Analysis and Design of a CMOS UWB LNA With Dual- -Branch Wideband Input Matching Network

A wideband low-noise amplifier (LNA) based on the current-reused cascade configuration is proposed. The wideband input-impedance matching was achieved by taking advantage of the resistive shunt–shunt feedback in conjunction with a parallel LC load to make the input network equivalent to two parallel $RLC$-branches, i.e., a second-order wideband bandpass filter. Besides, both the inductive series- and shunt-peaking techniques are used for bandwidth extension. Theoretical analysis shows that both the frequency response of input matching and noise figure (NF) can be described by second-order functions with quality factors as parameters. The CMOS ultra-wideband LNA dissipates 10.34-mW power and achieves ${ S}_{11}$ below $-$8.6 dB, ${ S}_{22}$ below $-$10 dB, ${ S}_{12}$ below $-$26 dB, flat ${ S}_{21}$ of 12.26 $pm$ 0.63 dB, and flat NF of 4.24 $ pm$ 0.5 dB over the 3.1–10.6-GHz band of interest. Besides, good phase linearity property (group-delay variation is only $pm$22 ps across the whole band) is also achieved. The analytical, simulated, and measured results agree well with one another.      

A 1 V 23 GHz Low-Noise Amplifier in 45 nm Planar Bulk-CMOS Technology With High-$Q$ Above-IC Inductors

A 23 GHz electrostatic discharge-protected low-noise amplifier (LNA) has been designed and implemented by 45 nm planar bulk-CMOS technology with high-$Q$ above-IC inductors. In the designed LNA, the structure of a one-stage cascode amplifier with source inductive degeneration is used. All high- $Q$ above-IC inductors have been implemented by thin-film wafer-level packaging technology. The fabricated LNA has a good linearity where the input 1 dB compression point $({rm IP}_{{-}1~{rm dB}})$ is ${- 9.5}~{rm dBm}$ and the input referred third-order intercept point $(P _{rm IIP3})$ is ${+ 2.25}~{rm dBm}$. It is operated with a 1 V power supply drawing a current of only 3.6 mA. The fabricated LNA has demonstrated a 4 dB noise figure and a 7.1 dB gain at the peak gain frequency of 23 GHz, and it has the highest figure-of-merit. The experimental results have proved the suitability of 45 nm gate length bulk-CMOS devices for RF ICs above 20 GHz.      

A Wideband Low Noise Amplifier With 4 kV HBM ESD Protection in 65 nm RF CMOS

This study presents a wideband low noise amplifier (LNA) including electrostatic discharge (ESD) protection circuits using 65 nm CMOS with a gate oxide thickness of only ${sim}2$ nm. By co-designing the ESD blocks with the core circuit, the LNA shows almost no performance degradation compared to the reference design without ESD. Under a power consumption of only 6.8 mW, the silicon results show that the LNA can achieve a peak power gain of 13.8 dB. Within the 3 dB bandwidth from 2.6 GHz to 6.6 GHz, the noise figure (NF) is in a range of 4.0 dB to 6.5 dB and the input reflection coefficient $S_{11}$ is below ${-}13.0$ dB. Using the miniaturized Shallow-Trench-Isolation (STI) diode of ${sim}40$ fF capacitance and a robust gate-driven power clamp configuration, the proposed LNA demonstrates an excellent 4 kV human body mode (HBM) ESD performance, which has the highest voltage/capacitance ratio ( ${sim}100$ V/fF) among the published results for RF LNA applications.      

A 0.1–5 GHz Cryogenic SiGe MMIC LNA

In this letter, the design and measurement of the first SiGe integrated-circuit LNA specifically designed for operation at cryogenic temperatures is presented. At room temperature, the circuit provides greater than 25.8 dB of gain with an average noise temperature $(T_{e})$ of 76 K $(NF=1 {rm dB})$ and $S_{11}$ of $-$ 9 dB for frequencies in the 0.1–5 GHz band. At 15 K, the amplifier has greater than 29.6 dB of gain with an average $T_{e}$ of 4.3 K and $S_{11}$ of $-$14.6 dB for frequencies in the 0.1–5 GHz range. To the authors' knowledge, this is the lowest noise ever reported for a silicon integrated circuit operating in the low microwave range and the first matched wideband cryogenic integrated circuit LNA that covers frequencies as low as 0.1 GHz.      

