Corrosion characteristics of copper microparticles and copper nanoparticles in distilled water

The corrosion characteristics of copper microparticles and copper nanoparticles in distilled water were investigated in this paper. The Cu²⁺ transformations of copper microparticles and copper nanoparticles in distilled water were tested by using absorbance measurement, the structures of their corrosion products were determined by using XRD and TEM techniques. The results of absorbance measurement show that the corrosion characteristics of copper nanoparticles in distilled water are quite different from that of copper microparticles. The Cu²⁺ transformations ratio of copper microparticles increases slowly with the increasing of immersion time and levels off eventually, but the Cu²⁺ transformations ratio of copper nanoparticles increases sharply with the increasing of immersion time and gets to peak rapidly, and then decreases as the immersion time increases and levels off finally. The results of XRD present that they have different corrosion products, the corrosion products of copper microparticles in distilled water are Cu and CuO, but the nanoparticles are Cu, CuO, Cu(OH,Cl)₂ · 2H₂O and Cu₂(CO₃)(OH)₂. All these differences owe to the size effect of copper particles.     

X-ray diffraction phase analysis of crystalline copper corrosion products after treatment in different chloride solutions

The corrosion products Cu₂(OH)₃Cl, Cu₂O, and CuCl₂ were identified on the surface of copper plates after their four days treating in three different sodium chloride, sodium/magnesium, and sodium/calcium chloride solutions using X-ray diffraction powder analysis. However, the quantitative proportions of individual corrosion products differ and depend on the type of chloride solution used. Treating of copper plates only in the sodium chloride solution produced the mixture of corrosion products where Cu₂O is prevailing over the Cu₂(OH)₃Cl and CuCl₂ was not identified. The sample developed after treating of the cooper surface in the sodium/magnesium chloride solution contains Cu₂(OH)₃Cl and CuCl₂ prevailing over the Cu₂O, while the sample developed after treatment of copper in sodium/calcium chloride solution contains Cu₂(OH)₃Cl prevailing over CuCl₂ and Cu₂O was not identified.     

Surface characterization and corrosion behavior of a novel gold-imitation copper alloy with high tarnish resistance in salt spray environment

A novel gold-imitation copper alloy (CuZnAlNiSnBRe) was designed and its corrosion behavior in salt spray environment was investigated. The new alloy has better tarnish resistance and corrosion resistance than the current coinage alloy used in China (H7211). A multi-layer film formed on the surface of the new alloy after a period of exposure to salt spray was responsible for the good resistance of the alloy. The corrosion products were a mixture of CuO, Cu₂O, ZnO, Al₂O₃ and Al(OH)₃, with the transition from Cu₂O to CuO occurring during the corrosion process.     

Surface characterization and corrosion behavior of 70/30 Cu-Ni alloy in pristine and sulfide-containing simulated seawater

The corrosion behavior of the 70/30 Cu-Ni alloy in stagnant, aerated pristine and sulfide-containing simulated seawater as a function of exposure time was investigated with polarization curve measurement and electrochemical impedance spectroscopy (EIS). It was demonstrated that the compact protective oxide film formed on the 70/30 Cu-Ni alloy resulted in the decrease of corrosion rate in aerated pristine seawater; while the corrosion rate of 70/30 Cu-Ni alloy in aerated sulfide-containing seawater increased dramatically due to the catalysis of the sulfide ions or sulfide scale for both the cathodic and anodic reactions. The impedance spectra and the corresponding equivalent circuits confirmed that a duplex layer of a surface film was formed on the 70/30 Cu-Ni alloy in aerated pristine seawater after a period of time and that the inner layer was responsible for the good resistance of the alloy; while only a porous and non-protective corrosion product layer formed on the 70/30 Cu-Ni alloy in aerated sulfide-containing seawater, which made small values of charge transfer resistance (R_ct) to last for a abnormally long time by interfering with the growth of the protective oxide film. The composition of the surface film on the alloy in pristine and sulfide-containing seawater for different exposure times were investigated thoroughly by XPS. It was found that the duplex corrosion product layer formed on the alloy in pristine seawater was composed of an inner Cu₂O and an outer CuO layer. The porous and non-protective corrosion product layer formed on the alloy in aerated sulfide-containing seawater was a mixture of CuCl, Cu₂S, NiS, Cu₂O and NiO with trace amounts of CuO and Ni(OH)₂ and that the most significant component was Cu₂S. In addition, SEM was used to analyze the topography of the 70/30 Cu-Ni alloy in both solutions after different exposure times.     

