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1.
Novel intercrosslinked networks of siliconized epoxy‐1,2‐bis(maleimido)ethane matrix systems are developed. The siliconization of epoxy resin is carried out by using 5–15% hydroxyl‐terminated poly(dimethylsiloxane) with γ‐aminopropyltriethoxysilane as a crosslinking agent and dibutyltin dilaurate as a catalyst. The siliconized epoxy systems are further modified with 5–15% 1,2‐bis(maleimido)ethane and cured by using diaminodiphenylmethane. The prepared neat resin castings are characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into these epoxy resins improves the toughness with a reduction in the stress–strain values, whereas incorporation of bismaleimide (BMI) into the epoxy resin improves the stress–strain properties with a lowering of the toughness. The introduction of both siloxane and BMI into the epoxy resin influences the mechanical properties according to their content percentages. Differential scanning calorimetry (DSC), thermogravimetry, and heat distortion temperature analyses are also carried out to assess the thermal behavior of the matrix materials that are developed. DSC thermograms of the BMI modified epoxy systems show unimodal reaction exotherms. The glass‐transition temperature, thermal degradation temperature, and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content. The water absorption behavior of the matrix materials is also studied. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 89: 3808–3817, 2003  相似文献   

2.
Novel hybrid intercrosslinked networks of hydroxyl‐terminated polydimethylsiloxane‐modified epoxy and bismaleimide matrix systems have been developed. Epoxy systems modified with 5, 10, and 15 wt % of hydroxyl‐terminated polydimethylsiloxane (HTPDMS) were developed by using epoxy resin and hydroxyl‐terminated polydimethylsiloxane with γ‐aminopropyltriethoxysilane (γ‐APS) as compatibilizer and dibutyltindilaurate as catalyst. The reaction between hydroxyl‐terminated polydimethylsiloxane and epoxy resin was confirmed by IR spectral studies. The siliconized epoxy systems were further modified with 5, 10, and 15 wt % of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry and thermogravimetric analysis of the matrix samples were also performed to determine the glass‐transition temperature and thermal‐degradation temperature of the systems. Data obtained from mechanical studies and thermal characterization indicate that the introduction of siloxane into epoxy improves the toughness and thermal stability of epoxy resin with reduction in strength and modulus values. Similarly the incorporation of bismaleimde into epoxy resin improved both tensile strength and thermal behavior of epoxy resin. However, the introduction of siloxane and bismaleimide into epoxy enhances both the mechanical and thermal properties according to their percentage content. Among the siliconized epoxy/bismaleimide intercrosslinked matrices, the epoxy matrix having 5% siloxane and 15% bismaleimide exhibited better mechanical and thermal properties than did matrices having other combinations. The resulting siliconized (5%) epoxy bismaleimide (15%) matrix can be used in the place of unmodified epoxy for the fabrication of aerospace and engineering composite components for better performance. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 38–46, 2001  相似文献   

3.
Intercrosslinked network of siliconized epoxy-1,3-bis(maleimido)benzene matrix systems have been developed. The siliconization of epoxy resin was carried out by using various percentages of (5-15%) hydroxyl-terminated polydimethylsiloxane (HTPDMS) with γ-aminopropyltriethoxysilane (γ-APS) as crosslinking agent and dibutyltindilaurate as catalyst. The siliconized epoxy systems were further modified with various percentages of (5-15%) 1,3-bis(maleimido)benzene (BMI) and cured by using diaminodiphenylmethane (DDM). The neat resin castings prepared were characterized for their mechanical properties. Mechanical studies indicate that the introduction of siloxane into epoxy resin improves the toughness of epoxy resin with reduction in the values of stress-strain properties whereas, incorporation of bismaleimide into epoxy resin improves stress-strain properties with lowering of toughness. However, the introduction of both siloxane and bismaleimide into epoxy resin influences the mechanical properties according to their percentage content. Differential scanning calorimetry (DSC), thermogravimetric analysis (TGA) and measurement of heat distortion temperature were also carried out to assess the thermal behavior of the matrix samples. DSC thermogram of the BMI modified epoxy systems show unimodel reaction exotherms. The glass transition temperature (Tg), thermal degradation temperature and heat distortion temperature of the cured BMI modified epoxy and siliconized epoxy systems increase with increasing BMI content and this may be due to the homopolymerization of BMI rather than Michael addition reaction. The morphology of the BMI modified epoxy and siliconized epoxy systems were also studied by scanning electron microscopy.  相似文献   

