Simulation of InGaAs subchannel DG-HEMTs for analogue/RF applications

The paper reports on the influence of a barrier thickness and gate length on the various device parameters of double gate high electron mobility transistors (DG-HEMTs). The DC and RF performance of the device have been studied by varying the barrier thickness from 1 to 5 nm and gate length from 10 to 150 nm, respectively. As the gate length is reduced below 50 nm regime, the barrier thickness plays an important role in device performance. Scaling the gate length leads to higher transconductance and high frequency operations with the expense of poor short channel effects. The authors claim that the 30-nm gate length, mole fractions tuned In_0.53Ga_0.47As/In_0.7Ga_0.3As/In_0.53Ga_0.47As subchannel DG-HEMT with optimised device structure of 2 nm In_0.48Al_0.52As barrier layer show a peak g_m of 3.09 mS/µm, V_T of 0.29 V, I_ON/I_OFF ratio of 2.24 × 10⁵, subthreshold slope ~73 mV/decade and drain induced barrier lowering ~68 mV/V with f_T and f_max of 776 and 905 GHz at V_ds = 0.5 V is achieved. These superior performances are achieved by using double-gate architecture with reduced gate to channel distance.     

Comparative assessment of InGaAs sub-channel and InAs composite channel double gate (DG)-HEMT for sub-millimeter wave applications

This work analyses the impact of channel material, channel thickness (T_CH) and gate length (L_g) on the various performance device metrics of Double-gate (DG) High Electron Mobility Transistor (HEMT) by using 2D Sentaurus TCAD simulation. A comparison between In_0.53Ga_0.47As/In_0.7Ga_0.3As/In_0.53Ga_0.47As sub-channel and In_0.7Ga_0.3As/InAs/In_0.7Ga_0.3As composite channel DG-HEMT along with SG-HEMT is made by characterizing the device with structural and geometrical parameters suitable for applications requiring high frequency operations. The DG-In_0.53Ga_0.7As/In_0.7Ga_0.3As/In_0.53Ga_0.7As sub-channel/DG-In_0.7Ga_0.3As/InAs/In_0.7Ga_0.3As composite channel HEMT with channel thickness of 13 nm and barrier thickness (T_B) of 2 nm with L_g = 30 nm are seen offering a positive threshold voltage (V_T) of 0.298/0.21 V, transconductance (g_m) of 3.09/3.3 mS/µm, with cut-off frequency (f_T) and maximum oscillation frequency (f_max) of 776/788 GHz and 905/978 GHz, respectively at V_ds = 0.5 V is obtained. If the channel thickness of the DG-InAs composite channel device is scaled and reduced to 10 nm, the RF performances are further enhanced to 809 GHz (f_T) and 1030 GHz (f_max). Compared to DG-InGaAs sub-channel device, the device with thin DG-InAs composite channel device shows a better performance in terms of drain current (I_ds), analog/RF performance thereby making it preferable for future THz applications.     

In0.48Ga0.52P/In0.20Ga0.80As/GaAs pseudomorphic high electron mobility transistors grown by solid-source molecular-beam epitaxy using a valved phosphorus cracker cell

In_0.48Ga_0.52P/In_0.20Ga_0.80As/GaAs pseudomorphic high electron mobility transistor (p-HEMT) structures were grown by solid-source molecular beam epitaxy (SSMBE) using a valved phosphorus cracker cell. The sheet carrier density at room temperature was 3.3 × 10¹²cm^?2. A peak transconductance (G _m) of 267 mS mm^?1 and peak drain current density (I _ds) of 360 mA mm^?1 were measured for a p-HEMT device with 1.25 µm gate length. A high gate-drain breakdown voltage (BV _gd) of 33V was measured. This value is more than doubled compared with that of a conventional Al_0.30Ga_0.70As/In_0.20Ga_0.80As/GaAs device. The drain-source breakdown voltage (BV _ds) was 12.5V. Devices with a mushroom gate of 0.25 µm gate length and 80 µm gate width achieved a peak transconductance (G _m) of 420 mS mm^?1 and drain current density of nearly 500mA mm^?1. A high cutoff frequency (f _T) of 58GHz and maximum oscillation frequency (f _max) of 120 GHz were obtained. The results showed that the In_0.48Ga_0.52P/In_0.20Ga_0.80As/GaAs material system grown by SSMBE using the valved phosphorus cracker cell for the In^0.48Ga^0.52P Schottky and spacer layers is a viable technology for high frequency p-HEMT device applications.     

