A reliable ground bounce noise reduction technique for nanoscale CMOS circuits

Power gating is the most effective method to reduce the standby leakage power by adding header/footer high-V_TH sleep transistors between actual and virtual power/ground rails. When a power gating circuit transitions from sleep mode to active mode, a large instantaneous charge current flows through the sleep transistors. Ground bounce noise (GBN) is the high voltage fluctuation on real ground rail during sleep mode to active mode transitions of power gating circuits. GBN disturbs the logic states of internal nodes of circuits. A novel and reliable power gating structure is proposed in this article to reduce the problem of GBN. The proposed structure contains low-V_TH transistors in place of high-V_TH footer. The proposed power gating structure not only reduces the GBN but also improves other performance metrics. A large mitigation of leakage power in both modes eliminates the need of high-V_TH transistors. A comprehensive and comparative evaluation of proposed technique is presented in this article for a chain of 5-CMOS inverters. The simulation results are compared to other well-known GBN reduction circuit techniques at 22 nm predictive technology model (PTM) bulk CMOS model using HSPICE tool. Robustness against process, voltage and temperature (PVT) variations is estimated through Monte-Carlo simulations.     

PVT variations aware low leakage INDEP approach for nanoscale CMOS circuits

Increasing in device parameter variations is the critical issue in very deep sub-micron regime due to continue scaling of the transistor dimensions. The overall performance yield of the logic circuit is diminished by raising leakage current and variability issues in scaled devices. In this article; we have proposed an approach called INDEP, based on Boolean logic calculation for the input signals of the extra inserted transistors between the pull-up and pull-down network of the CMOS logic. INDEP approach is not only reduces the leakage current but also mitigates the variability issues with minimum susceptible delay paths. Various process, voltage and temperature (PVT) variations are analyzed at 22 nm BSIM4 bulk CMOS PTM technology node for chain of 5-inverters using HSPICE tool. Several guidelines are provided to design the variability aware CMOS circuits in nanoscale regime by considering the leakage current variation. INDEP approach works effectively in both active as well as standby state of the circuit and keeping the modal performance characteristics of the CMOS gate. The electrical simulation results show that our proposed INDEP approach is less susceptible to PVT variations as compared to conventional circuit. The Monte-Carlo simulation results confirm that average INDEP leakage current reduction is 62.31% at ±20% PVT variations under 3σ Gaussian distribution for chain of 5-inverters.     

Dynamic SVL and body bias for low leakage power and high performance in CMOS digital circuits

In this article, a new complementary metal oxide semiconductor design scheme called dynamic self-controllable voltage level (DSVL) is proposed. In the proposed scheme, leakage power is controlled by dynamically disconnecting supply to inactive blocks and adjusting body bias to further limit leakage and to maintain performance. Leakage power measurements at 1.8?V, 75°C demonstrate power reduction by 59.4% in case of 1?bit full adder and by 43.0% in case of a chain of four inverters using SVL circuit as a power switch. Furthermore, we achieve leakage power reduction by 94.7% in case of 1?bit full adder and by 91.8% in case of a chain of four inverters using dynamic body bias. The forward body bias of 0.45?V applied in active mode improves the maximum operating frequency by 16% in case of 1?bit full adder and 5.55% in case of a chain of inverters. Analysis shows that additional benefits of using the DSVL and body bias include high performance, low leakage power consumption in sleep mode, single threshold implementation and state retention even in standby mode.     

Standby power consumption estimation by interacting leakage current mechanisms in nanoscaled CMOS digital circuits

Leakage currents are gaining importance as design parameters in nanometer CMOS technologies. A novel leakage current estimation method, which takes into account the dependency of leakage mechanisms, is proposed for general CMOS complex gates, including non-series-parallel transistor arrangements, not covered by existing approaches. The main contribution of this work is a fast, accurate, and systematic procedure to determine the potentials at transistor network nodes for calculating standby static currents. The proposed method has been validated through electrical simulations, showing an error smaller than 7% and an 80× speed-up when comparing to electrical simulation.     

DOIND: a technique for leakage reduction in nanoscale domino logic circuits

A novel DOIND logic approach is proposed for domino logic, which reduces the leakage current with a minimum delay penalty. Simulation is performed at 70 nm technology node with supply voltage 1V for domino logic and DOIND logic based AND, OR, XOR and Half Adder circuits using the tanner EDA tool. Simulation results show that the proposed DOIND approach decreases the average leakage current by 68.83%, 66.6%, 77.86% and 74.34% for 2 input AND, OR, XOR and Half Adder respectively. The proposed approach also has 47.76% improvement in PDAP for the buffer circuit as compared to domino logic.     

