负温度系数热敏电阻匹配电路设计

不同型号的负温度系数（negative temperature coefficient,NTC）热敏电阻的特性是不同的,在实际的应用中,每种型号的热敏电阻根据使用场合的不同需要重新进行匹配电路设计.提出了评估NTC热敏电阻匹配电路设计的相关指标,详细介绍了经验公式法和遍历法2种设计方法,并对NTC热敏电阻匹配电路的使用场合以及实际使用中器件的布局与走线的注意事项进行了阐述.测试结果表明：这2种匹配电路方法具有复杂度低,灵敏度高,实用性强的特点.     

热敏电阻器的正确使用

热敏电阻器按电阻温度系数可分为两大类,即负温度系数(NTC)和正温度系数(PTC)热敏电阻器,它们作用不同,应用范围也不同,下面分别进行说明。一、NTC热敏电阻器的正确使用NTC热敏电阻器应用非常广泛,几乎涉     

彩电消磁电路用热敏电阻

<正> 用于彩电的消磁电路 Slegefs Frans(荷兰) US 4 164 775 选用材料:NTC、PTC热敏电阻,消磁线圈、二极管及电容和电阻。 特征用途:本发明消磁电路所用之热敏电阻为一个与消磁线圈串联的PTC热敏电阻和一个NTC热敏电阻。NTC     

热敏电阻在温补电源中的应用

稳压电源旨在提供稳定的输出电压,不受输入电压波动、负载以及温度变化的影响。然而有些应用需要一个基于温度变化的输出电压。本文介绍如何利用负温度系数(NTC)热敏电阻器设计温补电源及应用实例。 NTC热敏电阻器为稳压电源提供了一个近乎最佳的设计方案,其价格低廉、货源充足(拥有Murata、Panasonic等多家供货商),而且具有从0402到1206尺寸的贴片式封装,能够很方便地用到实际的电路设计中。 NTC的阻值随温度而变化,但其     

机电组件

0507587压电陶瓷线性位移步进马达研究[刊,中]/段智勇//电子机械工程.—2004,20(3).—4-8,12(C)0507588NTC 热敏电阻器在高精度温度测量中的应用[刊,中]/于丽丽//传感器技术.—2004,23(12).—75-77(D2)介绍了用 NTC 热敏电阻器进行高精度温度测量的几点考虑。分析了影响测量精度的各种因素,并提出了一些解决方法,主要的措施有:直流恒流源微安级电流;四线制测量电路;高分辨力(24位)ADC;数字滤波;仪器自校准等。实际测量表明,使用恰当的热敏电阻器在较窄的范围内(0 ∽ 60℃)测量精度可达±0.001℃。参3     

线性NTC热敏电阻浆料的研试

本文介绍了一种以具有烧绿石结构的铌钌酸铋镉为导电阻,铅硼硅酸盐玻璃为无机粘接相的NTC热敏电阻浆料。该NTC热敏电阻浆料阻值范围宽,电阻温度系数负、阻温特性呈线性变化。实现了使用厚膜工艺制备线性NTC热敏电阻元件,推动国内相关热敏电阻器产品的研发。     

基于PIC16C71的数字水温配制阀的设计

设计了一种基于PIC16C71单片机的数字水温配制阀。该配制阀采用NTC热敏电阻作温度传感器,与固定电阻组成简单分压电路作为水温测量电路,利用PIC16C71单片机内置的8位A/D转换器把热敏电阻上的模拟电压转换为数字量,PIC16C71单片机控制直流电机驱动混水阀调节冷热水的混合比例实现水温调节。给出了控制电路图,对水温测量电路的参数选择和测温精度作了详细讨论。实验和分析表明,选用阻值较大的NTC热敏电阻和分压电阻可较好地解决热敏电阻因功耗较大造成的热击穿问题。     

NTC热敏电阻的研究现状及发展方向

首先介绍了NTC热敏电阻的类型以及各类NTC热敏电阻的研究进展,然后详细地阐述了NTC热敏电阻的制备工艺,并且探讨了NTC热敏电阻的导电机理,最后总结了NTC热敏电阻的研究热点及发展方向。     

负温度系数传感器特性检测系统设计

负温度系数(NTC)传感器是一种阻值随温度升高而降低的热敏电阻,广泛应用于家用电器的测控系统中.鉴于不同NTC元件的温度-电阻特性一致性较差,给批量家用电器产品的调试带来不便.因此,NTC特性的自动测量和筛选是十分重要的.文中介绍了一种新型的NTC热敏电阻特性检测系统,阐述了该系统的检测原理和硬件组成,给出了系统的硬件框图和软件流程.该系统实现了NTC传感器温度特性的自动测量和筛选,方便了整机装配前对使用的NTC传感器温度特性的检测,降低了后道工序的调整难度,节省了工时.     

玻璃釉包覆片式NTC热敏电阻器的研制

为了得到更稳定、可靠的片式NTC热敏电阻器,在芯片表面涂覆一层玻璃釉是有效的途径之一。为此调整了玻璃釉包覆片式NTC热敏电阻器所进行的工艺,进行了玻璃浆及银浆的选取和匹配工作。所研制的片式NTC热敏电阻器,克服了传统片式NTC热敏电阻的精度不高、稳定性不好、可靠性差等主要缺点,F级阻值合格率提高了45%,阻值的年漂移小于0.1%,端电极强度提高了约4.9N,耐焊上锡率提高了约5%。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Teleportation of an arbitrary unknown N-qubit entangled state under the controlling of M controllers

A new quantum protocol to teleport an arbitrary unknown N-qubit entangled state from a sender to a fixed receiver under M controllers(M < N) is proposed. The quantum resources required are M non-maximally entangled Greenberger-Home-Zeilinger (GHZ) state and N-M non-maximally entangled Einstein-Podolsky-Rosen (EPR) pairs. The sender performs N generalized Bell-state measurements on the 2N particles. Controllers take M single-particle measurement along x-axis, and the receiver needs to introduce one auxiliary two-level particle to extract quantum information probabilistically with the fidelity unit if controllers cooperate with it.     

Diode-end-pumped Nd:YVO4/LBO lasers with 4.2W continuous-wave output at 457 nm

A continuous-wave (CW) 457 nm blue laser operating at the power of 4.2 W is demonstrated by using a fiber coupled laser diode module pumped Nd: YVO4 and using LBO as the intra-cavity SHG crystal With the optimization of laser cavity and crystal parameters, the laser operates at a very high efficiency. When the pumping power is about 31 W, the output at 457nm reaches 4.2 W, and the optical to optical conversion efficiency is about 13.5% accordingly. The stability of the out putpower is better than 1.2% for 8 h continuously working.     

A rigorous proof of MIMO channel capacity’s increase with antenna number

It is well known that adding more antennas at the transmitter or at the receiver may offer larger channel capacity in the multiple-input multiple-output（MIMO） communication systems. In this letter, a simple proof is presented for the fact that the channel capacity increases with an increase in the number of receiving antennas. The proof is based on the famous capacity formula of Foschini and Gans with matrix theory.     

Call for Papers

正Wireless Body-area Networks The last decade has witnessed the convergence of three giant worlds:electronics,computer science and telecommunications.The next decade should follow this convergence in most of our activities with the generalization of sensor networks.In particular with the progress in medicine,people live longer and the aging of population will push the development of wireless personal networks