Contact Damage of Silicon Carbide/Boron Nitride Nanocomposites

To investigate the deformation mechanism of silicon carbide (SiC)/boron nitride (BN) nanocomposites, Hertzian contact tests were performed on monolithic SiC, and nanocomposite and microcomposite SiC/BN. Monolithic SiC had the typical microstructure of hot-pressed SiC with Y₂O₃ and Al₂O₃ additives, composed of slightly large grains in small matrix grains. The microcomposite comprised large BN grains dispersed along the grain boundaries of elongated SiC grains, while the nanocomposite showed a finer microstructure with fine BN particles and small matrix grains. These microstructural differences led to differences in the mechanism of contact damage. The damage of the monolithic SiC and the SiC/BN microcomposite exhibited classical Hertzian cone fracture and many large cracks, whereas the damage observed in the nanocomposites appeared to be quasi-plastic deformation.     

Mechanical Properties of Hot-Pressed B-B4C Materials

Elastic modulus and flexural strength were measured at room temperature for solid pieces hot-pressed at 1900 to 2600 K from mixtures of B₄C powder and ≤15 wt% B powder. Regression analysis showed that elastic modulus and flexural strength are not significantly affected by these boron additions. Elastic modulus is related to porosity and flexural strength to porosity and grain size. The fracture surface energy of boron carbide was evaluated. X-ray diffraction and chemical analyses showed that the specimens were composed entirely of boron carbide after hot-pressing. Lattice constants increased with the initial boron content.     

Sintering of the Mechanochemically Activated Powders of Hexagonal Boron Nitride

Pressureless sintering of hexagonal boron nitride (BN) was performed using a powder activated by mechano-chemical treatments. Physical properties of the sintered BN bodies depend on the type of starting powder and the conditions of the treatments. The BN body, which was obtained at 2000°C using an appropriate activated powder, was 99 wt% pure and was excellent in mechanical and physical properties, in spite of its low density (1.64 g/cm³).     

The synergistic effects on enhancing thermal conductivity and mechanical strength of hBN/CF/PE composite

In this work, a simple and novel method was applied to prepare polymer composites by taking the advantage of melt flow shear force driving orientation of the fillers. By using this method, hexagonal boron nitride/polyethylene (hBN/PE) and hexagonal boron nitride/carbon fibers/polyethylene (hBN/CF/PE) composites were fabricated to be possessed of high thermal conductivity and mechanical properties. A high thermal conductivity of 3.11 W/mK was realized in the composite containing 35 wt% hBN and 5 wt% CF, which was over 1,200% higher than that of unfilled PE matrix. Under this component, the compressive strength and modulus of hBN/CF/PE composite were determined to be 30.1 and 870.9 MPa, respectively, which were far higher than that of unfilled PE accordingly. The bending performance was also somewhat enhanced. Meanwhile, the bulk resistivity of the composite material reached 2.55 × 10¹¹ Ω·cm, which was basically the same as that of pure PE. The novel composites with high thermal conductivity, excellent mechanical properties, and controllable electrical insulation could be a potential thermal management material for electrical and electronics industries.     

A novel Si3N4/BAS/BN composite synthesized by spark plasma sintering

Based on good thermomechanical and electromagnetic properties of silicon nitride (Si₃N₄), barium aluminosilicate (BaO–BaTiO₃–SiO₂ or BAS), and boron nitride (BN), a novel combination of Si₃N₄/BAS/BN composites was fabricated by spark plasma sintering (SPS) after traditional powder mixing process. The effect of different amounts of BN (3–9 wt%) on the mechanical properties of composite was studied. The phases were observed by X-ray diffraction, and the microstructures were identified by scanning electron microscopy (SEM). The optimal sample is the one containing 3 wt% of BN and is sintered under a final pressure of 50 MPa. This sample has a hardness of 9.03 GPa, a flexural strength of 418.75 MPa, an elastic modulus of 934.46 MPa, and a loss tangent of less than 0.002 in 38% of the X-band frequencies. The optimal sample thickness was determined via the Nicolson-Ross-Weir (NRW) technique considering the mechanical strength limits.     

