Catalyst effect on cure reactions in the blend of aromatic dicyanate ester and bismaleimide

Catalyst effects on cure reactions of a bismaleimide [4,4′‐bismaleimidodiphenylmethane (BMI)] associated with a liquid aromatic dicyanate ester [1,1′‐bis(4‐cyanatophenyl)ethane (BEDCy)] and with a powder type of aromatic dicyanate ester [bisphenol A dicyanate (BADCy)] were thoroughly investigated by in situ FTIR and DSC dynamic scanning. In noncatalyzed blend systems, coreactions between the dicyanate ester and bismaleimide always occur, and thus the formation of the pyrimidine and/or pyridine structures occurs. The pyrimidine structure always predominates. The use of a dicyanate‐sensitive catalyst facilitates the formation of a sequential interpenetrating network (IPN). The extent of the sequential IPN depends on the level of catalyst and the type of matrix materials, and thus the extent of coreactions. Probable reaction paths were also proposed for various formulations of hybrid blends. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 94: 345–354, 2004     

Cure reactions in the blend of cyanate ester with maleimide

Cure reactions of a bismaleimide (4,4′-bismaleimidodiphenylmethane, BMI) associated with a liquid aromatic dicyanate ester (1,1′-bis(4-cyanatophenyl)ethane, BEDCy) and with a powder type aromatic dicyanate ester (bisphenol A dicyanate, BADCy) were investigated by in situ FTIR and DSC dynamic scanning. In non-catalyzed blend systems, co-reactions between dicyanate ester and bismaleimide always occur, and hence the formation of pyrimidine and/or pyridine structures take place. Pyrimidine structures always predominate. Probable reaction paths were also proposed for various formulations of hybrid blends. In addition, N-phenylmaleimide (MI) and p-phenyl-phenylcyanate (S-Cy) were utilized as model compounds and mixed via a melting method and a solution method to explore the corresponding cure reactions by means of FTIR, DSC and NMR. ¹³C NMR spectra of the model compounds demonstrated the formation of linkages of sym-triazine rings, pyrimidine structures, pyridine structures and dioxazine structures. The reaction mechanism or linkage structures produced in the model compound system studied may be somewhat different from those of the real system due to a diffusion effect in real systems or to the different activation energy in both systems.     

Cure kinetics and catalyzed effect of hydroxyl group of LC diglycidyl ether of bisphenol‐S with aromatic diamines

The curing reactions of liquid crystalline 4,4′‐bis‐(2,3‐epoxypropyloxy)‐sulfonyl‐bis(1,4‐phenylene) (p‐BEPSBP) with 4,4′‐diaminodiphenylmethane (DDM) and 4,4′‐diaminodiphenylsulfone (DDS) were investigated by nonisothermal differential scanning calorimeter (DSC). The relationships of E_a with the conversion α in the curing process were determined. The catalyzed activation of hydroxyl group for curing reaction of epoxy resins with amine in DSC experiment was discussed. The results show that these curing reactions can be described by the autocatalytic ?esták‐Berggren model. The curing technical temperature and parameters were obtained, and the even reaction orders m, n, and ΔS for p‐BEPSBP/DDM and p‐BEPSBP/DDS are 0.35, 0.92, ?81.94 and 0.13, 1.32, ?24.45, respectively. The hydroxyl group has catalyzed activation for the epoxy–amine curing system in the DSC experiment. The average E_a of p‐BEPSBP/DDM is 67.19 kJ mol^?1 and is 105.55 kJ mol^?1 for the p‐BEPSBP/DDS system, but it is different for the two systems; when benzalcohol as hydroxyl group was added to the curing system, the average E_a of p‐BEPSBP/DDM decreases and increases for p‐BEPSBP/DDS. The crystalline phase had formed in the curing process and was fixed in the system. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Cure kinetics and physical properties of dicyanate/polyetherimide semi‐IPNs

