Effect of nano aluminum nitride filler on mechanical,thermal, and dielectric properties of the glass/mullite composites for low-temperature co-fired ceramic applications

Mullite/glass/nano aluminum nitride (AlN) filler (1–10 wt% AlN) composites were successfully fabricated for the low-temperature co-fired ceramics applications that require densification temperatures lower than 950°C, high thermal conductivity to dissipate heat and thermal expansion coefficient matched to Si for reliability, and low dielectric constant for high signal transmission speed. Densification temperatures were ≤825°C for all composites due to the viscous sintering of the glass matrix. X-ray diffraction proved that AlN neither chemically reacted with other phases nor decomposed with temperature. The number of closed pores increased with the AlN content, which limited the property improvement expected. A dense mullite/glass/AlN (10 wt%) composite had a thermal expansion coefficient of 4.44 ppm/°C between 25 and 300°C, thermal conductivity of 1.76 W/m.K at 25°C, dielectric constant (loss) of 6.42 (0.0017) at 5 MHz, flexural strength of 88 MPa and elastic modulus of 82 GPa, that are comparable to the commercial low temperature co-fired ceramics products.     

Mechanical,dielectric, and thermal properties of fluorosilicone rubber composites filled with silica/multiwall carbon nanotube hybrid fillers

In this work, hybrid fillers consist of modified silica (SiO₂) and multiwalled carbon nanotube (MWCNT) were used to improve the mechanical, dielectric, and thermal properties of fluorosilicone (FSR) composites via a direct mechanical mixing method. With the increase of CNT loading in SiO₂/CNT hybrid loading ratio, the tensile properties, dielectric constant, electrical conductivity, and thermal properties all increase without a sharp sacrifice of flexibility. The dielectric constant of FSR-S15/C5 achieved 7,370 @1 kHz, which is about four orders of the FSR-S20, and the dielectric loss remains as low as 0.676 @1 kHz. Therefore, the linkage of SiO₂ and FSR chains not only enhances the interfacial interaction between the fillers and FSR matrix but also decreases the agglomeration of the fillers in matrix. What is more, modified SiO₂ and CNT were designed as the effective hybrid filler to improve the performance of the polymeric matrix through synergic effect.     

Thermal properties of low loss PTFE‐CeO2 dielectric ceramic composites for microwave substrate applications

Polytetrafluroethylene (PTFE) composites filled with CeO₂ were prepared by powder processing technique. The PTFE is used as the matrix and the loading fraction of CeO₂ in the composite varied up to 0.6 volume fraction. The thermal conductivity and coefficient of thermal expansion were studied in relation to filler concentration. The thermal conductivity increased and coefficient of thermal expansion decreased with increase in CeO₂ content. For 0.6 volume fraction loading of the ceramic, the composite has a thermal conductivity of 3.1 W/m°C and coefficient of thermal expansion 19.6 ppm/°C. Different theoretical approaches have been employed to predict the effective thermal conductivity and coefficient of thermal expansion of composite systems and the results were compared with the experimental data. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Mechanical and thermal properties of polypropylene/modified basalt fabric composites

Basalt fabric (BF) was first treated with silane coupling agent KH550, modified basalt fabric (MBF) was obtained. Then MBF were molded with polypropylene (PP) matrix, and polypropylene/modified basalt fabrics (PP/MBF) composites were obtained. The influence of concentration and treating time of KH550 on MBF were characterized by hydrophilicity and lipophilicity. The tensile strength and morphology of basalt fabric were tested by single filament strength tester and scanning electron microscopy. The mechanical properties of composites were measured with electronic universal testing machine and impact testing machine, and the thermal properties were tested by thermogravimetric analysis and dynamic mechanical analysis. The results showed that the lipophilicity of MBF is improved significantly by KH550 while the tensile is nearly damaged. The mechanical properties of composites are larger than that of pure PP, among which the impact property was improved the most, showing 194.12% enhancement. The thermal stability and dynamic viscoelasticity were better than pure PP; furthermore, the concentration of KH550 virtually had no effect on the thermal stability. © 2015 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2015 , 132, 42504.     

