Standby power consumption estimation by interacting leakage current mechanisms in nanoscaled CMOS digital circuits

Leakage currents are gaining importance as design parameters in nanometer CMOS technologies. A novel leakage current estimation method, which takes into account the dependency of leakage mechanisms, is proposed for general CMOS complex gates, including non-series-parallel transistor arrangements, not covered by existing approaches. The main contribution of this work is a fast, accurate, and systematic procedure to determine the potentials at transistor network nodes for calculating standby static currents. The proposed method has been validated through electrical simulations, showing an error smaller than 7% and an 80× speed-up when comparing to electrical simulation.     

INDEP approach for leakage reduction in nanoscale CMOS circuits

Complementary metal oxide semiconductor (CMOS) technology scaling for improving speed and functionality turns leakage power one of the major concerns for nanoscale circuits design. The minimization of leakage power is a rising challenge for the design of the existing and future nanoscale CMOS circuits. This paper presents a novel, input-dependent, transistor-level, low leakage and reliable INput DEPendent (INDEP) approach for nanoscale CMOS circuits. INDEP approach is based on Boolean logic calculations for the input signals of the extra inserted transistors within the logic circuit. The gate terminals of extra inserted transistors depend on the primary input combinations of the logic circuits. The appropriate selection of input gate voltages of INDEP transistors are reducing the leakage current efficiently along with rail to rail output voltage swing. The important characteristic of INDEP approach is that it works well in both active as well as standby modes of the circuits. This approach overcomes the limitations created by the prevalent current leakage reduction techniques. The simulation results indicate that INDEP approach mitigates 41.6% and 35% leakage power for 1-bit full adder and ISCAS-85 c17 benchmark circuit, respectively, at 32 nm bulk CMOS technology node.     

一种新的低功耗CMOS三值电路设计

提出一种新的静态电压型CMOS三值电路设计方案.该方案具有电路结构规则,输入信号负载对称等特点,是一种具有互补输入-输出的双轨三值逻辑电路.由于电路中同时采用pMOS和nMOS两种传输管,从而保证了输出信号具有完整的逻辑摆幅和高噪声容限.尤为重要的是该设计方案是基于标准CMOS工艺而无需修改阈值电压,且结构较简单.采用0.25μm CMOS工艺参数及3V电源的计算机模拟结果同时表明所提出的电路设计具有高速及低功耗的特点.     

Impact of technology scaling on leakage power in nano-scale bulk CMOS digital standard cells

Leakage estimation is an important step in nano-scale technology digital design flows. While reliable data exist on leakage trends with bulk CMOS technology scaling in stand-alone devices and circuits, there is a lack of public domain results on the effect of scaling on leakage power consumption for a complete standard cell set. We present an analysis on a standard cell library applying a logic-level estimation model, supported by SPICE BSIM4 comparison. The logic-level model speedup over SPICE is >10³ with average accuracy below 1% error. We therefore explore the effects of scaling on the whole standard cell set with respect to different leakage mechanisms (sub-threshold, body, gate) and to input pattern dependence. While body leakage appears to be dominant, sub-threshold leakage is expected to increase more than other components with scaling. Detailed data of the whole analysis are reported for use in further research on leakage aware digital design.     

Introduction of a new technique for simultaneous reduction of the delay and leakage current in digital circuits

By the reduction in the size of transistors and the development of submicron technology, as well as the construction of more integrated circuits on chips, leakage power has become one of the main concerns of electronic circuit designers. In this article, we first review techniques presented in recent years to reduce leakage power and then present a new technique based on the gate-level body biasing technique and the multi-threshold CMOS technique to minimize leakage power in digital circuits. Afterward, we develop another new method by improving the first proposed technique to achieve higher efficiency and simultaneously reduce leakage power and propagation delay in digital circuits. In the proposed technique, we use two dynamic threshold MOSFET transistors to reduce leakage current. In this paper, the body biasing generator structure is applied to reduce propagation delay. The proposed technique has been successfully validated and verified by post-layout simulation with Cadence Virtuoso based on the 32 nm process technology.We evaluate the efficiency of the proposed techniques by examining factors including power, delay, area, and the power delay product. The simulation results using HSPICE software and performance analysis to process corner variations based on the 32 nm process technology show that the proposed technique, in addition to having proper performance in different corners of the technology, significantly reduces leakage power and propagation delay in logic CMOS circuits. In general, the proposed technique has a very successful performance compared to previous techniques.     

