EFFECT OF Ar PRESSURE ON STRUCTURAL AND ELECTRICAL PROPERTIES OF Cu FILMS DEPOSITED ON GLASS BY DC MAGNETRON SPUTTERING

Cu films with thickness of 630-1300nm were deposited on glass substrates without heating by DC magnetron sputtering in pure Ar gas. Ar pressure was controlled to 0.5, 1.0 and 1.5Pa respectively. The target voltage was fixed at 500V but the target current increased from 200 to 1150mA with Ar pressure increasing. X-ray diffrac-tion, scanning electron microscopy and atomic force microscopy were used to observe the structural characterization of the films. The resistivity of the films was measured using four-point probe technique. At all the Ar pressures, the Cu films have mixture crystalline orientations of [111], [200] and [220] in the direction of the film growth. The film deposited at lower pressure shows more [111] orientation while that deposited at higher pressure has more [220] orientation. The amount of larger grains in the film prepared at 0.5Pa Ar pressure is slightly less than that prepared at 1.0Pa and 1.5Pa Ar pressures. The resistivities of the films prepared at three different Ar pressures re     

Study of bactericidal efficiency of magnetron sputtered TiO2 films deposited at varying oxygen partial pressure

TiO₂ thin films have been deposited at different Ar:O₂ gas ratios (20:80,70:30,50:50,and 40:60 in sccm) by rf reactive magnetron sputtering at a constant power of 200 W. The formation of TiO₂ was confirmed by X-ray photoelectron spectroscopy (XPS). The oxygen percentage in the films was found to increase with an increase in oxygen partial pressure during deposition. The oxygen content in the film was estimated from XPS measurement. Band gap of the films was calculated from the UV-Visible transmittance spectra. Increase in oxygen content in the films showed substantial increase in optical band gap from 2.8 eV to 3.78 eV. The Ar:O₂ gas ratio was found to affect the particle size of the films determined by a transmission electron microscope (TEM). The particle size was found to be varying between 10 and 25 nm. The bactericidal efficiency of the deposited films was investigated using Escherichia coli (E. coli) cells under 1 h UV irradiation. The growth of E. coli cells was estimated through the Optical Density measurement by UV-Visible absorbance spectra. The qualitative analysis of the bactericidal efficiency of the deposited films after UV irradiation was observed through SEM. A correlation between the optical band gap, particle size and bactericidal efficiency of the TiO₂ films at different argon:oxygen gas ratio has been studied.     

磁控溅射制备Ni-Mn-Ga磁性形状记忆合金薄膜

本文采用直流磁控溅射的方法，分别在Si、Cu和NaCl基底上沉积了Ni-Mn-Ga薄膜，研究了不同基底、不同溅射条件和热处理对薄膜成分、组织形貌及结构的影响。结果表明，当溅射功率为22．5W，靶基距为40mm，溅射氮气压为0．1Pa时为最佳工艺参数。Si基片上薄膜比较致密均匀，Cu基片上薄膜则较为疏松，Naa基片上薄膜表面分布着团簇颗粒，但三种薄膜均可见明显的岛状结构，表明薄膜的形成为核生长型机制。热处理前的薄膜具有部分非晶存在。     

Fabricating TiO2 Photocatalysts by rf Reactive Magnetron Sputtering at Varied Oxygen Partial Pressures

Titanium dioxide (TiO₂) thin films were fabricated onto non-alkali glass substrates by rf reactive magnetron sputtering at room temperature using Ti-metal target at varied oxygen partial pressure [O₂/(Ar + O₂)]. The sputtering deposition was performed under an rf power of 200 W. The target to substrate distance was kept at 80 mm, and the total gas pressure was 10 mTorr after 2 h of deposition. It was found that the crystalline structure, surface morphology, and photocatalytic activities of the TiO₂ thin films were affected by the oxygen partial pressure during deposition. The XRD patterns exhibited a broad-hump shape indicating the amorphous structure of TiO₂ thin films. The thin films deposited at a relatively high value of oxygen partial pressure (70%) had a good photo-induced decomposition of methylene blue (MB), photo-induced hydrophilicity, and had a small grain size.     

THE EFFECTS OF SPUTTERING POWER ON STRUCTURE AND ELECTRICAL PROPERTIES OF Cu FILMS

1. IntroductionCu filnls are very pron1isillg for electronic devices because of both high electromigrationresista11ce alld high electrical conductivity['--']. For a sputter-deposited film, base pressure,deposition rate, substrate temperature and energetic…     

磁控溅射法制备W-Cu薄膜的研究

采用W70Cu30单靶磁控溅射与纯W、纯Cu双靶磁控共溅两种工艺,在多种基材上制备W-Cu薄膜,分析了薄膜的宏观形貌和组织结构.分析结果表明:单靶磁控溅射时,控制靶电压520 V,溅射电流0.8～1.2A,Ar气流量25 mL/min(标准状态),可在玻璃基体上镀得W-Cu薄膜,但退火时如温度过高,会使W和Cu两种元素原子偏聚加重;双靶磁控溅射时,控制Ar气流量20 mL/min(标准状态),Cu靶电流0.7A,W靶电流1.2A,溅射时间3600 s,可在硅基和玻璃基上镀得W-Cu薄膜,但在石墨基体、陶瓷基体及45钢基体上的镀膜效果不理想.     

