A method for partitioning applications in hybrid reconfigurable architectures

In this paper, we propose a methodology for accelerating application segments by partitioning them between reconfigurable hardware blocks of different granularity. Critical parts are speeded-up on the coarse-grain reconfigurable hardware for meeting the timing requirements of application code mapped on the reconfigurable logic. The reconfigurable processing units are embedded in a generic hybrid system architecture which can model a large number of existing heterogeneous reconfigurable platforms. The fine-grain reconfigurable logic is realized by an FPGA unit, while the coarse-grain reconfigurable hardware by our developed high-performance data-path. The methodology mainly consists of three stages; the analysis, the mapping of the application parts onto fine and coarse-grain reconfigurable hardware, and the partitioning engine. A prototype software framework realizes the partitioning flow. In this work, the methodology is validated using five real-life applications. Analytical partitioning experiments show that the speedup relative to the all-FPGA mapping solution ranges from 1.5 to 4.0, while the specified timing constraints are satisfied for all the applications.     

Designing coarse-grain reconfigurable architectures by inlining flexibility into custom arithmetic data-paths

This paper introduces a design technique for coarse-grained reconfigurable architectures targeting digital signal processing (DSP) applications. The design procedure is analyzed in detail and an area-time-power efficient reconfigurable kernel architecture is presented. The proposed technique inlines flexibility into custom carry-save (CS) arithmetic datapaths exploiting a stable and canonical interconnection scheme. The canonical interconnection is revealed by a transformation, called uniformity transformation, imposed on the basic architectures of CS-multipliers and CS-chain-adders/subtractors. Experimental results including quantitative and qualitative comparisons with existing reconfigurable arithmetic cores and exploration results of the proposed reconfigurable architecture are provided.     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Nanoimprint Lithography -A Next Generation High Volume Lithography Technique

IntroductionNanoimprint Lithography is a well-acknowl-edged low cost, high resolution, large area pattern-ing process. It includes the most promising methods,high-pressure hot embossing lithography (HEL) [2],UV-cured imprinting (UV-NIL) [3] and micro contactprinting (m-CP, MCP) [4]. Curing of the imprintedstructures is either done by subsequent UV-lightexposure in the case of UV-NIL or by cooling downbelow the glass transition temperature of the ther-moplastic material in case of HEL…     

Influence of PVK ： NPB hole transporting layer on the characteristics of organic light-emitting devices

A doping system consisting of NPB and PVK is employed as a composite hole transporting layer （CHTL）. By adjusting the component ratio of the doping system, a series of devices with different concentration proportion of PVK ： NPB are constracted. The result shows that doping concentration of NPB enhances the competence of hole transporting ability, and modifies the recombination region of charge as well as affects the surface morphology of doped film. Optimum device with a maximum brightness of 7852 cd/m^2 and a power efficiency of 1.75 lm/W has been obtained by choosing a concentration proportion of PVK ： NPB at 1：3.     

Preparation and Characterization of TaN ALD Precursors

High purity organic-tantalum precursors for thin film ALD TaN were synthesized and characterized.Vapor pressure and thermal stability of these precursors were studied.From the vapor pressure analysis,it was found that TBTEMT has a higher vapor pressure than any other published liquid TaN precursor,including TBTDET,TAITMATA,and IPTDET.Thermal stability of the alkyl groups on the precursors was investigated using a 1H NMR technique.The results indicated that the tertbutylimino group is the most stable group on TBTDET and TBTEMT as compared to the dialkylamido groups.Thermal stability of TaN precursors decreased in the following order:TBTDET ＞ PDMAT ＞ TBTEMT.In conclusion,precursor vapor pressure and thermal stability were tuned by making slight variations in the ligand sphere around the metal center.