Mechanistic studies of corrosion product flaking on copper and copper-based alloys in marine environments

The mechanism of corrosion product flaking on bare copper sheet and three copper-based alloys in chloride rich environments has been explored through field and laboratory exposures. The tendency for flaking is much more pronounced on Cu and Cu–4 wt%Sn than on Cu–15 wt%Zn and Cu–5 wt%Al–5 wt%Zn. This difference is explained by the initial formation of zinc and zinc–aluminum hydroxycarbonates on Cu15Zn and Cu5Al5Zn, which delays the formation of CuCl, a precursor of Cu₂(OH)₃Cl. As a result, the observed volume expansion during transformation of CuCl to Cu₂(OH)₃Cl, and concomitant corrosion product flaking, is less severe on Cu15Zn and Cu5Al5Zn than on Cu and Cu4Sn.     

A study of the corrosion products of aluminum brass formed in sodium sulfate solution in the presence of chlorides

The surface film forming on Al brass specimens immersed in stagnant Na₂SO₄ solutions containing chlorides at pH values 3.0–7.25 was examined by using chemical, electrochemical and X-ray techniques. In the absence of chlorides the surface film consists of oxides (CuO, Cu₂O) and cupric basic sulfates Cu₃(SO₄)₂.4H₂O, stable in the whole range of pH; the surface film is quite homogeneous and no dezincification or localized corrosion occurs. In the presence of chlorides, the surface film consists also of cuprous chloride (CuCl) and of cupric [Cu(OH,Cl)₂.2H₂O] and aluminum oxychlorides [Al₄₅O₄₅(OH)₄₅Cl] and aluminum oxides (Al(OH)₃]. The weight of the corrosion products is a maximum in solutions containing 5 × 10⁻³ M NaCl at each pH value. In the most acidic solutions the surface film is physically and chemically extremely unhomogeneous, thus favouring the occurrence of dezincification or localized corrosion phenomena.     

Differential reflectometry of corrosion products of copper

The new technique of differential reflectometry was applied to study some fundamental corrosion processes for copper. Free corrosion in air for one day yielded differential reflectograms characteristic of mixed oxides of Cu₂O and CuO. With increasing time of exposure to air, the reflectograms evolved into typical CuO patterns. Similarly, free corrosion of copper in distilled water yielded mixed oxides of Cu₂O and CuO. Holding copper potentiostatically near the boundary between these two corrosion products as shown on the Pourbaix diagram always yielded at first a mixed oxide which turned into the stable species after several days of polarization. It was further found that copper held potentiostatically first in the CuO region and then in the Cu₂O region of the Pourbaix diagram does not lose the characteristic patterns of CuO. This suggests that the sudden shift in potential induces growth of Cu₂O under the existing CuO layer without dissolving the CuO.     

Cathodic reduction of the duplex oxide films formed on copper in air with high relative humidity at 60 °C

The cathodic reduction of duplex air-formed oxide film on copper was performed at a constant current density of i_c = −50 μA cm⁻² in deaerated 0.1 M KCl solution to investigate the sequence of cathodic reduction of each oxide layer and its mechanism. The single-phase thick CuO film on copper was also cathodically reduced at i_c = −50 μA cm⁻² or −2.5 mA cm⁻². The surface characterizations of the air-formed oxide film and single-phase CuO film before cathodic reduction and after partial or complete cathodic reduction were performed by XPS and X-ray diffraction, respectively.The two plateau regions appeared in the potential vs. time curve during cathodic reduction of the duplex air-formed oxide film on copper, while one plateau region was observed in the potential-time curve during cathodic reduction of the single-phase CuO film on copper. The potential in the first plateau region for the air-formed film coincided with that in the plateau region for the CuO film. The results of XPS and X-ray diffraction suggested that in the first plateau region, the outer CuO layer is directly reduced to metallic Cu, while in the second plateau region, the inner Cu₂O layer is reduced to metallic Cu.     

Influence of the corrosion products of copper on its atmospheric corrosion kinetics in tropical climate

In the present paper, the identification of the corrosion product phases formed on copper under different atmospheres of Cuban tropical climate is reported. Cuprite (Cu₂O), paratacamite (Cu₂Cl(OH)₃), posnjakite (Cu₄SO₄(OH)₆ · 2H₂O) and brochantite (Cu₄SO₄(OH)₆) were the main phases identified by X-ray diffraction (XRD) analysis and Fourier transform infrared spectroscopy (FTIR).Copper corrosion products are known to have a protective effect against corrosion. However, a different behaviour was obtained under sheltered coastal conditions. This can be due to the corrosion products morphology and degree of crystallisation, rather than their phase composition. A higher time of wetness and the accumulation of pollutants not washed away from the metal surface can also play an important role.     

