Packaging for a 40-channel parallel optical interconnection modulewith an over-25-Gbit/s throughput

NTT is currently working on developing a high-throughput interconnection module that is both compact and cost effective. The technology being developed is called “parallel inter-board optical interconnection technology”, or “ParaBIT”. The ParaBIT module that has been developed is the first step; it is a front-end module with 40 channels, a throughput of over 25 Gbit/s, and a transmission distance of over 100 m along multimode fibers. One major feature of this module is the use of vertical-cavity surface-emitting laser (VCSEL) arrays as very cost-effective light sources. These arrays enable the same packaging structure to be used for both the transmitter and receiver. To achieve super-multichannel performance, high-density multiport bare-fiber (BF) connectors were developed for the module's optical interface. Unlike conventional optical connectors, these BF connectors do not need a ferrule or spring. This ensures physical contact with an excellent insertion loss (less than 0.1 dB per channel). A polymeric optical waveguide film with a 45° mirror for coupling to the VCSEL and photo-diode (PD) arrays by passive optical alignment was also developed. To facilitate coupling between the VCSEL/PD array chips and the waveguide, a packaging technique was developed to align and die bond the optical array chips on a substrate. This technique is called transferred multichip bonding (TMB); it can be used to mount optical array chips on a substrate with a positioning error of only several micrometers. These packaging techniques enabled ultra-parallel interconnections to be achieved in prototype ParaBIT modules     

有源相控阵射频系统稳定性设计与评估

有源相控阵的核心是微波射频系统,包含T/R组件和延时放大组件。T/R组件具有高效率、高幅度相位稳定性、高可靠性、低成本、小型化等优点。在组件小型化的同时提供了极高的射频增益,其稳定性设计与评估就显得十分重要。文中介绍了有源相控阵射频系统稳定性常见的问题以及评估方法,用此方法确保了微波射频系统的稳定性,同时极大提高了雷达的可靠性和安全性,为有源相控阵雷达长期稳定运行提供了有力的技术保证。     

射频微机电系统技术现状

较全面地介绍了 RF MEMS 器件、由 RF 器件构成的组件及应用系统,并给出了一些新的典型示例。通过比较 RF MEMS 器件与传统微波器件在性能、尺寸等各方面的差别,可以了解 RF MEMS 技术在相控阵雷达上运用的优势。     

Parallel optical interconnection for uncoded data transmission with1 Gb/s-per-channel capacity, high dynamic range, and low powerconsumption

The design, realization, and characterization of a multichannel dc-coupled ECL-voltage compatible parallel optical interconnection with a bit rate of up to 1 Gb/s-per-channel is reported. The transmitter module consists of an array of laser diodes with low threshold currents and the 50 Ω matching network, the receiver module of a photo diode array and an amplifier array. All the opto-electronic and electronic components are fabricated as arrays with a pitch of 250 μm. The total power consumption is 110 mW per channel, For a BER <10¹⁴ the dynamic range is 15 dB for a bit rate per channel of 200 Mb/s, 13 dB for 630 Mb/s, and 8 dB for 1 Gb/s. The channel crosstalk is below -48 dB (electrical). The size of the opto-electronic parts (12 channels, without electrical connectors) is only 10 mm (length)×5 mm (width)×4 mm (height)     

The IRIDIUM main mission antenna concept

The design of a novel phase array panel that provides the L-band satellite to ground links for the IRIDIUM global communications system is presented. Key components and aspects of this phase array antenna are discussed including the beamforming architecture, radiated intermodulation products, the patch radiators, and the T/R module. The strategy for minimizing DC power consumption over a large range of multicarrier RF output power is described. Finally, test results showing compliant array operation are summarized     

美国军用射频连接器的发展

通过描述美国军用小型射频连接器,特别是射频频率远高于1 GHz下工作的军用射频连接器的发展情况.给出的军用射频连接器有基本互连连接器、非常用互连连接器和精密测量连接器.重点介绍了SMA,K,BNC,N,APC-7mm,SMB,SMC,W,V,3.5 mm,2.9 mm,1.85 mm和1.0 mm型射频连接器的发展.     