Microstructures and transformation characteristics of thin films of TiNiCu shape memory alloy

Both sputtering conditions and crystallizing temperatures have great influence on the microstructures and phase transformation characteristics for TislNi44Cus. By means of the resistance-temperature measurement, X-ray diffraction and atomic fore microscopic study, the results indicate that the transformation temperatures of the thin films increase and the “rock candy“ martensitic relief is more easily obtained with promoting the sputtering Ar pressure, sputtering power, orcrystallizing temperature. However, when sputtering Ar pressure, sputtering power, or crystallizing temperature are lower, a kind of “chrysanthemum“ relief, which is related with Ti-rich GP zones, is much easier to be observed. The reason is that during crystallization process, both of the inherent compressive stresses introduced under the condition of higher sputteringpressure or higher crystallizing temperature are helpful to the transition from GP zones to Ti2(NiCu) precipitates and the increase of the transformation temperatures. The addition of copper to substitute for 5 96 nickel in mole fraction can reduce the transformation hvsteresis width to about 10 - 15 ℃.     

磁控溅射SiNx 薄膜的表面动态演化行为

采用射频磁控溅射法在石英玻璃和不锈钢基底上沉积SiNx薄膜,以SEM和AFM观察薄膜的表面形貌,检测粗糙度和颗粒度大小对薄膜表面形貌动态演化进行量化表征。结果表明:石英玻璃基片SiNx薄膜较不锈钢基片薄膜更为均匀致密,且颗粒更为细小;真空退火处理有利于细化SiNx薄膜颗粒,减小其表面粗糙度;在溅射功率为125～175W范围内,SiNx薄膜颗粒平均直径高达41.0nm,其rms以及颗粒度在75W时受氩气溅射压强的影响大。     

Effect of fabrication parameters on the microstructure,in-plane anisotropy and magnetostriction of Fe-Ga thin films

The microstructure,in-plane anisotropy,and magnetic properties of Fe-Ga thin films were investigated by X-ray diffraction analysis,vibrating sample magnetometer,and capacitive cantilever method.The in-plane induced anisotropy is well formed by the applied magnetic field during sputtering,and the anisotropy field Hk decreases with the sputtering power increasing.The coercivity of Fe-Ga thin films decreases with increasing power when the sputtering power is less than 60 W and increases when the power is larger than 60 W.The magnetostriction of the thin films reaches 66 × 10-6 at the sputtering power of 60 W.Excellent Fe-Ga films,which exhibit good field sensitivity,low coercivity and high magnetostriction,have been fabricated at the power of 60 W,and they can be used as the materials of magnetostrictive transducers.     

Low temperature growth of rutile TiO2 films in modified rf magnetron sputtering

Low temperature (≤300°C) growth of rutile TiO₂ films with high refractive index which is equal to bulk TiO₂ crystal was achieved by using a modified sputtering method. Depositions were carried out in rf magnetron sputtering apparatus equipped with an auxiliary permanent magnet just under the grounded electrode. The as-deposited films showed rutile polycrystalline structure and fine surface morphology indicating higher densification. Remarkable changes in composition, total current and energy of incident ions were presented at a Ar–O₂ total pressure of 2.7 Pa. The rutile phase grows in a modified sputtering method in contrast with anatase phase growth in conventional sputtering apparatus.     

制备工艺对超磁致伸缩Fe-Ga合金薄膜表面形貌的影响

采用JZCK-600F型多功能镀膜设备制备了Fe-Ga合金薄膜,研究了溅射工艺对Fe-Ga合金薄膜沉积速率及表面形貌的影响。用SEM、EDS研究了Fe-Ga合金薄膜的表面形貌和薄膜成分。当其他工艺参数不变时,溅射时间、溅射功率是影响Fe-Ga合金薄膜的厚度和生长速率的主要因素。随溅射时间和功率的增加,薄膜厚度和沉积速率也随之增加,并且薄膜厚度与溅射时间和功率呈现出正比例关系;但是薄膜厚度过大,加大的内应力会使薄膜剥离。溅射功率过大时,内应力同样会使薄膜内部出现裂纹。所制备Fe-Ga合金薄膜的磁畴图像明暗对比明显。磁畴形状呈现不太规则的团圈状,类似珊瑚结构。薄膜的结晶化生长良好,薄膜形貌为较均匀致密的颗粒状结构。优化的薄膜溅射工艺参数为溅射功率80 W、溅射工作气压0.6 Pa、溅射时间60 min、Ar气工作流量25 mL/min。采用此优化工艺制备的Fe-Ga合金磁致伸缩薄膜悬臂梁偏移量为69.048 μm,可满足制备微器件所需性能。     

