基于MEMS技术的微热电器件的研究进展

对基于MEMS微加工工艺的微致冷器件和微发电器件的最新研究情况进行了综述，对各种结构形式和研究现状进行了综合比较。从微热电器件的优化设计方法、微机械加工工艺等方面，分析了提高微热电器件性能的途径。     

温差电器件接触电阻和接触热阻的测试及分析

接触电阻和接触热阻是影响温差电器件性能的两个重要的工艺参数，直接反映器件制造的工艺水平。因此，对器件的接触电阻和接触热阻进行测试分析，将能够定量地了解现行工艺对器件温差电性能的影响程度。本文首先介绍接触电阻的测试方法和实验结果，然后利用所测的数据，再通过对器件输出功率特性的测试，间接地导出器件的接触热阻。据笔者所知，这是温差电器件接触热阻实测数值的首次报道。     

P型Bi2Te3基温差电材料性能研究

近年来,由于环境问题、能源问题及需求增加的刺激,探索高性能温差电器件的热潮再度掀起。温差电器件是体积小、无污染、无噪声的固态器件。但温差电器件若要在与常规制冷方式和传统电源的竞争中脱颖而出,关键的是要增加温差电致冷器和温差发电器的效率,而其最有效的途径就是提高温差电材料的热电性能。     

TGS热释电器件综合模型的计算机模拟

本文用计算机对TGS热释电器件综合模型的解析结果进行模拟实验,画出20组80多条曲线,对器件的多方性能进行了讨论研究。     

碳纳米管场效应晶体管电子输运特性的研究

由于硅器件尺寸不断缩小至纳米尺度,人们因此对纳米尺度器件开展了理论与结构方面的广泛而深入的研究,其中最重要的纳米尺度器件是基于碳纳米管的电场效应器件并被称为碳纳米管场效应晶体管(CNTFET).本文分析了碳纳米管场效应晶体管沟道电子的传输特性,并给出了用器件端子参数描述的器件I-V特性方程表达式,计算了器件的I-V特性曲线并把结果与纳米器件专用分析软件nanoMOS-2.0给出的结果作了比较,发现本文模型的计算结果均大于nanoMOS-2.0给出的结果,表明本文模型尚需进一步的深入分析和优化.     

OTS修饰的不同厚度酞菁铜OTFT的研究

用十八烷基三氯硅烷(OTS)修饰了不同厚度的酞菁铜(CuPc)有机薄膜晶体管器件, 对比酞菁铜厚度为15、40、80 nm的3种器件性能后,得到40 nm的酞菁铜器件具有最高载流子迁移率.分析了OTS修饰的绝缘层表面对器件性能的影响,得到的40 nm厚度酞菁铜器件载流子迁移率为4.3×10-3cm2/V*s, 阈值电压为-9.5 V.     

新型有机电致蓝色磷光器件的研究

研究了基于FIrpic的超薄非掺杂有机电致蓝色磷光器件的光电特性.改变超薄非掺杂FIrpic发光层以及其隔离层的厚度,可以调控FIrpic分子的聚集及激子相互作用强度对器件性能的影响.研究结果表明,具有TCTA 5 nm/FIrpic 1 nm/TCTA 5 nm/FIrpic 1 nm/TPBI 5 nm/FIrpic 1 nm多发光层结构的器件性能较优,最大发光效率为9.9 cd/A,超薄非掺杂发光层结构避免了掺杂方法中共沉积磷光材料浓度的精确控制,有利于简化器件制备工艺.     

国内热释电器件的应用现状

热释电器件是七十年代中取得重要进展的一种新型器件,在红外器件领域中占有十分重要的位置。我国几家主要的红外研究所大致从1970年起开始从事这种器件的研究,现已研制出适应于不同用途的各种类型的热释电器件,并分别达到了国内先进水平和国际先进水平。目前国内从事热释电器件研究的单位很多,其中最主要的有上海技术物理所(探测器),昆明物理所(探测器和摄象管),电子部11所(探测器)、31所和55所     

NPB层嵌入MgF_2超薄层对OLED性能的影响

将MgF2超薄层嵌入有机电致发光器件(OLED)的空穴传输层NPB中,制备了结构为ITO/NPB(10nm)/MgF2(xnm)/NPB(20nm)/Alq3(30nm)/Al(30nm)的一系列OLED。测试结果表明,合适厚度的MgF2可有效降低器件启亮电压,提高器件的发光效率。MgF2厚度为0.5nm的器件启亮电压只有2.3V,较未嵌入MgF2器件降低2V;MgF2厚度为1.0nm的器件最大电流效率达到3.93cd/A,最大光功率效率达到1.58lm/W,较未嵌入MgF2器件分别提高95%和110%。     

