. This result strongly indicates that the Ag-ITO scheme can serve as a highly promising p-type ohmic contact for the realization of high brightness near ultraviolet LEDs.     

Thermally stable Ge/Ag/Ni Ohmic contact for InAlAs/InGaAs/InP HEMTs

Excellent annealed ohmic contacts based on Ge/Ag/Ni metallization have been realized in a temperature range between 385 and 500/spl deg/C, with a minimum contact resistance of 0.06 /spl Omega//spl middot/mm and a specific contact resistivity of 2.62 /spl times/10/sup -7/ /spl Omega//spl middot/cm/sup 2/ obtained at an annealing temperature of 425/spl deg/C for 60 s in a rapid thermal annealing (RTA) system. Thermal storage tests at temperatures of 215 and 250/spl deg/C in a nitrogen ambient showed that the Ge/Ag/Ni based ohmic contacts with an overlay of Ti/Pt/Au had far superior thermal stabilities than the conventional annealed AuGe/Ni ohmic contacts for InAlAs/InGaAs high electron mobility transistors (HEMTs). During the storage test at 215/spl deg/C, the ohmic contacts showed no degradation after 200 h. At 250/spl deg/C, the contact resistance value of the Ge/Ag/Ni ohmic contact increased only to a value of 0.1 /spl Omega//spl middot/mm over a 250-h period. Depletion-mode HEMTs (D-HEMTs) with a gate length of 0.2 /spl mu/m fabricated using Ge/Ag/Ni ohmic contacts with an overlay of Ti/Pt/Au demonstrated excellent dc and RF characteristics.     

Low loss, thin p-clad 980-nm InGaAs semiconductor laser diodes with an asymmetric structure design

Thin p-clad InGaAs ridge waveguide quantum-well lasers having an asymmetric structure design were fabricated. The internal absorption coefficient is as low as 2.5 cm/sup -1/, due to the restricted field extension in the 0.3-/spl mu/m-thick p-type top AlGaAs cladding layer. Ti-Pt-Au metallization is used outside the ridge to provide adherence on the oxide while Au directly contacts the ridge region. It is shown that the most likely source of loss in these thin p-clad devices is scattering at the rough interface between Au and the p/sup ++/ top GaAs layer, after ohmic contact heat treatment.     

InAlN/GaN HEMTs: a first insight into technological optimization

High-electron mobility transistors (HEMTs) were fabricated from heterostructures consisting of undoped In/sub 0.2/Al/sub 0.8/N barrier and GaN channel layers grown by metal-organic vapor phase epitaxy on (0001) sapphire substrates. The polarization-induced two-dimensional electron gas (2DEG) density and mobility at the In/sub 0.2/Al/sub 0.8/N/GaN heterojunction were 2/spl times/10/sup 13/ cm/sup -2/ and 260 cm/sup 2/V/sup -1/s/sup -1/, respectively. A tradeoff was determined for the annealing temperature of Ti/Al/Ni/Au ohmic contacts in order to achieve a low contact resistance (/spl rho//sub C/=2.4/spl times/10/sup -5/ /spl Omega//spl middot/cm/sup 2/) without degradation of the channels sheet resistance. Schottky barrier heights were 0.63 and 0.84 eV for Ni- and Pt-based contacts, respectively. The obtained dc parameters of 1-/spl mu/m gate-length HEMT were 0.64 A/mm drain current at V/sub GS/=3 V and 122 mS/mm transconductance, respectively. An HEMT analytical model was used to identify the effects of various material and device parameters on the InAlN/GaN HEMT performance. It is concluded that the increase in the channel mobility is urgently needed in order to benefit from the high 2DEG density.     

GaN MSM UV photodetectors with titanium tungsten transparent electrodes

GaN metal-semiconductor-metal (MSM) ultraviolet photodetectors with titanium tungsten (TiW) transparent electrodes were fabricated and characterized. It was found that the 10-nm-thick TiW film deposited with a 300-W RF power can still provide a reasonably high transmittance of 75.1% at 300 nm, a low resistivity of 1.7/spl times/10/sup -3/ /spl Omega//spl middot/cm and an effective Schottky barrier height of 0.773 eV on u-GaN. We also achieved a peak responsivity of 0.192 A/W and a quantum efficiency of 66.4% from the GaN ultraviolet MSM photodetector with TiW electrodes. With a 3-V applied bias, it was found that minimum noise equivalent power and maximum D/sup */ of our detector were 1.987/spl times/10/sup -10/ W and 6.365/spl times/10/sup 9/ cmHz/sup 0.5/W/sup -1/, respectively.     

大功率倒装结构GaN LED p电极研究

从接触电阻、反射率、电流扩展等方面对Ni/Au/Ag,ITO/Ag,Ag等多种倒装结构p电极金属体系进行分析比较，给出了实现倒装结构大功率GaN LED p电极的多种设计方案. 指出Ni/Au金属化体系在大功率LED应用中存在的热稳定性问题及Ru,Ir等新型金属体系实现GaN p电极接触的潜在优势.     