The curing behavior and physical properties of dicyanate/polyetherimide (PEI) semi‐interpenetrating polymer network (IPN) systems were investigated. Differential scanning calorimetry (DSC) was used to study the curing behavior of the dicyanate/PEI semi‐IPN systems. The curing rate of the semi‐IPN system decreased as the PEI content increased. An autocatalytic reaction mechanism can describe well the curing kinetics of the semi‐IPN systems. The reaction kinetic parameters were determined by fitting DSC conversion data to the kinetic equation. The glass transition temperature of the semi‐IPNs decreased with increasing PEI content. Two glass transitions due to phase‐separated morphology were observed for the semi‐IPN containing over 15 phr (parts per hundred parts of dicyanate resin) PEI. The thermal stability and dynamic mechanical properties of the semi‐IPNs were measured by thermal analysis.     

DGEBF/DDS体系固化动力学机理的研究

以4,4′-二氨基二苯砜(DDS)胺类固化剂固化9,9-二[4-(2,3环氧丙氧基)苯基]芴(DGEBF),采用非等温DSC法推导了固化反应参数和固化机理,并用原位红外和移动窗口二维相关红外分析对固化机理和固化模式进行了验证。结果表明:DGEBF/DDS体系固化反应的表观活化能为64.08 kJ/mol,扩散因子为4.05×104s-1,反应级数为1.55;固化工艺为150℃/1.5 h+190℃/2 h+220℃/1.5 h;固化模式为枝状成核的自催化反应;固化机理为伯胺先与环氧基反应生成仲胺,肿胺继续与环氧基反应生成叔胺,2个反应同时进行,以及在高温下的羟基与环氧基的自催化反应,交联的固化网络逐渐形成。     

Polymerization kinetics and thermal properties of dicyanate/clay nanocomposites

The polymerization kinetics and thermal properties of dicyanate/clay nanocomposites were investigated. A type of organically modified clay was used as nanometer‐size fillers for the thermosetting dicyanate resin. Differential scanning calorimetry (DSC) was used to study the curing behavior of the dicyanate/clay nanocomposite systems. The polymerization rate of the nanocomposite systems increased with increasing clay content. An autocatalytic reaction mechanism could adequately describe the polymerization kinetics of the dicyanate/clay nanocomposite systems. The polymerization kinetic parameters were determined by fitting the DSC conversion data to the proposed kinetic equation. The glass‐transition temperature of the dicyanate/clay nanocomposites increased with increasing clay content. The thermal decomposition behavior of the dicyanate/clay nanocomposites was investigated by thermogravimetric analysis. © 2004 Wiley Periodicals, Inc. J Appl Polym Sci 92: 1955–1960, 2004     

Effect of blending polyethersulfone on the cure kinetics and physical properties of dicyanate resin

The curing behavior and thermomechanical properties of dicyanate/polyethersulfone (PES) blends were investigated. Differential scanning calorimetry (DSC) was used to study the curing behavior of the dicyanate/PES blends. A second‐order autocatalytic reaction mechanism was used to describe the cure kinetics of the blends. The reaction kinetic parameters were determined by fitting DSC conversion data to the kinetic equation. The main glass‐transition temperatures of the blends decreased with increasing PES content. Two glass‐transition temperatures indicating phase‐separated morphology of the blends were observed. The thermal decomposition behavior of the blends was measured using thermogravimetric analysis. Mechanical and electrical properties of the blends were investigated. © 2001 John Wiley & Sons, Inc. J Appl Polym Sci 82: 1952–1962, 2001     

Curing kinetics and reaction‐induced homogeneity in networks of poly(4‐vinyl phenol) and diglycidylether epoxide cured with amine

Mixtures of diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin with poly(4‐vinyl phenol) (PVPh) of various compositions were examined with a differential scanning calorimeter (DSC), using the curing agent 4,4′‐diaminodiphenylsulfone (DDS). The phase morphology of the cured epoxy blends and their curing mechanisms depended on the reactive additive, PVPh. Cured epoxy/PVPh blends exhibited network homogeneity based on a single glass transition temperature (T_g) over the whole composition range. Additionally, the morphology of these cured PVPh/epoxy blends exhibited a homogeneous network when observed by optical microscopy. Furthermore, the DDS‐cure of the epoxy blends with PVPh exhibited an autocatalytic mechanism. This was similar to the neat epoxy system, but the reaction rate of the epoxy/polymer blends exceeded that of neat epoxy. These results are mainly attributable to the chemical reactions between the epoxy and PVPh, and the regular reactions between DDS and epoxy. Polym. Eng. Sci. 45:1–10, 2005. © 2004 Society of Plastics Engineers.     