Corrosion of copper and silver plates by volcanic gases

Corrosion products that had been formed on copper and silver plates exposed in Miyake Island, where suffered a volcanic eruption in 2000, were analyzed by X-ray techniques to get better understanding of copper and silver corrosion in harsh environment. The exposure experiment was carried out from September 2004 to April 2005. Many kinds of patina were found on copper such as cuprite (Cu₂O), posnjakite (Cu₄SO₄(OH)₆ · H₂O), brochantite (Cu₄SO₄(OH)₆), antlerite (Cu₃SO₄(OH)₄), and geerite (Cu₈S₅). For silver, silver chloride (AgCl) and silver sulfide (Ag₂S) were formed. Although the volcanic activity had greatly subsided, the atmospheric corrosion of copper and silver plates exposed on Miyake Island was mainly affected by volcanic gases, wet-dry cycles in the environment, and sea-salt aerosols.     

Corrosion mechanism of copper in palm biodiesel

Biodiesel is a promising alternative fuel. However, it causes enhanced corrosion of automotive materials, especially of copper based components. In the present study, corrosion mechanism of copper was investigated by scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS). Compositional change of biodiesel due to the exposure of copper was also investigated. Corrosion patina on copper is found to be composed of Cu₂O, CuO, Cu(OH)₂ and CuCO_3. Dissolved O₂, H₂O, CO₂ and RCOO⁻ radical in biodiesel seem to be the leading factors in enhancing the corrosiveness of biodiesel.     

Effects of copper on the corrosion properties of low-alloy steel in an acid-chloride environment

The influence of Cu addition on the corrosion resistance of low-alloy steel in an acid-chloride solution was investigated by electrochemical methods, such as potentiodynamic polarization tests and an electrochemical impedance spectroscopy (EIS). The XPS analysis of the corroded surfaces indicated the formation of protective Cu₂O and Cu(OH)₂ layers on the surface. The formation of Cu products on the surface reduced the uniform corrosion rate of the steel, but promoted localized corrosion due to the galvanic interaction between the covered areas of copper oxide/hydroxide and the uncovered areas on the surface of steel.     

Corrosion Resistance of Copper Coatings Deposited by Cold Spraying

In the article, a study of corrosion resistance of copper and copper-based cermet (Cu+Al₂O₃ and Cu+SiC) coatings deposited onto aluminum alloy substrate using the low-pressure cold spraying method is presented. The samples were subjected to two different corrosion tests at room temperature: (1) Kesternich test and (2) a cyclic salt spray test. The selected tests were allowed to simulate service conditions typical for urban, industrial and marine environment. Examination of corroded samples included analysis changes on the coating surface and in the microstructure. The physicochemical tests were carried out using x-ray diffraction to define corrosion products. Moreover, microhardness and electrical conductivity measurements were conducted to estimate mechanical and physical properties of the coatings after corrosion tests. XRD analysis clearly showed that regardless of corrosion conditions, for all samples cuprite (Cu₂O) was the main product. However, in the case of Cu+Al₂O₃ cermet coating, chlorine- and sulfate-containing phases such as Cu₂Cl(OH)₃ (paracetamite) and Cu₃(SO₄)(OH)₄ (antlerite) were also recorded. This observation gives better understanding of the lowest microstructure changes observed for Cu+Al₂O₃ coating after the corrosion tests. This is also a justification for the lowest decrease in electrical conductivity registered after the corrosion tests for this coating.     

Research on Cu transformations of Cu and its oxides particles with different sizes in the simulated uterine solution

Cu²⁺ transformations of Cu and its oxides particles with different sizes in the simulated uterine solution were investigated by absorbance measurements. The corrosion intermediate of Cu nanoparticle in the simulated uterine solution was determined by using XRD technique. The results show that the transformation ratio of Cu nanoparticle is remarkably higher than that of Cu microparticle. Moreover, nanoparticles of CuO and Cu₂O can be further transformed into cupric ion with transformation ratio over 90%. The high transformation ratio and the transformation mechanism of nanoparticles are discussed.     

Characterization of corrosion products on chalcographic copper plates after 200 years' exposure to indoor atmospheres

This work studies the characterization of corrosion products formed on six eighteenth century chalcographic copper plates preserved in the National Chalcography Collection in the San Fernando Royal Academy of Fine Arts in Madrid. The experimental methods used were X-ray diffraction analysis (XRDA), Infrared spectroscopy (IRS), Auger electron spectroscopy (AES) and X-ray photoelectron spectroscopy (XPS). The main compounds found were malachite CuCO₃ · Cu(OH)₂, atacamite CuCl₂· 3Cu(OH)₂, nantokite CuCl, tenorite CuO, and cuprite Cu₂O. Cuprite is the main compound found on the smooth areas of chalcographic plates, forming tarnish films. The thickness of the tarnish films is approximately 10–15 Å.     