Mechanical,thermal, and dielectric properties of SiCf/SiC composites reinforced with electrospun SiC fibers by PIP

Electrospun unidirectional SiC fibers reinforced SiC_f/SiC composites (e-SiC_f/SiC) were prepared with ∼10% volume fraction by polymer infiltration and pyrolysis (PIP) process. Pyrolysis temperature was varied to investigate the changes in microstructures, mechanical, thermal, and dielectric properties of e-SiC_f/SiC composites. The composites prepared at 1100 °C exhibit the highest flexural strength of 286.0 ± 33.9 MPa, then reduced at 1300 °C, mainly due to the degradation of electrospun SiC fibers, increased porosity, and reaction-controlled interfacial bonding. The thermal conductivity of e-SiC_f/SiC prepared at 1300 °C reached 2.663 W/(m∙K). The dielectric properties of e-SiC_f/SiC composites were also investigated and the complex permittivities increase with raising pyrolysis temperature. The e-SiC_f/SiC composites prepared at 1300 °C exhibited EMI shielding effectiveness exceeding 24 dB over the whole X band. The electrospun SiC fibers reinforced SiC_f/SiC composites can serve as a potential material for structural components and EMI shielding applications in the future.     

Thermal,dielectric, and mechanical properties of SiC particles filled linear low‐density polyethylene composites

A thermally conductive linear low‐density polyethylene (LLDPE) composite with silicon carbide (SiC) as filler was prepared in a heat press molding. The SiC particles distributions were found to be rather uniform in matrix at both low and high filler content due to a powder mixing process employed. Differential scanning calorimeter results indicated that the SiC filler decreases the degree of crystallinity of LLDPE, and has no obvious influence on the melting temperature of LLDPE. Experimental results demonstrated that the LLDPE composites displays a high thermal conductivity of 1.48 Wm^?1 K^?1 and improved thermal stability at 55 wt % SiC content as compared to pure LLDPE. The surface treatment of SiC particles has a beneficial effect on improving the thermal conductivity. The dielectric constant and loss increased with SiC content, however, they still remained at relatively low levels (<10² Hz); whereas, the composites showed poorer mechanical properties as compared to pure LLDPE. In addition, combined use of small amount of alumina short fiber and SiC gave rise to improved overall properties of LLDPE composites. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009     

Effect of polyphenylene sulfide containing amino unit on thermal and mechanical properties of polyphenylene sulfide/glass fiber composites

Three kinds of high‐molecular‐weight compatibilizers [copoly(1,4‐phenylene sulfide)‐poly(2,5‐phenylene sulfide amine)] (PPS‐NH₂) containing different proportions of amino units in the side chain) were synthesized by the reaction of dihalogenated monomer and sodium sulfide via nucleophilic substitution polymerization under high pressure. The intrinsic viscosity of the obtained copolymers was 0.354–0.489 dL/g and they were found to have good thermal performance with melting point (T_m) of 271.3–281.0 °C and initial degradation temperature (T_d) of 490.0–495.7 °C. There was an excellent physical compatibility between PPS‐NH₂ and the pure industrial PPS. The results of dynamic mechanical analysis and macro‐ and micromechanical test showed that the selective compatibilizer PPS‐NH₂ (1.0) (1.0% mol aminated ratio) can improve the mechanical and interfacial properties of polyphenylene sulfide/glass fiber (PPS/GF) composite. The macro‐optimal tensile strength, Young's modulus, bending strength, and notched impact strength of 5%PPS‐NH₂ (1.0)/PPS/GF composite raised up to 141 MPa, 1.98 GPa, 203 MPa, and 6.15 kJ/m², which increased 12.8%, 9.4%, 4.1%, and 13.8%, respectively, comparing with the pure PPS/GF composite (125 MPa, 1.81 GPa, 195 MPa, and 5.40 kJ/m², respectively). © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45804.     

Thermal and dielectric properties of the aluminum particle/epoxy resin composites

Microsized aluminum/epoxy resin composites were prepared, and the thermal and dielectric properties of the composites were investigated in terms of composition, aluminum particle sizes, frequency, and temperature. The results showed that the introduction of aluminum particles to the composites hardly influenced the thermal stability behavior, and decreased T_g of the epoxy resin; moreover, the size, concentration, and surface modification of aluminum particles had an effect on their thermal conductivity and dielectric properties. The dielectric permittivity increased smoothly with a rise of aluminum particle content, as well as with a decrease in frequency at high loading with aluminum particles. While the dissipation factor value increased slightly with an increase in frequency, it still remained at a low level. The dielectric permittivity and loss increased with temperature, owing to the segmental mobility of the polymer molecules. We found that the aluminum/epoxy composite containing 48 vol % aluminum‐particle content possessed a high thermal conductivity and a high dielectric permittivity, but a low loss factor, a low electric conductivity, and a higher breakdown voltage. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010     

Polyimide hollow glass microspheres composite films with low dielectric constant and excellent thermal performance