Thermal characterization of a bis-maleimide/bis-cyanate/epoxy thermosetting resin for composites

The thermosetting resin investigated here was a mixture of bis-maleimide and bis-cyanate, frequently referred to as BT (bis-maleimide triazine). Triazine is the reaction product of the cyclotrimerization of bis-cyanate during curing. For circuit board applications, a brominated epoxy resin was blended with BT to impact flame resistance. Resin cure was extensively investigated using a combination of thermoanalytical techniques (thermal analysis, heated cell infrared spectroscopy, and dynamic mechanical analysis). The ultimate glass transition temperature was found to be 240°C, which could only be obtained using cure temperatures above 225°C. At lower temperatures, the reaction does not reach full conversion, since the glass transition temperature of the curing network equals or slightly exceeds the cure temperature. Differential scanning calorimetry (DSC) indicates a minimum of two separate reactions. Fourier transform infrared spectroscopy provided more detailed information on the crosslinking reactions during cure. The onset of cyclotrimerization was found to start at 150°C, correlating with one of the peaks in the DSC. At higher temperatures, the epoxide reacts with the cyanate functionality forming oxazoline ring structures. It was not possible to unambiguously assign the origins of the high temperature peaks in the DSC. These high temperature peaks may be attributed to several reactions, including epoxy homopolymerization and polymerization of bis-maleimide. The high temperature reaction mechanisms warrant further investigation.     

Cure kinetics and properties of epoxy/dicyanate blends

The cure behavior and properties of epoxy/dicyanate blends containing a stoichiometric amount of an amine curing agent for epoxilde groups were investigated as a function of blend composition. Differential scanning calorimetry (DSC) was used to investigate the dynamic and isothermal cure behavior of the blends. The cure rate of the blend increased with increasing dicyanate content. A second order autocatalytic reaction mechanism described the cure kinetics of the blends. The kinetic parameters were determined by fitting the dynamic DSC data to the model kinetic equation. The k₁₀ and E₁ values were mainly affected by the change of dicyanate content. The glass transition temperature of the blend decreased with increasing dicyanate content. The thermal decomposition characteristics of the blends were investigated by thermogravimetric analysis (TGA). Dynamic mechanical analysis (DMA) and thermal mechanical analysis (TMA) were used to investigate the mechanical properties of the blends. With increasing dicyanate content, the cure rate increased but the thermal and mechanical properties of the cured blends were not improved.     

Ultraviolet curing kinetics of cycloaliphatic epoxide with real‐time fourier transform infrared spectroscopy

The photo‐induced curing kinetics of cycloaliphatic epoxide coatings were investigated with real‐time Fourier transform infrared spectroscopy with an optical fiber ultraviolet curing system. The consumption of epoxy group as a function of time was obtained by monitoring of the oxirane absorbance in the 789–746‐cm^?1 region. The effect of the type of epoxide, hydroxyl equivalent weight, ratio of oxirane to hydroxyl groups (R), photoinitiator, and exposure time on the curing reaction was investigated. In general, the rate of curing was dependent on the hydroxyl equivalent weight, R, type of epoxide, and photoinitiator. For formulations without polyol, both initiator concentration and exposure time had minimal effects on the curing reaction. However, for formulations with polyol, the curing a reaction was dependent on the initiator concentration. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 2485–2499, 2003     

