退火处理对ZnO薄膜结晶性能的影响

研究了退火处理对Zn O薄膜结晶性能的影响.Zn O薄膜由直流反应磁控溅射技术制得,并在O2 气氛中不同温度(2 0 0～10 0 0℃)下退火,利用X射线衍射(XRD)、原子力显微镜(AFM)和X射线光电子能谱(XPS)对其结晶性能进行了研究,提出了一个较为完善的Zn O薄膜退火模型.研究表明:热处理可使c轴生长的薄膜取向性增强;随退火温度的升高,薄膜沿c轴的张应力减小,压应力增加;同时晶粒度增大,表面粗糙度也随之增加.在6 4 0℃的应力松弛温度(SRT)下,Zn O薄膜具有很好的c轴取向,沿c轴的应力处于松弛状态,晶粒度不大,表面粗糙度较小,此时Zn O薄膜的结晶性能最优.     

退火处理对ZnO薄膜结晶性能的影响

研究了退火处理对ZnO薄膜结晶性能的影响.ZnO薄膜由直流反应磁控溅射技术制得,并在O2气氛中不同温度(200～1000℃)下退火,利用X射线衍射(XRD)、原子力显微镜(AFM)和X射线光电子能谱(XPS)对其结晶性能进行了研究,提出了一个较为完善的ZnO薄膜退火模型.研究表明:热处理可使c轴生长的薄膜取向性增强;随退火温度的升高,薄膜沿c轴的张应力减小,压应力增加;同时晶粒度增大,表面粗糙度也随之增加.在640℃的应力松弛温度(SRT)下,ZnO薄膜具有很好的c轴取向,沿c轴的应力处于松弛状态,晶粒度不大,表面粗糙度较小,此时ZnO薄膜的结晶性能最优.     

退火温度对生长在TiO2缓冲层上的ZnO薄膜的影响

采用电子束蒸发技术在TiO2缓冲层上沉积了ZnO薄膜,研究了不同的退火温度对薄膜晶化质量及发光性质的影响. 利用X射线衍射仪和扫描探针显微镜分析了薄膜样品的结构性质,利用荧光光谱仪研究了薄膜样品的光致发光性质. 分析结果表明,退火处理后的ZnO薄膜都沿c轴择优生长. 在600℃下退火的样品具有最强的（002）衍射峰、最强的紫外发射和最弱的可见光发射,其晶粒大小均匀,紧密堆积. 而对于在500和700℃下退火的样品,其可见光发射较强. 这表明在600℃下退火的样品具有最好的晶化质量.     

退火温度对生长在TiO2缓冲层上的ZnO薄膜的影响

采用电子束蒸发技术在TiO2缓冲层上沉积了ZnO薄膜,研究了不同的退火温度对薄膜晶化质量及发光性质的影响.利用X射线衍射仪和扫描探针显微镜分析了薄膜样品的结构性质,利用荧光光谱仪研究了薄膜样品的光致发光性质.分析结果表明,退火处理后的ZnO薄膜都沿c轴择优牛长.在600℃下退火的样品具有最强的(002)衍射峰、最强的紫外发射和最弱的可见光发射,其晶粒大小均匀.紧密堆积.而对于在500和700℃下退火的样品,其可见光发射较强.这表明在600℃下退火的样品具有最好的晶化质量.     

缓冲层厚度对透明导电薄膜ZnO:Zr性能的影响

利用直流磁控溅射法在有ZnO:Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO:Zr透明导电薄膜,缓冲层的厚度介于35～208 nm.利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO:Zr薄膜的结构、形貌、电光性能.结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性.当缓冲层厚度从35 nm增加到103 nm时,薄膜的颗粒尺寸增大,电阻率减小.而当缓冲层厚度从103 nm增加到208 nm时,薄膜的颗粒尺寸减小,电阻率增大.当缓冲厚度为103 nm时,薄膜的电阻率最小为2.96×10-3 Ω·cm,远小于没有缓冲层时的12.9×10-3 Ω·cm.实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO:Zr薄膜质量的一种有效方法.     

退火对溅射ZnO薄膜光吸收性能的影响

利用射频磁控溅射制备了高c轴取向的ZnO薄膜,采用X-射线衍射仪、扫描电镜和紫外-可见光分光光度计研究了退火对ZnO薄膜的结构和光吸收性能的影响。结果表明,退火可以改善ZnO薄膜的质量和光吸收性能。退火后薄膜的结构、形貌和光吸收性能得到改善,薄膜中缺陷减少,晶粒长大致密化,尺寸较均匀;紫外吸收峰变窄,强度增加,吸收边变得陡峭并向长波方向移动,光学带隙降低。450℃退火的ZnO薄膜具有最佳的结晶质量和紫外吸收性能。     

利用ZnO缓冲层制备AlN薄膜

采用脉冲激光淀积 (PL D)技术 ,利用 Zn O作为缓冲层 ,在 Si(10 0 )衬底上生长出 Al N薄膜。X-射线衍射图谱表明 ,该 Al N薄膜具有 c轴取向特性。X-光电子能谱测试表明 ,要获得接近理想化学配比的 Al N薄膜 ,需要高真空淀积气氛或合适的 N2 气氛 ;同时还表明 ,Al N薄膜表面容易形成保护性氧化层。剖面透射电子显微镜显微照相显示该 Al N/ Zn O/ Si(10 0 )多层结构清晰可辨 ,层与层之间的界面非常平整。原子力显微镜分析表明 ,采用 Zn O缓冲层可改善 Al N薄膜的表面粗糙度 (RMS=1nm)     