A Millimeter-Wave (23–32 GHz) Wideband BiCMOS Low-Noise Amplifier

This paper presents a 23–32 GHz wideband BiCMOS low-noise amplifier (LNA). The LNA utilizes coupled-resonators to provide a wideband load. To our knowledge, the proposed LNA achieves the widest bandwidth with minimum power consumption using 0.18 $mu$m BiCMOS technology in K-band. Analytical expressions for the wideband input matching, gain, noise figure and linearity are presented. The LNA is implemented using 0.18 $mu$m BiCMOS technology and occupies an area of 0.25 mm$^2$ . It achieves a voltage gain of 12 dB, 3-dB bandwidth of 9 GHz, noise figure between 4.5–6.3 dB, linearity higher than ${-}$6.4 dBm with a power consumption of 13 mW from a 1.5 V supply.      

A 3–10 GHz CMOS UWB Low-Noise Amplifier With ESD Protection Circuits

A low-power fully integrated low-noise amplifier (LNA) with an on-chip electrostatic-static discharge (ESD) protection circuit for ultra-wide band (UWB) applications is presented. With the use of a common-gate scheme with a ${rm g}_{rm m}$ -boosted technique, a simple input matching network, low noise figure (NF), and low power consumption can be achieved. Through the combination of an input matching network, an ESD clamp circuit has been designed for the proposed LNA circuit to enhance system robustness. The measured results show that the fabricated LNA can be operated over the full UWB bandwidth of 3.0 to 10.35 GHz. The input return loss $({rm S}_{11})$ and output return loss $({rm S}_{22})$ are less than ${-}8.3$ dB and ${-}9$ dB, respectively. The measured power gain $({rm S}_{21})$ is $11 pm 1.5$ dB, and the measured minimum NF is 3.3 dB at 4 GHz. The dc power dissipation is 7.2 mW from a 1.2 V supply. The chip area, including testing pads, is 1.05 mm$,times,$ 0.73 mm.      

W-Band Active Down-Conversion Mixer in Bulk CMOS

A W-band (76–77 GHz) active down-conversion mixer has been demonstrated using low leakage (higher ${rm V}_{{rm T}}$) NMOS transistors of a 65-nm digital CMOS process with 6 metal levels. It achieves conversion gain of ${-}8$ dB at 76 GHz with a local oscillation power of 4 dBm (${sim-}2$ dBm after de-embedding the on-chip balun loss), and 3 dB bandwidth of 3 GHz. The SSB noise figures are 17.8–20 dB (11.3–13.5 dB after de-embedding on-chip input balun loss) between 76 and 77 GHz. ${rm IP}_{1{rm dB}}$ is ${-}6.5$ dBm and IIP3 is 2.5 dBm (${sim-}13$ and ${sim}-4$ dBm after de-embedding the on-chip balun loss). The mixer consumes 5 mA from a 1.2 V supply.      

A 36–80 GHz High Gain Millimeter-Wave Double-Balanced Active Frequency Doubler in SiGe BiCMOS

This letter presents a high conversion gain double-balanced active frequency doubler operating from 36 to 80 GHz. The circuit was fabricated in a 200 GHz ${rm f}_{rm T}$ and ${rm f}_{max}$ 0.18 $mu$m SiGe BiCMOS process. The frequency doubler achieves a peak conversion gain of 10.2 dB at 66 GHz. The maximum output power is 1.7 dBm at 66 GHz and ${-}3.9$ dBm at 80 GHz. The maximum fundamental suppression of 36 dB is observed at 60 GHz and is better than 20 dB from 36 to 80 GHz. The frequency doubler draws 41.6 mA from a nominal 3.3 V supply. The chip area of the active frequency doubler is 640 $mu$m $,times,$424 $mu$m (0.272 mm $^{2}$) including the pads. To the best of authors' knowledge, this active frequency doubler has demonstrated the highest operating frequency with highest conversion gain and output power among all other silicon-based active frequency doublers reported to date.      