4.
The objective of the present work is the development and characterization of siliconized epoxy-phosphorus based bismaleimide coating systems using diglycidylether terminated poly (dimethylsiloxane) (DGTPDMS) and phosphorus-containing bismaleimide (PBMI) as chemical modifiers for epoxy resin. Phosphorus-containing diamine (DOPO-NH2) was synthesized from 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) and 4,4′-diaminobenzophenone (DABP), which was utilized in the preparation of phosphorus-containing bismaleimide (PBMI) with maleic anhydride. Siliconized epoxy prepolymer was prepared using epoxy resin and functionally terminated polydimethylsiloxane. The purity and structural conformation of these materials were ascertained from FTIR and NMR spectral studies. The prepared siliconized epoxy prepolymer was blended with varying percentages of PBMI using diaminodiphenylsulfone (DDS) and diaminodiphenylmethane (DDM) as curing agents. The siliconized epoxy and bismaleimide modified epoxy and siliconized epoxy coating materials were characterized by dynamic mechanical thermal analysis (DMTA), differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), heat distortion temperature (HDT) and Limiting oxygen index (LOI).  相似文献   

5.
An epoxy matrix system modified by diglycidylether‐terminated polydimethylsiloxane (DGETPDMS) and bismaleimide (BMI) was developed. Epoxy systems modified with 4, 8, and 12% (by wt) of DGETPDMS were made using epoxy resin and DGETPDMS, with diaminodiphenylmethane as the curing agent. The DGETPDMS‐toughened epoxy systems were further modified with 4, 8, and 12% (by wt) of BMI, namely (N,N′‐bismaleimido‐4,4′‐diphenylmethane). DGETPDMS/BMI/epoxy matrices were characterized using differential scanning calorimetry, thermogravimetric analysis, and heat deflection temperature analysis. The matrices, in the form of castings, were characterized for their mechanical properties, viz. tensile strength, flexural strength, and impact test, as per ASTM methods. Mechanical studies indicate that the introduction of DGETPDMS into epoxy resin improves the impact strength, with reduction in tensile strength, flexural strength, and glass transition temperature, whereas the incorporation of BMI into epoxy resin enhances the mechanical and thermal properties according to its percentage content. However, the introduction of both DGETPDMS and BMI enhances the values of thermomechanical properties according to their percentage content. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 668–674, 2006  相似文献   

6.
Interpenetrating polymer networks of bismaleimide‐modified polyurethane–epoxy systems were prepared using the aliphatic and aromatic bismaleimides‐ and polyurethane‐modified epoxy and cured in the presence of 4,4′‐diaminodiphenylmethane. Infrared spectral analysis was used to confirm the polyurethane‐crosslinked epoxy (PU–EP). The matrices developed were characterized by mechanical, thermal, electrical, and morphological studies. The results obtained from the mechanical studies indicate that the incorporation of polyurethane and bismaleimides into epoxy increased the tensile strength, flexural strength, and impact strength, according to their nature and percentage concentration. The results obtained from the thermal and electrical studies indicate that the incorporation of polyurethane into epoxy decreased the thermal properties (glass transition temperature, heat distortion temperature (HDT), thermal stability) and electrical properties (dielectric strength, volume and surface resistivity, and arc resistance). The incorporation of aromatic bismaleimide into the polyurethane‐modified epoxy system increased the glass transition temperature, thermal stability, and electrical properties. Decreased values of glass transition and HDT were obtained in the case of aliphatic bismaleimide‐modified polyurethane–epoxy system. Surface morphology of modified epoxy systems was studied using scanning electron microscopy, and it was found that the polyurethane‐modified epoxy systems exhibited heterogeneous morphology and bismaleimides‐modified epoxy systems showed a homogeneous morphology. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3592–3602, 2006  相似文献   

7.
A bismaleimide (BMI) resin was added to an epoxy system composed of N,N′-tetraglycidyldiaminodiphenyl methane (TGDDM) and diaminodiphenyl methane (DDM). Cure behavior of the BMI modified epoxy resins was studied by a dynamic differential scanning calorimetry (DSC) method. Dynamic DSC thermograms of the BMI modified epoxy resins indicated unimodal reaction exothermic peaks. The overall heat of reaction per unit mass decreased with BMI composition. The residual heat of reactions of the epoxy blends cured at 180°C for 3 h increased with BMI composition. Thermal stability of the epoxy system improved by incorporating BMI resin. Flexural strength and modulus increased with BMI composition.  相似文献   