Tertiarybutylarsine and tertiarybutylphosphine for the MOCVD growth of low threshold 1.55 μm InxGa1-xAs/InP quantum-well lasers

Tertiarybutylarsine (TBA) and teriarybutylphosphine (TBP) are liquid organometallic sources that are a safer alternative to arsine and phosphine. In this work, we have grown high-quality In_0.53Ga_0.47As/InP quantum wells at a temperature of 590° with TBA and TBP partial pressures of 0.4 and 2.5 Torr, respectively. A low-temperature photoluminescence study indicated optimized column V growth interruption times of 0.5 s for In_0.53Ga_0.47As wells with InP barriers. Using the optimized growth conditions, we have obtained lattice matched In_0.53Ga_0.47As/In_xGa_1-xAs_yP_1-x single quantum-well lasers emitting at 1.55 μm. Broad-area devices with a length of 3.5 mm exhibit a low threshold current density of 220A/cm². Broad-area lasers containing four quantum wells had a threshold current density of 300A/cm² for a 3.0 mm cavity length and CW powers of 40 mW per facet for an as-cleaved 4 × 750 μm device.     

New low contact resistance triple capping layer enabling very high Gm InAIAs/lnGaAs HEMTs

It has been demonstrated that a highly doped (Si:3 × 10¹⁹ cm^-3) triple capping layer consisting of n⁺−In_0.53Ga_0.47As, n⁺−In_0.52Al_0.48As, and n⁺-In_0.53Ga_0.47As can remarkably reduce the parasitic source resistance in InP-based high electron mobility transistors (HEMTs). The analysis of the source resistance revealed that the resistance element at the n⁺−In_0.53Ga_0.47As/un−In_0.52Al_0.48As/un-In_0.53Ga_0.47As channel heterointerfaces was as large as 70% of the source resis-tance when nonalloyed ohmic electrodes were used. The highly doped triple capping layer reduces the resistance contribution of vertical conduction between the capping layer and 2DEG channel. A low source resistance of 0.57 Ωmm and a low contact resistivity of 3 × 10⁻⁵ Ωcm² were obtained for the HEMTs with the highly doped triple capping layer, which were 60% lower and one order of magnitude smaller than those for the HEMTs with a conventional single capping layer doped 5 × 10¹⁸ cm⁻³, respectively. These values were also 70 and 30% lower than those for the HEMTs with a highly doped (3 × 10¹⁹ cm⁻³) single capping layer, respectively. The low source resistance brings high peak extrinsic transconduc-tance of 1 S/mm for a device with 0.4 μm long gate, which was 42% higher than the previously reported HEMTs with the same gate length.     

OMVPE growth of In0.53Ga0.47As on InP using tertiarybutylarsine

We have successfully grown bulk In_0.53Ga_0.47As on InP using tertiarybutylarsine (TBA), trimethylindium and trimethylgallium. The growth temperature was 602° and the V/III ratio ranged from 19 to 38. Net carrier concentrations were 2 – 4 × 10¹⁵ cm^-3, n-type, with a peak 77 K mobility of 68,000 cm²/V. sec. Increasing compensation was observed in In_0.53Ga_0.47As grown at higher V/III ratios. PL spectra taken at 5 K revealed strong near bandgap emission at 0.81 eV—with the best sample having a FWHM of 2.5 meV. At lower energies, donor-acceptor pair transitions were evident. Strong and sharp 5 K PL emission was observed from InP/In_0.53Ga_0.47As/InP quantum wells grown with TBA.     

High electron mobility 18300 cm2/V·s in the InAIAs/lnGaAs pseudomorphic structure obtained by channel indium composition modulation

The highest electron mobility yet reported for an InP-based pseudomorphic structure at room temperature, 18300 cm²/V·s, has been obtained by using a structure with an indium composition modulated channel, namely, In_0.53Ga_0.47As/ In_0.8Ga_0.2As/InAs/In_0.8Ga_0.2As/In_0.53Ga_0.47As. Although the total thickness of the high In-content layers (In_0.8Ga_0.2As/InAs/In_0.8Ga_0.2As) exceeds the critical thick-ness predicted by Matthews theory, In_0.8Ga_0.2As insertion makes it possible to form smooth In_0.53Ga_0.47As/In_0.8Ga_0.2As and In_0.8Ga_0.2As/InAs heterointerfaces. This structure can successfully enhance carrier confinement in the high In-content layers. This superior carrier confinement can be expected to lead to the highest yet reported electron mobility.     