Optimization of AuGe-Ni-Au ohmic contacts for GaAs MOSFETs

GaAs-based metal-oxide-semiconductor field-effect transistors (MOSFETs) are promising devices for high-speed and high-power applications. One important factor influencing the performance of a GaAs MOSFET is the characteristics of ohmic contacts at the drain and source terminals. In this paper, AuGe-Ni-Au metal contacts fabricated on a thin (930 /spl Aring/) and lightly doped (4/spl times/10/sup 17/ cm/sup -3/) n-type GaAs MOSFET channel layer were studied. The effects of controllable processing factors such as the AuGe thickness, the Ni/AuGe thickness ratio, alloy temperature, and alloy time to the characteristics of the ohmic contacts were analyzed. Contact qualities including specific contact resistance, contact uniformity, and surface morphology were optimized by controlling these processing factors. Using the optimized process conditions, a specific contact resistance of 5.6/spl times/10/sup -6/ /spl Omega//spl middot/cm/sup 2/ was achieved. The deviation of contact resistance and surface roughness were improved to 1.5% and 84 /spl Aring/, respectively. Using the improved ohmic contacts, high-performance GaAs MOSFETs (2 /spl mu/m/spl times/100 /spl mu/m) with a large drain current density (350 mA/mm) and a high transconductance (90 mS/mm) were fabricated.     

Highly reliable GaN-based light-emitting diodes formed by p-In/sub 0.1/Ga/sub 0.9/N-ITO structure

Indium-tin-oxide (ITO) is deposited as a transparent current spreading layer of GaN-based light-emitting diodes (LEDs). To reduce the interfacial Schottky barrier height, a thin p-In/sub 0.1/Ga/sub 0.9/N layer is grown as an intermediate between ITO and p-GaN. The contact resistivity around 2.6/spl times/10/sup -2/ /spl Omega//spl middot/cm/sup 2/ results in a moderately high forward voltage LED of 3.43 V operated at 20 mA. However, the external quantum efficiency and power efficiency are enhanced by 46% and 36%, respectively, in comparison with the conventional Ni-Au contact LEDs. In the life test, the power degradation of the p-In/sub 0.1/Ga/sub 0.9/N-ITO contact samples also exhibits a lower value than that of the conventional ones.     

Fabrication of Germanosilicate glass optical fibers containing Tm/sup 2+/ ions and their nonlinear optical properties

Germanosilicate glass optical fibers incorporated with the Tm/sup 2+/ ions were fabricated to enhance optical nonlinearity by providing a strong reduction environment based on the solution doping technique in the modified chemical vapor deposition (MCVD) process. The incorporation of the Tm/sup 2+/ ions into the fiber core was identified by the electron paramagnetic resonance (EPR) spectrum in the fiber preform, and the absorption and emission properties between 350 and 1600 nm of the Tm/sup 2+/ ions in optical fibers and the fiber preform. A strong broad absorption band due to the Tm/sup 2+/ ions appeared from 350 to /spl sim/900 nm, and a broad emission from /spl sim/600 to /spl sim/1050 nm and the other emission from /spl sim/1050 to /spl sim/1300 nm, which were not shown in the Tm/sup 3+/ ions, were found upon Ar-ion laser pumping at 515 nm. Both absorption and emission results confirm that the Tm/sup 2+/ ions in the germanosilicate glass have the 4f-5d energy band from 350 to /spl sim/900 nm and the 4f-4f energy level at /spl sim/1115 nm. Also, the resonant nonlinearity at /spl sim/1310 and /spl sim/1530 nm due to the Tm/sup 2+/ ions in the fiber was measured upon the 515 nm optical pumping by using a long-period fiber grating (LPG) pair method. The nonlinear refractive index n/sub 2/ at /spl sim/1310 and /spl sim/1530 nm was found to be /spl sim/4/spl times/10/sup -15/ m/sup 2//W, where 70% and 30% of the n/sub 2/ are attributed to the nonradiative transitions and the radiative transitions, respectively.     

Nitride-based MQW LEDs with multiple GaN-SiN nucleation layers

Nitride-based light emitting diodes (LEDs) separately prepared with a conventional single low-temperature (LT) GaN nucleation layer and multiple GaN-SiN nucleation layers were both prepared. It was found that we could reduce defect density and thus improve crystal quality of the GaN-based LEDs by using multiple GaN-SiN nucleation layers. With a 20-V applied reverse bias, it was found that the reverse leakage currents measured from the LED with a single LT GaN nucleation layer and the one with 10-pair GaN-SiN nucleation layers were 1.5/spl times/10/sup -4/ and 2.5/spl times/10/sup -6/ A, respectively. It was also determined that we could use the multiple GaN-SiN nucleation layers to enhance the output intensity of near ultraviolet (UV) LEDs and to improve the reliability of nitride-based LEDs.     

