生物芯片

生物芯片是近10年在生命科学领域中迅速发展起来的一项高新技术。它主要是指通过微加工和微电子技术在固体芯片表面构建微型生物化学分析系统，以实现对生命机体的生物组分进行准确、快速、大信息量的检测。目前常见的生物芯片分为三大类：即基因芯片、蛋白芯片和芯片实验室等。生物芯片主要特点是高通量、微型化和自动化，检测效率是传统检测手段的成百上千倍。     

生物科技的新引擎——生物芯片（上）

一 前言 当初次听到“生物芯片”时,很多人会把它当作一种新的电脑芯片。实际上,生物芯片和微处理器芯片有着本质区别。微处理器芯片是由硅、锗等半导体材料经微电子加工技术制作的集成电路设备;而生物芯片只是一种执行生物检测和分析的微型设备。不过从起源     

MEDAguard:基于逻辑加密的微电极点阵生物芯片知识产权保护方案

在微电极点阵(Micro-Electrode-Dot-Array,MEDA)生物芯片外包生产的过程中,未受保护的芯片设计知识产权容易遭受盗窃或过度生产攻击.本文提出一种基于逻辑加密的微电极点阵生物芯片的知识产权保护方案,称为MEDAguard,该方案使用生化协议中的废液滴和输入液滴构成逻辑加密模块,实现对生化协议的锁定...     

一种低成本高效率气动式微流控混合器

液体混合是微流控芯片的重要功能之一,微流控液体混合方式可分为主动式和被动式两种。针对目前微流控混合器存在的被动式混合效率不高和主动式混合器制作工艺复杂等问题,研究设计了一种基于雕刻机加工的低成本、高效率气动式微流控混合器。该微流控芯片采用数控雕刻机快速加工微模具,经PDMS固化、翻模、打孔和键合等工艺,实现了微流控混合器的制作。同时研究设计了多气室脉冲气体驱动模式,有效实现了微量试剂和样品的快速混合。实验结果表明,所研究的主动式微流控混合器可以产生对流混沌作用,显著提高微尺度下的混合效率,为实现低成本的微流控芯片制作和高效试剂混合的MEMS生化检测系统提供了一种有效的技术途径。     

液相生物芯片检测技术的改进

介绍了液相生物芯片检测技术的进展,给出了一种能对液相生物芯片进行快速、准确、高灵敏度分析的检测技术。该技术采用数字图像采集技术获取二维检测区域的微球探针荧光信号,提高了检测速度。微流场是液相芯片的检测场所,研究了微流场系统的设计和流速控制方法。     

生物芯片技术正在崛起

生物芯片主要指通过平面微细加工技术在固体芯片表面构建的微流体分析单元和系统,以实现对细胞、蛋白质、核酸以及其它生物组分的准确、快速、大信息量的检测.高密度基因芯片是最重要的一种生物芯片,芯片上集成的成千上万的密集排列的基因探针,能够在同一时间内分析大量的基因,使人们可迅速读取生命的篇章,准确高效地破译遗传密码.这将是继大规模集成电路之后的又一次具有深远意义的科学技术革命.     

生物芯片无限希冀

生物芯片概念 生物芯片是一种把DNA、蛋白质、抗体、肽等生物分子或细胞固定到硅、玻璃、高分子、和金基板等固体表面上,通过固定化的生物分子、固化蛋白质(探针)等与其他化合物靶点相结合,生成并检测其特异反应的芯片.它具有能以微量样品实现大量快速检测和分析的特点.在需要大量同时并行处理的后染色体时代的生物分子功能分析技术中,以DNA芯片为首的生物芯片技术是最为重要的.基本上,生物芯片是利用生物分子的固有功能来模仿生物功能的人工器件,它是一种诱发电信号又能进行电信号处理的设备.     