Introduction of a new technique for simultaneous reduction of the delay and leakage current in digital circuits

By the reduction in the size of transistors and the development of submicron technology, as well as the construction of more integrated circuits on chips, leakage power has become one of the main concerns of electronic circuit designers. In this article, we first review techniques presented in recent years to reduce leakage power and then present a new technique based on the gate-level body biasing technique and the multi-threshold CMOS technique to minimize leakage power in digital circuits. Afterward, we develop another new method by improving the first proposed technique to achieve higher efficiency and simultaneously reduce leakage power and propagation delay in digital circuits. In the proposed technique, we use two dynamic threshold MOSFET transistors to reduce leakage current. In this paper, the body biasing generator structure is applied to reduce propagation delay. The proposed technique has been successfully validated and verified by post-layout simulation with Cadence Virtuoso based on the 32 nm process technology.We evaluate the efficiency of the proposed techniques by examining factors including power, delay, area, and the power delay product. The simulation results using HSPICE software and performance analysis to process corner variations based on the 32 nm process technology show that the proposed technique, in addition to having proper performance in different corners of the technology, significantly reduces leakage power and propagation delay in logic CMOS circuits. In general, the proposed technique has a very successful performance compared to previous techniques.     

VSF:CMOS组合电路的静态功耗评估模型

为了解决利用晶体管级电路模拟分析CMOS电路静态功耗时模拟时间随电路规模增大迅速增加的问题,在分析晶体管堆叠效应对标准单元泄漏电流影响的基础上,定义了归一化堆叠系数和电路等效堆叠系数的概念,提出了基于电路有效堆叠系数的静态功耗评估模型.该模型可用于CMOS组合电路静态功耗估算和优化.实验结果表明使用该模型进行静态功耗估算时,不需要进行Hspice模拟.针对ISCAS85基准电路的静态功耗优化结果表明,利用该模型能够取得令人满意的静态功耗优化效果,优化速度大大提高.     

VSF:CMOS组合电路的静态功耗评估模型

为了解决利用晶体管级电路模拟分析CMOS电路静态功耗时模拟时间随电路规模增大迅速增加的问题,在分析晶体管堆叠效应对标准单元泄漏电流影响的基础上,定义了归一化堆叠系数和电路等效堆叠系数的概念,提出了基于电路有效堆叠系数的静态功耗评估模型.该模型可用于CMOS组合电路静态功耗估算和优化.实验结果表明使用该模型进行静态功耗估算时,不需要进行Hspice模拟.针对ISCAS85基准电路的静态功耗优化结果表明,利用该模型能够取得令人满意的静态功耗优化效果,优化速度大大提高.     

FELERION: a new approach for leakage power reduction

The circuit proposed in this paper simultaneously reduces the sub threshold leakage power and saves the state of art aspect of the logic circuits. Sleep transistors and PMOS-only logic are used to further reduce the leakage power. Sleep transistors are used as the keepers to reduce the sub threshold leakage current providing the low resistance path to the output. PMOS-only logic is used between the pull up and pull down devices to mitigate the leakage power further. Our proposed fast efficient leakage reduction circuit not only reduces the leakage current but also reduces the power dissipation. Power and delay are analyzed at the 32 nm BSIM4 model for a chain of four inverters, NAND, NOR and ISCAS-85 c17 benchmark circuits using DSCH3 and the Microwind tool. The simulation results reveal that our proposed approach mitigates leakage power by 90%–94% as compared to the conventional approach.     

LECTOR: a technique for leakage reduction in CMOS circuits

In CMOS circuits, the reduction of the threshold voltage due to voltage scaling leads to increase in subthreshold leakage current and hence static power dissipation. We propose a novel technique called LECTOR for designing CMOS gates which significantly cuts down the leakage current without increasing the dynamic power dissipation. In the proposed technique, we introduce two leakage control transistors (a p-type and a n-type) within the logic gate for which the gate terminal of each leakage control transistor (LCT) is controlled by the source of the other. In this arrangement, one of the LCTs is always "near its cutoff voltage" for any input combination. This increases the resistance of the path from V/sub dd/ to ground, leading to significant decrease in leakage currents. The gate-level netlist of the given circuit is first converted into a static CMOS complex gate implementation and then LCTs are introduced to obtain a leakage-controlled circuit. The significant feature of LECTOR is that it works effectively in both active and idle states of the circuit, resulting in better leakage reduction compared to other techniques. Further, the proposed technique overcomes the limitations posed by other existing methods for leakage reduction. Experimental results indicate an average leakage reduction of 79.4% for MCNC'91 benchmark circuits.     