Compact multielement Marconi-Franklin type printed antennas for millimeter wireless systems

Two novel Marconi-Franklin type printed antenna arrays, each consisting of three radiating elements arranged in a cascade configuration, are investigated. Both antennas are printed on a single high permittivity dielectric substrate and fed by SMA connectors, although coplanar waveguide (CPW) feed could easily be applied to further allow easier integration into an RF chip module. Two constructed prototypes, suitable for local-multipoint-distribution service operation in the 26-GHz band (25.5-26.5 GHz), are demonstrated. The constructed prototypes show an impedance bandwidth of about 1 GHz and a maximum gain of more than 5 dBi, with small variations (<1.8 dBi), is obtained across the achieved impedance bandwidth. Details of theoretical and experimental results showing impedance and radiation characteristics for both prototype antennas are given and discussed.     

A 60-GHz point-to-multipoint millimeter-wave fiber-radio communication system

A 60-GHz point-to-multipoint wireless access link with data rate of 156 Mb/s incorporating 60-GHz transceiver modules and full-duplex fiber-optic millimeter-wave transmission is developed for short-range applications such as indoor wireless local area networks and intelligent transport systems. For compact system configuration, a small-size millimeter-wave transceiver module with planar antennas is developed. The transceiver module is based on broadband planar integration and packaging of millimeter-wave circuits. The RF output power is +10 dBm and the measured 3-dB antenna beamwidth is 30/spl deg/. The total size of the developed 60-GHz transceiver module, except input and output connectors, is 50 mm /spl times/ 75 mm /spl times/ 35 mm. A point-to-point full duplex fiber-optic configuration is extended to the scheme with multiple access points (APs) by using a tree coupler and a dense wavelength division multiplexing multiplexer. The AP has a simple configuration without frequency conversion. The bit error rate and packet error rate performances of the 60-GHz fiber-radio access link are evaluated. Furthermore, the effect of the extension to the scheme with multiple APs is investigated.     

Design and Characterization of Solid-State LDMOS Based T/R Module

Solid-state transmit/receive modules (T/R) are the vital super components of the multifunction Active Phased Array Radars. The Active Phased Array Radar consists of several solid-state T/R module to achieve the required power aperture product. This paper describes the realization of S-band dual T/R module. The research consists of design, modelling, analysis challenges, realization, and characterization. Studied several solid-state devices such as silicon bipolar junction transistors moving on to laterally diffused metal oxide semiconductor (LDMOS). The study eventually overtaken by the advancement in gallium arsenide and gallium nitride. The LDMOS devices are designed to handle the required power and could support up to a 20% duty cycle. Based on commercial off-the-shelf devices, we have studied, analyzed their performance, presented trade-offs between different performance parameters, and proposed a common arm architecture for a set of requirements. Dual T/R modules consist of two identical TRMs having two independent RF antenna connectors and a common RF input/output connector. A detailed methodology and step-by-step results were presented for developing S-band T/R modules for multi-function Active Phased Array Radar applications.

     

基于硅基堆叠SIP技术的超宽带T/R组件

传统的超宽带T/R组件采用的是两维砖块式结构,体积和重量已不适应目前小型化、低剖面、易共形的相控阵天线要求。文中提出的基于硅基堆叠系统级封装(SIP)技术,将四通道的射频芯片高度集成在硅基介质基板上,将多层介质基板厚金压合,实现多层堆叠的三维封装。通过采用芯片多功能集成技术和超宽带射频信号的垂直互连技术,设计出三维堆叠的四通道超宽带T/R组件。T/R组件带宽为6 GHz～18 GHz,单通道的发射功率优于23 dBm,接收增益优于20 dB,可实现6位数控衰减及6位数控移相,尺寸仅有13.0 mm×13.0 mm×3.4 mm。该技术可以实现多通道超宽带T/R组件的SIP封装,有利于工程应用。     

射频三同轴电缆和连接器的结构及屏蔽性能

介绍了数据总线用射频三同轴电缆及连接器的应用情况，并对电缆和连接器的结构及屏蔽性能进行了分析。     

多功能相控阵雷达发展现状及趋势

多功能相控阵雷达(MPAR)是一种高性能相控阵雷达,一部MPAR就可以实现多部传统雷达才能实现的功能,从而大大降低了使用和维护成本,是雷达发展过程中的一项重大进步和创新.文中首先分体制、产品和波段3个方面介绍了MPAR的发展现状;然后,分析了MPAR关键技术,如射频模块技术、了阵列集成技术、多波束形成技术、双极化技术、MI-MO技术等;最后,指出了 MPAR的发展趋势.     