8.
An intercrosslinked network of polysulfone (PSF)—bismaleimide (BMI) modified epoxy matrix system was made by using diglycidyl ether of bisphenol A (DGEBA) epoxy resin, hydroxyl terminated polysulfone and bismaleimide (3,3′‐bis(maleimidophenyl) phenylphosphine oxide) with diaminodiphenylmethane (DDM) as curing agent. BMI–PSF–epoxy matrices were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and heat deflection temperature (HDT) analysis. The matrices, in the form of castings, were characterized for their mechanical properties such as tensile strength, flexural strength, and unnotched Izod impact test as per ASTM methods. Mechanical studies indicated that the introduction of polysulfone into epoxy resin improves the toughness to an appreciable extent with insignificant increase in stress–strain properties. DSC studies indicated that the introduction of polysulfone decreases the glass transition temperature, whereas the incorporation of bismaleimide into epoxy resin influences the mechanical and thermal properties according to its percentage content. DSC thermograms of polysulfone as well as BMI modified epoxy resin show a unimodal reaction exotherm. The thermal stability and flame retardant properties of cured epoxy resins were improved with the introduction of bismaleimide and polysulfone. Water absorption characteristics were studied as per ASTM method and the morphology of the BMI modified epoxy and PSF‐epoxy systems were studied by scanning electron microscope. POLYM. COMPOS., 2008. © 2008 Society of Plastics Engineers  相似文献   

9.
Novolac epoxy (EPN)—2,2′‐diallyl bisphenol A (DABA) resin system was modified by cocuring it with bisphenol A bismaleimide (BMI). Molar concentration of BMI in the stochiometric blend of EPN and DABA was varied from 0.5 to 2.0. The cure optimization was done using DSC, IR spectroscopy, and rheological studies. The curing proceeded by phenol‐epoxy and Alder‐ene reactions. The performance of the ternary Epoxy‐Allyl phenolic‐Bismaleimide system was evaluated through their thermal and dynamic mechanical characterization. BMI improved the overall thermal stability and the modulus of the resultant composites. The increase in BMI concentration in the system resulted in enhanced glass transition temperature with a consequent improvement in high temperature performance typically estimated by their lap shear strength at high temperatures. The high temperature performance of the epoxy‐phenol‐bismaleimide (EPB) system was found to be far superior to the epoxy‐phenol (EP)system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007  相似文献   

10.
A series of intercrosslinked networks formed by diglycidyl ether of bisphenol A epoxy resin (DGEBA) and novel bismaleimide containing phthalide cardo structure (BMIPP), with 4,4′‐diamino diphenyl sulfone (DDS) as hardener, have been investigated in detail. The curing behavior, thermal, mechanical and physical properties and compatibility of the blends were characterized using differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), notched Izod impact test, scanning electron microscopy (SEM) and water absorption test. DSC investigations showed that the exothermic transition temperature (Tp) of the blend systems shifted slightly to the higher temperature with increasing BMIPP content and there appeared a shoulder on the high‐temperature side of the exothermic peak when BMIPP content was above 15 wt %. TGA and DMA results indicated that the introduction of BMIPP into epoxy resin improved the thermal stability and the storage modulus (G′) in the glassy region while glass transition temperature (Tg) decreased. Compared with the unmodified epoxy resin, there was a moderate increase in the fracture toughness for modified resins and the blend containing 5 wt % of BMIPP had the maximum of impact strength. SEM suggested the formation of homogeneous networks and rougher fracture surface with an increase in BMIPP content. In addition, the equilibrium water uptake of the modified resins was reduced as BMIPP content increased. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011  相似文献   

11.
Aromatic polyesters were prepared and used to improve the brittleness of bismaleimide resin, composed of 4,4′‐bismaleimidodiphenyl methane and o,o′‐diallyl bisphenol A (Matrimid 5292 A/B resin). The aromatic polyesters included PEPT [poly(ethylene phthalate‐co‐ethylene terephthalate)], with 50 mol % of terephthalate, PEPB [poly(ethylene phthalate‐co‐ethylene 4,4′‐biphenyl dicarboxylate)], with 50 mol % of 4,4′‐biphenyl dicarboxylate, and PEPN [poly(ethylene phthalate‐co‐ethylene 2,6‐naphthalene dicarboxylate)], with 50 mol % 2,6‐naphthalene dicarboxylate unit. The polyesters were effective modifiers for improving the brittleness of the bismaleimide resin. For example, inclusion of 15 wt % PEPT (MW = 9300) led to a 75% increase in fracture toughness, with retention in flexural properties and a slight loss of the glass‐transition temperature, compared with the mechanical and thermal properties of the unmodified cured bismaleimide resin. Microstructures of the modified resins were examined by scanning electron microscopy and dynamic viscoelastic analysis. The toughening mechanism was assessed as it related to the morphological and dynamic viscoelastic behaviors of the modified bismaleimide resin system. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 81: 2352–2367, 2001  相似文献   

