Dy掺杂的CdS薄膜的制备及性能分析

采用化学水浴法在玻璃衬底上制备纯的和稀土Dy掺杂的CdS薄膜,并在N2气氛中,对以上制备的薄膜进行T=350℃、t=40min的热处理.实验结果表明,水浴温度在70℃～80℃间制备的CdS薄膜,表面致密、光滑,膜的质量最好,且为沿[111]晶向择优生长的立方闪锌矿结构.掺Dy虽未改变CdS薄膜的晶体结构,但改善了薄膜的表面形貌,使得薄膜的致密性增强、颗粒大小匀称,同时Dy的掺入增大了CdS薄膜在可见光范围内的透光率.     

磁控溅射法制备的CdS:Al薄膜的性质研究

采用Al和CdS双靶共溅射的方法, 调控Al和CdS源的沉积速率, 制备出不同Al掺杂浓度的CdS:Al薄膜。通过XRD、SEM、AFM、紫外-可见透射光谱分析、常温霍尔测试对CdS: Al薄膜的结构、形貌、光学和电学性质进行表征。XRD结果表明, 不同Al掺杂浓度的CdS:Al薄膜均为六方纤锌矿结构的多晶薄膜, 并且在(002)方向择优生长。SEM和AFM结果表明, CdS:Al薄膜的表面均匀致密, 表面粗糙度随着Al掺杂浓度的增加略有增加。紫外-可见透射光谱分析表明, CdS:Al薄膜禁带宽度在2.42~2.46 eV 之间, 随着Al掺杂浓度的增加而略微减小。常温霍尔测试结果证明, 掺Al对CdS薄膜的电学性质影响显著, 掺Al原子浓度3.8%以上的CdS薄膜, 载流子浓度增加了3个数量级, 电阻率下降了3个数量级。掺Al后的CdS薄膜n型更强, 有利于与CdTe形成更强的内建场, 从而提高太阳电池效率。用溅射方法制备的CdS:Al薄膜的性质适合用作CdTe薄膜太阳电池的窗口层。     

直流反应磁控溅射制备单一相Cu_2O薄膜及光电性能研究

室温下,采用直流反应磁控溅射法制备透明导电氧化亚铜(Cu_2O)薄膜。利用X射线衍射仪(XRD)、原子力显微镜(AFM)、四探针测试仪及拉曼光谱仪分别研究不同沉积时间下制备的Cu_2O薄膜的晶体结构、表面形貌、电阻率及表面增强拉曼散射特性。实验结果表明,沉积时间为3和6min时,获得单一相的透明导电Cu_2O薄膜;随着沉积时间的增加,薄膜由非晶态转变为(111)方向择优生长,薄膜致密且颗粒呈球状,其粗糙度的均方根(RMS)值增大,薄膜电阻率呈下降趋势;以罗丹明B(RhB)为探针分子,表征样品表面增强拉曼活性,通过对比不同样品表面RhB的拉曼光谱,其散射强度随薄膜表面粗糙度的增大而增强。     

工艺参数和热处理温度对ZrW_2O_8薄膜制备的影响

采用WO3和ZrO2复合陶瓷靶材,以射频磁控溅射法在石英基片上沉积制备了ZrW2O8薄膜.利用X射线衍射仪(XRD)、表面粗糙轮廓仪和扫描电子显微镜(SEM),研究了不同工艺参数和不同退火温度对ZrW20s薄膜的相组成、沉积速率和表面形貌的影响.采用高温X射线衍射和Powder X软件研究薄膜的负热膨胀特性.实验结果表明随着溅射功率的增加,薄膜沉积速率增加;而随着工作气压的增加,薄膜沉积速率先增加后减小;磁控溅射沉积制备的ZrW20s薄膜为非晶态,表面平滑、致密,随着热处理温度的升高,薄膜开始结晶且膜层颗粒增大;在740℃热处理3 n血后得到膜层颗粒呈短棒状的三方相ZrW2O8薄膜,在1200℃密闭条件下热处理3 min淬火后得到膜层颗粒呈球状的立方相ZrW2O8薄膜,且具有良好的负热膨胀特性.     