Preparation and Use of a Boron Nitride Precursor as Binder for the Densification of Boron Nitride

A precursor of boron nitride was prepared through the partial condensation of 2,4,6-trichloroborazine and bis-(trimethylsilyl)acetylene. This reaction was conducted at 100°C and is catalyzed by AlCl₃. The condensation product pyrolyzed at 800°C, producing trimethylsilyl chloride as a volatile product and a boron nitride rich residue containing 54 wt% of the initial weight. Mixtures of the precursor and commercial boron nitride were made and hot-pressed at 800°C and 27.6 MPa. A maximum density of 1.84 g/cm³ is reached at a loading corresponding to the deposition of 13 wt% residue derived from the precursor. Examination by analytical electron microscopy, including X-ray energy dispersive spectroscopy and electron energy loss spectroscopy analyses, revealed the location of material derived from the precursor in BN-binder composites through the presence of residual aluminum, silicon, and carbon. Crystallization of boron nitride from the precursor appears to have taken place, as deduced from the morphology of the phases observed and association with residual elements present in the binder.     

Densification and Mechanical Properties of Titanium Diboride with Silicon Nitride as a Sintering Aid

Titanium diboride (TiB₂) was hot-pressed at a temperature of 1800°C, and silicon nitride (Si₃N₄) was added as a sintering aid. The amount of Si₃N₄ that was added had a significant influence on the sinterability and mechanical properties of the TiB₂. When a small amount (2.5 wt%) of Si₃N₄ was added, the Si₃N₄ reacted with titania (TiO₂) that was present on the surface of the TiB₂ powder to form titanium nitride (TiN), boron nitride (BN), and amorphous silica (SiO₂). The elimination of TiO₂ suppressed the grain growth effectively, which led to an improvement in the densification of TiB₂. The formation of SiO₂ also was deemed beneficial for densification. The mechanical properties-especially, the flexural strength-were enhanced remarkably through these improvements in the sinterability and microstructure. On the other hand, when a large amount (greaterthan equal to5 wt%) of Si₃N₄ was added, the mechanical properties were not improved much, presumably because of the extensive formation of a glassy Si-Ti-O-N phase at the grain boundaries.     

Orientation and Growth of Grains in Copper-Activated Hot-Pressed Hexagonal Boron Nitride

Hexagonal boron nitride powder was hot pressed in an environment of metallic copper. When compared with a copper-free system, the sintered body exposed to the copper was composed of substantially thicker grains having an unusual arrangement, consisting of preferred alignment of (0001) basal planes parallel to the pressure axis. The character of the orientation of the boron nitride grains substantially influenced the mechanical strength of the ceramics. The difference in the orientation of the grains is explained by the interaction between copper atoms and boron nitride crystals selectively occurring on the (0001) basal planes of the latter.     

Mullite–Boron Nitride Composite with High Strength and Low Elasticity

Mullite–boron nitride (BN) composite with high strength, low Young's modulus, and highly improved strain tolerance was prepared by reactive hot pressing (RHP) using aluminum borates (9Al₂O₃·2B₂O₃ and 2Al₂O₃·B₂O₃) and silicon nitride as starting materials. Compared with the monolithic mullite, the composite RHPed at 1800°C showed 1.64 times (540 MPa) the strength, 70% (153 GPa) the Young's modulus, and 2.34 times (3.53 × 10⁻³) the strain tolerance. Transmission electron microscopy observation revealed that the composite had an isotropic microstructure with a fine mullite matrix grain size of less than 1 μm and nanosized hexagonal BN (h-BN) platelets of about 200 nm in length and 60–80 nm in thickness. The high strength was suggested to be from the reduced matrix grain size and the small toughening effect by the h-BN platelets.     