反应磁控溅射制备的Cr-N薄膜的成相行为

采用反应磁控溅射在不锈钢衬底上制备Cr-N薄膜,并研究了基片温度、氮气分压和溅射功率变化对薄膜相组成的影响。结果表明,基片温度升高使薄膜由单一的CrN相变成CrN和Cr2N两相共存,同时使有效的沉积速率下降;在基片温度为373K、溅射功率约45W时,氮气和氩气流量比在1：4到3：2的范围内变化时,薄膜的相组成几乎没有明显的变化;过高的溅射功率使薄膜以非晶态的形式存在。热处理后的Cr-N薄膜通常有CrN和Cr2N两相共存。     

Study on adhesion and electro-optical properties of ITO films on flexible PET substrate

High-quality ITO films on flexible PET substrate were prepared by RF magnetron sputtering at low deposition temperature with different Ar gas sputtering pressure.Adhesion and electro-optical properties of ITO films were investigated as a function of Ar partial pressure.The sputtering conditions provide very uniform ITO films with high transparency (＞85% in 400-760 nm spectra) and low electrical resistivity (1.408×10-3-1.956×10-3 Ω·cm).Scratch test experiments indicate that there is a good adhesion property between ITO films and PET substrate, the critical characteristic load increases from 16.5 to 23.2 N with increasing Ar sputtering pressure from 0.2 to 1.4 Pa.     

磁控溅射和退火制备ZnO/SiO2复合薄膜

采用射频磁控溅射和退火处理的方法在单晶硅衬底上制备了ZnO/SiO2复合薄膜,利用X射线衍射(XRD)、扫描电镜(SEM)、能谱分析(EDS)和接触角测量等测试手段研究溅射气压、溅射功率、氧氩比和退火温度等对复合薄膜成分组成、组织结构及润湿性能的影响。研究表明,复合薄膜中主要有ZnO、SiO2、Zn2SiO4 3种物相,且分别以六方纤锌矿结构、无定形态和硅锌矿型等形式存在。随着溅射和退火工艺的改变,复合薄膜的接触角在41°～146°间变化,组织形态由颗粒状向纳米竹叶状变化。溅射气压0.5 Pa,溅射功率120 W,氧氩比(O2∶Ar)为0∶30,退火温度为700℃的条件下获得具有六方纤锌矿结构的ZnO纳米组织,该组织呈现出竹叶状,在薄膜表面交错排列形成了无序多空隙的微观形貌,使复合薄膜具有超疏水性,接触角为146°。     

Study?on?Vanadium?Films?Deposited?on?Concave?Object?by?Conventional?Direct?Current?and?High?Power?Pulsed?Magnetron?Sputtering

高功率脉冲磁控溅射是一种制备高质量薄膜的新兴方法。在相同的平均功率下分别采用HPPMS技术和传统DCMS技术在凹槽工件表面制备了钒薄膜。对比研究了两种方法下的等离子体组成、薄膜的晶体结构、表面形貌及膜层厚度的异同。结果表明：HPPMS产生的等离子体包括Ar(1+),V(0)和相当数量的V(1+);而DCMS放电时的等离子体包括Ar(1+),V(0)和极少量的V(1+)。两种方法制备的凹槽不同位置处钒薄膜相结构的变化规律大致相似。HPPMS制备的钒薄膜表面致密、平整;而DCMS制备的膜层表面出现非常锐利的尖峰且高度很高,凹槽不同位置表面状态表现出较大差异。DCMS制备的钒薄膜截面表现为疏松的柱状晶结构;而HPPMS制备的膜层也具有轻微的柱状晶结构,但结构更为致密。HPPMS时的膜层厚度小于DCMS时的膜层厚度。与凹槽工件的上表面相比,DCMS时侧壁膜层的厚度为上表面的32%,底部膜层的厚度为上表面的55%。而HPPMS时侧壁的厚度为上表面的35%,底部膜层的厚度为上表面的69%。采用HPPMS方法在凹槽工件表面获得的膜层厚度整体上表现出更好的均匀性     

The Characterization of Sputtered Zr-Ge-N Thin Films as Diffusion Barriers Between Copper and Silicon