Nowadays, polyimide (PI) with low dielectric constant is expected to be widely applied in microelectronics. For this reason, hollow glass microspheres (HGM) modified by silane coupling agent KH-550 (K-HGM), a series of HGM/PI and K-HGM/PI composite films with excellent thermal performance, hydrophobic and low dielectric constant were fabricated by in situ polymerization. The effect of HGM/K-HGM content on the properties of composite films was studied. The superior heat resistance of HGM can improve the thermal performance of composite films. Due to silane coupling agent KH-550, K-HGM exhibits a good interfacial compatibility with PI matrix and forms an interfacial adhesion region. With the HGM loading of 6%, comparing with pure PI films, the glass transition temperatures (T_g) of composite films were dramatically increased by 32.3°C. Especially, the low dielectric constant of 2.21 and dielectric loss of 0.0059 at 1 MHz were obtained for the PI/K-HGM composite film with addition of 8 wt%. Thus, PI/K-HGM composite films show more excellent performance. The current work provides a promising solution for fabrication of PI with low dielectric constant and superior thermal performance that may be applied in microelectronics industry.     

Mechanical and thermal properties of eucalyptus fiber composites bonding by blocked polyurethane adhesive

In this work, composites from eucalyptus fiber (EF) and polyurethane emulsion (PU) were prepared. Ethyl cellosolve-blocked polyisocyanate (EC-bp) was used as a novel adhesive and the mechanical and water absorption properties of the prepared composites were analyzed. The results showed that the tensile, flexural, and water resistance properties of the composites modified by such adhesive were enhanced compared with those of unmodified ones. Effects of EC-bp on the thermal degradation and the morphology of the composites were also investigated and compared. The presence of modification on the surface of EC-bp treated EF/PU composites was identified by Fourier transform infrared spectroscopy (FTIR) from the appearance of CO bands absorbance and the reducing of relative intensity of OH. Thermo-gravimetric analysis (TGA) resulted that the thermal stability of the modified composites was improved. Environmental scanning electron microscopy (ESEM) was used to observe the morphology and evaluate the interfacial adhesion of the composites. The results showed that much better homogeneity morphology of the modified composites was achieved, which indicated that the prepared EC-bp as an adhesive could improve the interfacial adhesion. These findings appeared that the occurrence of strong bonds between the composite components in the presence of EC-bp, rather than the unique existence of Van der Waals interactions among the nonpolar structures or the hydrogen bonding interaction. © 2011 Wiley Periodicals, Inc. J Appl Polym Sci, 2012     

Mechanical and dielectric properties and crystalline behavior of multilayer graphite-filled polyethylene composites

As one of the duplicated cases of ultrathin polymer films, multilayer graphite/polymer composites are of great interests in various applications. Graphite/polyethylene (PE) composites with various layer numbers and graphite particle sizes were prepared by lamination. The mechanical and dielectric properties and crystalline behavior of the composites were investigated by scanning electron microscopy, differential scanning calorimetry, tensile test, and dielectric strength test. With the same amount of graphite addition, the tensile strength of the composites increases with decreasing layer thickness, but decreases with increasing graphite particle size. The longitudinal tensile strength is greater than the transverse one. The tensile strength of the 3⁶-layer composites with a particle size of 15 μm has enhancements of 34.76 and 68.39% in the longitudinal and transverse directions compared with that of the single-layer pure PE film. The dielectric constant of the composites nonlinearly increases with decreasing layer thickness, while the dielectric loss is independent of this factor. The dielectric constant of the 3⁶-layer composites with a particle size of 15 μm is about two times as large as that of the single-layer pure PE film. The crystalline peak temperature and the crystallinity of the composites increase with the decrease in layer thickness. Coarse-grained molecular dynamics simulations were also carried out to understand the experimental observations by getting an insight into the microstructure of the multilayer composites. This work would be helpful for the production of optimized of multilayer graphite/polymer composites by lamination for electric energy storage. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 136, 48131.     

Mechanical,thermal, and hydrophobic properties of silica aerogel–epoxy composites

Epoxy composites were prepared with different contents of hydrophobic silica aerogel particles to investigate their mechanical, thermal, and hydrophobic properties. The composites, particularly the one containing 1 wt % silica aerogel, showed remarkable toughness and yielding behaviors compared to neat epoxy, with its brittle behavior. As the content of silica aerogel increased, the thermal properties of the composites (e.g., thermal conductivity and thermal stability) improved. This was due to the very low thermal conductivity and high thermal stability of the silica aerogel particles. Moreover, the use of the hydrophobic silica aerogel led to the development of composites with hydrophobic properties. To examine the hydrophobicity more deeply, a series of water‐uptake tests were performed, and the results show that the composite with 3 wt % silica aerogel absorbed 50% less water than the neat epoxy. © 2017 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2018 , 135, 45706.     