无反应直流溅射中功率对ZnO：Al薄膜光电性能与形貌的影响

采用氧化锌铝陶瓷靶材，在室温下使用无氧直流磁控溅射法于载玻片衬底上制备了ZnO：Al透明导电薄膜，研究了溅射功率对薄膜微观结构、电阻率和透光率的影响。结果表明：薄膜具有六方纤锌矿结构并沿C轴择优取向生长，沉积速率与溅射功率呈准线性关系。溅射功率对薄膜的电阻率和表面形貌有显著影响，当功率为80w和120w时，薄膜的电阻率值为7．2×10^-3Ω·cm和2．3×10^-3Ω·cm，表面形貌分别为光滑与织构化,但溅射功率对薄膜的透光率影响不大，薄膜在可见光区的平均透光率均在90％左右。     

等离子体辅助ITO薄膜低温生长

采用基片加热和后期热处理的手段使ITO薄膜结晶和调整其组织结构来降低电阻的方法,已经被广泛应用于在玻璃等基体上制备ITO薄膜.但是随着不耐高温的柔性基体的广泛使用,ITO薄膜低温生长已经成为一个重要的研究课题.为此,本研究探讨室温等离子体辅助条件下,ITO薄膜沉积生长过程,以期为上述问题的解决提供理论依据.研究结果表明等离子辅助可以有效控制ITO薄膜的结晶程度和晶粒尺寸以及晶界结构,在优化条件下,在PET基体上制备出电阻率为1.1×10-3Ω·cm的ITO薄膜.     

室温下高速沉积AZO薄膜的研究

在室温下,采用射频磁控溅射技术以较大的功率密度(7W/cm2)沉积了一系列掺铝氧化锌(AZO)透明导电薄膜,探索了溅射压强对沉积速率及薄膜性能的影响。结果表明,当工作压强为2.0Pa时,高速(67nm/min)沉积得到的薄膜的电阻率为2.63×10-3Ω.cm,可见光平均透过率为83%,并且在薄膜表面有一定的织构。     

Ar-CdCl_2热处理和稀土Nd掺杂对CdS/CdTe复合薄膜结构及其光学性能的影响

在TCO玻璃衬底上依次采用化学水浴法和真空热蒸发工艺沉积CdS、CdTe薄膜,并在不同条件下进行热处理,制备了CdS/CdTe异质结复合薄膜。通过X射线衍射、扫描电镜,紫外-可见(U-V)透射光谱研究了不同温度下稀土Nd掺杂以及Ar-CdCl2热处理对薄膜结构、形貌和光学性能的影响。结果表明:不同条件下制备的薄膜均具有(111)晶面择优取向;样品表面形貌在不同条件下热处理后存在剧烈的差异,随着热处理温度的升高,薄膜晶粒增大;掺入Nd并在Ar-CdCl2氛围下热处理后,薄膜致密且粒径均匀,粒径明显增大,其(111)晶面的择优取向进一步增强。U-V透射光谱分析表明,Ar气氛下热处理对改善薄膜的光吸收作用并不明显,但掺Nd和在Ar-CdCl2氛围下热处理均可明显增强薄膜的光吸收性能,这对于提高太阳电池的光谱响应是非常有利的。     

射频磁控溅射沉积高质量ZnO薄膜的工艺研究

在室温下利用射频磁控溅射法在硅(100)基片上制备ZnO薄膜,利用X射线衍射(XRD)和扫描电子显微镜(SEM)对其结晶性能进行分析。研究了制备条件对薄膜沉积速率的影响。分析了薄膜沉积速率对薄膜结晶状况的影响及源气体中的氧气和氩气的流量比对薄膜结晶状况的影响。研究结果表明,薄膜的生长速率强烈依赖于射频功率和工作气压,薄膜的结晶性能强烈依赖于薄膜的沉积速率和反应气体中氧气和氩气的流量比。制备高结晶质量的ZnO薄膜的最佳工艺参数为靶到衬底的距离为4cm,输入功率为250W,源气体中氩气和氧气的流量比n(Ar)∶n(O2)为5∶20,溅射工作气压为2Pa。在最佳工艺条件下所制备的薄膜表面平整致密,接近单晶,在可见光区的透射率高达90%。     

电子束蒸发制备CdS多晶薄膜及性质研究

采用电子束蒸发工艺在普通玻璃衬底上制备了硫化镉(CdS)多晶薄膜,研究了不同衬底温度对薄膜结构、表面形貌及光透过率的影响.测试结果显示:(1)不同衬底温度下沉积的CdS薄膜均呈现了〈002〉晶向的高度优势生长,属于六方相结构.随着衬底温度的升高,还逐渐出现了〈103〉、〈004〉、〈105〉等六方晶向;(2)CdS多晶薄膜表面连续,致密性好,且晶粒大小随着衬底温度的升高而增大;(3)低温下制备CdS薄膜吸收谱有较宽的吸收边,随着衬底温度的升高,吸收曲线趋于陡直.制备样品在550nm波段后的平均透过率都超过70%,符合作为CdTe太阳电池的窗口层.     