引脚约束的数字微流控生物芯片在线并行测试

随着数字微流控生物芯片在生化领域中的广泛应用,对芯片可靠性和制造成本的要求也越来越高,在线测试对于确保微流控生物芯片正常工作异常重要。该文针对引脚约束的数字微流控生物芯片,提出一种基于改进最大最小蚁群算法的在线并行测试方案,在满足各种约束条件的情况下,采用伪随机比例原则,建立禁忌判断策略,自适应地改变信息素的残留系数,实现引脚约束数字微流控生物芯片的在线并行测试。实验结果表明,该方法可以同时用于离线和在线测试,相对于单液滴离线和在线测试,可有效减少芯片的测试时间,提高了测试工作效率。     

生物芯片发展现状和未来

生物芯片技术是近几年才发展起来的高通量检测技术,它利用微电子、微机械、物理化学技术、计算机技术在固体芯片表面构建的微流体分析单元和系统,将生命科学研究中不连续的分析过程(如样品制备、化学反应和分析检测)连续化、集成化、微型化〔1〕。本文就生物芯片的类型、发展状况及其应用作简要论述。     

参比型SPR生物芯片的检测

参比型SPR生物芯片是一种具有参比、检测两个位点的葡聚糖修饰的SPR生物芯片。为了验证该芯片的效果，进行了在芯片上固定人IgG，检测溶液中的羊抗人IgG的免疫结合试验。参比位点的SPR信号随溶液的变化而变化，但不会固定人IgG，检测位点可以牢固地固定人IgG。羊抗人IgG可以与固定在芯片上的人IgG发生免疫结合反应。这种方法可用来进行固定抗原检测抗体的研究。     

Resolution Enhancement Technology:Integrated Process Solutions using OPC

DUV lithography, using the 248 nm wavelength, is a viable manufacturing option for devices with features at 130 nm and less. Given the low kl value of the lithography, integrated process development is a necessary method for achieving acceptable process latitude. The application of assist features for rule based OPC requires the simultaneous optimization of the mask, illumination optics and the resist.Described in this paper are the details involved in optimizing each of these aspects for line and space imaging.A reference pitch is first chosen to determine how the optics will be set. The ideal sigma setting is determined by a simple geometrically derived expression. The inner and outer machine settings are determined, in turn,with the simulation of a figure of merit. The maximum value of the response surface of this FOM occurs at the optimal sigma settings. Experimental confirmation of this is shown in the paper.Assist features are used to modify the aerial image of the more isolated images on the mask. The effect that the diffraction of the scattering bars (SBs) has on the image intensity distribution is explained. Rules for determining the size and placement of SBs are also given.Resist is optimized for use with off-axis illumination and assist features. A general explanation of the material' s effect is discussed along with the affect on the through-pitch bias. The paper culminates with the showing of the lithographic results from the fully optimized system.     

Cost-effective test solutions for smart card and other integrated flash applications

From its emergence in the late 1980s as a lower cost alternative to early EEPROM technologies, flash memory has evolved to higher densities and speedsand rapidly growing acceptance in mobile applications.In the process, flash memory devices have placed increased test requirements on manufacturers. Today, as flash device test grows in importance in China, manufacturers face growing pressure for reduced cost-oftest, increased throughput and greater return on investment for test equipment. At the same time, the move to integrated flash packages for contactless smart card applications adds a significant further challenge to manufacturers seeking rapid, low-cost test.     

Theoretical analysis of the relationship between the Brillouin gain coefficient and the strain in the optical-fiber sensors

The relation between the power of the Brillouin signal and the strain is one of the bases of the distributed fiber sensors of temperature and strain. The coefficient of the Bfillouin gain can be changed by the temperature and the strain that will affect the power of the Brillouin scattering. The relation between the change of the Brillouin gain coefficient and the strain is thought to be linear by many researchers. However, it is not always linear based on the theoretical analysis and numerical simulation. Therefore, errors will be caused if the relation between the change of the Brillouin gain coefficient and the strain is regarded as to be linear approximately for measuring the temperature and the strain. For this reason, the influence of the parameters on the Brillouin gain coefficient is proposed through theoretical analysis and numerical simulation.     

An improved parallel thinning algorithm with two subiterations

The parallel thinning algorithm with two subiterations is improved in this paper. By analyzing the notions of connected components and passes, a conclusion is drawn that the number of passes and the number of eight-connected components are equal. Then the expression of the number of eight-connected components is obtained which replaces the old one in the algorithm. And a reserving condition is proposed by experiments, which alleviates the excess deletion where a diagonal line and a beeline intersect. The experimental results demonstrate that the thinned curve is almost located in the middle of the original curve connectivelv with single pixel width and the processing speed is high.     