Synthesis,characterization and dielectric properties of nickel-based polyoxometalate/polyurethane composites

The aim of this study was to synthesis, characterization and investigation of the influence of the polyoxometalate concentrations (1, 3, 5 and 10 wt%) on chemical, thermal, physical and morphological properties of nickel-based polyoxometalate/polyurethane composite (Ni-POM/PU) materials. Firstly, nickel-based polyoxometalate (Ni-POM) compound has been synthesized and characterized through various spectroscopic techniques. Synthesized Ni-POM compounds have been used for preparation of polyurethane composites as a reinforcement. Three different Ni-POM/PU composites containing Ni-POM were prepared by solution mixing and casting techniques. The chemical structure and morphology of prepared Ni-POM/PU composite samples were confirmed by Fourier transform infrared spectroscopy (FTIR), elemental analysis and SEM techniques. Effects of Ni-POM on thermal stability, glass transition temperature, optical transparency, hydrophilicity and physical properties of polyurethane composites were examined. Thermal stabilities and glass temperatures of the materials have been checked by differential thermal analysis (DTA), thermogravimetric analysis (TGA) and differential scanning calorimeter (DSC). The SEM results confirmed the highly porous structure and the formation of Ni-POM structures in the polymer matrix. Synthesized composites showed high chemical stability, good processability, and low Tg values. The dielectric properties of the prepared Ni-POM/polyurethane composites were also investigated at room temperature. These results displayed that the dielectric constant of the POM/polyurethane composites decreased with the increase of the Ni-POM content in polymeric matrix.     

Simultaneous impact modified and chain extended glass fiber reinforced poly(lactic acid) composites: Mechanical,thermal, crystallization,and dynamic mechanical performance

Herein, glass fiber (GF) reinforced binary, ternary, and quaternary poly(lactic acid) (PLA) composites were prepared. Toughening, and chain extension of PLA was achieved through the incorporation of impact modifier and chain extender and their concurrent effects on the spectroscopic, crystallization, mechanical, thermal, and thermomechanical properties of the composites were investigated. High mechanical properties of GF influenced the mechanical performance of the composites. However, GF alone could not restrict the chain mobility of PLA due to poor interface and low crystallization activities in the PLA-GF composite. Incorporation of impact modifier and chain extender produced significantly enhanced interaction between GF and PLA. Significantly, the crystallinity, impact strength, and flexural modulus of PLA in the quaternary composite were increased by 58%, 63%, and 66%, respectively. In addition, damping and effectiveness coefficient of the PLA-GF composite were notably reduced by the simultaneous impact modification and chain extension of the reinforced composites.     

Preparation and properties of porous Al5BO9 for high-temperature wave-transparent and thermal insulating applications

Porous Al₅BO₉ is a promising high-temperature wave-transparent material. However, method for the preparation of this material is not readily available. Herein, porous Al₅BO₉ ceramics with controlled porosity and small volume shrinkage are successfully prepared by using Al₂O₃ and B₂O₃ as starting materials without pore formers. The SEM and pore size distribution studies show that the as-prepared porous Al₅BO₉ ceramics exhibit a uniform pore structure and a narrow pore size distribution. Intriguingly, simply adjusting the densities of the green bodies, the density and porosity of the porous Al₅BO₉ ceramics can be controlled. The pore-forming mechanism is presumed to be a combination of boron oxide volatilization during the high-temperature synthesis and lap of elongated grains. Porous Al₅BO₉ ceramics have good high-temperature stability, which can maintain dimensional and composition stability up to 1673 K. The compressive strength can reach 211 MPa at 32.4% porosity and the dielectric constant can be as low as 3.02 at 43.2% porosity. In addition, the dielectric constant and loss tangent keep almost unchanged with temperature.     

Mechanical and thermal properties of hierarchical composites enhanced by pristine graphene and graphene oxide nanoinclusions

