太赫兹Si/SiGe量子级联激光器的能带设计

使用nextnano3模拟软件计算Si/Si1-xGex/Si量子阱的能带结构,对Si/SiGe量子级联激光器有源区的能带结构进行设计,结果表明使用Ge组分为0.27～0.3,量子阱宽度为3nm的SiGe合金与垒宽为3nm的Si层构成对称应变级联异质结构,有利于优化THz Si/SiGe量子级联激光器结构.     

太赫兹Si/SiGe量子级联激光器波导模拟

波导层结构设计是制备太赫兹(THz)量子级联激光器的关键问题之一.本文基于德鲁得(Drude)模型,利用时域有限差分(FDTD)法,对Si/SiGe量子级联激光器的波导层进行优化设计,从理论上对传统的递变折射率波导、单面金属波导、双面金属波导以及金属/金属硅化物波导横磁模(TM模)的模式损耗和光场限制因子进行了对比分析.结果表明,金属/金属硅化物波导不但可以减小波导损耗,而且有很高的光学限制因子,同时其工艺也比双面金属波导容易实现,为Si/SiGe太赫兹量子级联激光器波导层的设计提供了一定的理论指导.     

Si基Ge/SiGeⅠ型量子阱结构的理论设计和实验研究

基于能带工程理论,设计了Si基Ge/SiGeⅠ型量子阱结构。采用超高真空化学气相淀积系统,制备出高质量的Si基Ge/SiGe多量子阱系列材料。当样品中Ge量子阱宽从15nm减少到12nm和11nm时,室温下荧光(PL)光谱观测到量子限制效应引起的直接带跃迁发光峰位的蓝移,峰位的实验值与理论值符合得很好;当Ge量子阱宽逐渐减小到9nm和7nm时,测试得到样品的PL谱峰位却与理论预期出现了较大的差值。进一步的实验表明,这主要是由于量子阱厚度小到一定程度时,量子阱的直接带发光受到抑制,其发光主要源于Ge虚拟衬底。     

弛豫SiGe衬底上SiGe/Si Ⅱ型量子阱

采用UHV/CVD系统,在Si衬底上生长了具有渐变Si1-xGex缓冲层结构的弛豫Si0.76Ge0.24虚衬底和5个周期的Si0.76Ge0.24/Si多量子阱.在渐变Si1-xGex缓冲层生长过程中引入原位退火,消除了残余应力,抑制了后续生长的SiGe中的位错成核.透射电子显微照片显示,位错被有效地限制在组份渐变缓冲层内,而SiGe上层和SiGe/Si量子阱是无位错的.在样品的PL谱中,观察到跃迁能量为0.961eV的Ⅱ型量子阱的无声子参与(NP)发光峰.由于Ⅱ型量子阱中电子和空穴不在空间同一位置,较高光功率激发下引起的高浓度载流子导致能带弯曲严重.NP峰随激发功率增加向高能方向移动,在一定激发条件下,电子跃迁或隧穿至弛豫SiGe层弯曲的导带底后与处于同一位置的空穴复合发光,所以NP峰积分强度随光激发功率先增加后减小.     

太赫兹Si/SiGe量子级联激光器波导模拟

波导层结构设计是制备太赫兹(THz)量子级联激光器的关键问题之一.本文基于德鲁得(Drude)模型,利用时域有限差分(FDTD)法,对Si/SiGe量子级联激光器的波导层进行优化设计,从理论上对传统的递变折射率波导、单面金属波导、双面金属波导以及金属/金属硅化物波导横磁模(TM模)的模式损耗和光场限制因子进行了对比分析.结果表明,金属/金属硅化物波导不但可以减小波导损耗,而且有很高的光学限制因子,同时其工艺也比双面金属波导容易实现,为Si/SiGe太赫兹量子级联激光器波导层的设计提供了一定的理论指导.     

P型张应变Si/SiGe量子阱红外探测器的能带设计

提出P型张应变Si/SiGe量子阱红外探测器(QWIP)结构,应用k·P方法计算应变Si/SiGe量子阱价带能带结构和应变SiGe合金空穴有效质量.结果表明量子阱中引入张应变使轻重空穴反转,基态为有效质量较小的轻空穴态,因此P型张应变Si/SiGe QWIP与n型QWIP相比具有更低的暗电流;而与P型压应变或无应变QWIP相比光吸收和载流子输运特性具有较好改善.在此基础上讨论了束缚态到准束缚态子带跃迁型张应变p-Si/SiGe QWIP的优化设计.     

P型张应变Si/SiGe量子阱红外探测器的能带设计

提出P型张应变Si/SiGe量子阱红外探测器(QWIP)结构,应用k·P方法计算应变Si/SiGe量子阱价带能带结构和应变SiGe合金空穴有效质量.结果表明量子阱中引入张应变使轻重空穴反转,基态为有效质量较小的轻空穴态,因此P型张应变Si/SiGe QWIP与n型QWIP相比具有更低的暗电流;而与P型压应变或无应变QWIP相比光吸收和载流子输运特性具有较好改善.在此基础上讨论了束缚态到准束缚态子带跃迁型张应变p-Si/SiGe QWIP的优化设计.     