Interface state densities, low frequency noise and electron mobility in surface channel In0.53Ga0.47As n-MOSFETs with a ZrO2 gate dielectric

This paper reports on an investigation of interface state densities, low frequency noise and electron mobility in surface channel In_0.53Ga_0.47As n-MOSFETs with a ZrO₂ gate dielectric. Interface state density values of D_it ∼ 5 × 10¹² cm⁻² eV⁻¹ were extracted using sub-threshold slope analysis and charge pumping technique. The same order of magnitude of trap density was found from low frequency noise measurements. A peak effective electron mobility of 1200 cm²/Vs has been achieved. For these surface channel In_0.53Ga_0.47As n-MOSFETs, it was found that η parameter, an empirical parameter used to calculate the effective electric field, was ∼0.55, and is to be comparable to the standard value found in Si device.     

Zinc diffusion in InAsP/InGaAs heterostructures

A systematic study of the sealed ampoule diffusion of zinc into epitaxially grown InP, In_0.53Ga_0.47As, In_0.70Ga_0.30As, In_0.82Ga_0.18As, and through the InAsP/InGaAs interface is presented. Diffusion depths were measured using cleave-and-stain techniques, electrochemical profiling, and secondary ion mass spectroscopy. The diffusion coefficients, , were derived. For InP, D₀=4.82 × 10⁻²cm²/sec and E_a=1.63 eV and for In_0.53Ga_0.47As, D₀=2.02 × 10⁴cm²/sec and E_a=2.63 eV. Diffusion into the heteroepitaxial structures used in the fabrication of planar PIN photodiodes is dominated by the effects of the InP/InGaAs interface.     

高峰谷电流比的高掺杂发射区In0.53Ga0.47As/AlAs共振隧穿二极管

利用空气桥工艺设计和制作了高掺杂发射区In0.53Ga0.47As/AlAs共振隧穿二极管（RTD）。在室温下,器件的峰谷电流比大于40,峰值电流密度为24kA/cm2。建立了RTD器件等效电路模型,并从直流和微波测试结果中提取出器件参数。高峰谷电流比的RTD器件具有非常小的电容,有利于在微波/太赫兹领域中的应用。     

Pd/Sb(Zn) and Pd/Ge(Zn) ohmic contacts on p-type indium gallium arsenide: The employment of the solid phase regrowth principle to achieve optimum electrical and metallurgical properties

The development of two metallizations based on the solid-phase regrowth principle is presented, namely Pd/Sb(Zn) and Pd/Ge(Zn) on moderately doped In_0.53Ga_0.47As (p=4×10¹⁸ cm⁻³). Contact resistivities of 2–3×10⁻⁷ and 6–7×10⁻⁷ Ωcm², respectively, have been achieved, where both systems exhibit an effective contact reaction depth of zero and a Zn diffusion depth below 50 nm. Exhibiting resistivities equivalent to the lowest values of Au-based systems in this doping range, especially Pd/Sb(Zn) contacts are superior to them concerning metallurgical stability and contact penetration. Both metallizations have been successfully applied for contacting the base layer of InP/In_0.53Ga_0.47As heterojunction bipolar transistors.     

p-i-n InP/InGaAs光电探测器电流及电容特性研究

为了实现高灵敏度探测,红外探测器需要得到优化。利用Silvaco器件仿真工具研究了p-i-n型InP/In_0.53Ga_0.47As/In_0.53Ga_0.47As光电探测器结构,模拟了结构中吸收层浓度和台阶宽度对暗电流及结电容的影响。结果表明,随着吸收层掺杂浓度的逐渐增大,器件暗电流逐渐减小,结电容逐渐增大;当台阶宽度变窄时,器件暗电流随之减小,结电容也随之变小。最后研究了光强和频率对器件结电容的影响：在低光强下,器件结电容基本不变;当光强增大到1 W/cm²时,器件结电容迅速增大;器件结电容随频率的升高而减小,其峰值由缺陷能级引起。     