Gate leakage current reduction in IP3 SRAM cells at 45 nm CMOS technology for multimedia applications

We have presented an analysis of the gate leakage current of the IP3 static random access memory (SRAM) cell structure when the cell is in idle mode (performs no data read/write operations) and active mode (performs data read/write operations), along with the requirements for the overall standby leakage power, active write and read powers. A comparison has been drawn with existing SRAM cell structures, the conventional 6T, PP, P4 and P3 cells. At the supply voltage, V_DD = 0.8 V, a reduction of 98%, 99%, 92% and 94% is observed in the gate leakage current in comparison with the 6T, PP, P4 and P3 SRAM cells, respectively, while at V_DD = 0.7 V, it is 97%, 98%, 87% and 84%. A significant reduction is also observed in the overall standby leakage power by 56%, the active write power by 44% and the active read power by 99%, compared with the conventional 6T SRAM cell at V_DD = 0.8 V, with no loss in cell stability and performance with a small area penalty. The simulation environment used for this work is 45 nm deep sub-micron complementary metal oxide semiconductor (CMOS) technology, t_ox = 2.4 nm, V_thn = 0.22 V, V_thp = 0.224 V, V_DD = 0.7 V and 0.8 V, at T = 300 K.     

A new approach to power estimation and reduction in CMOS digital circuits

Modelling and optimization of dynamic capacitive power consumption in digital static CMOS circuits, taking into consideration a reason of a gate switching—gate control mode, is discussed in the present paper. The term ‘gate control mode’ means that a number and type of signals applied to input terminals of the gate have an influence on total amount of energy dissipated during a single switching cycle. Moreover, changes of input signals, which keep the gate output in a steady state, can also cause power consumption. Based on this observation, complex reasons of power losses have been considered. In consequence, the authors propose a new model of dynamic power consumption in static CMOS gates. Appropriate parameters’ calculation method for the new model was developed. The gate power model has been extended to logic networks, and consequently a new measure of the circuit activity was proposed. Switching activity, which is commonly used as a traditional measure, characterizes only the number of signal changes at the circuit node, and it is not sufficient for the proposed model. As the power consumption parameters of CMOS are dependent on their control mode, the authors used probability of the node control mode as a new measure of the circuit activity. Based on the proposed model, a procedure of combinational circuit optimization for power dissipation reduction has been developed. The procedure can be included in a design flow, after technology mapping. Results of the power estimation received for some benchmark circuits are much closer to SPICE simulations than values obtained for other methods. So the model proposed in this study improves the estimation accuracy. Additionally, we can save several percent of the consumed energy.     

A nature-inspired firefly algorithm based approach for nanoscale leakage optimal RTL structure

Optimization of leakage power is essential for nanoscale CMOS (nano-CMOS) technology based integrated circuits for numerous reasons, including improving battery life of the system in which they are used as well as enhancing reliability. Leakage optimization at an early stage of the design cycle such as the register-transfer level (RTL) or architectural level provides more degrees of freedom to design engineers and ensures that the design is optimized at higher levels before proceeding to the next and more detailed phases of the design cycle. In this paper, an RTL optimization approach is presented that targets leakage-power optimization while performing simultaneous scheduling, allocation and binding. The optimization approach uses a nature-inspired firefly algorithm so that large digital integrated circuits can be effectively handled without convergence issues. The firefly algorithm optimizes the cost of leakage delay product (LDP) under various resource constraints. As a specific example, gate-oxide leakage is optimized using a 45 nm CMOS dual-oxide based pre-characterized datapath library. Experimental results over various architectural level benchmark integrated circuits show that average leakage optimization of 90% can be obtained. For a comparative perspective, an integer linear programming (ILP) based algorithm is also presented and it is observed that the firefly algorithm is as accurate as ILP while converging much faster. To the best of the authors׳ knowledge, this is the first ever paper that applies firefly based algorithms for RTL optimization.     

静态存储器保持状态下几种不同漏电流压制技术的漏电流拆分式分析

SRAM standby leakage reduction plays a pivotal role in minimizing the power consumption of application processors.Generally,four kinds of techniques are often utilized for SRAM standby leakage reduction: V_dd lowering（VDDL）,V_ss rising（VSSR）,BL floating（BLF） and reversing body bias（RBB）.In this paper,we comprehensively analyze and compare the reduction effects of these techniques on different kinds of leakage.It is disclosed that the performance of these techniques depends on the leakage composition of the SRAM cell and temperature.This has been verified on a 65 nm SRAM test macro.     