中红外量子级联激光器的研究进展

以不同结构类型的有源区为主线,如三阱垂直跃迁有源区、超晶格有源区、应变补偿量子阱有源区、束缚-连续跃迁有源区和四阱双声子共振有源区等,介绍了半导体能带工程在量子级联激光器中的应用。以不同技术指标和特性参数为主要内容,如激射波长、阈值电流密度、工作温度和输出功率等,评述了量子级联激光器在近3～5年内的研究进展。提出了进一步改善器件性能的可能途径,并指出了其今后研究的新方向。     

双偏振双波长混合应变量子阱激光器

本文报道了以混合应变量子阱结构为有源区的激光器。对有源区分别采用体材料、匹配量子阱、压应变量子阱和混合应变量子阱结构的激光器进行了比较。混合应变量子阱激光器能同时工作于两种偏振模式，而且两种偏振模式的激射波长不同。结合实验结果，我们可以看出在混合应变量子阱结构中，从偏偏自发辐射谱峰值长差不能推断两种量子陆的能带填充效应大小。     

二氧化硅覆盖退火增强磷化铟基体激光器材料的量子阱混合

我们对SiO2覆盖退火增强InGaAs/InGaAsP/InP激光器材料量子阱混合技术进行了实验研究.相对于原始样品,退火时无SiO2覆盖的样品经800℃,30s快速退火后,其光致发光谱的峰值波长“蓝移”了7nm,退火时有SiO2覆盖的样品经过同样的快速退火后,其光致发光谱的峰值波长“蓝移”了56nm.即在同一片子上实现了在需要量子阱混合的区域带隙的“蓝移”足够大的同时,不希望量子阱混合的区域能带结构的变化创记录的小.本文认为增大量子阱的宽度、采用无应力的量子阱结构以及引入足够厚的缓冲层可以改善量子阱材料的晶格质量,有利于提高量子阱混合技术的可靠性与重复性,     

On the radiative recombination and tunneling of charge carriers in SiGe/Si heterostructures with double quantum wells

For SiGe/Si(001) epitaxial structures with two nonequivalent SiGe quantum wells separated by a thin Si barrier, the spectral and time characteristics of interband photoluminescence corresponding to the radiative recombination of excitons in quantum wells are studied. For a series of structures with two SiGe quantum wells different in width, the characteristic time of tunneling of charge carriers (holes) from the narrow quantum well, distinguished by a higher exciton recombination energy, to the wide quantum well is determined as a function of the Si barrier thickness. It is shown that the time of tunneling of holes between the Si_0.85Ge_0.15 layers with thicknesses of 3 and 9 nm steadily decreases from ~500 to <5 ns, as the Si barrier thickness is reduced from 16 to 8 nm. At intermediate Si barrier thicknesses, an increase in the photoluminescence signal from the wide quantum well is observed, with a characteristic time of the same order of magnitude as the luminescence decay time of the narrow quantum well. This supports the observation of the effect of the tunneling of holes from the narrow to the wide quantum well. A strong dependence of the tunneling time of holes on the Ge content in the SiGe layers at the same thickness of the Si barrier between quantum wells is observed, which is attributed to an increase in the effective Si barrier height.     

Quantum Confinement Effects in Strained SiGe/Si Multiple Quantum Wells

Strained SiGe/Si multiple quantum wells (MQWs) were grown by cold-wall ultrahigh vacuum chemical vapor deposition (UHV/CVD). Photoluminescence measurement was performed to study the exciton energies of strained Si0.84 Ge0.16/Si MQWs with SiGe well widths ranging from 4.2nm to 25.4nm. The confinement energy of 43meV is found in the Si0.84Ge0.16/Si MQWs with well width of 4.2nm. The confinement energy was calculated by solving the problem of a particle confined in a single finite rectangular poteintial well using one band effect mass model. Experimental and theoretical confinement energies are in good agreement     

Quantum Confinement Effects in Strained SiGe/Si Multiple Quantum Wells

Two heterointerfaces with several nanometers apart will confine the electrons(orholes) in the resulting wells.In the well,there existthe quantized subband levels.Confine-ment of carriers in1D(1dimension) ,2 D or3D occurs in the nanomet...     

Resonant cavity enhanced photoluminescence of tensile strained Ge/SiGe quantum wells on silicon-on-insulator substrate

The tensile strained Ge/SiGe multiple quantum wells （MQWs） grown on a silicon-on-insulator （SOI） substrate were fabricated successfully by ultra-high chemical vapor deposition. Room temperature direct band photoluminescence from Ge quantum wells on SOI substrate is strongly modulated by Fabry-Perot cavity formed between the surface of Ge and the interface of buried SiO2. The photoluminescence peak intensity at 1.58 μm is enhanced by about 21 times compared with that from the Ge/SiGe quantum wells on Si substrate, and the full width at half maximum （FWHM） is significantly reduced. It is suggested that tensile strained Ge/SiGe multiple quantum wells are one of the promising materials for Si-based microcavity lijzht emitting devices.     

