Nonlinear GaAs MESFET modeling using pulsed gate measurements

The effects of traps in GaAs MESFETs are studied using a pulsed gate measurement system. The devices are pulsed into the active region for a short period (typically 1 μs) and are held in the cutoff region for the rest of a 1-ms period. While the devices are on, the drain current is sampled and a series of pulsed gate I-V curves are obtained. The drain current obtained under the pulsed gate conditions for a given V_GS and V_DS gives a better representation of the instantaneous current for a corresponding V_gs and V_ds in the microwave cycle because of the effects of traps. The static and pulsed gate curves were used in a nonlinear time-domain model to predict harmonic current. The results showed that analysis using pulsed gate curves yielded better predictions of harmonic distortion than analysis based on conventional state I-V curves under large-signal conditions     

High-frequency InP/InGaAs double heterojunction bipolar transistorson Si substrate

Self-aligned high-frequency InP/InGaAs double heterojunction bipolar transistors (DHBTs) have been fabricated on a Si substrate. A current gain of 40 was obtained for a DHBT with an emitter dimension of 1.6 μm×19 μm. The S parameters were measured for various bias points. In the case of I_C=15 mA, f _T was 59 GHz at V_CE=1.8 V, and f _max was 69 GHz at V_CE=2.3 V. Due to the InP collector, breakdown voltage was so high that a V_CE of 3.8 V was applied for I_C=7.5 mA in the S-parameter measurements to give an f_T of 39 GHz and an f_max of 52 GHz     

A pseudomorphic AlGaAs/n+-InGaAs metal-insulator-dopedchannel FET for broad-band, large-signal applications

Molecular beam epitaxy (MBE)-grown L_g=1.7-μm pseudomorphic Al_0.38Ga_0.62As/n⁺-In_0.15Ga _0.85As metal-insulator-doped channel FETs (MIDFETs) are presented that display extremely broad plateaus in both f_T and f_max versus V_GS, with f_T sustaining 90% of its peak over a gate swing of 2.6 V. Drain current is highly linear with V_GS over this swing, reaching 514 mA/mm. No frequency dispersion in g _m up to 3 GHz was found, indicating the absence of electrically active traps in the undoped AlGaAs pseudoinsulator layer. These properties combine to make the pseudomorphic MIDFET highly suited to linear, large-signal, broadband applications     

Si/a-Si:H heterojunction microwave bipolar transistors with cut-offfrequencies ft above 5 GHz

The fabrication of a silicon heterojunction microwave bipolar transistor with an n⁺ a-Si:H emitter is discussed, and experimental results are given. The device provides a base sheet resistance of 2 kΩ/□ a base width 0.1 μm, a maximum current gain of 21 (V_CE=6 V, I_c=15 mA), and an emitter Gummel number G _E of about 1.4×10¹⁴ Scm^-4. From the measured S parameters, a cutoff frequency f_t of 5.5 GHz and maximum oscillating frequency f_max of 7.5 GHz at V_CE=10 V, I_c=10 mA are obtained     

A physical model for the gate current injection in p-channelMOSFET's

A quantitative physical model for calculating the hot-electron injection probability, I_G/I_SUB, for both buried and surface p-channel MOSFETs is presented. The model utilizes the two-dimensional potential contours generated by PISCES, and integrates the probability of substrate hot-electron injection across the high-field region near the drain. The known phenomenon that buried-channel (BC) PMOS has higher hot-electron injection probability but lower channel field (I_SUB/I_D) than a similar surface-channel (SC) device is successfully modeled. This phenomenon can be attributed to the larger energy band hump-up near the drain and the larger oxide field (and thus greater barrier lowering) at a given bias condition for the buried-channel device. The I_G characteristics can be obtained from the calculated I_G /I_SUB ratio, using readily available I_SUB values     

Importance of source and drain resistance to the maximum fT of millimeter-wave MODFETs