硅基压电悬臂梁式微麦克风的设计与优化

设计了一种硅基PZT压电悬臂梁式微麦克风。这种微麦克风采用压电多层膜悬臂梁作为声压感受器件，采用有限元耦合场分析的方法对压电复合膜悬臂梁进行了有限元分析和模拟，研究了压电复合多层膜悬臂梁的结构参数与力学性能的关系，分析了影响微麦克风机电性能的多种因素，给出了优化的器件结构和工艺流程。     

Micro and nano structures of carbonised polymer through pyrolytic transformation from polymer structures

Micro and nano structures of carbonised polymers resulting from the pyrolytic transformation of polymer structures are presented. Polymers have become increasingly popular as materials for micro/nano electromechanical systems (MEMS/NEMS), especially for chemical or biological application. Focus is on the transformation of polymer structures into carbonised structures using a pyrolysis process. Combination of this pyrolysis process with conventional MEMS/NEMS fabrication technology could provide various fine structures of carbonised polymer. Carbonised polymers have advantages over conventional carbon materials, with respect to compatibility with MEMS, because they can be transformed directly from a polymer structure. Three-dimensional micro and nano free-standing structures of carbonised polymer as typical MEMS/NEMS structures are reported. Micro molding process is used to demonstrate a unique polymer structure to be pyrolysed. Furthermore, EB lithography technology is employed for the patterning of polymers in addition to UV photolithography which is used by previous researches. A 100 nm wide bridge structure is designed as nano structures. In addition, the presented structures of carbonised polymer are expected to be applied to micro and nano functional devices such as electrochemical sensors by making the best use of their carbon-like features     

移动互联网络时代MEMS技术的创新发展

微电子机械系统(MEMS)技术是半导体微电子学的创新,利用Si基集成电路的平面工艺从两维加工向三维加工发展,开创了MEMS新的领域。综述并分析了与信息产业以及移动网络相关的MEMS主流产品(加速度计、陀螺仪、微麦克风、数字微镜器件(DMD)、喷墨头和RF MEMS)的技术发展现状和趋势,同时预测了MEMS新兴产品(光滤波器、微小电子鼻、微扬声器、微超声器、微能量采集器和纳机电系统(NEMS))的科研现状和面临的技术挑战。从当前世界MEMS技术发展的特点(系统集成、与CMOS工艺结合走向标准加工、纳米制造与微米、纳米融合和多应用领域扩展)出发,结合国内MEMS技术发展的现状,提出我国MEMS技术发展的建议。     

纳机电系统阻尼及噪声研究进展

在微机电系统(MEMS)领域,自1989年Tang等人首次提出横向多晶硅谐振器结构以来,有关谐振器振动过程中阻尼问题的研究一直就是影响和推进谐振器发展的一个主要方面。近几年,随着器件尺寸的进一步缩小,器件尺寸进入亚微米级甚至是纳米级领域,阻尼及噪声问题更是成为影响器件工作特性的一个重要因素。本文就近几年微机电系统和纳机电系统中,相关MEMS谐振器以及微悬臂梁的阻尼和噪声问题的研究,作了一些介绍和分析。     

Packaging of nanostructured microelectromechanical systems microtriode devices

Combining the world of microelectromechanical systems (MEMS) with that of nano can lead to new devices with unique or advanced functionalities. Carbon nanotubes are fascinating new nanomaterials with many interesting physical, chemical, and electronic properties and potential new applications. We have incorporated nanotubes into the MEMS structure as patterned, cold-cathode field emitters to create on-chip, miniature vacuum tubes of microtriodes that can be useful for high-frequency microwave communications. Proper bonding and assembly processes were essential in providing reliable electrical connections and improved amplification performances.     

Nanotribology and nanomechanics of MEMS/NEMS and BioMEMS/BioNEMS materials and devices

The micro/nanoelectromechanical systems (MEMS/NEMS) need to be designed to perform expected functions typically in millisecond to picosecond range. Expected life of the devices for high speed contacts can vary from few hundred thousand to many billions of cycles, e.g., over a hundred billion cycles for digital micromirror devices (DMDs), which puts serious requirements on materials. For BioMEMS/BioNEMS, adhesion between biological molecular layers and the substrate, and friction and wear of biological layers may be important. There is a need for development of a fundamental understanding of adhesion, friction/stiction, wear, and the role of surface contamination, and environment. Most mechanical properties are known to be scale dependent. Therefore, the properties of nanoscale structures need to be measured. MEMS/NEMS materials need to exhibit good mechanical and tribological properties on the micro/nanoscale. There is a need to develop lubricants and identify lubrication methods that are suitable for MEMS/NEMS. Methods need to be developed to enhance adhesion between biomolecules and the device substrate. Component-level studies are required to provide a better understanding of the tribological phenomena occurring in MEMS/NEMS. The emergence of micro/nanotribology and atomic force microscopy-based techniques has provided researchers a viable approach to address these problems. This paper presents a review of micro/nanoscale adhesion, friction, and wear studies of materials and lubrication studies for MEMS/NEMS and BioMEMS/BioNEMS, and component-level studies of stiction phenomena in MEMS/NEMS devices.     