Epoxy resin nanocomposites incorporated with 0.5, 1, 2, and 4 wt % pristine graphene and modified graphene oxide (GO) nanoflakes were produced and used to fabricate carbon fiber‐reinforced and glass fiber‐reinforced composite panels via vacuum‐assisted resin transfer molding process. Mechanical and thermal properties of the composite panels—called hierarchical graphene composites—were determined according to ASTM standards. It was observed that the studied properties were improved consistently by increasing the amount of nanoinclusions. Particularly, in the presence of 4 wt % GO in the resin, tensile modulus, compressive strength, and flexural modulus of carbon fiber (glass fiber) composites were improved 15% (21%), 34% (84%), and 40% (68%), respectively. Likewise, with inclusion of 4 wt % pristine graphene in the resin, tensile modulus, compressive strength, and flexural modulus of carbon fiber (glass fiber) composites were improved 11% (7%), 30% (77%), and 34% (58%), respectively. Also, thermal conductivity of the carbon fiber (glass fiber) composites with 4% GO inclusion was improved 52% (89%). Similarly, thermal conductivity of the carbon fiber (glass fiber) composites with 4% pristine graphene inclusion was improved 45% (80%). The reported results indicate that both pristine graphene and modified GO nanoflakes are excellent options to enhance the mechanical and thermal properties of fiber‐reinforced polymeric composites and to make them viable replacement materials for metallic parts in different industries, such as wind energy, aerospace, marine, and automotive. © 2014 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2014 , 131, 40826.     

The impact of polymer matrix blends on thermal and mechanical properties of boron nitride composites

To improve mechanical and thermal properties of a hexagonal boron nitride platelet filled polymer composites, maleic anhydride was studied as a coupling agent and compatibilizer. Injection molded blends of acrylonitrile butadiene styrene (ABS), high-density polyethylene (HDPE), and maleic anhydride with boron nitride filler were tested for thermal conductivity and impact strength to determine whether adding maleic anhydride improved interfacial interactions between matrix and filler and between the polymers. Adding both HDPE and maleic anhydride to ABS as the matrix of the composite resulted in a 40% improvement in impact strength without a decrease in thermal conductivity when compared to an ABS matrix. The best combination of thermal conductivity and impact strength was using pure HDPE as the matrix material. The effective medium theory model is used to help explain how strong filler alignment helps achieve high thermal conductivity, greater than 5 W/m K for 60 wt % boron nitride. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019 , 137, 48661.     

Mechanical and thermal transmission properties of carbon nanofiber‐dispersed carbon/phenolic multiscale composites

The present article reports the development and characterization of carbon nanofiber (CNF)‐incorporated carbon/phenolic multiscale composites. Vapor‐grown CNFs were dispersed homogeneously in to phenolic resin using an effective dispersion route, and carbon fabrics were subsequently impregnated with the CNF‐dispersed resin to develop carbon fiber/CNF/phenolic resin multiscale composites. Mechanical and thermal transmission properties of multiscale composites were characterized. Elastic modulus and thermal conductivity of neat carbon/phenolic and multiscale composites were predicted and compared with the experimental results. It was observed that incorporation of only 1.5 wt % CNF resulted in 10% improvement in Young's modulus, 12% increase in tensile strength, and 36% increase in thermal conductivity of carbon/phenolic composites. Fracture surface of composite samples revealed the formation of stronger fiber/matrix interface in case of multiscale composites than neat carbon/phenolic composites. Enhancement of above properties through CNF addition has been explained, and the difference between the predicted values and experimental results has been discussed. © 2013 Wiley Periodicals, Inc. J. Appl. Polym. Sci., 2013     

Ultra-low cost porous mullite ceramics with excellent dielectric properties and low thermal conductivity fabricated from kaolin for radome applications

Near-net-shape mullite ceramics with high porosity were prepared from ultra-low cost natural aluminosilicate mineral kaolin as raw material and polystyrene micro-sphere (PS) as pore-forming agent. Microstructure, flexural strength, thermal conductivity and dielectric properties of the ceramics were systematically researched. Results show that the porous mullite ceramics possess fibrous skeleton structure formed by a large quantity of interlocked mullite whiskers, which results in good mechanical properties and low-to-zero sintering shrinkage. Flexural strength of the porous mullite ceramics can be up to 41.01 ± 1.12 MPa, even if the porosity is as high as 62.44%. The dielectric constant and loss tangent of the porous mullite ceramics at room temperature are lower than 2.61 and 5.9 × 10⁻³, respectively. Besides, dielectric constant is very stable with the rising of temperature, and the dielectric loss can be consistently lower than 10⁻² when the temperature is not higher than 800 °C. In addition, thermal conductivity at room temperature is as low as 0.163 W/m/K when the porosity of mullite ceramics is 80.05%. The infiltration of SiO₂ aerogels (SiO₂ AGs) can further decrease the thermal conductivity to 0.075 W/m/K, while has just little effects on the dielectric properties. Excellent mechanical, thermal and dielectric properties show that the porous mullite ceramics have potential applications in radome fields. The porous mullite ceramics prepared from kaolin not only have low cost, but also can achieve near-net-shape.