基于预警优先级的ZigBee传感网络MAC层退避算法

针对无线传感器网络中有预警信息的高优先级数据包需要尽快传输,且IEEE 802.15.4协议本身不支持任何优先级传输机制的情况,提出了一种基于预警优先级的非时隙CSMA/CA自适应调整阶梯退避算法,并建立了离散时间马尔可夫分析模型,比较分析了网络中不同优先级节点的信道接入概率、网络吞吐量和传输延时,仿真结果表明,本文改进的自适应调整阶梯退避机制对提高无线传感器网络中高优先级数据包的实时传输性能具有积极的作用。     

新的改进IEEE 802.11 DCF性能的退避机制

分布式协调功能DCF是IEEE802.11标准最基本的媒体接入方法,它的核心是载波检测多址接入/冲突避免（CSMA/CA）机制,通过退避算法,减少碰撞的概率。提出了一种新的退避机制改进IEEE802.11DCF饱和吞吐量性能,建立了三维马尔可夫链网络模型详细研究分析,同时利用NS2对所提出的机制进行仿真,比较了改进后的802.11DCF饱和吞吐量与原802.11DCF的饱和吞吐量的大小,仿真结果证明了算法的准确有效。     

IEEE802.15.4时隙CSMA/CA算法性能研究

对IEEE802.15.4标准和时隙CSMA/CA算法进行了简单介绍,基于OPNET仿真软件,针对节点个数、工作周期(占空比)等参数对时隙CSMA/CA算法性能的影响,进行了不同网络环境的仿真实验。分别在固定节点个数和固定占空比条件下,仿真并分析了介质接入时延与吞吐量及网络能耗之间的关系。仿真结果表明,较多的节点个数和较小的工作周期会增大介质接入时延,降低网络吞吐量。     

长距离CSMA/CA协议的系统设计

文中研究载波监听多路访问/冲突避免(CSMA/CA)接入机制在航空无线自组织网络中的应用。航空无线自组织网络是一种长传播时延的自组织网络,首先对长传播时延背景下的CSMA/CA接入协议进行了理论分析,研究时隙长度(Slot),短帧间间隔(SIFS)和源节点等待ACK包的时间对系统性能的影响。通过分析得到不同传输半径下CSMA/CA的最优参数配置。通过仿真结果表明,长距离CSMA/CA可以基本保持CSMA/CA的吞吐量。     

WLAN无线网络规划及优化技术研究

针对WLAN无线接入网络的规划方法,分别从传播预测及覆盖设计方面研究覆盖规划、分析研究基于DCF协议的容量规划以及干扰分析和信道优化配置等。其中容量规划部分采用已有退避窗口机制(BEB)的二维马尔可夫模型,对基于CSMA/CA协议的DCF性能进行分析并改进。提出了基于RTS/CTS机制改进的退避算法,得出了饱和条件下系统归一化吞吐率、丢包率、网络延时等性能,以指导实际吞吐量的估算和网络容量规划。经过理论分析和OPNET仿真比较,所提出的新算法降低了数据包的碰撞概率,从而降低了时延,增加了系统吞吐率,进而增加了网络容量。     

对WLAN无线网络规划及优化技术的分析

经过理论分析和OPNET仿真比较所提出的针对WLAN无线接入网络的规划从传播预测及覆盖设计方面研究覆盖规划、分析研究基于DCF协议的容量规划以及干扰分析和信道优化配置等方法,能有效的降低数据包的碰撞概率,从而降低了时延,增加了系统吞吐率、和网络容量.提出的基于RTS/CTS机制改进的退避算法是对基于CSMA/CA协议的DCF性能的分析和改进,并得出的饱和条件下系统归一化吞吐率、丢包率、网络延时等性能,以此指标用来指导实际吞吐量的估算和网络容量规划.     