TRANSIENT CHARACTERISTIC ANALYSIS OF HIGH TEMPERATURE CMOS DIGITAL INTEGRATED CIRCUITS

This paper analyses the transient characteristics of high temperature CMOS inverters and gate circuits, and gives the computational formulas of their rise time, fall time and delay time. It may be concluded that the transient characteristics of CMOS inverters and gate circuits deteriorate due to the reduction of carrier mobilities and threshold voltages of MOS transistors and the increase of leakage currents of MOS transistors drain terminal pn junctions. The calculation results can explain the experimental phenomenon.     

An ultra-low-power CMOS voltage reference generator based on body bias technique

A CMOS voltage reference, based on body bias technique, has been proposed and simulated using SMIC 0.18 μm CMOS technology in this paper. The proposed circuit can achieve a temperature coefficient of 19.4 ppm/°C in a temperature range from −20 °C to 80 °C, and a line sensitivity of 0.024 mV/V in a supply voltage range from 0.85 V to 2.5 V, without the use of resistors and any other special devices such as thick gate oxides MOSFETs with higher threshold voltage. The supply current at the maximum supply voltage and at 27 °C is 214 nA. The power supply rejection ratio without any filtering capacitor at 10 Hz and 10 kHz are −88.2 dB and −36 dB, respectively.     

Low power high gain CMOS LNA based on inverter cell and self-body bias for UWB receivers

A low-power low-noise amplifier (LNA) utilized a resistive inverter configuration feedback amplifier to achieve the broadband input matching purposes. To achieve low power consumption and high gain, the proposed LNA utilizes a current-reused technique and a splitting-load inductive peaking technique of a resistive-feedback inverter for input matching. Two wideband LNAs are implemented by TSMC 0.18 μm CMOS technology. The first LNA operates at 2–6 GHz. The minimum noise figure is 3.6 dB. The amplifier provides a maximum gain (S₂₁) of 18.5 dB while drawing 10.3 mW from a 1.5-V supply. This chip area is 1.028×0.921 mm². The second LNA operates at 3.1–10.6 GHz. By using self-forward body bias, it can reduce supply voltage as well as save bias current. The minimum noise figure is 4.8 dB. The amplifier provides a maximum gain (S₂₁) of 17.8 dB while drawing 9.67 mW from a 1.2-V supply. This chip area is 1.274×0.771 mm².     

基于GSAA算法的组合电路最大功耗估计方法

最大功耗估计问题是一个NP难题。提出的方法利用遗传模拟退火算法(GSAA)在整个解空间快速搜索问题的最优解，实现组合电路最大功耗的快速、精确估计。仿真结果表明，提出的方法比基于遗传算法(GA)的估计方法在估算精度和收敛速度上都有提高，适合于大规模组合电路最大功耗的估计。     

High performance low power CMOS dynamic logic for arithmetic circuits

This paper presents the design of high performance and low power arithmetic circuits using a new CMOS dynamic logic family, and analyzes its sensitivity against technology parameters for practical applications. The proposed dynamic logic family allows for a partial evaluation in a computational block before its input signals are valid, and quickly performs a final evaluation as soon as the inputs arrive. The proposed dynamic logic family is well suited to arithmetic circuits where the critical path is made of a large cascade of inverting gates. Furthermore, circuits based on the proposed concept perform better in high fanout and high switching frequencies due to both lower delay and dynamic power consumption. Experimental results, for practical circuits, demonstrate that low power feature of the propose dynamic logic provides for smaller propagation time delay (3.5 times), lower energy consumption (55%), and similar combined delay, power consumption and active area product (only 8% higher), while exhibiting lower sensitivity to power supply, temperature, capacitive load and process variations than the dynamic domino CMOS technologies.     

A reliable ground bounce noise reduction technique for nanoscale CMOS circuits

Power gating is the most effective method to reduce the standby leakage power by adding header/footer high-V_TH sleep transistors between actual and virtual power/ground rails. When a power gating circuit transitions from sleep mode to active mode, a large instantaneous charge current flows through the sleep transistors. Ground bounce noise (GBN) is the high voltage fluctuation on real ground rail during sleep mode to active mode transitions of power gating circuits. GBN disturbs the logic states of internal nodes of circuits. A novel and reliable power gating structure is proposed in this article to reduce the problem of GBN. The proposed structure contains low-V_TH transistors in place of high-V_TH footer. The proposed power gating structure not only reduces the GBN but also improves other performance metrics. A large mitigation of leakage power in both modes eliminates the need of high-V_TH transistors. A comprehensive and comparative evaluation of proposed technique is presented in this article for a chain of 5-CMOS inverters. The simulation results are compared to other well-known GBN reduction circuit techniques at 22 nm predictive technology model (PTM) bulk CMOS model using HSPICE tool. Robustness against process, voltage and temperature (PVT) variations is estimated through Monte-Carlo simulations.     

