双层膜椭偏数据处理的新算法

为了准确测量双层透明膜,有效地结合了模拟退火法和单纯形法的优点,提出一种模拟退火-单纯形混合算法来处理双层透明膜的椭偏数据。在单波长测量时,仅测量1组椭偏参量,可以求解双层透明膜任意两个参量;测量两组以上椭偏参量,可以同时反演双层透明膜4个参量,求解薄膜折射率和厚度精度分别达到0.0002和0.07nm。结果表明,模拟退火-单纯形混合算法反演双层透明膜参量是可行和可靠的,且有较强的样品适应性。该算法适合于单波长椭偏仪对双层及多层膜的反演及实际测量。     

Effects of the ZnO buffer layer and Al proportion on AZO film properties

To evaluate the influence of the ZnO buffer layer and Al proportion on the properties of ZnO: Al (AZO)/ZnO bi-layer films, a series of AZO/ZnO films are deposited on the quartz substrates by electron beam evaporation. The X-ray diffraction measurement shows that the crystal quality of the films is improved with the increase of the film thickness. The electrical properties of the films are investigated. The carrier concentration and Hall mobility both increase with the increase of buffer layer thickness. However, the resistivity reaches the lowest at about 50 nm-thick buffer layer. The lowest resistivity and the maximum Hall mobility are both obtained at 1 wt% Al concentration. But the optical transmittance of all the films is greater than 80% regardless of the buffer layer thickness with Al concentration lower than 5 wt% in the visible region.     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明: 相比直接在Al2O3衬底上生长的GaN薄膜, 通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差, 但表面较平整; 而且随着AlN缓冲层厚度的增加, GaN薄膜的晶体质量和表面平整度均逐渐提高。可见, AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

AlN缓冲层厚度对脉冲激光沉积技术生长的GaN薄膜性能的影响

在蓝宝石(Al2O3)衬底上应用脉冲激光沉积技术(PLD)生长不同厚度的AlN缓冲层后进行GaN薄膜外延生长。采用高分辨X射线衍射仪(HRXRD)和扫描电子显微镜(SEM)对外延生长所得GaN薄膜的晶体质量和表面形貌进行了表征。测试结果表明:相比直接在Al2O3衬底上生长的GaN薄膜,通过生长AlN缓冲层的GaN薄膜虽然晶体质量较差,但表面较平整;而且随着AlN缓冲层厚度的增加,GaN薄膜的晶体质量和表面平整度均逐渐提高。可见,AlN缓冲层厚度对在Al2O3衬底上外延生长GaN薄膜的晶体质量和表面形貌有着重要的影响。     

TiO_2过渡层对Bi_(3.54)Nd_(0.46)Ti_3O_(12)薄膜微观结构及电性能的影响

选取厚度为5、10和20nm的TiO2薄膜为过渡层,采用sol-gel法在Pt/Ti/SiO2/Si衬底上制备了Bi3.54Nd0.46Ti3O12(BNT)铁电薄膜,研究了过渡层厚度对铁电薄膜微观结构及电学性质的影响。结果表明,加入TiO2过渡层后,BNT薄膜微观结构得到改善,εr及2Pr值大幅提高,介电损耗及漏电流密度都有降低。过渡层厚度为20nm时,BNT薄膜的εr、tanδ及2Pr值分别为325、0.025(测试频率为10kHz)和36.1×10–6C/cm2,漏电流密度为8.45×10–7A/cm2(外加电场为100×103V/cm)。     

A new buffer layer for MOCVD growth of GaN on sapphire

High quality GaN films have been grown on sapphire substrates (C face and A face) by atmospheric pressure metalorganic chemical vapor deposition (MOCVD) using a new buffer layer. With our reactor configuration and growth parameters, a GaN film grown on a single GaN buffer layer appears opaque with high density of hexagonal pits. Using a single A1N buffer layer results in extremely nonuniform morphology with mirror-like areas near the edge of the substrates and opaque areas in the center. The double buffer layer we report here, with GaN as the first layer and A1N as the second, each with an optimized thickness, leads to mirror-like films across the entire substrate. Scanning electron microscopy, photoluminescence, x-ray diffraction, and van der Pauw geometry Hall measurement data are presented to establish the quality of our films. The mechanism for this new buffer layer is also discussed.     