The usual approximate expression for measured f_T =[g_m/2π (C_gs+C _gd)] is inadequate. At low drain voltages just beyond the knee of the DC I-V curves, where intrinsic f _t is a maximum for millimeter-wave MODFETs, the high values of C_gd and G_ds combine with the high g_m to make terms involving the source and drain resistance significant. It is shown that these resistances can degrade the measured f_T of a 0.30-μm GaAs-AlGaAs MODFET from an intrinsic maximum f_T value of 73 GHz to a measured maximum value of 59 GHz. The correct extraction of maximum f_T is essential for determining electron velocity and optimizing low-noise performance     

Quarter-micrometer gate ion-implanted GaAs MESFET's with an f1 of 126 GHz

The fabrication and characterization of a 0.25-μm-gate, ion-implanted GaAs MESFET with a maximum current-gain cutoff frequency f_t of 126 GHz is reported. Extrapolation of current gains from bias-dependent S-parameters at 70-100% of I _dss yields f₁'s of 108-126 GHz. It is projected that an f₁ of 320 GHz is achievable with 0.1-μm-gate GaAs MESFETs. This demonstration of f₁'s over 100 GHz with practical 0.25-μm gate length substantially advances the high-frequency operation limits of short-gate GaAs MESFETs     

Modeling the gate I/V characteristic of a GaAsMESFET for Volterra-series analysis

The authors show that the Taylor-series coefficients of a FET's gate/drain I/V characteristic, which is used to model this nonlinearity for Volterra-series analysis, can be derived from low-frequency RF measurements of harmonic output levels. The method circumvents many of the problems encountered in using DC measurements to characterize this nonlinearity. This method was used to determine the incremental gate I/V characteristic of a packaged Aventek AT10650-5 MESFET biased at a drain voltage of 3 V and drain current of 20 mA. The FET's transconductance was measured at DC, and its small-signal equivalent circuit (including the package parasitics) was determined by adjusting its circuit element values until good agreement between calculated and measured S parameters was obtained. The FET was then installed in a low-frequency test fixture. Excellent results were obtained     

Wavelength dependence of 1/f noise in the light output oflaser diodes: an experimental study

The optical power emitted by a monomode GaAlAs laser is filtered with a monochromator. The 1/f noise in the filtered emission is found to be directly dependent on the noncoherent emission, such as S_pαP_nc^m. Here s_p is the spectral density of the 1/f fluctuations, P_nc is the average noncoherent power, m=3/2 under spontaneous emission, and m=4 in the superradiation and laser regions. Study of the 1/f noise in the optical power in a band centered at the laser wavelength and with variable bandwidth shows three operating regions. (1) LED region (at low currents): the fluctuations with a 1/f spectrum are uncorrelated in wavelength. (2) Superradiation region (at currents close to the threshold): the fluctuations are correlated. (3) Laser region: the 1/f noise apparently is dominated by noncoherent emission within a small optical band around the laser wavelength     

A model for the temperature-dependent saturated ID-VD characteristics of an a-Si:H thin-filmtransistor

A simplified analytical expression for the temperature dependent saturated I_D-V_D characteristics of hydrogenated amorphous silicon (a-Si:H) thin-film transistors, between -50°C and 90°C, is presented and experimentally verified. The results show that the experimental transfer and output characteristics at several temperatures are easily modeled by a single equation. The model is based on three functions obtained from the experimental data of I_D versus V_G, over a range of temperature. Theoretical results confirm the simple form of the model in terms of the device geometry. As the temperature increased, the saturated drain current increased and, at a fixed gate voltage the device saturated at increasingly larger drain voltages while the threshold voltage decreased. Good agreement between the measured data and the model was obtained up to 363 K. Also observed at temperatures larger than 363 K was a decrease in I_D and more severe gate voltage hysteresis characteristics     