A new approach to power estimation and reduction in CMOS digital circuits

Modelling and optimization of dynamic capacitive power consumption in digital static CMOS circuits, taking into consideration a reason of a gate switching—gate control mode, is discussed in the present paper. The term ‘gate control mode’ means that a number and type of signals applied to input terminals of the gate have an influence on total amount of energy dissipated during a single switching cycle. Moreover, changes of input signals, which keep the gate output in a steady state, can also cause power consumption. Based on this observation, complex reasons of power losses have been considered. In consequence, the authors propose a new model of dynamic power consumption in static CMOS gates. Appropriate parameters’ calculation method for the new model was developed. The gate power model has been extended to logic networks, and consequently a new measure of the circuit activity was proposed. Switching activity, which is commonly used as a traditional measure, characterizes only the number of signal changes at the circuit node, and it is not sufficient for the proposed model. As the power consumption parameters of CMOS are dependent on their control mode, the authors used probability of the node control mode as a new measure of the circuit activity. Based on the proposed model, a procedure of combinational circuit optimization for power dissipation reduction has been developed. The procedure can be included in a design flow, after technology mapping. Results of the power estimation received for some benchmark circuits are much closer to SPICE simulations than values obtained for other methods. So the model proposed in this study improves the estimation accuracy. Additionally, we can save several percent of the consumed energy.     

Design and simulation of an ultra-low power high performance CMOS logic: DMTGDI

An ultra-low power, high speed dual mode CMOS logic family called DMTGDI is introduced. This logic family takes over and improves main characteristics of Gate Diffusion Input (GDI) and Dual Mode Logic (DML). Simulations have been performed in 90 nm CMOS on a single bit full adder. DMTGDI shows 60% performance improvement over conventional DML, and significant reduction of power-delay product (PDP), of about 95% in static mode, and 75% in dynamic mode. Monte Carlo simulations reveal that DMTGDI is more robust under process variation comparing to conventional DML. Post layout simulation demonstrates negligible effect of parasitic elements on performance of the single bit adder.     

A few CMOS transconductors optimized for low power and wide band operation

Maximizing the bandwidth of operation relative to dc power dissipation in complementary metal oxide semiconductor (CMOS) transconductors has been addressed in this article. It is proposed that the ac transconductance-to-dc power dissipation ratio is an appropriate objective function in this case. The general nature of the objective function is examined first. CMOS transconductors with two and four MOS working transistors are analyzed next. For structures of each kind, the ac transconductance-to-dc power dissipation ratio is maximized, and the optimal set of voltage variables is evaluated. For four-MOS structures with differential input signals, it is revealed that the choice of signal phase influences the objective function. The results of theoretical analyses are exhaustively tabulated. Numerical simulations are used to bring out the significance of the analytical expressions. This facilitates a comparison among several transconductors regarding the best possible ac transconductance-to-dc power dissipation ratio. These results are combined with HSPICE simulation results to suggest a few transconductor structures that are optimum with reference to the operation over wide bandwidths with lower power dissipation, high linearity and low harmonic distortion.The research was supported by grant no. N485 awarded to Dr. R. Raut by the Natural Science and Engineering Research Council (NSERC) of Canada.     

Methodology for low power design of on-line testers for digital circuits

This work is concerned with the development of an algorithm for lowering the power consumption of the tester used in digital circuits with on-line testing (OLT) capability. The proposed scheme is generic and flexible in terms of tradeoffs regarding fault coverage and detection latency versus power and area overheads. Most of the works presented in the literature on OLT have emphasised on minimising area overhead and maintaining high fault coverage. However, power, which was mainly a concern for handheld devices, is now a first order impact factor for deep sub-micron designs. Its increased importance for OLT can be realised from the fact that the tester is executed concurrently with the circuit. The proposed technique can handle generic digital circuits with cell count as high as 15,000 and having the order of 2⁵⁰⁰ states. Results for design of on-line fault detectors for various ISCAS89 benchmark circuits are provided. The results illustrate that with marginal impact on performance in terms of coverage and latency, the proposed technique can lower the power and area consumption significantly, compared to traditional approaches.     