基于ZigBee信标模式的无线语音通信研究

ZigBee技术以其低功耗,高网络容量和灵活的自组网能力适合于很多无线通信场景。对ZigBee网络信标模式下,CSMA/CA和GTS两种传输机制分别进行仿真建模,研究在不同语音编码速率时,星型网络能容纳的语音节点数。仿真结果表明:在CSMA/CA方式下,语音编码速率依次为5.15,16和32 kb/s时,ZigBee网络能容纳的节点数分别为8,4和3;在GTS方式下,端节点数超过4时,网络丢包率和吞吐量均优于CSMA/CA,能容纳至多7个端节点同时通信。     

一种面向MAC的Ad Hoc网络时延模型分析

在Ad Hoc网络中,时延主要是介质接入冲突造成的。为了更好地分析Ad Hoc网络,提出了一种面向MAC的Ad Hoc时延(MAC-Orient Delay Model)模型。该模型通过深入研究Ad Hoc网络的MAC接入机制,得出MAC时延主要包括传输时延和冲突退避等待时延。传输时延是介质接入时数据传输的时间,是必需的;而退避等待是接入冲突产生的,由冲突退避机制决定。由Ad Hoc采用的CSMA/CA的二进制退避算法,得到了MAC时延。仿真结果表明,该模型简单有效。基于该模型,分析了如何减小时延等,为解决负载均衡等问题指明了方向。     

IEEE802.15.4MAC协议CSMA/CA优化算法研究

IEEE802.15.4作为无线局域网的MAC层规范,它适用在低速率、低功耗和低成本的短距离通信的设备中。CSMA/CA协议是无线自组织网络中的基本协议,本文引入了一个新退避算法对CSMA/CA进行改进。改进后的结果表明,结点可以根据自身的流量动态地调整竞争窗口,从而有效地避免了访问冲突,提高了网络的吞吐量,进而也降低了设备的功耗。     

无线传感器网络低能耗协议研究与仿真

针对目前无线传感器网络MAC协议无法在事件驱动感知和周期性事件感知共存的复杂环境下应用的问题,提出一种能够在分簇网络中应用的自适应混合MAC协议TC2-MAC。在研究了MAC层能耗来源及节能策略的基础上,给出了TC2-MAC协议的时隙分配方法、时间同步策略和CSMA/CA竞争接入机制。     

Interfacial reaction and shear strength of SnAgCu-xNi/Ni solder joints during aging at 150 °C

The interfacial microstructure and shear strength of Sn3.8Ag0.7Cu-xNi (SAC-xNi, x = 0.5, 1, and 2) composite solders on Ni/Au finished Cu pads were investigated in detail after aging at 150 °C for up to 1000 h. The interfacial characteristics of composite solder joints were affected significantly by the weight percentages of added Ni micro-particles and aging time. After aging for 200 h, the solder joints of SAC, SAC-0.5Ni and -1Ni presented duplex intermetallic compound (IMC) layers regardless of the initial interfacial structure on as-reflowed joints, whose upper and lower IMC layers were comprised of (CuNi)₆Sn₅ and (NiCu)₃Sn₄, respectively. Only a single (NiCu)₃Sn₄ IMC layer was ever observed at the SAC-2Ni/Ni interface on whole aging process. Based on the compositional analysis, the amount of Ni within the IMC regions increased as the proportion of Ni addition increased. The IMC (NiCu)₃Sn₄ layer thickness on the interface of SAC and SAC-0.5Ni grew more slowly when compared to that of SAC-1Ni and -2Ni, while for the (CuNi)₆Sn₅ layer the reverse is true. Except the IMCs sizes are increased with increased aging time, the interfacial IMCs tended to transfer their morphologies to polyhedra. In all composite joints testing, the shear strengths were approximately equal to non-composite joints. The fracturing observed during shear testing of composite joints occurred in the bulk solder, indicating that the SAC-xNi/Ni solder joints had a desirable joint reliability.     