Electron transport in 0.15-μm gate In0.52Al0.48As/In0.53Ga0.47As HEMT

Magneto-transport and cyclotron resonance measurements were made to determine directly the density, mobility, and the effective mass of the charge carriers in a high-performance 0.15-μm gate In_0.52 Al_0.48As/In_0.53Ga_0.47As high-electron-mobility transistor (HEMT) at low temperatures. At the gate voltage V_G=0 V, the carrier density n _g under the gate is 9×10¹¹ cm^-2, while outside of the gate region n_g=2.1×10¹² cm^-2. The mobility under the gate at 4.2 K is as low as 400 cm²/V-s when V_G<0.1 V and rapidly approaches 11000 cm²/V-s when V_G>0.1 V. The existence of this high mobility threshold is crucial to the operation of the device and sets its high-performance region in V_G>0.1 V     

Low-frequency intensity noise in semiconductor lasers

The observed 1/f noise in the light-output power S _p of four different types of heterostructure lasers is explained in terms of spatially uncorrelated gain fluctuations and spontaneous emission fluctuations. Two possible noise sources are suggested: fluctuations in the absorption coefficient and fluctuations in the number of free carriers. Both models are in agreement with the experimental results obtained from index-guided and gain-guided diodes at wavelengths of 1.3 and 0.8 μm. The dependence S_p ∝P^m has been observed with P the average light-output power and m=3/2 under spontaneous emission, a small transition region with m=5/2, m=4 in the superradiation region, and 0⩽m⩽1 in the laser region     

A new technique for measuring MOSFET inversion layer mobility

An experimental technique for accurately determining both the inversion charge and the channel mobility μ of a MOSFET is presented. With this new technique, the inversion charge is measured as a function of the gate and drain voltages. This improvement allows the channel mobility to be extracted independent of drain voltage V_DS over a wide range of voltages (V_DS=20-100 mV). The resulting μ(V_GS) curves for different V_DS show no drastic mobility roll-off at V _GS near V_TH. This suggests that the roll-off seen in the mobility data extracted using the split C- V method is probably due to inaccurate inversion charge measurements instead of Coulombic scattering     

Noise sources across a normal-to-superconducting boundary in bulkYBa2Cu3O7-x

Experiments in which a normal-to-superconducting (NS) boundary is created in an originally superconducting bar of bulk YBa₂Cu ₃O_7-x is described. The first noise measurements associated with such a boundary are presented. A high-density (5.20 g-cm ^-3) sample (sample A) and a low density (4.23 g-cm^-3 ) sample (sample B) have been investigated. Common to both samples is 1/f² noise observed in the frequency region between about 15 and 50 Hz that can be associated with the NS boundary itself. Sample A also exhibits conventional 1/f noise as expected for the normal part of the boundary, below about 15 Hz. In contrast, sample B shows 1/f^1.5 noise in this region; since the sample contains considerably fewer small grains than sample A, any 1/f noise is presumably masked in B. It is suggested that the 1/f² noise might be associated with flux-flow noise     

A simple characterization method for silicon-on-insulator materialsusing a depletion-mode MOSFET

A simple method is proposed for extracting the electrical parameters of a silicon-on-insulator (SOI) material from a depletion-mode MOSFET. It is based on an analysis of static input current-voltage I_D(V_G) and transconductance-voltage g_m(V_G) characteristics in the linear region. Functions varying linearly with gate voltage are constructed from I_D(V_G) and g_m(V_G) functions. These new functions allow a straightforward determination of the parameters usually obtained from a capacitance-voltage measurement (doping level, oxide charge, etc.) and also the bulk-layer and accumulation-layer carrier mobility     

