共查询到20条相似文献,搜索用时 15 毫秒
1.
The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy (SEM), energy dispersive spectroscopy ( EDS ) and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 MPa can be obtained under the condition of bonding temperature 850℃ for 30 rain. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, CoaTi and CuSn3Ti5. And the brittle Cu3Ti and CuSn3 Ti5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn , Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0. 013 9,0. 069 7 and 0. 056 4 mm^2/s. 相似文献
2.
采用镍箔做中间层,在真空下对TC4和ZQSn10-2-3进行扩散连接.使用扫描电镜对接头的界面组织进行了研究.确定TC4/Ni/ZQSn10-2-3接头的界面结构是TC4/β-Ti/Ti2Ni/TiNi/TiNi31Ni/Cu(Cu,Ni)/ZQSn10-2-3.通过最优工艺试验,确定最佳工艺参数为连接温度830℃,连接压力10 MPa,连接时间30 min.此时接头最大抗剪强度为135 MPa,接头断口为带有一定塑性的结晶状形貌.通过x射线衍射对断口分析认为,断裂位于TC4/Ni界面处的金属间化合物TiNi3层. 相似文献
3.
采用纯铜(cu)箔作中间过渡层在真空下对钛合金Ti-6Al-4V与锡青铜ZQSn10-10异种材料进行扩散连接。用冷场发射扫描电镜对连接接头进行微观分析,用拉伸试验获得接头强度。结果表明,采用铜箔作中间过渡层,可以防止一些低熔点组元的挥发,并且可以阻止某些元素(Sn、Pb等)向钛合金基体扩散,避免更多金属问化合物的产生,从而提高了接头性能。中间过渡层铜与锡青铜ZQSn10-10之间实现了良好的连接,未形成明显的过渡区;在中间过渡层铜与钛合金Ti-6Al-4V之间形成了较宽的过渡区,并有金属间化合物Cu3Ti2产生,对接头性能影响较大。最佳工艺参数是:连接温度为850℃、连接压力为10~15MPa、连接时间为30min,可获得钛合金与锡青铜的牢固连接,接头强度可达192MPa(达到锡青铜母材基体强度的80%),且连接试样无明显变形。 相似文献
4.
Microstructure and mechanical properties of Ti-6Al-4V/Ti-22Al-25Nb joint formed by diffusion bonding
Peng LIN Xian-zheng XI Wen-kai ZHAO Rui-hong YANG Fei LIN Xiao-lei CUI Gang LIU 《中国有色金属学会会刊》2021,31(5):1339-1349
Ti-6Al-4V (wt.%) and Ti-22Al-25Nb (at.%) were joined by diffusion bonding at 950 °C and 15 MPa for 100 min, and the microstructure and mechanical properties of the resulting joints were investigated. The composition of the diffusion layer is B2/discontinuous α/α2 layer/necklace-shaped β+α′ layer, where the content of any element at a given point mainly depends on the distance of the point from the interface and the phase type at the point. The tensile strength of the joint is 894 MPa, which is almost the same as that of the Ti-22Al-25Nb base alloy. The fracture surfaces on both sides of the joint are composed of two main regions. One region displays a relatively flat surface and fractures along the bonding interface. The other is composed of a moderate number of irregularly-shaped cavities on the Ti-6Al-4V side and many irregularly-shaped bulges on the Ti-22Al-25Nb side. Both regions result from fracture along the boundaries between β+α′ layers and αp grains or from the transcrystalline fracture of αp grains. 相似文献
5.
6.
研究了置氢Ti-6AL-4V合金在800~860℃温度范围内气压扩散连接行为与机理。在840℃对置氢0.11%(质量分数,下同)的纯钛和Ti-6AL-4V合金进行了扩散连接。应用光学显微镜(OM)、扫描电子显微镜(SEM)和电子探针显微分析仪(EPMA)研究了氢对扩散连接接头焊合率及元素扩散行为的影响。结果表明:氢能够显著提高扩散连接接头的焊合率(置氢0.11%在840℃的焊合率大于98%);氢含量为0.11%的Ti-6Al-4V合金扩散连接后仍为等轴组织,而高氢含量(0.32%~0.48%H)Ti-6Al-4V合金扩散连接后组织转变为粗大的魏氏组织;氢对扩散连接行为的改善作用主要是由于氢的弱键效应及其对元素扩散系数的提高;相对于未置氢Ti-6Al-4V合金,0.11%的氢能够将Al和V元素的扩散系数提高一个数量级,并使扩散连接温度降低了40℃。 相似文献
7.
8.
9.
10.
SiC纤维增强Ti基复合材料(SiCf/Ti)容易发生界面反应,从而影响其力学性能。开展界面反应和动力学的研究,对于SiCdTi复合材料的制备和服役具有指导意义。采用扫描电镜、透射电镜和X射线衍射分析了SICf/Ti-6Al—4V复合材料的界面反应及其动力学,发现SiC纤维的C涂层与Ti-6Al—4V反应形成粗晶粒的和细晶粒的TiC,长期高温热处理使得界面反应加剧,TiC层加厚,当C涂层完全消耗后,界面反应层中除了TiC外,还出现了Ti3SiC2。研究表明,界面反应层的加厚受元素扩散控制,服从抛物线规律,求出的动力学参数Q为268.8kJ/mol,k为0.0057m/s1/2。 相似文献
11.
