A novel DMTL capacitive switch with electrostatic actuation MAM capacitors

A novel DMTL capacitive switch with electrostatic actuation metal–air–metal (MAM) capacitors is presented. The top board of MAM capacitors will be pulled down together with the switch bridge. It has higher isolation in down-state than DMTL capacitive switch and has lower insert loss and higher self-actuation RF power comparing with MEMS shunt capacitive switch. Two of the novel DMTL capacitive switches are designed for high isolation and high self-actuation RF power, respectively. The calculated result shows that both of the two novel switches have lower insert loss than the MEMS shunt capacitive switch. The self-actuation RF power of them are 4 and 2.4 times that of MEMS shunt capacitive switch, respectively, at the cost of ?6.23 and ?3.54?dB reduction in isolation (30?GHz).     

Redundancy RF MEMS Multiport Switches and Switch Matrices

The objective of this paper is to investigate novel configurations of planar multiport radio-frequency (RF) microelectromechanical systems (MEMS) C-type and R-type switches and redundancy switch matrices for satellite communications. An in-house monolithic fabrication process dedicated to electrostatic multiport RF MEMS switches and switch matrices is developed and fine tuned. The proposed C-type switch is a four-port device with two operational states. This switch exhibits an insertion loss of less than 0.3 dB and isolation of about 25 dB at satellite C-band frequency range. The novel R-type switch is also a four-port device with an additional operational state. The measured results show an insertion loss of better than 0.4 dB and an isolation of better than 25 dB at C-band. This is the first time that an R-type RF MEMS switch is ever reported. Several of these switches are integrated in the form of redundancy switch matrices, and two novel monolithic five to seven redundancy switch matrices are developed, fabricated, and tested. It is shown that the additional operating state of the R-type switch not only decreases the number of elements by 50% but also reduces the size drastically     

Schottky Barrier Contact-Based RF MEMS Switch

This paper presents the design, fabrication, and measurement results for a novel Schottky barrier contact-based radio frequency (RF) microelectromechanical systems (MEMS) switch. This Schottky barrier contact allows one not only to operate the RF MEMS switch in a traditional capacitive mode when it is reverse biased but also conduct current in a forward biased state. Forward biasing the switch recombines trapped charges, thus extending the lifetime of the switch. This paper intimately combines MEMS processing with solid-state electronics to produce a truly unique RF device.$hfill$[2008-0097]      

A zero static power consumption bi-stable RF MEMS switch based on inertial generated timing sequence method

Microsystem Technologies - This paper reports on a novel in-plane and electrostatically actuated bi-stable radio frequency (RF) microelectromechanical systems (MEMS) switch. A lateral RF MEMS...     

基于分布式射频MEMS移相器电容开关的分析与设计

通过分析MEMS电容开关的工作原理,设计出一种适合分布式射频MEMS移相器电路的新型电容开关.采用Intel lisuiteTM软件优化电容开关的驱动电压、响应时间、释放时间和机械振动模式.结果表明,开关驱动电压为2.5 V、响应时间小于30μs,释放时间大于60 μs和所有振动模式固有频率都大于15 KHz.与普通开关结构比较,该新型电容开关结构具有优越射频机电性能和响应时间,同时也对电容开关的制备工艺进行分析.     

A low loss and power efficient micro-electro-thermally actuated RF MEMS switch for low power and low loss applications

Microsystem Technologies - A novel laterally and micro-electro-thermally actuated RF MEMS switch is presented in this paper. Despite many RF MEMS switches requiring continuous actuation voltage to...     

Design and modeling of a novel RF MEMS series switch with low actuation voltage

This paper presents the design, analysis, modeling and simulation of a novel RF MEMS series switches with low actuation voltage. A mechanical modeling is presented to describe the behavior of the series switch. The switch is designed with special mechanical structures. The novel mechanical and mathematical modeling of the switch leads to calculation of the accurate actuation voltage. The spring constant has been calculated in relation to the presence of the residual stress in the beam. The calculated spring constant for this beam is used to determine the accurate actuation voltage. The size of the switch is 60 × 110 µm². The designed RF MEMS series switch was simulated using Intellisuite MEMS tool. He calculated actuation voltage is 4.05 V and simulated one is 4.2 V for 0.6 µm beam thickness. The calculated result is also very close with simulated one. The proposed switch compared with other electrostatic switches has low actuation voltage and small size. The RF characteristics were simulated using HFSS software and the switch has good RF performance. The insertion loss of 0.067 dB, return loss of 26 dB and isolation of 16 dB were achieved at 40 GHz.     

A low voltage vertical comb RF MEMS switch

Design and simulations of a novel RF MEMS switch is reported as a solution to many RF wireless applications. A new comb structure for RF MEMS switch is proposed for low voltage and high frequency operations. Isolation degree and actuation voltage, both improved by the new structure. The mechanical and electromagnetic simulation results show better performance for this new switch compared to parallel plate switch. The simulation is done by the intellisuit and HFSS softwares. The Simulation results show that the actuation voltage is decreased by 13% and the linearity of the switch displacement with respect to the actuation voltage is improved by 22% compared to the parallel plate structure. The HFSS simulation results indicate an insertion loss better than 0.33 dB at 50 GHz and isolation greater than 13.4 dB at 50 GHz.     