Evolution of patinas on copper exposed in a suburban area

Copper plates were exposed under sheltered outdoor conditions for up to one year, starting in September 2001 in Musashino City, Tokyo, a suburban area. Following various periods of exposure, the patinas on the plates were characterized to investigate their evolution by using X-ray fluorescence analysis, X-ray diffraction, field emission scanning electron microscopy, and glow discharge optical emission spectroscopy. The difference in the roles of sulfur and chlorine in the early stages of copper patination were identified by analyzing the depth profiles of these two elements. Sulfur was found on top of the patina as cupric sulfates such as posnjakite (Cu₄SO₄(OH)₆ · H₂O) or brochantite (Cu₄SO₄(OH)₆). Brochantite appeared only after 12 months of exposure. In contrast, chlorine was found on the surface after only one month of exposure. It gradually penetrated the patina as the exposure period lengthened, forming copper chloride complexes. Chloride ions accumulated at the patina/copper interface, forming nantokite (CuCl), which promoted corrosion.     

A study of the initial oxidation of copper in 0.1 MPa oxygen and the effect of purity by metallographic methods

To clarify the initial oxidation mechanism of copper, the oxidation was carried out at 400 °C in 0.1 MPa oxygen using 99.9999% (6 N) and 99.5% (2 N) pure specimens. Oxidation of 6 N copper after 60 s showed that the number density of the oxide nuclei varied with the face of copper crystals, while the nucleation occurred preferentially at the grain boundaries. A metallographic examination indicated that the products of initial oxidation consist of both CuO and Cu₂O. CuO is firstly formed as a thin uniform film on the copper surface, and then Cu₂O nucleates and grows beneath the CuO film. This result is different from the conclusion reached in the literature that CuO does not appear until the laterally growing Cu₂O nuclei have covered the whole surface using other methods. In contrast to 6 N copper, nucleation of Cu₂O was much delayed for 2 N copper, though a thin CuO film was similarly formed on 2 N copper surface. Impurities in 2 N copper should be responsible for slow nucleation of Cu₂O and slow growth of nuclei.     

The valence state of copper in anodic films formed on Al-1at.% Cu alloy

During anodising of Al-Cu alloys, copper species are incorporated into the anodic alumina film, where they migrate outward faster than Al³⁺ ions. In the present study of an Al-1at.% Cu alloy, the valence state of the incorporated copper species was investigated by X-ray photoelectron spectroscopy, revealing the presence of Cu²⁺ ions within the amorphous alumina film. However, extended X-ray irradiation led to reduction of units of CuO to Cu₂O, probably due mainly to interactions with electrons from the X-ray window of the instrument and photoelectrons from the specimen. The XPS analysis employed films formed on thin sputtering-deposited alloy/electropolished aluminium specimens. Such an approach enables sufficient concentrations of copper species to be developed in the anodic film for their ready detection.     

Differences between corrosion products formed on copper exposed in Tokyo in summer and winter

We analyzed the copper corrosion products that formed during a month in summer and a month in winter at three sites in Tokyo using several analytical techniques. The X-ray diffraction patterns revealed that cuprite Cu₂O and posnjakite Cu₄SO₄(OH)₆·H₂O formed on copper exposed in summer. By contrast, only cuprite was found in winter exposed copper. The X-ray fluorescence results indicated that the amounts of sulfur and chlorine on the copper plates exposed in summer were much greater than those in winter. This could be explained by the change in particulate sulfate and sea salt concentrations. Depth profiling analysis by Auger electron spectroscopy revealed that the oxide layer formed in summer was thicker than that in winter. This difference in oxide layer thickness could have been due to the differences in temperature, relative humidity, and the amount of sulfur and chlorine on the copper plate.     

Outdoor atmospheric corrosion of copper in Saudi Arabia

Abstract

Copper specimens have been exposed to the action of marine, marine industrial, urban and rural atmospheres of Saudi Arabia. Environmental factors such as average temperature, average relative humidity and deposition rates of atmospheric pollutants (i.e. Cl^- and SO₂) was investigated. By applying the standard ISO 9223, the aggressiveness of the atmospheres corresponding to the different test stations has been determined. Calculations of corrosion rates were made via loss of weight after one, two and three years of exposure and characterisation of the corrosion products formed on samples have been analysed using X-ray diffraction. Three main sequences have been identified on outdoor copper, representing different reaction routes in chloride dominated environments. Many kinds of patina were found on copper specimens such as cuprite (Cu₂ O), atacamite (Cu₂ Cl(OH)₃), paratacamite (Cu₂ (OH)₃Cl), copper amine nitrite hydroxide, gerhardite, copper hydroxide nitrate and copper amine nitrate.