激光快速成形Ti-6Al-4V合金力学性能 总被引:2,自引:1,他引:2
采用实验研究的方法,对激光快速成形Ti-6Al-4V合金的力学性能进行了探讨。结果发现:和锻造件相比,激光快速成形沉积态Ti-6Al-4V合金的拉伸性能具有高强低塑特点和更显著的各向异性;成形试样的组织、氧含量和冶金缺陷都将影响到拉伸性能,其中组织的影响最显著,其次为氧含量和熔合不良缺陷:对于氧含量符合GJBGJB2921-1997标准的激光快速成形Ti-6Al-4V合金,经固溶时效热处理后所获得的网篮组织综合性能最好,不论是强度指标还是塑性指标都高于锻件标准。 相似文献
12.
13.
14.
J. H. Li P. Deshpande R. Y. Lin 《Journal of Materials Engineering and Performance》2004,13(4):445-450
The objective of this study is to investigate an innovative infrared (IR) technique to enhance adhesion of electroplated copper
(Cu) on Ti-6Al-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on Ti-6Al-4V without hazardous
hexavalent chromium (Cr) solution treatments. Cu coatings of around 50 μm were electroplated on Ti-6Al-4V specimens at a current
density of 0.03 A/cm2 in an acidic Cu solution. To improve adhesion of coatings, IR heat treatments were performed on the Cu-coated samples at
different temperatures and durations: 860 °C for 600 s and 875 °C for 20–120 s. This process was accomplished in an attempt
to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 °C, no bonding existed, even
after 600 s. It is believed that solid-state diffusion prevailed at 860 °C and that 600 s was not enough for sufficient diffusion
to occur. Adhesion was poor when samples were heat treated at 875 °C for 20 s. Excellent adhesion was observed when the heat
treatment holding time was increased to 40 s. For 90 s, the surface appearance of coatings partially changed from Cu-colored
to a grayish color. There was no Cu left on the surface after a 120 s heat treatment. From optical microscopic observations
on sample cross sections, an interlayer between the Cu and Ti-6Al-4V formed when heat treated at 875 °C for 40 s and longer.
The interlayer thickness increased as the holding time increased, until depletion of Cu. The sheet resistivity of coated specimens
was on the order of pure Cu for samples heat treated at 875 °C and less than 90 s. During the 875 °C heat treatment, the following
occurred: solid-state diffusion of Cu in Ti-6Al-4V, formation of eutectic solutions, dissolution of Cu and Ti-6Al-4V into
the liquid phase, and the formation of intermetallic compounds. The lowest eutectic temperature of 875 °C played a key role
in this innovative process of Cu coating on Ti-6Al-4V.
This paper was presented at the 2nd International Surface Engineering Congress sponsored by ASM International, on September
15–17, 2003, in Indianapolis, Indiana and appears on pp. 403–10 of the Proceedings. 相似文献
15.
应力状态对Ti-6Al-4V绝热剪切敏感性的影响 总被引:3,自引:0,他引:3
采用分离式Hopkinson压杆技术对双态组织和片层组织Ti-6Al-4V进行了圆柱试样和帽形试样的冲击试验,对比了单轴压缩和压剪复合2种不同应力状态下2种组织钛合金的绝热剪切敏感性差异.结果表明:在单轴压缩状态下片层组织的绝热剪切敏感性要高于双态组织,而在压剪复合应力状态下其绝热剪切敏感性要低于双态组织,即应力状态对材料的绝热剪切敏感性影响显著. 相似文献
16.
采用双辉等离子渗金属技术在Ti-6Al-4V表面形成均匀致密连续的渗铌合金层。将未渗铌和渗铌的Ti-6Al-4V试样分别在700℃,800℃,900℃进行100h的高温氧化实验,采用XRD,SEM及EDX对试样在900℃氧化100h后的氧化层的相组成、截面形貌及成分分布进行分析,初步探讨Ti-6Al-4V表面渗铌后的抗氧化性能及氧化机理。结果表明:渗铌后的Ti-6Al-4V合金氧化速率常数降低了1个数量级,氧化激活能提高,抗氧化性能明显改善。 相似文献
17.
18.
19.
20.
对钛合金TC4与铜合金ZQSn10-10异种金属扩散连接进行了试验研究.采用Ni Cu中间层时,其最佳工艺参数为连接温度850 ℃,连接时间20 min,连接比压力10 MPa,抗拉强度达到155.8 MPa.在TC4/Ni界面上,形成了成分逐渐变化的互扩散层.经微区成分分析可知,连接温度为800 ℃时,界面主要为Ni3Ti;850 ℃时,界面主要为Ni3Ti及NiTi;880 ℃时,界面主要为NiTi2,Ni3Ti及NiTi.通过EDS和XRD分析,接头强度主要取决于镍钛金属间化合物的种类及厚度. 相似文献