Cure characterization of triglycidyl epoxy/aromatic amine systems

The curing of triglycidyl para-aminophenol (TGPAP) epoxy resin with three aromatic amine hardeners, diaminodiphenye sulphone (DDS), pyridinediamine (PDA), and toluenediamine (TDA), has been investigated. A series of iosthermal cures was conducted and analyzed by Fourier transform infrared spectrometry (FTIR) and differential scanning calorimetry (DSC). The chemical reactions occurring during cure were monitored at different temperatures by qualitative and quantitative estimation of different groups in the IR spectra, and the ratio of rate constants (k₂/k₁) were evaluated. Dynamic DSC analysis of TGPAP/TDA resulted in two exothermal peaks, indicating cure kinetics different from those of TGPAP/DDS and TGPAP/PDA systems, which gave a single exothermal peak. Various kinetic parameters such as total heat of reaction. ΔH′, activation energy E_a, Frequency factor z, and order of reaction n were evaluated for all the three systems. From the initial kick-off temperatures and activation energy values it was concluded that the rate of curing followed the order TDA > PDA > DDS. The reaction conversions during cure, evaluated from IR analysis, were exactly the same as those obtained from DSC Borchardt–Daniels kinetics. Using this model, the plots of time vs. temperature for different conversions were constructed for all the three systems; on the basis of these, the cure cycles can be fixed. © 1995 John Wiley & Sons, Inc.     

Effect of the epoxy molecular weight on the properties of a cyanate ester/epoxy resin system

Bisphenol A dicyanate (BADCy) was modified by diglycidyl ether of bisphenol A epoxy resins with different molecular weights [E20 (weight‐average molecular weight = 1000) and E51 (weight‐average molecular weight = 400)] to investigate the effects of the epoxy molecular weight on the properties of the modified systems. The reactions were monitored with differential scanning calorimetry (DSC) and Fourier transform infrared spectroscopy, and the results showed that more pentacyclic oxazolidinone rings were formed in BADCy/E51 than in BADCy/E20 with the same epoxy resin weight content. DSC showed that BADCy/E20 had a lower curing temperature than BADCy/E51 because of the higher concentration of hydroxyl groups (? OH) in E20. Thermal, moisture absorption, and mechanical testing showed that E51‐modified BADCy performed better because of its lower molecular weight. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 1744–1750, 2006     

异氰酸酯/环氧树脂的固化机理

详细研究了异氰酸酯/环氧树脂体系的固化反应和固化机理。采用差示扫描量热法（DSC）和红外光谱法（FTIR）跟踪了异氰酸酯/环氧树脂固化反应过程,定量分析了异氰酸酯、环氧基团和新生成的异氰脲酸酯和口恶唑烷酮的变化。DSC分析结果表明,DSC曲线上出现3个放热峰,说明固化过程中存在至少3种反应;FTIR分析结果表明,在140℃以下固化体系主要发生异氰酸酯的三聚反应生成三嗪环（异氰脲酸酯）;在200℃下,异氰酸酯-NCO基团与环氧基团开环反应生成口恶唑烷酮;在230℃ 下,三嗪环（异氰脲酸酯）进一步与环氧基团开环反应生成口恶唑烷酮。研究了不同温度下环氧基团、异氰酸酯基团、异氰脲酸酯基团、口恶唑烷酮基团随反应时间的变化规律。     

Synthesis,characterization, and cure reaction of methacrylate‐based multifunctional monomers for dental composites

The synthesis of 2,2‐bis[(4‐(2‐hydroxy‐3‐methacryloxyethoxy)phenyl]propane (BHEP) and (1‐methacryloxy‐3‐ethoxymethacryloxy‐2‐hydroxy)propane (MEHP) for use as the monomer phase in dental composites are reported. The monomers were prepared by the reaction of 2‐hydroxyethyl methacrylate (HEMA) with diglycidyl‐ether of bisphenol A (DGEBA) and with glycidyl methacrylate (GMA), respectively. The progress of the reaction was followed by measuring the disappearance of the epoxide group peak using FTIR and the structure of the monomers was characterized by ¹H‐NMR. BHEP and MEHP have lower viscosity because of the presence of long aliphatic spacer on both sides of the aromatic ring in BHEP and the absence of aromatic rings and the presence of only one hydroxyl group in each molecule of MEHP. Thermal curing of the monomers was conducted in a DSC using benzoyl peroxide as an initiator. Photopolymerization of the monomers was also conducted with the visible light using camphorquinone and N,N‐dimethylaminoethyl methacrylate as the photoinitiating system. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007     