有机发光二极管中ADN掺杂ErQ的1.54μm电致发光

自行设计了基于8-羟基喹啉铒(ErQ)为发射层(EMLs)和二硝酰胺铵(ADN)为蓝光主体材料的近红外有机发光二级管.器件的基本结构为(p-Si/NPB/EML/Bphen/Bphen:Cs2CO3/Sm/Au),设计并比较了三套不同发射层结构(ErQ/ADN为双层结构器件,(ErQ/ADN)×3为多层结构器件,ErQ:ADN为掺杂结构器件)的器件.三组器件在一定的偏压下,均可发出1.54μm的光,对应三价铒离子4I13/2→4I15/2的跃迁.其中,ADN:ErQ(1∶1)掺杂结构的近红外电致发光强度是ADN/ErQ双层结构中的三倍.此外,不同掺杂浓度的ADN:ErQ复合膜做了以下表征:吸收谱、光致发光谱和荧光寿命谱.实验结果证实了在近红外电致发光过程中存在从ADN主体分子到ErQ发射分子的高效率的能量转移.     

BNBST无铅压电陶瓷的制备工艺研究

设计了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3（BNBST[100x-100a／100b]）无铅压电陶瓷新体系。该体系压电陶瓷具有工艺特性及压电响应好，压电常数高的特点，且有实际应用前景的新型压电陶瓷材料体系。采用传统的陶瓷工艺制备了（Bi0.55Na0.5）1-X（BaaSrb）xTiO3无铅压电陶瓷，研究了制备工艺参数对其物化结构性能的影响。生料的热重-差热（TGA-DTA）分析表明，粉料合成过程中，先是SrTiO3、BaTiO3的形成，然后是（Bi0．5Na0．5）Tio，的形成，同时三者形成固溶体；密度测试表明，陶瓷的体积密度随烧结温度的升高而增大，可较易获得理论密度94％的陶瓷；X-射线能谱分析（EDAX）研究表明，陶瓷的Bi、Na的挥发随着烧结温度的升高而加剧。研究结果表明，要制备性能优良的无铅压电陶瓷，需要精确控制制备工艺。     

Emerging interconnects: a state-of-the-art review and emerging solutions

Aluminium was a primary material for interconnection in integrated circuits (ICs) since their inception. Later, copper was introduced as interconnect material which has better metallic conductivity and resistance to electromigration. As the aggressive technology scaling continues, the copper resistivity increased because of size effects, which causes increase in delay, power dissipation and electromigration. The need to reduce the resistor-capacitor??????? delay, dynamic power utilisation and the crosstalk commotion is as of now the fundamental main impetus behind the presentation of new materials. The purpose of this paper is to do a survey of interconnect material used in IC from introduction of ICs to till date. This paper studies and reviews new materials available for interconnect application which are optical interconnects, carbon nanotube (CNT), graphene nanoribbons (GNRs) and silicon nanowires which are alternatives to copper. While doing a survey of interconnect material, it is found that multiwalled CNTs, multilayer GNR and mixed CNT bundles are promising candidates and are ultimate choice that can strongly address the problems faced by copper but on integration basis copper would last for coming years.     

钠离子对poly(dT).poly(dA).poly(dT)三螺旋DNA分子呼吸模式的影响

利用分子结构的螺旋对称性,建立了一个包括钠离子的三链DNA分子poly(dT)*poly(dA)*poly(dT)的晶格动力学模型,计算了poly(dT)*poly(dA)*poly(dT)的氢键呼吸模式.结果发现钠离子的加入明显地淬灭了位于较低频率的几个最为强烈的Hoogensteen氢键呼吸模式,而对Watson-Crick氢键呼吸模式影响不明显,这说明钠离子能提高poly(dT)*poly(dA)*poly(dT)三螺旋结构的稳定性.该计算结果很好地解释了poly(dT)*poly(dA)*poly(dT)的热融化实验.     

聚对苯撑苯并双(口恶)唑发光及其器件制备

采用光谱技术,研究了聚对苯撑苯并双(口恶)唑(PBO)溶液的光敏发光特性,并用相对法估算出溶液发光效率在50%范围.结合光谱技术、半导体电学和电化学等研究手段,具体研究了以PBO为发光层的单层电致发光器件,研究结果显示,电致发光与薄膜的光致发光有具有相同的发光中心,峰值位于510 nm左右.同时发现,由于存制备过程中不同处理条件使得不同厚度薄膜残留的掺杂物质浓度不同,从而引起薄膜的导电性的不同.使得器件的阈值场强随PBO厚度的减小而逐渐增加.     