Synthesis of ultrafine nano-polycrystalline cubic boron nitride by direct transformation under ultrahigh pressure

Using a turbostratic pyrolytic boron nitride as a starting material, we synthesized a variety of ultrahard polycrystalline cubic boron nitride (PcBN) as a function of the heating duration changing from 1 to 60?min under a constant temperature and pressure conditions (1950?°C and 25?GPa) using a multi-anvil apparatus. When the heating duration was less than 13?min, ultrafine nano-polycrystalline cBN (U-NPcBN) with the mean grain size of <50?nm was produced. Among these U-NPcBNs those synthesized with 11–13?min were found to have a uniform texture composed purely of cBN (i.e. with no wurzite BN residue) and a Knoop hardness of >53?GPa, which is 20% higher than that of the hardest conventional binderless PcBN in practical use. Furthermore, the PcBNs synthesized with 18–20?min showed a unique nanocrystalline texture composed of relatively coarse grains dispersed in a fine grained matrix and even higher Knoop hardness (54.5–55.2?GPa).     

The synergistic effect of boron nitride particle and die on the capillary extrusion processability of mLDPE

The synergistic effects of boron nitride (BN) powder and die on the rheology and processability of metallocene‐catalyzed low density polyethylene (mLDPE) were investigated. The processability in the extrusion process is closely related to the interfacial properties between the polymer melts and the die wall. BN powder was added to mLDPE to reduce the friction coefficient and surface energy. Adding 0.5 wt% BN powder to mLDPE was very effective in improving the processability and the extrudate appearance. To study the effect of die surface property, three different dies were applied in capillary extrusion. One was conventional tungsten carbide (TC) die, and the others were hot‐pressed BN (hpBN) die and hot‐pressed BN composite (hpBNC) die. The applications of these BN dies were quite effective in delaying surface melt fracture (sharkskin) and postponing gross melt fracture to higher shear rate compared to the TC die. These improvements result from the fact that BN dies reduce the wall shear stress significantly and promote slip. The synergistic effect of processability could be obtained when both BN powder and hpBN die were used together.     

Effect of BN content on the structural,mechanical, and dielectric properties of PDCs-SiCN(BN) composite ceramics

Hexagonal boron nitride (h-BN) with low dielectric loss and high temperature resistance opens up new opportunities for the preparation of polymer-derived SiCN ceramics (PDCs-SiCN ceramics) with excellent mechanical and dielectric properties. BN-containing polymer-derived SiCN composite ceramics (PDCs-SiCN(BN) composite ceramics) with different BN content were prepared via a pyrolysis process of ball-milling-blended Polyvinylsilazane/boron nitride (PVSZ/BN) precursors. BN is stably embedded in the SiCN tissue and tightly bound with it. The appropriate content of BN greatly improves the mechanical properties of PDCs-SiCN ceramics, as BN reduces the number of pores and prevents crack expansion. Additionally, BN is also beneficial in lowering the dielectric loss of PDCs-SiCN ceramics because of the weakened polarization relaxation behavior. PDCs-SiCN (BN) composite ceramics have optimal mechanical and dielectric properties when the BN content is 1 wt%. The flexural strength, flexural modulus and compression strength of PDCs-SiCN(BN) composite ceramics with 1 wt% BN doping content were 189.37 MPa, 46.38 GPa, and 399.02 MPa, respectively. Its average dielectric loss (tanδ_ε) at 12.4-18 GHz is 0.0049.     

Phase and Property Studies of Boron Carbide–Boron Nitride Composites

Boron carbide–boron nitride particulate composites were fabricated by vacuum hot-pressing. Near-theoretical densities of B₄C were obtained, but percent theoretical densities decreased with increasing amounts of BN. The grain size of B₄C and BN was not affected by composition, but the amount of twinning in B₄C decreased with increasing BN content. No third phase was found at the B₄C–BN interface by analytical STEM analysis. Lattice parameter measurements indicated slight solubility of B₄C in BN, but no solubility of BN in B₄C for samples hot-pressed at 2250°C. Room-temperature flexural strength measurements revealed a sharply decreasing strength with increasing BN content up to 40% BN, and then relatively constant values with greater amounts of BN.     