Recrystallization of silicon-on-sapphire structures at various amorphization-ion-beam energies

Silicon films on sapphire substrates are grown via recrystallization from the silicon-sapphire interface. An amorphous layer is formed using ion implantation with silicon ion energies of 90–150 keV. An X-ray rocking curve is used to estimate the crystalline perfection of the silicon films. After recrystallization, the silicon layer consists of two parts with different crystalline quality. The recrystallized silicon-on-sapphire structures have a highly perfect upper layer (for fabricating microelectronic devices) and a lower layer adjacent to the sapphire substrate containing a large number of defects.     

High-Performance barium titanate capacitors with double layer structure

High-performance barium titanate (B_aTiO₃) capacitors with excellent electrical and dielectric properties have been made by a two step deposition scheme using reactive rf magnetron sputtering. A novel double layer structure has been developed to reduce the pinholes and improve the electrical properties, such as higher dielectric constant, lower dissipation factor, higher breakdown fields and low leakage currents. Films deposited on a cooled substrate are amorphous whereas those deposited on a heated substrate are poly crystalline. Both polycrystalline and amorphous natures are verified by x-ray diffraction and scanning electron microscopy. Amorphous films have a low leakage current, a high breakdown voltage up to 2.5 x 10⁶ V/cm, and a dielectric constant less than 20. Polycrystalline films yield a high dielectric constant of 330. However, these films also have large leakage currents. The capacitors with the two layer structures,i.e. amorphous layer on top of polycrystal layer, have been shown to be much superior to those prepared by either polycrystal or amorphous layer alone for practical applications. The dielectric constant and breakdown voltage of capacitors with a double layer are found to be as high as 220 and 1.2 x 10⁶ V/cm, respectively. The leakage current is reduced to the same order as the amorphous films alone.     

Oxidative Inorganic Multilayers for Polypyrrole Film Generation

A controlled nanoscale fabrication of conducting polymer films sets severe requirements for the preparation method and substrate. A new and versatile approach for producing thin polypyrrole films on a variety of surfaces is presented. Purely inorganic thin films are first prepared from poly(metaphosphate) and tetravalent metal ions using a sequential layer‐by‐layer technique. Redox‐active cerium(IV) polyphosphate multilayer and redox‐inactive zirconium(IV) and hafnium(IV) polyphosphate multilayers are prepared. Cerium‐based polyphosphate films grow exponentially with the number of layers but multilayers containing zirconium or hafnium exhibit a linear buildup process. All the studied systems produce relatively smooth films with initial bilayer thickness less than 2 nm. The cerium(IV) containing film is redox‐active, which is shown by its capability to form a polypyrrole layer on its surface by oxidation of pyrrole monomers in the adjacent aqueous solution. This is a general method to produce thin oxidative films of arbitrary size and form on a wide variety of surfaces.     

层状钙钛矿型Bi_(3.15)Nd_(0.85)Ti_3O_(12)铁电薄膜在LaNiO_3/Si上取向生长的TEM研究

用溶胶-凝胶工艺在披覆了LaNiO3底电极的(100)Si衬底上制备了Bi3.15Nd0.85Ti3O12(BNdT)铁电薄膜.X射线衍射结果显示,LaNiO3层呈(110)择优取向,BNdT薄膜呈c轴和a/b轴混合择优取向.透射电镜观察表明,LaNiO3电极层和BNdT薄膜厚度分别约为180 nm和320 nm.BNdT薄膜分为上下两层,厚约100 nm的底层以薄片状c轴择优取向晶粒为主,在顶层许多柱状晶粒为a/b轴择优取向.讨论了BNdT薄膜在(110)LaNiO3电极上的择优取向生长机制.     