Multi-Standard Mobile Broadcast Receiver LNA With Integrated Selectivity and Novel Wideband Impedance Matching Technique

A CMOS LNA supporting multiple mobile video standards (MediaFLO, DVB-H, and ISDB-T) is implemented using a 0.18 $ mu$m CMOS process. The LNA uses a novel feedback configuration and implements an RF elliptic low-pass filter (LPF) response. Because of this elliptic LPF response, the receiver is able to operate concurrently with radio transmitter leakage from GSM, DCS, WLAN, and Bluetooth. The design decouples the feedback path from the main path to allow integration of the LPF as well as obtain wideband input matching. Measurement results show voltage gain of 25 dB, NF of 1.6 dB, and IIP3 of ${-}$2 dBm in MediaFLO mode. DVB-H mode demonstrates voltage gain of 25 dB, NF of 1.8 dB, and IIP3 of ${-}$1 dBm while achieving interference rejection greater than 70 dB.      

A Fully Integrated 5 GHz Low-Voltage LNA Using Forward Body Bias Technology

A fully integrated 5 GHz low-voltage and low-power low noise amplifier (LNA) using forward body bias technology, implemented through a 0.18 $mu{rm m}$ RF CMOS technology, is demonstrated. By employing the current-reused and forward body bias technique, the proposed LNA can operate at a reduced supply voltage and power consumption. The proposed LNA delivers a power gain (S21) of 10.23 dB with a noise figure of 4.1 dB at 5 GHz, while consuming only 0.8 mW dc power with a low supply voltage of 0.6 V. The power consumption figure of merit $(FOM_{1})$ and the tuning-range figure of merit $(FOM_{2})$ are optimal at 12.79 dB/mW and 2.6 ${rm mW}^{-1}$, respectively. The chip area is 0.89 $,times,$0.89 ${rm mm}^{2}$.      

17 GHz RF Front-Ends for Low-Power Wireless Sensor Networks

A 17 GHz low-power radio transceiver front-end implemented in a 0.25 $mu{hbox {m}}$ SiGe:C BiCMOS technology is described. Operating at data rates up to 10 Mbit/s with a reduced transceiver turn-on time of 2 $mu{hbox {s}}$, gives an overall energy consumption of 1.75 nJ/bit for the receiver and 1.6 nJ/bit for the transmitter. The measured conversion gain of the receiver chain is 25–30 dB into a 50 $Omega$ load at 10 MHz IF, and noise figure is 12 $pm$0.5 dB across the band from 10 to 200 MHz. The 1-dB compression point at the receiver input is $-$37 dBm and ${hbox{IIP}}_{3}$ is $-$25 dBm. The maximum saturated output power from the on-chip transmit amplifier is $-$1.4 dBm. Power consumption is 17.5 mW in receiver mode, and 16 mW in transmit mode, both operating from a 2.5 V supply. In standby, the transceiver supply current is less than 1 $mu{hbox {A}}$.      

A 2–40 GHz Active Balun Using 0.13 $mu{rm m}$ CMOS Process

A 2 to 40 GHz broadband active balun using 0.13 $mu{rm m}$ CMOS technology is presented in this letter. Using two-stage differential amplified pairs, the active balun can achieve a wideband performance with the gain compensation technique. This active balun exhibits a measured small signal gain of ${0} pm{1}~{rm dB}$, with the amplitude imbalances below 0.5 dB and the phase differences of ${180} pm {10} ^{circ}$ from 2 to 40 GHz. The core active balun has a low power consumption of 40 mW, and a compact area of 0.8 mm $times,$ 0.7 mm. This proposed balun achieved the highest operation frequency, the widest bandwidth, and the smallest size among all the reported active baluns.      