Understanding the self-sharpening characteristics of polycrystalline cubic boron nitride super-abrasive in high-speed grinding of Inconel 718

This study aims to understand the self-sharpening characteristics of the polycrystalline cubic boron nitride (PCBN) super-abrasive grains in high-speed grinding of Inconel 718. Comparative single grain grinding operations by separately using the brazed PCBN and conventional CBN abrasive grains are carried out. An in-depth analysis on the grain fracture morphologies and the workpiece scratch profiles during grinding are provided. The cutting mechanism and the material removal difference induced by the PCBN and conventional CBN grain fracture behaviour during grinding are revealed. The obtained results indicate that, the PCBN abrasive grain tends to intergranular fracture during grinding, which not only leads to the grain micro-fracture behaviour but also provides plenty of micro cutting-edges of microcrystalline CBN particles to participate in the grain cutting process. The surface roughness of the workpiece scratch grooves produced by the PCBN abrasive grain is 0.30 μm in average, which is 0.10 μm higher than that produced by the conventional CBN abrasive grain. This is mainly attributed to the additional cutting effects of the outcropped microcrystalline CBN particles on the PCBN grain fracture surface in the actual grinding process, and the additional grain cutting effects on the workpiece materials contribute to the self-sharpening characteristics of the PCBN. Finally, a mechanical analysis model of the single abrasive grain in grinding is also developed to provide a more comprehensive understanding on the self-sharpening mechanism of PCBN, and the established mechanical model can be correctly demonstrated by the calculated grinding force ratios in the single grain grinding operations.     

Influence of hBN content on mechanical and tribological properties of Si3N4/BN ceramic composites

Silicon nitride materials containing 1–5 wt% of hexagonal boron nitride (micro-sized or nano-sized) were prepared by hot-isostatic pressing at 1700 °C for 3 h. Effect of hBN content on microstructure, mechanical and tribological properties has been investigated. As expected, the increase of hBN content resulted in a sharp decrease of hardness, elastic modulus and bending strength of Si₃N₄/BN composites. In addition, the fracture toughness of Si₃N₄/micro BN composites was enhanced comparing to monolithic Si₃N₄ because of toughening mechanisms in the form of crack deflection, crack branching and pullout of large BN platelets. The friction coefficient was not influenced by BN addition to Si₃N₄/BN ceramics. An improvement of wear resistance (one order of magnitude) was observed when the micro hBN powder was added to Si₃N₄ matrix. Mechanical wear (micro-failure) and humidity-driven tribochemical reaction were found as main wear mechanisms in all studied materials.     

Mechanical and thermal properties of wood‐plastic composites reinforced with hexagonal boron nitride

Mechanical, thermal, and morphological properties of injection molded wood‐plastic composites (WPCs) prepared from poplar wood flour (50 wt%), thermoplastics (high density polyethlyne or polypropylene) with coupling agent (3 wt%), and hexagonal boron nitride (h‐BN) (2, 4, or 6 wt%) nanopowder were investigated. The flexural and tensile properties of WPCs significantly improved with increasing content of the h‐BN. Unlike the tensile and flexural properties, the notched izod impact strength of WPCs decreased with increasing content of h‐BN but it was higher than that of WPCs without the h‐BN. The WPCs containing h‐BN were stiffer than those without h‐BN. The tensile elongation at break values of WPCs increased with the addition of h‐BN. The differential scanning calorimetry (DSC) analysis showed that the crystallinity, melting enthalpy, and crystallization enthalpy of the WPCs increased with increasing content of the h‐BN. The increase in the crystallization peak temperature of WPCs indicated that h‐BN was the efficient nucleating agent for the thermoplastic composites to increase the crystallization rate. POLYM. COMPOS., 35:194–200, 2014. © 2013 Society of Plastics Engineers     

Dielectric property characterization at high temperature (RT to 1000 °C) of BN-based electromagnetic transparent materials for hypersonic applications

In this work, the dielectric properties of two dense, hot-pressed, commercial hexagonal boron nitride (h-BN, referred to as BN) samples and fabricated reinforced silicon carbonitride (SiCN) samples were evaluated from room temperature to 1000 °C across the Ka frequency band from 26.5 to 40 GHz in an air atmosphere. The two reinforcements in the fabricated samples are boron nitride nanotube (BNNT) and boron nitride nanobarb (BN-NanoBarb?). The ceramic matrix was prepared via the polymer-derived route. Each of the four types of samples was evaluated via free-space and waveguide methods. When the BNNT or BNNB loading was 10 wt%, the average permittivity of BNNT-SiCN and BNNB-SiCN were 2.52 and 3.42, with the loss tangent of 0.001 and 0.004, respectively. The porosity was detected to decrease from BN (31.14–41.61%) to BNNT - SiCN (28.11%) and BNNB - SiCN (23.28%) after the filler loading. The reduction of Van der Waals attraction by non-covalent functionalization ensures excellent dispersion between BNNT or BNNB and SiCN, as well as mechanical performance. This work aims to enhance the limited amount of dielectric data at high temperatures and across a high-frequency range. The results presented in the work establish the knowledge base for electromagnetic transparent materials in high-temperature and extreme environment applications.     