Development of a low stress RF MEMS double-cantilever shunt capacitive switch

Microsystem Technologies - In this paper, a novel RF MEMS shunt capacitive switch with application in the Ka frequency band is proposed. The spring design and the step structure added to the beam...     

Integration of piezoelectric tunable capacitors and bonded-wire inductors for contactless RF switch and tunable filter

This paper presents the design, fabrication, and characterization of a contactless radio frequency (RF) microelectromechanical system (MEMS) switch, composed of two surface-micromachined piezoelectric tunable capacitors and two bonded-wire inductors. The measured insertion loss and power isolation of the fabricated switch are 2.2 and 10.1 dB, respectively, with a capacitance variation of 4:1 over a narrow bandwidth near 2.2 GHz. This novel approach of using inductors eases the deflection requirement for the deformable bridge of the variable capacitor, and allows piezoelectric ZnO film to be used to deflect the capacitor bridge to vary the air gap, thus yielding a contactless RF switch.     

Design and performance analysis of double cantilever type capacitive shunt RF MEMS switch

This paper presents a novel structure of capacitance shunt type RF switch for 5G applications. The proposed RF MEMS switch is having Cantilever type designed with optimized dimensions to operate in V-band applications. The electromechanical analysis is done by using the COMSOL tool. The actuation voltage of the proposed switch is 10.5 V with the air gap of 1 µm and gold as a beam material. The proposed switch with the meanders and perforations show the scattering parameters in HFSS software such as insertion loss (S₁₂) of − 0.033 dB and return loss (S₁₁) less than − 48 dB and the isolation (S₂₁) calculated in off-state as − 62 dB at 50 GHz.

     

串联电容式RF MEMS开关设计与制造研究

介绍了一种串联电容式RF MEMS开关的设计与制造。所设计的串联电容式RF MEMS开关利用薄膜淀积中产生的内应力使MEMS桥膜向上发生翘曲,从而提高所设计的开关的隔离度,克服了串联电容式RF MEMS开关通常只有在1GHz以下才能获得较高隔离度的缺点。其工艺与并联电容式RF MEMS开关完全相同,解决了并联电容式RF MEMS开关不能应用于低频段(<10GHz)的问题。其插入损耗为-0.88dB@3GHz,在6GHz以上,插入损耗为-0.5dB;隔离度为-33.5dB@900MHz、-24dB@3GH和-20dB@5GHz,适合于3~5GHz频段的应用。     

Design and simulation of a thermally actuated MEMS switch for microwave circuits

The design, modeling, and optimization of a novel, thermally actuated CMOS‐MEMS switch are presented in this article. This series capacitive MEMS switch solves the substrate loss and down‐state capacitance degradation problems commonly plaguing MEMS switches. The switch uses finger structure for capacitive coupling. The vertical bending characteristic of bimorph cantilever beams under different temperatures is utilized to turn the switch on and off. A set of electrical, mechanical, and thermal models is established, and cross‐domain electro‐thermo‐mechanical simulations are performed to optimize the design parameters of the switch. The fabrication of the switch is completely CMOS‐process compatible. The design is fabricated using the AMI 0.6 μm CMOS process and a maskless reactive‐ion etching process. The measured results show the insertion loss and isolation are 1.67 and 33 dB, respectively, at 5.4 GHz, and 0.36 and 23 dB at 10 GHz. The actuation voltage is 25 V and the power consumption is 480 mW. This switch has a vast number of applications in the RF/microwave field, such as configurable voltage control oscillators, filters, and configurable matching networks. © 2009 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2009.     

认知无线电思想在ZigBee无线传感器网络中的应用

本文将认知无线电的思想在基于ZigBee技术的无线传感器网络中进行应用尝试,提出一种新的多频多跳的Ad-hoc组网方法。该方法充分利用现代高级无线射频芯片对信道占用情况的能量检测功能,解决了传统网络采用时分复用的方法时对信道的利用率不高的问题。针对该方法只在组网开始时对信道进行静态频谱分配的不足,本文给出了进一步改进的建议。改进后的算法具有依据射频情况智能地判决是否进行信道切换的功能。     

A lateral RF MEMS capacitive switch utilizing parylene as dielectric

A novel lateral RF MEMS capacitive switch was reported in this paper. This switch employed parylene as the dielectric material, taking advantages of its low temperature deposition and conformal coating. The low resistivity single crystalline silicon served as the material of the mechanical structures. The switch was fabricated by bulk micromachining processes with only two lithographic masks and a shadow mask. The dynamical response, parylene insulation performance, and RF performances of the fabricated switch were characterized, respectively. The switching time from the open state to the close state was 105 μs at a loaded voltage of 78 V, while 15.6 μs from the close state to the open state. The isolation was better than 15 dB from 20 to 40 GHz, and the maximal isolation was 23.5 dB at 25 GHz; while the insertion loss was below 1.4 dB at 25 GHz, when bonding wires connected the ground lines. These results verify that the parylene is a good candidate material to act as sidewall dielectric to realize the lateral capacitive switch.     