The main purpose of the present micro-structural analysis by transmission electron microscopy(TEM)and X-ray diffraction(XRD)was to investigate whether amorphous Zr-Ge-N films are a potential candidate as a diffusion barrier for Cu wiring used in Si devices.The Zr-Ge-N films were prepared by a radio frequency(RF)reactive magnetron sputter-deposition technique using N2 and Ar mixed gas,and the film structure was found to be sensitive to the gas flow ratio of N2 vs.Ar during sputtering.Polycrystalline Zr-Ge-N films were obtained when the N2/(Ar+N2)ratio was smaller than 0.2 and amorphous-like Zr-Ge-N films were obtained when the ratio was larger than 0.3.Diffusion barrier test was performed by annealing the Cu/Zr-Ge-N/Si film stack under Ar atmosphere.The deposited Zr-Ge-N(C)films remained amorphous even after high temperature annealing.The Cu diffusion profile in the film was assessed by the Auger electron spectroscopy(AES).The results indicate that Cu diffusion was minimal in amorphous Zr-Ge-N(C)films even at high annealing temperatures of 800℃.     

氩气压力对中频磁控溅射制备AZO薄膜性能的影响

在普通玻璃衬底上利用掺杂2%(质量)Al2O3的ZnO陶瓷靶材在中频磁控溅射设备中制备了掺铝氧化锌(ZnO∶Al,AZO)薄膜.利用XRD、XPS、紫外可见分光光度计和Hall测试系统研究了Ar气压力(0.73～2.0 Pa)对AZO透明导电薄膜结构、光学和电学性能的影响.随着Ar气压力的增大,电阻率呈先减小后增大的趋...     

Development of x-ray mask fabrication process using w-sputtering

Properties of DC magnetron sputter-deposited W and WNx absorber films were investigated for x-ray mask applications. Low stress film (5 x 10⁸ dyne/cm² tensile stress) is difficult to obtain with pure Ar gas as the film stress changes from highly compressive to highly tensile with pressure change. The variation of stress with pressure is significantly reduced with N₂/Ar mixture gas, and a reasonable tensile stress and stress stability were obtained with 5% N₂ at 3.5 mTorr. Film density decreases with increasing sputtering pressure and N₂/Ar + N₂ ratio. XRD patterns for films deposited at 3.5 mTorr show crystalline α-W structure for Ar sputtered film but amorphous structure for 5% N₂-sputtered film. Surface smoothness is very good at 5% N₂ but further increase of N₂/Ar+N₂ ratio results in a surface roughening and this is also confirmed by TEM analysis. At this sputtering condition (5% N₂, 3.5 mTorr), film stress stability during air-exposure and annealing was also superior, suggesting a optimum process condition for W-based absorber films.     

Surface discharge characteristics of MgO thin films prepared by RF reactive magnetron sputtering

This paper describes the surface glow-discharge effect of MgO thin films prepared by reactive radio-frequency planar magnetron sputtering on the dielectric layer of an alternating-current plasma display panel. By introducing an MgO coating on the dielectric the discharge voltage decreases sharply, although the thickness is only a few tens of Ångstroms. The lowest discharge voltage is obtained for the sample prepared at a 30% O₂ content in an O₂+Ar gas mixture and at a sputtering gas pressure of about 5 mTorr. Moreover, high transparency (95%) is also obtained under the same experimental conditions. The samples prepared show more sputter-resistant properties than samples prepared by the electron-beam method and no cracks are observed on the surface after post-deposition annealing.     

氮化钛薄膜二次电子发射特性研究

目的研究氮化钛薄膜的部分物理特性及真空中的电子发射特性,验证氮化钛薄膜具有相对较好的电导特性及较低的电子发射系数,证明氮化钛薄膜在空间大功率微波器件表面处理中有良好的应用前景。方法使用射频磁控溅射技术在单晶硅及玻璃片表面制备氮化钛薄膜,实验中通过调节溅射过程中氮气与氩气的气体流量比控制薄膜中的氮钛原子比。使用SEM对氮化钛薄膜的表面形貌及厚度进行表征。使用超高真空二次电子发射特性研究平台对氮化钛薄膜的二次电子发射特性进行表征。结果通过调节溅射过程中的氮气氩气流量比,能够有效控制薄膜中氮钛两种元素的含量,进而改变氮化钛薄膜的结晶方式和其他物理特性。当氮氩气体流量比约为10:15时,薄膜中氮钛原子比约为1:1。电阻率测试结果表明,薄膜中氮钛原子比越接近1:1,薄膜的电阻率越低。二次电子产额(SEY)测试结果表明,所制备氮化钛薄膜的最小SEY峰值约为1.46,低于平滑金(~1.8)、银(~2.2)表面的SEY。结论氮化钛薄膜具有较好的电导特性及较低的SEY,且其在真空环境中有良好的稳定性,能在不影响微波器件表面损耗的情况下,有效降低器件表面发生电子倍增的风险。