飞秒激光双光子聚合加工微纳结构

针对微/纳机电系统（MEMS/NEMS）零部件加工制造难题,研究具有亚衍射极限空间分辨率的飞秒激光双光子聚合加工方法,搭建钛蓝宝石飞秒激光微纳加工系统,对液态聚合物材料进行飞秒激光双光子聚合加工工艺试验研究。结果表明:随着激光功率的降低,单个固化点的尺寸减小,加工分辨率提高;扫描步距减小,所加工工件的表面粗糙度数值减小,但加工效率降低。基于CAD软件设计出微米墙和纳米线构成的三维微纳结构,利用飞秒激光双光子聚合加工得到该三维微纳结构实物,通过优化工艺参数加工出直径小于100 nm的纳米线,从而证明飞秒激光双光子聚合加工方法为微/纳器件的制造提供了一种有效方法。     

Packaging for microelectromechanical and nanoelectromechanical systems

Packaging is a core technology for the advancement of microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS). We discuss MEMS packaging challenges in the context of functional interfaces, reliability, modeling and integration. These challenges are application-dependent; therefore, two case studies on accelerometers and BioMEMS are presented for an in-depth illustration. Presently, most NEMS are in the exploratory stage and hence a unique path to identify the relevant packaging issues for these devices has not been determined. We do, however, expect the self-assembly of nano-devices to play a key role in NEMS packaging. We demonstrate this point in two case studies, one on a silicon nanowire biosensor, and the other on self-assembly in molecular biology. MEMS/NEMS have the potential to have a tremendous impact on various sectors such as automotive, aerospace, heavy duty applications, and health care. Packaging engineers have an opportunity to make this impact a reality by developing low-cost, high-performance and high-reliability packaging solutions.     

On the reliability of electrostatic NEMS/MEMS devices: Review of present knowledge on the dielectric charging and stiction failure mechanisms and novel characterization methodologies

This paper reviews the state of the art knowledge related to critical failure mechanisms in electrostatic micro- and nano-electromechanical systems (MEMS and NEMS) which are the dielectric charging and stiction. It describes also the recent employed nanoscale characterization techniques for these phenomena based on Kelvin probe force microscopy (KPFM) and force–distance curve measurements. The influence of relative humidity and dielectric deposition conditions on the charging/discharging processes is discussed. Moreover, different stiction mechanisms induced by electrostatic force and/or meniscus formation are analyzed. Finally, novel characterization methods are presented and used to correlate between the results from MEMS devices and metal–insulator–metal (MIM) capacitors. These methods are employed in view of application in electrostatic capacitive MEMS switches and could be easily extended to explore other NEMS/MEMS devices. The study provides an accurate understanding of the charging and stiction related failure mechanisms, presents guidelines for a proper packaging environment, and reveals precise explanations for the literature reported device level measurements of electrostatic MEMS devices.     

一种复合式MEMS皮拉尼真空计的设计

微电子机械系统(MEMS)皮拉尼真空计可广泛用于芯片封装和设备测试等领域.量程是MEMS皮拉尼真空计的重要性能指标之一.设计了一种复合式MEMS皮拉尼真空计,通过将具有不同测量范围的两款器件串联复合在同一芯片上,实现量程的扩展.以二极管型皮拉尼真空计为例设计了器件结构,优化了尺寸参数,并给出了兼容CMOS工艺的制造方案...     

纳米光波导光滑技术研究进展

随着半导体工业的发展,集成光电器件的特征尺寸越来越小,纳米光波导表面光滑技术将面临新的挑战。降低纳米光波导表面粗糙度,制造超低损耗纳米光波导,实现其高效片间光互连与片内光耦合,是集成光电子器件,特别是高灵敏微陀螺、生化传感器、光通讯等器件发展的关键。主要分析了光波导表面粗糙度与传播损耗的关系,着重阐述纳米光波导表面光滑工艺方法,包括热氧化法、氢退火法及激光束法的研究现状及最新进展,总结了各类工艺的技术难点与发展前景,并展望其在微机电、光集成方面应用前景。