人小肠粘膜免疫酶的定位研究—光镜和电镜免疫组织化学染色法

本文对免疫酶组织化学的样品制备程序和染色方法做了详细的阐述。用直接法、间接法和ABC法,对人小肠免疫酶的定位,进行了光镜和电镜的观察,染色阳性反应显著,获得了满意的效果。并对染色技巧做了分析和探讨。     

Arsenic deposition as a precursor layer on silicon (211) and (311) surfaces

We investigate the properties of arsenic (As) covered Si(211) and Si(311) surfaces by analyzing data from x-ray photoelectron spectroscopy (XPS) and low-energy electron diffraction (LEED) images. We then create a model using total surface energy calculations. It was found that both Si(211) and Si(311) had 0.68±0.08 surface As coverage. Si(211) had 0.28±0.04 Te coverage and Si(311) had 0.24±0.04 Te coverage. The Si(211) surface replaces the terrace and trench Si atoms with As for a lower surface energy, while the Si edge atoms form dimers. The Si(311) surface replaces all terrace atoms and adsorbs an As dimer every other edge site. These configurations imply an improvement in the mean migration path from the bare silicon surface by allowing the impinging atoms for the next epitaxial layer, tellurium (Te), to bind at every other pair of edge atoms, and not the step terrace sites. This would ensure a nonpolar, B-face growth.     

Joint estimation of TOA and DOA in IR-UWB system using a successive propagator method

Impulse radio ultra-wideband (IR-UWB) ranging and positioning require accurate estimation of time-of-arrival (TOA) and direction-of-arrival (DOA). With receiver of two antennas, both of the TOA and DOA parameters can be estimated via two-dimensional (2D) propagator method (PM), in which the 2D spectral peak searching, however, renders much higher computational complexity. This paper proposes a successive PM algorithm for joint TOA and DOA estimation in IR-UWB system to avoid 2D spectral peak searching. The proposed algorithm firstly gets the initial TOA estimates in the two antennas from the propagation matrix, then utilises successively one-dimensional (1D) local searches to achieve the estimation of TOAs in the two antennas, and finally obtains the DOA estimates via the difference in the TOAs between the two antennas. The proposed algorithm, which only requires 1D local searches, can avoid the high computational cost in 2D-PM algorithm. Furthermore, the proposed algorithm can obtain automatically paired parameters and has better joint TOA and DOA estimation performance than conventional PM algorithm, estimation of signal parameters via rotational invariance techniques algorithm and matrix pencil algorithm. Meanwhile, it has very close parameter estimation to that of 2D-PM algorithm. We have also derived the mean square error of TOA and DOA estimation of the proposed algorithm and the Cramer-Rao bound of TOA and DOA estimation in this paper. The simulation results verify the usefulness of the proposed algorithm.     

系统级封装新型埋入式电源滤波结构的研究

在高密度小尺寸的系统级封装(SiP)中,对供电系统的完整性要求越来越高,多芯片共用一个电源网路所产生的电压抖动除了会影响到芯片的正常工作,还会通过供电网路干扰到临近电路和其他敏感电路,导致芯片误动作,以及信号完整性和其他电磁干扰问题.这种电压抖动所占频带相当宽,几百MHz到几个GHz的中频电源噪声普通方法很难去除.结合埋入式电容和电源分割方法的特点,提出一种新型高性能埋入式电源低通滤波结构直接替代电源/地平面.研究表明,在0.65～4GHz的频带内隔离深度可达-40～75 dB,电源阻抗均在0.25ohm以下,实现了宽频高隔离度的高性能滤波作用.分别用电磁场和广义传输线两种仿真器模拟,高频等效电路模型分析这种低通滤波器的工作原理以及结构对隔离性能的影响,并进行了实验验证.