Low-actuation voltage RF MEMS shunt switch with cold switching lifetime of seven billion cycles

This paper investigates the performance and lifetime of a metal-to-metal shunt RF MEMS switch fabricated on an SI-GaAs substrate. The switch is a shunt bridge design that is compatible with standard microelectronic processing techniques. The RF performance of the switch includes actuation voltages of less than 15 V, isolation better than 20 dB from 0.25 to 40 GHz, and switching speeds of less than 22 /spl mu/s. Varying the geometry of the switch affects both switching voltage and reliability, and the tradeoffs are discussed. We have developed a cold switching test method to identify the root cause of sticking as a failure mechanism. The switch structure includes "separation posts" that eliminate sticking failure and has demonstrated lifetimes as high as 7/spl times/10/sup 9/ cold switching cycles. These results show that good reliability is possible with a metal-to-metal RF MEMS switch operated with a low actuation voltage.     

RF MEMS Sequentially Reconfigurable Sierpinski Antenna on a Flexible Organic Substrate With Novel DC-Biasing Technique

Devices and systems that use RF microelectromechanical systems (RF MEMS) switching elements typically use one switch topology. The switch is designed to meet all of the performance criteria. However, this can be limiting for highly dynamic applications that require a great deal of reconfigurability. In this paper, three sets of RF MEMS switches with different actuation voltages are used to sequentially activate and deactivate parts of a multiband Sierpinski fractal antenna. The implementation of such a concept allows for direct actuation of the electrostatic MEMS switches through the RF signal feed, therefore eliminating the need for individual switch dc bias lines. This reconfigurable antenna was fabricated on liquid crystal polymer substrate and operates at several different frequencies between 2.4 and 18 GHz while maintaining its radiation characteristics. It is the first integrated RF MEMS reconfigurable antenna on a flexible organic polymer substrate for multiband antenna applications. Simulation and measurement results are presented in this paper to validate the proposed concept.[2007-0013]     

悬臂梁接触式RF MEMS开关的关键工艺研究

采用厚度为2μm的Au制作成共平面波导（CPW）、聚酰亚胺作为牺牲层、PECVD法淀积Si3N4薄膜作为悬臂梁,制作成悬臂梁接触式RF MEMS开关。着重对开关的关键工艺-CPV的Au剥离工艺和悬臂梁制作工艺进行研究,讨论了工艺中存在的问题及其解决方法。通过实验获得较佳的工艺参数,并制作出驱动电压为12-20V的悬臂梁接触式RF MEMS开关。     

Design and fabrication aspects of an S-shaped film actuator based DC to RF MEMS switch

This paper reports on design and fabrication aspects of a new microelectromechanical series switch for switching dc and RF signals. The switch consists of a flexible S-shaped film with the switching contact, rolling between a top and a bottom electrode in electrostatic touch-mode actuation. This design allows a low actuation voltage independent of the contact distance in the off-state. With a large contact distance, large overlapping switching contact areas are possible by obtaining a high off-state isolation. The RF transmission line and the MEMS part of the switch are fabricated on separate wafers, allowing an implementation of the switch with different RF substrates. The final assembly is done on device level for the first prototypes, even though the design provides the possibility of an assembly by full wafer bonding, leading to a near-hermetic package integrated switch. The measured prototype actuation voltages are 12 V to open and 15.8 V to close the contacts, with a resistance of 275 m/spl Omega/ of each contact at an estimated contact force of 102 /spl mu/N. The measured RF isolation with a contact distance of 14.2 /spl mu/m is better than -45 dB up to 2 GHz and -30 dB at 15 GHz, at a large nominal switching contact area of 3500 /spl mu/m/sup 2/.     

A W‐band RF‐MEMS switched LNA in a 70 nm mHEMT process

This work presents a monolithic integrated reconfigurable active circuit consisting of a W‐band RF micro‐electro‐mechanical‐systems (MEMS) Dicke switch network and a wideband low‐noise amplifier (LNA) realized in a 70 nm gallium arsenide (GaAs) metamorphic high electron mobility transistor process technology. The RF‐MEMS LNA has a measured gain of 10.2–15.6 dB and 1.3–8.2 dB at 79–96 GHz when the Dicke switch is switched ON and OFF, respectively. Compared with the three‐stage LNA used in this design the measured in‐band noise figure (NF) of MEMS switched LNA is minimum 1.6 dB higher. To the authors’ knowledge, the experimental results represent a first time demonstration of a W‐band MEMS switched LNA monolithic microwave integrated circuit (MMIC) in a GaAs foundry process with a minimum NF of 5 dB. The proposed novel integration of such MEMS switched MMICs can enable more cost‐effective ways to realize high‐performance single‐chip mm‐wave reconfigurable radiometer front‐ends for space and security applications, for example. © 2015 Wiley Periodicals, Inc. Int J RF and Microwave CAE 25:639–646, 2015.