Monte Carlo study of GaAs/Alx Ga1-xAsMODFETs: effects of AlxGa1-xAs composition

Monte Carlo methods are used to compare electronic transport and device behavior in n⁺-Al_xGa_1-xAs/GaAs modulation-doped field-effect transistors (MODFETs) at 300 K for x =0.10, 0.15, 0.22, 0.30, 0.35, and 0.40. The differences between the x=0.22 and x=0.30 MODFETs with respect to parasitic conduction in Al_xGa_1-xAs, gate currents, and switching times, are of particular interest. The donor-related deep levels in Al_xGa_1-xAs, are disregarded by assuming all donors to be fully ionized, and the focus is only on the confinement and transport of the carriers. The following quantities are studied in detail: transfer characteristics (I_D versus V _G), transconductance (g_m), switching speeds (τ_ON), parasitic conduction in Al_xGa _1-xAs, gate current (I_G), average electron velocities and energies in GaAs and Al_xGa_1-x As, electron concentration in the device domain, k-space transfer (to low mobility L and X valleys), and details of the real-space transfer process     

Mobility profiles in short and narrow GaAs MESFET channels

Gate-voltage-dependent mobility profiles in long-, short-, wide-, and narrow-channel WN_x-BPLDD (buried p-type buffer lightly doped drain region) GaAs MESFETs have been determined (L_G =10, 4, 2, 1, 0.8, 0.5, 0.3 μm, W_G=20 μm; W_G-100, 40, 20, 10, 4, 2 μm, L _G=0.5 μm). The mobility mainly depends on the channel width, while the gate length has much less influence. Thus, using proper gate dimensions the channel mobility can be tuned. The highest drift mobility values agree quite well with the measured Hall mobilities. Mobility profiles of large-area MESFETs are probably degraded by the WN _x-gate fabrication process. Injected excess charges at gate length below 0.5 μm distorts the mobility evaluations     

Correlation between 1/f noise and hFElong-term instability in silicon bipolar devices

Accelerated life tests with high-temperature storage and electric aging for n⁺-p-n silicon planar transistors were carried out. Current gain h_FE increases monotonously with time during the tests, and the h_FE drift is correlated with initial measured 1/f noise in the transistors, i.e. the drift amount significantly increases with the increase of noise level. The correlation coefficient of relative drift Δh_FE /h_FE and 1/f noise spectral density S_iB(f) is far larger than that of Δ h_FE/h_FE and initial DC parameters of the transistors. A quantitative theory model for the h _FE drift has been developed and explains the h _FE drift behavior in the tests, which suggests that the h _FE drift and 1/f noise can be attributed to the same physical origin, and both are caused by the modulation of the oxide traps near the Si-SiO₂ interface to Si surface recombination. 1/f noise measurement, therefore, may be used as a fast and nondestructive means to predict the long-term instability in bipolar transistors     

Doubly strainedIn0.41Al0.59As/n+-In0.65Ga0.35As HFET with high breakdown voltage

An In_0.41Al_0.59As/n⁺-In_0.65 Ga_0.35As HFET on InP was designed and fabricated, using the following methodology to enhance device breakdown: a quantum-well channel to introduce electron quantization and increase the effective channel bandgap, a strained In_0.41Al_0.59As insulator, and the elimination of parasitic mesa-sidewall gate leakage. The In_0.65Ga_0.35As channel is optimally doped to N_D=6×10¹⁸ cm^-3. The resulting device (L_g=1.9 μm, W_g =200 μm) has f_t=14.9 GHz, f_max in the range of 85 to 101 GHz, MSG=17.6 dB at 12 GHz V_B=12.8 V, and I_D(max)=302 mA/mm. This structure offers the promise of high-voltage applications at high frequencies on InP     

Modeling of nonhyperbolic sine I-Vcharacteristics in poly-Si resistors

Poly-Si resistors with an unimplanted channel region (and with n-type source/drain regions) can exhibit a nonhyperbolic sine (non-sinh) I-V characteristic at low V_DS and an activation energy which is not simply decreasing monotonically with increasing V_DS. These phenomena are not explained by conventional poly-Si resistor models. To describe these characteristics, a self-consistent model which includes the effects of a reverse-biased diode at the drain end is presented. Numerical simulation results show excellent agreement with experiment in regard to the shape of the I -V characteristic and of the effective activation energy as a function of V_DS