Impact of technology scaling on leakage power in nano-scale bulk CMOS digital standard cells

Leakage estimation is an important step in nano-scale technology digital design flows. While reliable data exist on leakage trends with bulk CMOS technology scaling in stand-alone devices and circuits, there is a lack of public domain results on the effect of scaling on leakage power consumption for a complete standard cell set. We present an analysis on a standard cell library applying a logic-level estimation model, supported by SPICE BSIM4 comparison. The logic-level model speedup over SPICE is >10³ with average accuracy below 1% error. We therefore explore the effects of scaling on the whole standard cell set with respect to different leakage mechanisms (sub-threshold, body, gate) and to input pattern dependence. While body leakage appears to be dominant, sub-threshold leakage is expected to increase more than other components with scaling. Detailed data of the whole analysis are reported for use in further research on leakage aware digital design.     

Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits

High leakage current in deep-submicrometer regimes is becoming a significant contributor to power dissipation of CMOS circuits as threshold voltage, channel length, and gate oxide thickness are reduced. Consequently, the identification and modeling of different leakage components is very important for estimation and reduction of leakage power, especially for low-power applications. This paper reviews various transistor intrinsic leakage mechanisms, including weak inversion, drain-induced barrier lowering, gate-induced drain leakage, and gate oxide tunneling. Channel engineering techniques including retrograde well and halo doping are explained as means to manage short-channel effects for continuous scaling of CMOS devices. Finally, the paper explores different circuit techniques to reduce the leakage power consumption.     

辐照诱发CMOS电路器件间漏电流的理论研究

应用解析分析和TCAD器件模拟研究了CMOS电路中由辐照诱发的器件间漏电流问题。以往报道中对于场氧化层中陷阱电荷沉积进而导致寄生漏电流通道开启的物理过程存在若干不同观点,本文中针对这些矛盾点入手,在理论分析中考虑电场强度、氧化层厚度和掺杂浓度随深度的变化,而不仅仅是针对单一变量进行分析。在所有可能的器件间漏电流通道中,以N型阱作为漏区和源区的寄生结构在源漏间存在电压差时相对其他寄生结构对总剂量效应更敏感。但考虑到电路实际工作中N阱区通常接相同电源电平,所以该类寄生结构不会恶化实际CMOS电路的总剂量效应敏感性。总的来说,存在于实际电路中、并且在实际工作中仍然需要考虑的器件间漏电流通道对总剂量效应并不十分敏感（< pA）。     

一种新的低功耗CMOS三值电路设计

提出一种新的静态电压型CMOS三值电路设计方案.该方案具有电路结构规则,输入信号负载对称等特点,是一种具有互补输入-输出的双轨三值逻辑电路.由于电路中同时采用pMOS和nMOS两种传输管,从而保证了输出信号具有完整的逻辑摆幅和高噪声容限.尤为重要的是该设计方案是基于标准CMOS工艺而无需修改阈值电压,且结构较简单.采用0.25μm CMOS工艺参数及3V电源的计算机模拟结果同时表明所提出的电路设计具有高速及低功耗的特点.     

基于GSAA算法的组合电路最大功耗估计方法

最大功耗估计问题是一个NP难题。提出的方法利用遗传模拟退火算法(GSAA)在整个解空间快速搜索问题的最优解，实现组合电路最大功耗的快速、精确估计。仿真结果表明，提出的方法比基于遗传算法(GA)的估计方法在估算精度和收敛速度上都有提高，适合于大规模组合电路最大功耗的估计。     

A comparative study on gate leakage and performance of high-𝛋 nano-CMOS logic gates

This paper provides a novel attempt to evaluate the gate leakage and delay characteristics of CMOS transistors and logic gates with various alternative high-κ gate dielectrics, which are replacing SiO₂ in traditional nanoscale MOSFETs. Results have been obtained for both fixed as well as variable loads. The assumption that all gates drive the same load is considered in order to provide a fair comparison of the effect of the variation of design and process parameters, especially that of different high-κ dielectrics on the gate direct tunnelling current and propagation delay. On the other hand, the variable loading effect considers a set of practical loading conditions for the logic gates. An exhaustive comparison of all cases finally presents concluding evidence that the tunnelling current is independent of the loading conditions. On the other hand, there is an increase in the delay as the dielectric constant of the gate material, and consequently the load on the device, increases. Ultimately, this paper presents fast and accurate models for on-the-fly calculation of tunnelling current and delay with the aim of integrating them into design automation tools.