Effects of annealing temperature on the structural,morphology, optical properties and resistivity of sputtered CCTO thin film

CaCu₃Ti₄O₁₂ (CCTO) thin films with a thickness of 200 nm were deposited on ITO substrates by RF magnetron sputtering using a pure CCTO target. After the deposition, thin films were annealed at 400, 450, 500 and 550?°C, respectively, for 1 h. The effects of annealing temperature on the structural, surface morphology, optical properties and resistivity of (CCTO) thin films were investigated. The X-ray diffractometer results show that the thin films are polycrystalline in nature and are assigned to body-centered cubic perovskite configuration with a space group of Im-3. The intensity of the peaks and crystallinity gradually increased with the increase in annealing temperature. Microstructural investigation through FESEM showed that the grain size increased with increase in annealing temperature from 32 to 85 nm. The root mean square and roughness (Ra) were also enhanced with higher annealing temperatures, from 3.8 to 6.2 nm and from 4.7 to 7.7 nm, respectively, as confirmed by AFM. Increase in annealing temperature also affected the optical transmittance values which decreased to almost 60% at the visible range (550–850), as well as the optical energy band gap which decreased from 3.86 to 3.39 eV. The relevance between resistance behaviors and film microstructure is discussed. Therefore, it can be concluded that the desirable crystallinity, surface roughness, energy band gap and resistivity for 200 nm thick CCTO thin films deposited by RF magnetron sputtering can be achieved through the annealing process.     

The effect of rapid thermal annealing on structural and electrical properties of TiB2 thin films

This work reports on the effect of post-deposition rapid thermal annealing on the structural and electrical properties of deposited TiB₂ thin films. The TiB₂ thin films, thicknesses from 9 to 450 nm, were deposited by e-beam evaporation on high resistivity and thermally oxidized silicon wafers. The resistivity of as-deposited films varied from 1820 μΩ cm for the thinnest film to 267 μΩ cm for thicknesses greater than 100 nm. In the thickness range from 100 to 450 nm, the resistivity of TiB₂ films has a constant value of 267 μΩ cm.

A rapid thermal annealing (RTA) technique has been used to reduce the resistivity of deposited films. During vacuum annealing at 7 × 10⁻³ Pa, the film resistivity decreases from 267 μΩ cm at 200 °C to 16 μΩ cm at 1200 °C. Heating cycles during RTA were a sequence of 10 s. According to scanning tunneling microscopy analysis, the decrease in resistivity may be attributed to a grain growth through polycrystalline recrystallization, as well as to an increase in film density.

The grain size and mean surface roughness of annealed films increase with annealing temperature. At the same time, the conductivity of the annealed samples increases linearly with grain size. The obtained results show that RTA technique has a great potential for low resistivity TiB₂ formation.     

Electrical properties of thin metal zinc films

Thin metal zinc films 40 to 200 nm thick are deposited by thermal evaporation at room temperature onto glass substrates with a deposition rate of 0.2 to 0.7 nm sec^–1. The electrical resistivity is measured as a function of film thickness, deposition rate and annealing temperature. The experimental results show that electrical resistivity decreases as the film thickness, deposition rate and annealing temperature increase, while the temperature coefficient of resistivity increases with the increase in the film thickness. The calculated values of the activation energy for the conduction electrons increases as the film thickness and deposition rate increase. The well known Fuchs-Sondheimer model is applied for zinc films. The theoretically calculated values for the electrical resistivity and the temperature coefficient of resistivity are in good agreement with the experimental results.     

Preparation of taN thin film by H2 plasma assisted atomic layer deposition using tert-butylimino-tris-ethylmethylamino tantalum

The plasma assisted atomic layer deposition (ALD) of tantalum nitride (TaN) thin films were conducted using tert-butylimino-tris-ethylmethylamino tantalum (TBTEMAT) and hydrogen plasma at 250 degrees C. The effects of H2-plasma pulse time and RF power on the film properties, such as resistivity, surface roughness, step coverage and stability in air, were examined. The film growth rate (thickness/cycle) was in the range of 0.05-0.08 nm/cycle and the resistivity of the films varied from 490 to 70,000 microomega cm, depending on the plasma conditions. Longer plasma pulse times and increasing RF power yielded films of lower resistivity along with improving the stability. The films were smooth and the conformality of the films deposited in 0.28 microm holes with an aspect ratio of 7:1 was 100%.     