Improved self-gain in deep submicrometer strained silicon-germanium pMOSFETs with HfSiOx/TiSiN gate stacks

The self-gain of surface channel compressively strained SiGe pMOSFETs with HfSiO_x/TiSiN gate stacks is investigated for a range of gate lengths down to 55 nm. There is 125% and 700% enhancement in the self-gain of SiGe pMOSFETs compared with the Si control at 100 nm and 55 nm lithographic gate lengths, respectively. This improvement in the self-gain of the SiGe devices is due to 80% hole mobility enhancement compared with the Si control and improved electrostatic integrity in the SiGe devices due to less boron diffusion into the channel. At 55 nm gate length, the SiGe pMOSFETs show 50% less drain induced barrier lowering compared with the Si control devices. Electrical measurements show that the SiGe devices have larger effective channel lengths. It is shown that the enhancement in the self-gain of the SiGe devices compared with the Si control increases as the gate length is reduced thereby making SiGe pMOSFETs with HfSiO_x/TiSiN gate stacks an excellent candidate for analog/mixed-signal applications.     

采用低温Si技术的Si/SiGe异质结P-MOSFET

针对S i/S iG e p-M O SFET的虚拟S iG e衬底厚度较大(大于1μm)的问题,采用低温S i技术在S i缓冲层和虚拟S iG e衬底之间M BE生长低温-S i层。S iG e层应力通过低温-S i层释放,达到应变弛豫。XRD和AFM测试表明,S i0.8G e0.2层厚度可减薄至300 nm,其弛豫度大于85%,表面平均粗糙度仅为1.02 nm。试制出应变S i/S iG e p-M O SFET器件,最大空穴迁移率达到112 cm2/V s,其性能略优于目前多采用1μm厚虚拟S iG e衬底的器件。     

Investigation of Si/SiGe heterostructures patterned by reactive ion etching

We present a modified pattern technique for fabrication of nanometer structures in the Si/SiGe heterosystem. A special multilayer-resist system is developed for pattern transfer by electron-beam lithography and anisotropic SF₆/O₂ dry etching. Photoluminescence measurements are carried out on homogeneously etched samples to determine the influence of the RIE process on the optical properties. Etching induced damages are reduced by a low-temperature post-annealing step. Additionally, surface contaminations are investigated using laser desorption mass spectrometry. SiGe wires with lateral widths from 4 μm down to 25 nm have been fabricated, but photoluminescence has been observed for structures down to 600 nm lateral width, only. Further improvement has been obtained by sidewall-passivation of the nanostructures with a low temperature plasma enhanced-chemical-vapour-deposited oxide. Up to now, clear excitonic emission is detected for wires as small as 250 nm.     

Photoluminescence line width of self-assembled Ge(Si) islands arranged between strained Si layers

The effect of variations in the strained Si layer thicknesses, measurement temperature, and optical excitation power on the width of the photoluminescence line produced by self-assembled Ge(Si) nanoislands, which are grown on relaxed SiGe/Si(001) buffer layers and arranged between strained Si layers, is studied. It is shown that the width of the photoluminescence line related to the Ge(Si) islands can be decreased or increased by varying the thickness of strained Si layers lying above and under the islands. A decrease in the width of the photoluminescence line of the Ge(Si) islands to widths comparable with the width of the photoluminescence line of quantum dot (QD) structures based on direct-gap InAs/GaAs semiconductors is attained with consideration of diffusive smearing of the strained Si layer lying above the islands.     

Fabrication of thick, high-quality strained SiGe layer on ultra-thin silicon-on-insulator and modeling of film strain

Fabrication of a thick strained SiGe layer on bulk silicon is hampered by the lattice mismatch and difference in the thermal expansion coefficients between Si and SiGe, and a high Ge content leads to severe strain in the SiGe film. When the thickness of the SiGe film is above a critical value (90 nm for 18% Ge), drastic deterioration of the film properties as well as dislocations will result. In comparison, a silicon-on-insulator (SOI) substrate with a thin top Si layer can mitigate the problems and so a thick SiGe layer with high Ge concentration can conceivably be synthesized. In the work reported here, a 110 nm thick high-quality strained Si_0.82Ge_0.18 layer was fabricated on an ultra-thin SOI substrate with a 30 nm top silicon layer using ultra-high vacuum chemical vapor deposition (UHVCVD). The thickness of the SiGe layer is larger than the critical thickness on bulk Si. Cross-sectional transmission electron microscopy (XTEM) reveals that the SiGe layer is dislocation-free and the atoms at the SiGe/Si interface are well aligned, even though X-ray diffraction (XRD) data indicate that the SiGe film is highly strained. The strain factors determined from the XRD and Raman results agree well.