基于软件无线电架构的智能天线幅相校准

针对天线阵对多通道幅度和相位一致性的要求,在基于软件无线电(Software Defined Radio,SDR)架构的智能天线基础上提出了射频通道幅相测算和板级幅相测算相结合方案,具备幅相慢变特性的射频通道采用离线参数法,而板上多通道采用在线测算法,并采用星座旋转算法实现了相位校准.最后通过现场可编程门阵列(Field Programmable Gate Array,FPGA)模块仿真验证了该校准方法的正确性,并分析了系统误差来源及规避方法,为多通道系统幅相校准提供了工程化应用基础.     

基于MLX90621红外传感器的开关柜温度无线监测系统设计

介绍了一种基于MLX90621红外传感器的开关柜 母线接头温度无线监测系统。采用STM32微控制器、MLX90621红 外传感器和nRF24L01无线通讯模块,设计了这种温度无线采集系统 的硬件和软件部分。通过非接触式MLX90621红外传感器阵列 可实时采集高压开关柜的母线接头温度。其数据可通过nRF24L01通讯模 块和串口上传给上位机进行显示。由于具有成本低、稳定性 高、抗干扰强等优点,该系统适用于开关柜内部的复杂磁场环境。     

射频同轴连接器的失效原因分析及提高其可靠性的方法

本文介绍了射频同轴连接器几种常见的失效模式,分析了失效产生的原因,并提出一些提高其可靠性的方法.     

Standardization of coaxial connectors in the IEC

This paper reviews the requirements and standardization of coaxial connectors in the United States. It details the standardization of coaxial connectors within the International Electrotechnical Commission (IEC) Subcommittee SC46D "Connectors for RF Cables." A list of published IEC connector standards and a list of IEC standards under consideration are included.     

感应钎焊技术及其在电连接器焊接中的应用

感应钎焊技术因其具有加热迅速、焊接效率高、焊料氧化少和加热部位局域化的优点,被用来焊接微波组件中的电连接器。针对组件外形不同和待焊电连接器种类不同,设计了与组件结构相匹配的感应线圈,探索优化了感应加热参数设置。焊接获得的电连接器焊缝质量良好、气密性指标优异,满足气密封质量要求。     

电连接器的感应钎焊工艺设计研究

微波组件中的电连接器焊接要求高,感应钎焊技术因其可以实现快速焊接、焊料氧化少、热影响区域小而被用来焊接电连接器。对感应钎焊电连接器的工艺设计进行了研究,针对其工艺设计中的主要因素工件结构形式、工件材料、接触镀层以及焊料种类展开了讨论分析。以上述工艺设计为指导,优化设置了感应钎焊工艺参数,焊接获得了满足相关质量要求和气密性指标的微波电连接器。     

我国射频连接器和射频电缆国际提案的最新动态

介绍了由我国主导制定的射频连接器和射频电缆国际标准的情况和进展.     

基于2比特结构的时间调制模块小型化设计

针对时间调制阵列中调制模块的小型化问题,采用多层板结构,将模块中开关的谐振单元和偏置电路以及射频信号电路放置在不同层,并通过类同轴耦合线和缺陷地等不同的技术措施结合,解决了不同射频通道之间的幅相不平衡以及谐振等问题,在实现小型化的同时兼顾了电性能. 据此设计了2比特结构的时间调制模块,该模块工作频段为14.2～16.4 GHz,尺寸为1.2λ×0.96λ@15.3 GHz,相邻状态相移为90°±5°,幅度差为±0.5 dB. 在载波频率为15.3 GHz、调制频率为1 MHz时可达到34 dB谐波抑制,最大信号带宽则可达200 MHz,验证了本文设计方法的有效性.