退火条件对Sn掺杂ZnO薄膜光电性能的影响

采用溶胶-凝胶法在普通载玻片上制备Sn掺杂ZnO薄膜(SZO薄膜)。研究空气退火、低真空退火、高真空退火、氮气退火、三高退火、循环退火6种不同退火条件对SZO薄膜光电性能的影响。结果表明:6种不同的退火条件制备的SZO薄膜均为纤锌矿结构且具有c轴择优取向生长的特性。高真空退火下,SZO薄膜的结晶状况和电学性质最优,最低电阻率可达到5.4×10~(-2)Ω·cm。薄膜的可见光区平均透过率均大于85%。薄膜在390nm和440nm附近(325nm光激发下)都出现光致发光峰,在空气、氮气、低真空中退火后薄膜440nm处发光强度最为显著。     

Dependence of electrical properties on thermal temperature in nanocrystalline SnO2 thin films

Nanocrystalline SnO2 thin films were prepared by pulsed laser deposition techniques on clean glass substrates, and the films were then annealed for 30 min from 50 to 550 degrees C with a step of 50 degrees C, respectively. The investigation of X-ray diffraction confirmed that the various SnO2 thin films were consisted of nanoparticles with average grain size in the range of 23.7-28.9 nm. Root-mean-square surface roughness of the as-prepared SnO2 thin film was measured to be 25.6 nm which decreases to 16.2 nm with thermal annealing. Electrical resistivity and refractive index were measured as a function of annealing temperature, and found to lie between 1.24 to 1.45 momega-cm, and 1.502 to 1.349, respectively. The results indicate that nearly opposite actions to root-mean-square surface roughness and electrical resistivity make a unique performance with thermal annealing temperature. The post annealing shows greater tendency to affect the structural and electrical properties of SnO2 thin films which composed of nanoparticles.     

Structural and electrical properties of RuO2 thin films prepared by rf-magnetron sputtering and annealing at different temperatures

Conductive ruthenium oxide (RuO₂) thin films have been deposited at different substrate temperatures on various substrates by radio-frequency (rf) magnetron sputtering and were later annealed at different temperatures. The thickness of the films ranges from 50 to 700 nm. Films deposited at higher temperatures show larger grain size (about 140 nm) with (200) preferred orientation. Films deposited at lower substrate temperature have smaller grains (about 55 nm) with (110) preferred orientation. The electrical resistivity decreases slightly with increasing film thickness but is more influenced by the deposition and annealing temperature. Maximum resistivity is 861 μΩ cm, observed for films deposited at room temperature on glass substrates. Minimum resistivity is 40 μΩ cm observed for a thin film (50 nm) deposited at 540°C on a quartz substrate. Micro-Raman investigations indicate that strain-free well-crystallized thin films are deposited on oxidized Si substrates.     

Al掺杂ZnO薄膜的制备及其电学性能研究

采用溶胶-凝胶法在玻璃基底上制备掺杂铝的氧化锌薄膜.研究了不同的铝掺杂浓度、薄膜厚度以及退火温度对电阻率的影响,结果表明掺杂铝摩尔分数为2%、退火温度在550℃时电阻率最低,电阻率随着薄膜厚度的增加而减小.通过XRD和SEM对薄膜的组织结构和形貌进行了表征,结果表明样品表面相对平整、致密,AZO薄膜保持着ZnO六角纤锌矿结构,说明了Al原子对Zn原子的有效替位.     

Optical and electrical properties of ZnO nanoparticle thin films deposited on quartz by sparking process

ZnO nanoparticle thin films were deposited on quartz substrates by a novel sparking deposition which is a simple and cost-effective technique. The sparking off two zinc tips above the substrate was done repeatedly 50-200 times through a high voltage of 10 kV in air at atmospheric pressure. The film deposition rate by sparking process was approximately 1.0 nm/spark. The ZnO thin films were characterized by X-ray diffraction, Raman spectroscopy, UV-vis spectrophotometry, and ionoluminescence at room temperature. The two broad emission peaks centered at 483 nm (green emission) and 650 nm (orange-red emission) were varied after two-step annealing treatments at 400-800 °C. Moreover, the electrical resistivity of the films was likely to be proportional to the peak intensity of the orange-red emission.     

Electrical resistivity of Ti-Zn mixed oxide thin films deposited by atomic layer deposition

Ti-Zn mixed oxide thin films, with thickness less than 50 nm, were grown with atomic layer deposition (ALD) technique at low temperature (90 °C) varying the composition. ALD is a powerful chemical technique to deposit thin films with thickness of few atomic layers. ALD oxide material growth is achieved by dosing sequentially the metal precursor and the oxidizing agent. Thanks to ALD nature of layer by layer growth it was possible to realize mixed metal, Ti and Zn, oxide thin films with controlled composition, simply by changing the number of cycles of each metal oxide layer. Structural and electrical properties of the prepared thin films were studied as a function of their composition. Synchrotron radiation X-ray diffraction technique was used to follow thin film crystallization during sample annealing, performed in situ. It was observed that the onset temperature of crystallization raises with Ti content, and sample structure was Zn₂TiO4 phase. Electrical resistivity measurements were performed on crystalline samples, annealed at 600 °C, revealing an increase in resistivity with Ti content.