Optically Transparent Antibacterial Films Capable of Healing Multiple Scratches

Optically transparent antibacterial films capable of healing scratches and restoring transparency are fabricated by exponential layer‐by‐layer assembly of branched polyethylenimine (bPEI)/poly(acrylic acid) (PAA) films and post‐diffusion of cetyltrimethylammonium bromide micelles encapsulated with antibacterial agent triclosan. The triclosan‐loaded bPEI/PAA transparent films can effectively inhibit the growth of gram‐positive and gram‐negative bacteria by the sustained release of triclosan molecules. Healing of multiple scratches on the triclosan‐loaded bPEI/PAA films can be conveniently achieved by immersing the films in water or spraying water on the damaged films, which also fully restores their transparency. The self‐healing ability of these transparent antibacterial films originates from the ability of bPEI and PAA to flow and recombine in the presence of water. The triclosan‐loaded bPEI/PAA films have satisfactory mechanical stability under ambient conditions, and thus show potential for application as transparent protective films with antibacterial properties.     

缓冲层厚度对透明导电薄膜ZnO:Zr性能的影响

利用直流磁控溅射法在有ZnO:Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO:Zr透明导电薄膜,缓冲层的厚度介于35～208 nm.利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO:Zr薄膜的结构、形貌、电光性能.结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性.当缓冲层厚度从35 nm增加到103 nm时,薄膜的颗粒尺寸增大,电阻率减小.而当缓冲层厚度从103 nm增加到208 nm时,薄膜的颗粒尺寸减小,电阻率增大.当缓冲厚度为103 nm时,薄膜的电阻率最小为2.96×10-3 Ω·cm,远小于没有缓冲层时的12.9×10-3 Ω·cm.实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO:Zr薄膜质量的一种有效方法.     

磁控溅射Ge/Si多层膜X射线低角衍射界面结构分析

本文对磁控溅射不同结构的Ｇｅ／Ｓｉ多层膜样品进行了Ｘ射线衍射的测试和分析,并进一步采用有过渡层的光学多层膜衍射模型对衍射谱进行了拟合;获得了扩散层厚度和分层厚度等多层膜的结构参数,定性讨论了多层膜中互扩散与分层厚度铁关系。计算结果与实验结果符合较好。     

(Bi,Pb)2Sr2CaCu2O8薄膜的激光感生电压效应

采用紫外脉冲激光沉积技术和高低温沉积工艺,在LaAlO3(100)平衬底及倾斜衬底上成功制备了c轴取向的(Bi,Pb)2Sr2CaCu2O8[(Bi,Pb)-2212]薄膜;研究了在倾斜LaAlO3(100)单晶衬底上生长的(Bi,Pb)-2212薄膜激光感生热电电压信号与沉积条件及入射激光能量的关系。为避免(Bi,Pb)-2212薄膜被激光剥蚀或蒸发,还初步研究了MgO保护层对(Bi,Pb)-2212薄膜激光感生电压信号的作用,结果表明MgO层能够显著增强激光感生热电电压效应。     

Silver nanowire/polymer composite soft conductive film fabricated by large-area compatible coating for flexible pressure sensor array

Soft conductive films composed of a silver nanowire (AgNW) network,a neutral-pH PEDOT:PSS overcoating layer and a polydimethylsiloxane (PDMS) elastomer substrate are fabricated by large area compatible coating processes.The neutral-pH PEDOT:PSS layer is shown to be able to significantly improve the conductivity,stretchability and air stability of the conductive films.The soft conductive films are patterned using a simple maskless patterning approach to fabricate an 8 × 8 flexible pressure sensor array.It is shown that such soft conductive films can help to improve the sensitivity and reduce the signal crosstalk over the pressure sensor array.     

外延GaN基薄膜表面应变演变RHEED分析

介绍了反射式高能电子衍射仪(RHEED)衍射原理以及半导体薄膜表面原子间距与其衍射图像间距成反比例关系。分析了采用ECR-PEMOCVD生长技术,在α-Al2O3衬底上低温外延GaN基薄膜(氮化层、缓冲层、外延层)工艺过程。通过对RHEED图像分析软件获取不同工艺过程中的外延薄膜衍射条纹间距的数据分析、计算、比较,得到薄膜表面衍射图像间距的大小,依据RHEED衍射图像与原子面间距之间的对应关系,分析薄膜表面的应变状态演变情况。分析计算结果表明生长20min氮化层、20min缓冲层的表面原子层处于压应变状态,而生长180min的AlN外延层,表面则处于完全弛豫状态。     