12.
Intercrosslinked networks of bismaleimide (BMI) modified polyurethane–epoxy systems were prepared from chain‐extended BMI and polyurethane modified epoxy and cured in the presence of 4,4′‐diaminodiphenylmethane. Infrared spectral analysis was used to confirm the grafting of polyurethane onto the epoxy skeleton. The prepared matrices were characterized by mechanical, thermal, and morphological studies. The results, obtained from the mechanical and thermal studies, reveal that the incorporation of polyurethane into epoxy increases the mechanical strength and decreases the glass‐transition temperature and thermal stability. The incorporation of chain‐extended BMI into polyurethane modified epoxy systems increases the thermal stability and both tensile and flexural properties, and decreases the impact strength and glass‐transition temperature. Surface morphologies of polyurethane modified epoxy and chain‐extended BMI modified polyurethane– epoxy systems were studied by scanning electron microscopy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 87: 1562–1568, 2003  相似文献   

13.
An intercrosslinked network of unsaturated polyester–bismaleimide modified epoxy matrix systems was developed. Epoxy systems modified with 10, 20, and 30% (by weight) of unsaturated polyester were made by using epoxy resin and unsaturated polyester with benzoyl peroxide and diaminodiphenylmethane as curing agents. The reaction between unsaturated polyester and epoxy resin was confirmed by IR spectral studies. The unsaturated polyester toughened epoxy systems were further modified with 5, 10, and 15% (by weightt) of bismaleimide (BMI). The matrices, in the form of castings, were characterized for their mechanical properties. Differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) of the matrix samples were performed to determine the glass transition temperature (Tg) and thermal degradation temperature of the systems, respectively. Mechanical properties, viz: tensile strength, flexural strength, and plain strain fracture toughness of intercrosslinked epoxy systems, were studied by ASTM methods. Data obtained from mechanical and thermal studies indicated that the introduction of unsaturated polyester into epoxy resin improves toughness but with a reduction in glass transition, whereas the incorporation of bismaleimide into epoxy resin improved both mechanical strength and thermal behavior of epoxy resin. The introduction of bismaleimide into unsaturated polyester‐modified epoxy resin altered thermomechanical properties according to their percentage concentration. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 2853–2861, 2002  相似文献   

14.
N‐(4‐hydroxyphenyl)maleimide was melt‐blended with the glycidyl ether of bisphenol‐A and various mole percentages of 4, 4′‐(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (To) and peak exothermic (Texo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (Tgs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry  相似文献   

15.
Three kinds of liquid crystalline aromatic azomethine modifiers were synthesized with high yield, and the modification of bismaleimide resin (BMI) with them was studied by scanning electron microscope, polarizing optical microscope, thermogravimetric analyzer, differential scanning calorimetry, and rheolometry. Blends cured at the temperature of liquid crystalline phase were found to have oriented liquid crystal‐rich phase and improved mechanical properties. The addition of o,o′‐diallyl bisphenol A in the blends of BMI decreases thermal properties but shows little effect on phase structures. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4366–4371, 2006  相似文献   

16.
A novel soluble phosphorus‐containing bismaleimide (BMI) monomer, bis(3‐maleimidophenyl)phenylphosphine oxide (BMIPO), was synthesized by the imidization of bis(3‐aminophenyl) phenylphosphine oxide, in which its structural characterization was identified with 1H‐NMR, 13C‐NMR, and Fourier transform infrared spectra. The BMIPO resin, with five‐membered imide rings and high phenyl density, was an excellent flame retardant with a high glass‐transition temperature (Tg), onset decomposition temperature, and limited oxygen index. In phosphorus‐containing BMI/epoxy/4,4′‐methylene dianiline (DDM)‐cured resins, homogeneous products were obtained from all proportions without phase separation. Because of the higher reactivity of BMIPO/DDM relative to that of 4,4′‐bismaleimidodiphenylmethane (BMIM)/DDM, the increase in the BMIPO/BMIM ratio in this blending resin increased the recrosslinking hazards of the postcuring stage and so lowered the Tg value and thermal stability. The thermal stability of the BMI/epoxy‐cured system was lower than that of the epoxy‐cured system because of the introduction of a phosphide group into BMIPO, whereas for the Tg value and flame retardancy, the former was significantly higher than the latter: the higher the BMIPO content in the blend, the higher the flame retardancy. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 84: 2080–2089, 2002; DOI 10.1002/app.10607  相似文献   