Enhanced mechanical and anisotropic thermal conductive properties of polyimide nanocomposite films reinforced with hexagonal boron nitride nanosheets

To attain thermally conductive but electrically insulating polymer films, in this study, polyimide (PI) nanocomposite films with 1–30 wt% functionalized hexagonal boron nitride nanosheets (BNNSs) were fabricated via solution casting and following imidization. The microstructures, mechanical and thermal conductive properties of PI/BNNS nanocomposite films were examined by taking account of the relative content, anisotropic orientation, and interfacial interaction of BNNS and PI matrix. The scanning electron microscopy, X-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and X-ray diffractometry data revealed that BNNSs with hydroxy and amino functional groups have specific molecular interactions with PI matrix and they form stacked aggregates in the nanocomposite films with high BNNS loadings of 10–30 wt%. The tensile mechanical strength/modulus, thermal degradation temperatures, and thermal conductivity of the nanocomposite films were found to be significantly enhanced with increasing the BNNS loadings. For the nanocomposite films with 1–30 wt% BNNS loadings, the in-plane thermal conductivity was measured to be 1.82–2.38 W/mK, which were much higher than the out-of-plane values of 0.35–1.14 W/mK. The significant anisotropic thermal conductivity of the nanocomposite films was found to be owing to the synergistic anisotropic orientation effects of both BNNS and PI matrix. It is noticeable that the in-plane and out-of-plane thermal conductivity values of the nanocomposite film with 30 wt% BNNS were ~1.31 and ~3.35 times higher than those of neat PI film, respectively.     

Anisotropic Properties in Hot Pressed Silicon Nitride—Silicon Carbide Platelet Reinforced Composites

The anisotropic properties (microstructure, mechanical properties) of a hot-pressed platelet reinforced silicon nitride composite were compared with those of the monolithic material. The platelets appeared to be orientated with their basal plane in the compressive plane, and to be embedded in a silicon nitride matrix consisting of interlocked elongated β-Si₃N₄ grains with their c axis orientated in this plane. TEM analysis showed an interface, consisting of glassy phase and graphite at the platelet–matrix grain boundary. Moreover the interfacial tensile stresses are in favour of a crack deflection mechanism. It was shown by TEM analysis that crack deflection occurs not only at the silicon nitride–platelet interface, but also at silicon nitride–silicon nitride grain boundaries. The efficiency of this reinforcing mechanism is highly orientation dependent. Because of their two dimensional geometry compared to the one-dimensional β-Si₃N₄ grains, platelets increase the toughness in two dimensions.     

Effects of Microstructure on Superplastic Behavior and Deformation Mechanisms in β-Silicon Nitride Ceramics

The influence of grain shape and size on superplastic behavior and deformation mechanisms was investigated in annealed β-silicon nitride materials and compared with the results for hot-pressed material. The microstructure of the annealed materials consisted of fine equiaxed β-grains together with some elongated ones. Similar to the deformation behavior in the hot-pressed material, strain hardening did not occur in these annealed materials. Moreover, in contrast to the deformation behavior under tension, grain alignment under compression resulting from the development of a mild texture did not give rise to strain hardening. An annealed material with small elongated grains had a flow-stress dependency of n = 1, whereas other annealed materials with large elongated grains exhibited a flow-stress dependency of n = 1.6. In terms of texture development and the effect of grain shape on the creep rate when diffusion was the rate-controlling mechanism, a single curve with a stress exponent of ∼1 and a grain-size exponent of 3 were obtained for all materials. This suggests that the deformation mechanism in these annealed materials was the same as that of fine equiaxed β-silicon nitride.