Reaction of phenol‐ and thiophenol‐terminated compounds with bisoxazolines

Bulk reactions of phenolic compounds (bisphenol‐A and α,ω‐diphenol oligosulfone) or thiols (thiophenol and bis(4‐mercaptophenyl)sulfide) with bisoxazoline coupling agents, namely 2,2'‐(1,3‐phenylene)bis(2‐oxazoline) ( mbox ), 2,2'‐(1,4‐phenylene)bis(2‐oxazoline) ( pbox ), and 2,2'‐(2,6‐pyridylene)bis(2‐oxazoline) ( pybox ), were carried out in the bulk at 140–240°C. The reactions were followed by viscosimetry, size exclusion chromatography, and ¹H‐ and ¹³C‐NMR spectroscopy. The phenol/bisoxazoline bulk reactions at 240°C required the presence of sodium methoxide catalyst. Bisoxazoline pybox gave the best results in this case. Thiol and dithiol/bisoxazoline reactions were faster and did not require any catalyst. High‐molar‐mass polymers were obtained within 5 min at 200°C while using bis(4‐mercaptophenyl)sulfide (BMPS) and any of the bisoxazolines. The NMR spectra of model compounds and polymers were fully assigned, showing that the oxazoline/phenol and oxazoline/thiophenol (tph) polyaddition reactions proceed in the expected way, without any noticeable side reaction. All polymers were amorphous and displayed good thermal stability. Bisoxazolines were also used as coupling agents for the preparation of copolymers of BMPS and α,ω‐dicarboxy polyamide‐12 and for the preparation of polysulfone‐polyamide‐12 block copolymers. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Cure kinetics of aqueous phenol–formaldehyde resins used for oriented strandboard manufacturing: Analytical technique

The cure kinetics of commercial phenol–formaldehyde (PF), used as oriented strandboard face and core resins, were studied using isothermal and dynamic differential scanning calorimetry (DSC). The cure of the face resin completely followed an nth‐order reaction mechanism. The reaction order was nearly 1 with activation energy of 79.29 kJ mol^?1. The core resin showed a more complicated cure mechanism, including both nth‐order and autocatalytic reactions. The nth‐order part, with reaction order of 2.38, began at lower temperatures, but the reaction rate of the autocatalytic part increased much faster with increase in curing temperature. The total reaction order for the autocatalytic part was about 5. Cure kinetic models, for both face and core resins, were developed. It is shown that the models fitted experimental data well, and that the isothermal DSC was much more reliable than the dynamic DSC in studying the cure kinetics. Furthermore, the relationships among cure reaction conversion (curing degree), cure temperature, and cure time were predicted for both resin systems. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 100: 1642–1650, 2006     

Effect of different aromatic amines on the crosslinking behavior and thermal properties of phthalonitrile oligomer containing biphenyl ethernitrile

To find a proper amine to promote the processability of phthalonitrile‐based composites, three different aromatic amines: 4‐aminophenoxyphthalonitrile (APN), 2,6‐bis (4‐diaminobenzoxy) benzonitrile (BDB) and 4,4′‐diaminediphenyl sulfone (DDS) were used as curing agents to investigate the crosslinking behavior and thermal decomposition behavior of phthalonitrile oligomer containing biphenyl ethernitrile (2PEN‐BPh). Differential scanning calorimeter (DSC) and dynamic rheological analysis were employed to study the curing reaction behavior of the phthalonitrile/amine blends and prepolymers. The studies revealed that BDB was the preferred curing agent and the preferred concentration of BDB was 3 wt %. The thermal properties of the 2PEN‐BPh polymers were monitored by TGA, and the results indicated that all the completely cured 2PEN‐BPh polymers maintained good structure integrity upon heating to elevated temperatures and these polymers could thermal stabilize up to over 550°C in both air and nitrogen atmospheres. Dynamic mechanical analysis (DMA) showed the glass transition temperature (T_g) exceeded 450°C when the 2PEN‐BPh polymer post cured at 375°C for 8 h. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2011