A Single-Ended Fully Integrated SiGe 77/79 GHz Receiver for Automotive Radar

A single-ended 77/79 GHz monolithic microwave integrated circuit (MMIC) receiver has been developed in SiGe HBT technology for frequency-modulated continuous-wave (FMCW) automotive radars. The single-ended receiver chip consists of the first reported SiGe 77/79 GHz single-ended cascode low noise amplifier (LNA), the improved single-ended RF double-balanced down-conversion 77/79 GHz micromixer, and the modified differential Colpitts 77/79 GHz voltage controlled oscillator (VCO). The LNA presents 20/21.7 dB gain and mixer has 13.4/7 dB gain at 77/79 GHz, and the VCO oscillates from 79 to 82 GHz before it is tuned by cutting the transmission line ladder, and it centres around 77 GHz with a tuning range of 3.8 GHz for the whole ambient temperature variation range from $- hbox{40},^{circ}{hbox{C}}$ to $+ hbox{125},^{circ}{hbox{C}}$ after we cut the lines by tungsten-carbide needles. Phase noise is $-$90 dBc/Hz@1 MHz offset. Differential output power delivered by the VCO is 5 dBm, which is an optimum level to drive the mixer. The receiver occupies 0.5 ${hbox{mm}}^{2}$ without pads and 1.26 ${hbox{mm}}^{2}$ with pads, and consumes 595 mW. The measurement of the whole receiver at 79 GHz shows 20–26 dB gain in the linear region with stable IF output signal. The input ${rm P}_{rm 1dB}$ of the receiver is $-$35 dBm.      

125-GHz Diode Frequency Doubler in 0.13-$mu{hbox {m}}$ CMOS

The first mm-wave Schottky diode frequency doubler fabricated in CMOS is demonstrated. The doubler built in 130-nm CMOS uses a balanced topology with two shunt Schottky barrier diodes, and exhibits $sim$10-dB conversion loss as well as $-$1.5-dBm output power at 125 GHz. The input matching is better than $-$10$~$dB from 61 to 66 GHz. The rejection of fundamental signal at output is greater than 12 dB for input frequency from 61 to 66$~$GHz. The doubler can generate signals up to 140 GHz.      

Q-Band pHEMT and mHEMT Subharmonic Gilbert Upconversion Mixers

This letter makes a comparison between Q-band 0.15 $mu{rm m}$ pseudomorphic high electron mobility transistor (pHEMT) and metamorphic high electron mobility transistor (mHEMT) stacked-LO subharmonic upconversion mixers in terms of gain, isolation and linearity. In general, a 0.15 $mu{rm m}$ mHEMT device has a higher transconductance and cutoff frequency than a 0.15 $mu{rm m}$ pHEMT does. Thus, the conversion gain of the mHEMT is higher than that of the pHEMT in the active Gilbert mixer design. The Q-band stacked-LO subharmonic upconversion mixers using the pHEMT and mHEMT technologies have conversion gain of $-$7.1 dB and $-$0.2 dB, respectively. The pHEMT upconversion mixer has an ${rm OIP}_{3}$ of $-$12 dBm and an ${rm OP}_{1 {rm dB}}$ of $-$24 dBm, while the mHEMT one shows a 4 dB improvement on linearity for the difference between the ${rm OIP}_{3}$ and ${rm OP}_{1 {rm dB}}$. Both the chip sizes are the same at 1.3 mm $times$ 0.9 mm.      

Wideband LNA Compatible for Differential and Single-Ended Inputs

This letter presents a wideband low-noise amplifier (LNA) that supports both differential and single-ended inputs, while providing differential output. The LNA is implemented in 0.13 $mu{rm m}$ CMOS technology. For sub-1 GHz wideband applications, this LNA achieves 22.5 dB voltage gain, ${+ 1}~{rm dBm}$ IIP3, and 2.5 dB NF in the differential receiving mode, while achieving 23 dB voltage gain, ${- 0.5}~{rm dBm}$ IIP3, and 2.65 dB NF in the single-ended receiving mode. The LNA core circuit draws 2.5 mA from 1.2 V supply voltage, and occupies a small chip area of 0.06 ${rm mm}^{2}$.      