Dynamic sleep transistor and body bias for active leakage power control of microprocessors

In order to manage the active power consumption of high-performance digital designs, active leakage control techniques are required to provide significant leakage power savings coupled with fast time constants for entering and exiting idle mode. In this paper, dynamic sleep transistors and body bias are used in conjunction with clock gating to control active leakage for a 32-bit integer execution core in 130-nm CMOS technology. Measurements on pMOS sleep transistor reveal that lowest-leakage state is reached in less than 1 /spl mu/s, resulting in 37/spl times/ reduction in leakage power, while reactivation of block is achieved in less than two clock cycles. PMOS body bias reduces leakage power by 2/spl times/ with no performance penalty, and similar reactivation time. Power measurements at 4 GHz, 1.3 V, 75/spl deg/C demonstrate 8% total power reduction using dynamic body bias and 15% power reduction using a pMOS sleep transistor, for a typical activity profile.     

Logical effort based dynamic power estimation and optimization of static CMOS circuits

This paper introduces a simple and yet accurate closed-form expression to estimate the switching power dissipation of static CMOS gates. The developed model depends on normalizing a gate switching power to that of the unit standard inverter and it accounts for the effect of internodal capacitances. For different loads, gates, sizes and processes, the developed model shows a good agreement with Hspice simulations using BSIM3v3 and BSIM4 models for UMC 0.13 μm and Predictive high-k 45 nm processes, respectively. The average error introduced by the model for the considered scenarios is about 3.1%. Depending on the normalized switching power model, two power optimization techniques have been proposed in this paper. The first deals with transistor sizing problem and presents a scheme to size transistors according to a specific design goal. The second technique relies on the joint transistor sizing and supply voltage scaling for reducing the switching power dissipation under specific delay requirements. This technique exhibits superiority over the first for the considered technology processes: UMC 0.13 μm and the Predictive high-k 45 nm.     

一种新型低功耗CMOS压控振荡器采用电感偏置实现高性能的FoM

A novel voltage-controlled oscillator(VCO) topology with low voltage and low power is presented. It employed the inductive-biasing to build a feedback path between the tank and the MOS gate to enhance the voltage gain from output nodes of the tank to the gate node of the cross-coupled transistor. Theoretical analysis using timevarying phase noise theory derives closed-form symbolic formulas for the 1/f~2 phase noise region, showing that this feedback path could improve the phase noise performance. The proposed VCO is fabricated in TSMC 0.13 m CMOS technology. Working under a 0.3 V supply voltage with 1.2 m W power consumption, the measured phase noise of the VCO is –119.4 d Bc/Hz at 1 MHz offset frequency from the carrier of 4.92 GHz, resulting in an Fo M of 192.5 d Bc/Hz.     

一种全集成高电源抑制比的低压差线性稳压器

This paper presents a capacitor-free CMOS low dropout voltage regulator which has high PSR perfor- mance and low chip area. Pole splitting and gm boosting techniques are employed to achieve good stability. The capacitor-free chip LDO was fabricated in commercial 0.18μm CMOS technology provided by GSMC （Shanghai, China）. Measured results show that the capacitor-free LDO has a stable output voltage 1.79 V, when supply voltage changes from 2.5 to 5 V, and the LDO is capable of driving maximum 100 mA load current. The LDO has high power supply rejection about -79 dB at low frequency and -40 dB at 1 MHz frequency, while sacrifice of the LDO＇s active chip-area is only smaller than 0.02 mm2.     

Threshold voltage mismatch and intra-die leakage current in digital CMOS circuits

Due to device and voltage scaling scenarios for present and future deep-submicron CMOS technologies, it is inevitable that the off-state current (I/sub off/) of MOSFET transistors increases as the technology minimum dimensions scale down. Experimental evidence shows that the leakage current distribution of modern deep-submicron designs not only has a higher mean value but it also presents a larger variability as well. In this paper, we investigate the impact of threshold voltage mismatch as one plausible source for this increased variability. In digital circuit design, it is commonly assumed that the threshold voltage difference (mismatch) of static CMOS cells is negligible. However, threshold voltage mismatch (/spl Delta/V/sub to/) has a two-sided effect on the off-state current. Namely, the total cell's current can increase or decrease depending upon the direction of the V/sub t/ mismatch shift. This effect can be so severe that I/sub off/ can increase by more than one order of magnitude with respect to its nominal value due only to V/sub to/ mismatch. We further show through experimental results that the V/sub to/ mismatch of paired transistors working in the subthreshold regime can be worse by a factor of two as compared to transistors working in the saturation or linear regions. A factor of two larger spread is obviously quite devastating in terms of area, speed, and power consumption, should it be desired to attain the same I/sub off/ level as for a V/sub to/ mismatch characterized out of the subthreshold regime.