Novel fiber-optical interferometer with miniaturized probe for in-hole measurements

Today, micro-system technology and the development of new MEMS （Micro-Electro-Mechanical Systems） are emerging rapidly. In order for this development to become a success in the long run, measurement systems have to ensure product quality. Most often, MEMS have to be tested by means of functionality or destructive tests. One reason for this is that there are no suitable systems or sensing probes available which can be used for the measurement of quasi inaccessible features like small holes or cavities. We present a measurement system that could be used for these kinds of measurements. The system combines a fiber optical, miniaturized sensing probe with low-coherence interferometry, so that absolute distance measurements with nanometer accuracy are possible.     

Development of the readout system for waveguide multilayer optical card

Waveguide multilayer optical card （WMOC） is a novel storage device of three-dimensional optical information. An advanced readout system fitting for the WMOC is introduced in this paper. The hardware mainly consists of the light source for reading, WMOC, motorized stages addressing unit, microscope imaging unit, CCD detecting unit and PC controlling ＆ processing unit. The movement of the precision motorized stage is controlled by the computer through Visual Basic （VB） language in software. A control panel is also designed to get the layer address and the page address through which the position of the motorized stages can be changed. The WMOC readout system is easy to manage and the readout result is directly displayed on computer monitor.     

Study of waveguide coupling efficiency in hybrid silicon lasers

This paper presents a new method to increase the waveguide coupling efficiency in hybrid silicon lasers. We find that the propagation constant of the InGaAsP emitting layer can be equal to that of the Si resonant layer through improving the design size of the InP waveguide. The coupling power achieves 42% of the total power in the hybrid lasers when the thickness of the bonding layer is 100 nm. Our result is very close to 50% of the total power reported by Intel when the thickness of the thin bonding layer is less than 5 nm. Therefore, our invariable coupling power technique is simpler than Intel＇s.     

Collinear phase-matching study of terahertz-wave generation via difference frequency mixed in GaAs and Inp

The collinearly phase-matching condition of terahertz-wave generation via difference frequency mixed in GaAs and InP is theoretically studied. In collinear phase-matching, the optimum phase-matching wave hands of these two crystals are calculated. The optimum phase-matching wave bands in GaAs and lnP are 0.95-1.38μm and 0.7-0.96μm respectively. The influence of the wavelength choice of the pump wave on the coherent length in THz-wave tuning is also discussed. The influence of the temperature alteration on the phase-matching and the temperature tuning properties in GaAs crystal are calculated and analyzed. It can serve for the following experiments as a theoretical evidence and a reference as well.     

Effects of the alloy compositions on the phonon-polaritons in ternary mixed crystals

Composition dependence of bulk and surface phonon-polaritons in ternary mixed crystals are studied in the framework of the modified random-element-isodisplacement model and the Bom-Huang approximation. The numerical results for Several Ⅱ - Ⅵ and Ⅲ- Ⅴ compound systems are performed, and the polariton frequencies as functions of the compositions for ternary mixed crystals AlxGa1-xAs, GaPxAS1-x, ZnSxSe1-x, GaAsxSb1-x, GaxIn1-xP, and ZnxCd1-xS as examples are given and discussed. The results show that the dependence of the energies of two branches of bulk phonon-polaritons which have phonon-like characteristics, and surface phonon-polaritons on the compositions of ternary mixed crystals are nonlinear and different from those of the corresponding binary systems.     

New insert layer structure OLEDs

An insert layer structure organic electroluminescent device（OLED） based on a new luminescent material （Zn（salen）） is fabricated. The configuration of the device is ITO/CuPc/NPD/Zn（salen）/Liq/LiF/A1/CuPc/NPD/Zn（salen）/Liq/LiF/A1. Effective insert electrode layers comprising LiF（1nm）/Al（5 nm） are used as a single semitransparent mirror, and bilayer cathode LiF（1 nm）/A1（100 nm） is used as a reflecting mirror. The two mirrors form a Fabry-Perot microcavity and two emissive units. The maximum brightness and luminous efficiency reach 674 cd/m^2 and 2.652 cd/A, respectively, which are 2.1 and 3.7 times higher than the conventional device, respectively. The superior brightness and luminous efficiency over conventional single-unit devices are attributed to microcavity effect.