Single- and Dual-Polarized Tunable Slot-Ring Antennas

Single- and dual-polarized slot-ring antennas with wideband tuning using varactor diodes have been demonstrated. The single-polarized antenna tunes from 0.95 to 1.8 GHz with better than ${-}13$ dB return loss. Both polarizations of the dual-polarized antenna tune from 0.93 to 1.6 GHz independently with better than ${-}10$ dB return loss and $> !20!$ dB port-to-port isolation over most of the tuning range. The capacitance of the varactor diodes varies from 0.45 to 2.5 pF, and the antennas are printed on 70 $,times,$70 $,times,$0.787 mm ${^3}$ substrates with ${epsilon_{rm r} = 2.2}$. The dual-polarized slot-ring antenna can either be made both frequency- and polarization-agile simultaneously, or can operate at two independent frequencies on two orthogonal polarizations. To our knowledge, this is the first dual-polarized tunable antenna with independent control of both polarizations over a 1.7:1 frequency range.      

A $Q$ -Band Four-Element Phased-Array Front-End Receiver With Integrated Wilkinson Power Combiners in 0.18-$mu{{hbox{m}}}$ SiGe BiCMOS Technology

A four-element phased-array front-end receiver based on 4-bit RF phase shifters is demonstrated in a standard 0.18- $mu{{hbox{m}}}$ SiGe BiCMOS technology for $Q$-band (30–50 GHz) satellite communications and radar applications. The phased-array receiver uses a corporate-feed approach with on-chip Wilkinson power combiners, and shows a power gain of 10.4 dB with an ${rm IIP}_{3}$ of $-$13.8 dBm per element at 38.5 GHz and a 3-dB gain bandwidth of 32.8–44 GHz. The rms gain and phase errors are $leq$1.2 dB and $leq {hbox{8.7}}^{circ}$ for all 4-bit phase states at 30–50 GHz. The beamformer also results in $leq$ 0.4 dB of rms gain mismatch and $leq {hbox{2}}^{circ}$ of rms phase mismatch between the four channels. The channel-to-channel isolation is better than $-$35 dB at 30–50 GHz. The chip consumes 118 mA from a 5-V supply voltage and overall chip size is ${hbox{1.4}}times {hbox{1.7}} {{hbox{mm}}}^{2}$ including all pads and CMOS control electronics.      

A 24 GHz Amplitude Monopulse Comparator in 0.13 $mu$m CMOS

This letter presents the design and implementation of a wideband 24 GHz amplitude monopulse comparator in 0.13 $mu$m CMOS technology. The circuit results in 9.6 dB gain in the sum channel at 24 GHz with a 3-dB bandwidth of 23.0–25.2 GHz, and a sum/difference ratio of $> 25$ dB at 20–26 GHz. The measured input P1 dB is ${-}14.4$ dBm at 24 GHz. The chip is only 0.55$,times,$ 0.50 mm$^{2}$ (without pads) and consumes 44 mA from a 1.5 V supply, including the input active baluns and the differential to single-ended output stages (28 mA without the input and output stages). To our knowledge, this is the first demonstration of a high performance mm-wave CMOS monopulse comparator RFIC.      

Design of an ESD-Protected Ultra-Wideband LNA in Nanoscale CMOS for Full-Band Mobile TV Tuners

This paper presents an electrostatic discharge (ESD)- protected ultra-wideband (UWB) low-noise amplifier (LNA) for full-band (170-to-1700 MHz) mobile TV tuners. It features a PMOS-based open-source input structure to optimize the I/O swings under a mixed-voltage ESD protection while offering an inductorless broadband input impedance match. The amplification core exploiting double current reuse and single-stage thermal-noise cancellation enhances the gain and noise performances with high power efficiency. Optimized in a 90-nm 1.2/2.5-V CMOS process with practical issues taken into account, the LNA using a constant- $g _{m}$ bias circuit achieves competitive and robust performances over process, voltage and temperature variation. The simulated voltage gain is 20.6 dB, noise figure is 2.4 to 2.7 dB, and IIP3 is $+10.8~hbox{dBm}$ . The power consumption is 9.6 mW at 1.2 V. $vert {rm S} _{11} vert ≪ -10~{hbox {dB}}$ is achieved up to 1.9 GHz without needing any external resonant network. Human Body Model ESD zapping tests of $pm 4~{hbox {kV}}$ at the input pins cause no failure of any device.