17.
Chlorine‐ and methyl‐substituted aromatic diamines based on diaminodiphenylmethane were epoxidized and characterized. The effect of different substituents on epoxidation was studied. The cure studies of the two new tetrafunctional resins in comparison with unsubstituted resin N,N,N′,N′‐tetraglycidyl‐4,4′‐diaminodiphenylmethane (TGDDM) was carried out by DSC with 3,3′‐dichloro‐4,4′diaminodiphenylmethane (o‐DCDDM; 30% w/w) as a common curing agent. The mechanical properties such as flexural, Izod impact, heat distortion temperature (HDT), of such cured neat resins were also studied. The results of the cure studies indicate that the substitution of the α‐hydrogen of the resin by chlorine or methyl group decreases the reactivity of the resin leading to an increase in the shelf life. This study also indicates that the functionality of the resin plays a pivotal role in the reactivity and thus the shelf life of an epoxy resin system. The results of the mechanical properties of the neat resin casts obtained by subjecting to a common cure schedule when compared with the unsubstituted resin showed a decrease in impact strength, which is obvious because of the presence of a bulky pendant group but the impact strength was higher than that of the TGOS30 resin system. Results of flexural strength of the different substituted neat resin casts did not show much of a deviation from that of the unsubstituted resin system. The HDT results indicate no significant difference in the values of the unsubstituted resin vis‐a‐vis with substituted resin systems. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 93: 2790–2801, 2004  相似文献   

18.
Three epoxy‐amine thermoset systems were cured at a low ambient temperature. Evolution of the reaction kinetics and molecular structure during cure at the sub‐glass transition temperature was followed by DSC and chemorheology experiments. The effect of vitrification and the reaction exotherm on curing and final mechanical properties of the epoxy thermosets was determined. Thermomechanical properties of the low‐temperature cured systems depend on the reaction kinetics and volume of the reaction mixture. Curing of the fast‐reacting system in a large volume (12‐mm thick layer) resulted in the material with Tg exceeding the cure temperature by 70–80°C because of an exothermal temperature rise. However, the reaction in a too large volume (50‐mm layer) led to thermal degradation of the network. In contrast, thin layers (1.5 mm) were severely undercured. Well‐cured epoxy thermosets could be prepared at sub‐Tg temperatures by optimizing reaction conditions. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 99: 3669–3676, 2006  相似文献   

19.
The short‐chain epoxy resin (SCER) was prepared direct from epichlorohydrin/bisphenol A (ECH/BPA). The resulted SCER and 4,4′‐diaminodiphenyl sulfone (DDS) with various weight percent of triallyl isocyanurate/4,4′‐bismaleimidophenylmethane (TAIC/BMI) were subsequently thermally coreacted to the corresponding high performance materials for high frequency application. They were characterized using potentiometry, Fourier transform infrared (FTIR), differential scanning calorimetry (DSC), thermogravimetric analyses (TGA), dielectric analyzer, and scanning electron microscope (SEM). Dynamic mechanical analysis (DMA) of polymers showed only a Tg indicating a low entropy, amorphous state and formed a conterminously linked polymer. The morphology of polymers revealed no phase separation. The formation of polymer was in good agreement with the proposed molecular structure, and has enhanced good thermal, mechanical, and electric properties. Furthermore, with lower nitrogen content was achieved UL‐94 V‐0 rating. No fume and toxic gas emission were observed during burning test for this system. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 2470–2480, 2006  相似文献   

20.
A novel phosphorous‐containing biphenol, 2‐(5,5‐dimethyl‐4‐phenyl‐2‐oxy‐1,3,2‐dioxaphosphorin‐6‐yl)‐ 1,4‐benzenediol (DPODB), was prepared by the addition reaction between 5,5‐dimethyl‐4‐phenyl‐2‐oxy‐1,3,2‐dioxaphosphorinane phosphonate (DPODP) and p‐benzoquinone (BQ). The compound (DPODB) was used as a reactive flame retardant in o‐cresol formaldehyde novolac epoxy resin (CNE) for electronic application. The structure of DPODB was confirmed by FTIR and NMR spectra. Thermal properties of cured epoxy resin were studied using differential scanning calorimetry (DSC) and thermal gravimetric analysis (TGA). The flame retardancy of cured epoxy resins was tested by UL‐94 vertical test and achieved UL‐94 vertical tests of V‐0 grade (nonflammable). © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 3842–3847, 2006  相似文献   

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