p-i-n InP/InGaAs光电探测器的电流及电容特性研究

为了实现高灵敏度探测,红外探测器需要得到优化。利用Silvaco器件仿真工具研究了p--i--n型InP/In0.53Ga0.47As/In0.53Ga0.47As光电探测器的结构,并模拟了该结构中吸收层浓度和台阶宽度对暗电流以及结电容的影响。结果表明,随着吸收层掺杂浓度的逐渐增大,器件的暗电流逐渐减小,结电容逐渐增大。当台阶宽度变窄时,器件的暗电流随之减小,结电容也随之变小。最后研究了光强和频率对器件结电容的影响。在低光强下,器件的结电容基本不变;当光强增大到1 W/cm2时,器件的结电容迅速增大。器件的结电容随频率的升高而减小,其峰值由缺陷能级引起。     

Very high purity In0.53Ga0.47As grown by molecular beam epitaxy

Very high purity In0_0.53Ga_0.47As layers were grown by molecular beam epitaxy (MBE). Origins ofn-type impurities in undoped In_0.53Ga_0.47As grown on an InP:Fe substrate were systematically examined. The most possible origins were impurities diffusing from the InP:Fe substrate and those contained in As molecular beam. These impurities were dramatically reduced by using an InAlAs buffer layer and a growth condition of high substrate temperature and low As pressure. The lowest electron concentration of the In0_0.53Ga_0.47As layer wasn = 1.8 × 10¹³ cm_-3 with mobilitiesμ = 15200 cm²/Vs at 300 K andμ = 104000 cm²/Vs at 77 K.     

Enhancement-mode In0.53Ga0.47As metal-oxide-semiconductor field-effect transistors with sol–gel processed gate dielectrics

Enhancement-mode In_0.53Ga_0.47As n-type metal-oxide-semiconductor field-effect transistors (MOSFETs), with barium zirconate titanate (BZT) and titanium dioxide (TiO₂) high-κ materials prepared via the solution–gelation process as gate dielectrics, have been fabricated. The dielectric constants of BZT and TiO₂ are 6.67 and 19.3, respectively. The In_0.53Ga_0.47As MOSFET with TiO₂ exhibits better electrical characteristics than the In_0.53Ga_0.47As MOSFET with BZT. These characteristics include higher maximum drain current density, higher maximum transconductance, and smaller subthreshold swing.     

Passivation of carbon acceptors during growth of carbon-doped GaAs,InGaAs, and HBTs by MOCVD

Carbon dopedp-type GaAs and In_0.53Ga_0.47As epitaxial layers have been grown by low-pressure metalorganic chemical vapor deposition using CC1₄ as the carbon source. Low-temperature post-growth annealing resulted in a significant increase in the hole concentration for both GaAs and In_0.53Ga_0.47As, especially at high doping levels. The most heavily doped GaAs sample had a hole concentration of 3.6 × 10²⁰ cm⁻³ after a 5 minute anneal at ≈400° C in N₂, while the hole concentration in In_0.53Ga_0.47As reached 1.6 × 10¹⁹ cm⁻³ after annealing. This annealing behavior is attributed to hydrogen passivation of carbon acceptors. Post-growth cool-down in an AsH₃/H₂ ambient was found to be the most important factor affecting the degree of passivation for single, uncapped GaAs layers. No evidence of passivation is observed in the base region of InGaP/GaAs HBTs grown at ≈625° C. The effect ofn-type cap layers and cool-down sequence on passivation of C-doped InGaAs grown at ≈525° C shows that hydrogen can come from AsH₃, PH₃, or H₂, and can be incorporated during growth and during the post-growth cool-down. In the case of InP/InGaAs HBTs, significant passivation was found to occur in the C-doped base region.     