Indium tin oxide transparent electrodes for broad-area top-emitting vertical-cavity lasers fabricated using a single lithography step

We report for the first time top-emitting buried oxide vertical cavity lasers using transparent indium tin oxide electrodes. Our process enables broad-area InAlGaAs VCSELs to be fabricated in a single lithography step, thus allowing the fast turn-around time necessary for evaluating VCSEL epitaxial materials. The ITO contacts attain a peak transmission of 96%, a specific contact resistance of 10/sup -5/ /spl Omega//spl middot/cm/sup 2/, and a sheet resistivity of 2.5/spl times/10/sup -4/ /spl Omega//spl middot/cm. Under room temperature CW pumping, the devices exhibit a minimum threshold current density of 1.2 kA/cm/sup 2/ at a wavelength of 801 mm, and have a maximum light output power of 5.2 mW.     

Copper gate AlGaN/GaN HEMT with low gate leakage current

Copper (Cu) gate AlGaN/GaN high electron mobility transistors (HEMTs) with low gate leakage current were demonstrated. For comparison, nickel/gold (Ni/Au) gate devices were also fabricated with the same process conditions except the gate metals. Comparable extrinsic transconductance was obtained for the two kinds of devices. At gate voltage of -15 V, typical gate leakage currents are found to be as low as 3.5/spl times/10/sup -8/ A for a Cu-gate device with gate length of 2 /spl mu/m and width of 50 /spl mu/m, which is much lower than that of Ni/Au-gate device. No adhesion problem occurred during these experiments. Gate resistance of Cu-gate is found to be about 60% as that of NiAu. The Schottky barrier height of Cu on n-GaN is 0.18 eV higher than that of Ni/Au obtained from Schottky diode experiments. No Cu diffusion was found at the Cu and AlGaN interface by secondary ion mass spectrometry determination. These results indicate that copper is a promising candidate as gate metallization for high-performance power AlGaN/GaN HEMT.     

Interface observation in Au/Ni/p-GaN studied by HREM and energy-filtering TEM

The contact resistance of Au/Ni/p-GaN ohmic contacts for different annealing conditions was measured. This was then correlated with microstructure, including phase distribution, observed by high-resolution electron microscopy combined with energy-filtering imaging. A contact resistance of 2.22 x 10(-4) ohms cm2 for Au/Ni contacts to p-GaN after annealing at 500 degrees C for 5 min in air ambient was obtained. NiO layers were identified at the interface and upper area of annealed Ni/Au/p-GaN for air ambient. In addition, an Au layer was found at the interface of p-GaN due to a reversal reaction during annealing. Identification of the observed phases is discussed, along with possible formation mechanisms for the ohmic contacts in the Au/Ni/p-GaN system.     

Improvement of InGaN/GaN laser diodes by using a Si-doped In/sub 0.23/Ga/sub 0.77/N/GaN short-period superlattice tunneling contact layer

InGaN/GaN multiple-quantum-well laser diode (LD) structures, including an Si-doped n/sup +/-In/sub 0.23/Ga/sub 0.77/N/GaN short-period superlattice (SPS) tunneling contact layer, are grown on c-face sapphire substrates by metalorganic vapor-phase epitaxy. The In/sub 0.23/Ga/sub 0.77/N/GaN(n/sup +/)-GaN(p) tunneling junction, which uses a low-resistivity n/sup +/-In/sub 0.23/Ga/sub 0.77/N/GaN SPS instead of a high-resistivity p-type GaN as a top contact layer, allows the reverse-biased tunnel junction to form a "quasi-ohmic" contact. Experimental results indicate that LDs with n/sup +/-In/sub 0.23/Ga/sub 0.77/N/GaN SPS contacting layers can achieve a lower threshold current and longer lasing duration under pulsed operation. Moreover, when the input pulse width is lengthened from 300 ns to 2 /spl mu/s, the lasing duration of the LD with Pt ohmic contact is three times longer than that of the LD with Ni/Au ohmic contacts. Therefore, we conclude that nitride-based LDs with an SPS reversed-tunneling contact layer may significantly reduce the contact resistance of an anode electrode and thereby increase the thermal stability of the device reliability.     

GaN MSM photodetectors with photo-CVD annealed Ni/Au electrodes

Thin Ni/Au (3/6 nm) bi-layer metal films annealed by photo-chemical vapor deposition (photo-CVD) were investigated. With proper annealing in oxygen by the photo-CVD systems, it was found that the transmittance of the deposited Ni/Au increased from 67 to 85% in the region between 350 and 450 nm. GaN metal-semiconductor-metal (MSM) ultraviolet (UV) photodetectors with photo-CVD annealed Ni/Au contact electrodes were also fabricated. It was found that dark current of the detector became significantly smaller after annealing. With a 1 V applied bias, it was found that we can achieve a photocurrent to dark current contrast ratio of 2.54×10³ from the photodetectors with 600 °C photo-CVD annealed Ni/Au contacts.