MgO缓冲层对Si衬底上制备Fe3Si薄膜性能的影响

采用磁控溅射方法和热加工工艺在n型Si衬底上溅射不同厚度的MgO层并制备Fe-Si薄膜层,退火后形成Fe3Si/MgO/Si多层膜结构.利用MgO缓冲层对退火时Si衬底扩散原子进行屏蔽,并分析MgO层对Fe3Si薄膜结构和电学性质的影响.通过X射线衍射仪(XRD)、扫描电子显微镜(SEM)和四探针测试仪对Fe3Si薄膜的晶体结构、表面形貌、断面形貌和电阻率进行表征与分析.研究结果表明:当MgO层厚度为20 nm时生成Fe0.9Si0.1薄膜,当厚度为50,100,150和200 nm时都生成了Fe3Si薄膜,生成的Fe3Si和Fe0.9Si0.1薄膜以(110)和(211)取向为主.随MgO缓冲层厚度增加,Si衬底扩散原子对Fe3Si薄膜的影响减小,Fe3 Si薄膜的晶格常数逐渐减小,晶粒大小趋向均匀,平均电阻率呈现先增大后减小趋势.研究结果为后续基于Fe3 Si薄膜的器件设计与制备提供了参考.     

HfO2薄膜折射率非均质性生长特性研究

在加热的BK7基板上,采用电子束蒸发(EB)工艺制备了一系列不同厚度的HfO2单层膜,对HfO2薄膜生长过程中的折射率非均质性进行了研究。光谱分析表明薄膜非均质性与其厚度息息相关。X射线衍射(XRD)测试表明不同非均质性薄膜对应不同的微观结构;薄膜的微观结构主要由薄膜的生长机制决定。当膜厚较薄时,薄膜不易结晶,呈无定形态,此时薄膜呈正非均质性。如果沉积温度足够高,则薄膜达到一定厚度后开始结晶,此后薄膜折射率就会逐渐下降。随着薄膜继续生长,薄膜晶态结构保持恒定不再变化,非均质性也会因此保持不变达到极值。     

直流磁控溅射法制备本征ZnO薄膜及光伏应用研究

采用直流磁控溅射法制备了ZnO薄膜,研究了沉积过程中变换氧分压对薄膜光电性能的影响.采用XRD、紫外可见光分光光度计及AFM等方法对薄膜的结构和光电性质进行了表征.结果表明,ZnO薄膜在可见光范围内的透过率可达88％,并且随着氧分压的增大,薄膜的透过率也增大;制备出的ZnO薄膜表面粗糙度为0.41 nm.在glass/ITO/CdS/CdTe结构的太阳电池中,将本征ZnO薄膜作为高阻层加入到ITO与CdS之间,电池的开路电压和填充因子有明显的提高,加入高阻层之后,电池的转换效率最高可达13.6％.     

Layer‐Controlled and Wafer‐Scale Synthesis of Uniform and High‐Quality Graphene Films on a Polycrystalline Nickel Catalyst

Chemical vapor deposition (CVD) provides a synthesis route for large‐area and high‐quality graphene films. However, layer‐controlled synthesis remains a great challenge on polycrystalline metallic films. Here, a facile and viable synthesis of layer‐controlled and high‐quality graphene films on wafer‐scale Ni surface by the sequentially separated steps of gas carburization, hydrogen exposure, and segregation is developed. The layer numbers of graphene films with large domain sizes are controlled precisely at ambient pressure by modulating the simplified CVD process conditions and hydrogen exposure. The hydrogen exposure assisted with a Ni catalyst plays a critical role in promoting the preferential segregation through removing the carbon layers on the Ni surface and reducing carbon content in the Ni. Excellent electrical and transparent conductive performance, with a room‐temperature mobility of ≈3000 cm² V^?1 s^?1 and a sheet resistance as low as ≈100 Ω per square at ≈90% transmittance, of the twisted few‐layer grapheme films grown on the Ni catalyst is demonstrated.