Galvanomagnetic properties of two-dimensional electron gases in strain relaxed InxGa1−xAs(x<0.40) heterostructures grown by molecular beam epitaxy on GaAs substrates

We have investigated, as a function of indium content x, the galvanomagnetic and Shubnikov de Haas (SdH) properties of two-dimensional electron gases (2DEG) formed at lattice matched, strain relaxed InAlAs/InGaAs heterojunctions. These were grown by molecular beam epitaxy on GaAs misoriented substrates with a two degree offcut toward the nearest (110) plane. Variable temperature resistivity and Hall measurements indicate an increase in the electron sheet density n_s from 0.78×10¹²cm⁻² for x=0.15 to 1.80×10¹² cm⁻² for x=0.40 at 300K, and from 0.75×10¹²cm⁻² to 1.67×10¹²cm⁻² at T=1.6K. The room temperature electron mobility, measured along the in plane [110], direction is independent of indium content and equals approximately 9500 cm²/Vs. For T<50K, the mobility is independent of temperature decreasing with increasing x from 82000 cm²/Vs for x=0.15 to 33000 cm²/Vs for x=0.40. The ratios (τ_t/τ_q) at 1.6K between the electron relaxation time τ_t and the single particle relaxation time τq, for the strain relaxed specimens, as well as for pseudomorphically strained Al_0.35Ga_0.65As/In_0.15Ga_0.85As structures grown on GaAs substrates, and In_0.52Al_0.48As/In_0.53Ga_0.47As heterostructures grown lattice matched on InP substrates. Such a study indicates the presence of inhomogeneities in the 2DEGs of the strain relaxed specimens which appear to be related to the process of strain relaxation. Such inhomogeneities, however, have little effect on the electron relaxation time τ_t which, at low temperatures, is limited principally by alloy scattering.     

Ultrafast Dynamics of Photoexcited Charge Carriers in In<Subscript>0.53</Subscript>Ga<Subscript>0.47</Subscript>As/In<Subscript>0.52</Subscript>Al<Subscript>0.48</Subscript>As Superlattices under Femtosecond Laser Excitation

The results of experimental studies of the time dynamics of photoexcited charge carriers in In_0.53Ga_0.47As/In_0.52Al_0.48As superlattices grown by molecular-beam epitaxy on a GaAs substrate with a metamorphic buffer are reported. On the basis of the results of the numerical simulation of band diagrams, the optimal thickness of the In_0.52Al_0.48As barrier layer (4 nm) is chosen. At this thickness, the electron wave functions in In_0.53Ga_0.47As substantially overlap the In_0.52Al_0.48As barriers. This makes it possible to attain a short lifetime of photoexcited charge carriers (τ ~ 3.4 ps) at the wavelength λ = 800 nm and the pumping power 50 mW without doping of the In_0.53Ga_0.47As layer with beryllium. It is shown that an increase in the wavelength to λ = 930 nm (at the same pumping power) yields a decrease in the lifetime of photoexcited charge carriers to τ ~ 2 ps. This effect is attributed to an increase in the capture cross section of trapping states for electrons with lower energies and to a decrease in the occupancy of traps at lower excitation densities.     

Scattering parameter based modeling and simulation of symmetric tied-gate InAlAs/InGaAs DG-HEMT for millimeter-wave applications

This paper analyses the RF performance of the symmetric tied-gate In_0.52Al_0.48As/In_0.53Ga_0.47As DG-HEMT in terms of its maximum frequency of oscillation (f_max) and the other important figures of merit that include Maximum Unilateral Transducer Power Gain and the Maximum Stable Gain. This comprehensive investigation has been done on the basis of scattering parameters in order to judge the potential of InAlAs/InGaAs DG-HEMT as the device for future millimeter wave frequency applications. The effect of parasitic elements has also been included in the analytical model which leads to better correspondence with the experimental results. The analytical results thus obtained using the charge control model are compared and found to agree well with both the ATLAS-3D device simulation results as well as the experimental results.     

InGaAs-InGaN Wafer-Bonded Current Aperture Vertical Electron Transistors (BAVETs)

In this paper, we report the fabrication process and direct-current (DC) characteristics of a wafer-bonded heterostructure-based vertical transistor. It comprises an In_0.53Ga_0.47As/In_0.52Al_0.48As/In_0.53Ga_0.47As field-effect transistor wafer-bonded to a Ga-polar In_0.1Ga_0.9N/GaN template. In the DC-bias operation of this device, the current conduction is initially confined lateral to the InGaAs channel and then flows vertically through a conductive aperture defined in the InGaN/GaN layers. The narrow aperture is isolated by ion-implanted current blocking layer (CBL) regions. The I _d–V _ds characteristics of the device demonstrate transistor-like behavior. Design optimizations have been applied to the implant and doping conditions of the InGaN/GaN layers to eliminate the leakage paths through the CBL while simultaneously obtaining unhindered current conduction through the aperture of the device.