ZnO和Al2O3缓冲层对AZO透明导电膜薄膜性能的影响

采用射频磁控溅射法,以纯度为99.9%,质量分数98%ZnO、2%Al2O3陶瓷靶为溅射靶材,在预先沉积了ZnO和Al2O3的玻璃衬底上制备了Al2O3掺杂的ZnO薄膜。研究并对比了两种不同的缓冲层对ZnO∶Al(AZO)薄膜的微观结构和光电性能的影响。并借助X线衍射(XRD)仪、扫描电子显微镜(SEM)、紫外可见光谱仪(UV-Vis)等方法测试和分析了不同缓冲层,对AZO薄膜的形貌结构、光电学性能的影响。结果表明:加入缓冲层后,在衬底温度为200℃时,溅射30min,负偏压为60V、在氮气气氛下经300℃退火处理后,制得薄膜的可见光透过率为83%～87%,AZO薄膜的最低电阻率,从9.2×10-4Ω.cm(玻璃)分别下降到8.0×10-4Ω.cm(ZnO)和5.4×10-4Ω.cm(Al2O3)。     

利用ZnO缓冲层制备AIN薄膜

采用脉冲激光淀积（ＰＬＤ）技术,利用ＺｎＯ作为缓冲层,在Ｓｉ（１００）衬底上生长出ＡＩＮ薄膜。Ｘ－射线衍射图谱表明,该ＡＩＮ薄膜具有ｃ轴取向特性。Ｘ－光电子能谱测试表明,要获得接近理想化学配比的ＡＩＮ薄膜,需要高真空演气氛或合适的Ｎ２气氛;同时还表明,ＡＩＮ薄膜表面容易形成保护性氧化层。剖面透射电子显微镜显微照相显示该ＡＩＮ／ＺｎＯ／Ｓｉ（１００）多层结构清晰可辨,层与层之间的界面非常平整。原子力     

缓冲层厚度对透明导电薄膜ZnO∶Zr性能的影响(英文)

利用直流磁控溅射法在有ZnO∶Zr缓冲层的水冷玻璃衬底上成功制备出了ZnO∶Zr透明导电薄膜,缓冲层的厚度介于35～208nm。利用XRD、SEM、四探针测试仪和紫外-可见分光光度计研究ZnO∶Zr薄膜的结构、形貌、电光性能。结果表明,薄膜的颗粒尺寸和电阻率对缓冲层厚度具有较强的依赖性。当缓冲层厚度从35nm增加到103nm时,薄膜的颗粒尺寸增大,电阻率减小。而当缓冲层厚度从103nm增加到208nm时,薄膜的颗粒尺寸减小,电阻率增大。当缓冲厚度为103nm时,薄膜的电阻率最小为2.96×10^-3Ω.cm,远小于没有缓冲层时的12.9×10^-3Ω.cm。实验结果表明,在沉积薄膜之前先沉积一层适当的缓冲层是提高ZnO∶Zr薄膜质量的一种有效方法。     

Surface acoustic wave characteristics of ZnO films grown on a polycrystalline 3C-SiC buffer layer

Zinc oxide (ZnO) thin films were deposited onto a polycrystalline (poly) 3C-SiC buffer layer for surface acoustic wave (SAW) applications using a magnetron sputtering system. Atomic force microscopy (AFM) and X-ray diffraction (XRD) showed that the ZnO grown on 3C-SiC/Si had a smooth surface, a dominant c-axis orientation and a lower residual stress in ZnO thin film compared to that grown directly onto Si substrate. In order to evaluate the SAW characteristics of ZnO films on a 3C-SiC buffer layer, the two-port SAW resonators, based on inter-digital transducer (IDT)/ZnO/3C-SiC/Si and IDT/ZnO/Si structures, were fabricated and measured within a temperature range of 25-135 °C. The resulting 3C-SiC buffer layer improved the insertion loss by approximately 7.3 dB within the SAW resonator and enhanced the temperature stability with TCF = −22 ppm/°C up to 135 °C in comparison to that of TCF = −45 ppm/°C within a temperature range of 25-115 °C of the ZnO/Si structure.     

ZnO过渡层对BiFeO_3薄膜铁电性能的影响

采用溶胶–凝胶法,在Pt(111)/Ti/SiO2/Si(100)衬底上采用逐层退火工艺制备了BFO(BiFeO3)、ZnO/BFO和ZAO(掺铝氧化锌)/BFO薄膜,研究了ZnO、ZAO过渡层对BFO薄膜晶相以及铁电、漏电和介电性能的影响。结果表明:与BFO薄膜相比,ZnO/BFO薄膜的表面更加致密、平整,结晶性更好,双剩余极化强度(2Pr)有非常大的提高,漏电和介电性能也均有改善。ZAO/BFO薄膜的铁电性能比ZnO/BFO薄膜的铁电性能差,这与ZAO的导电性强于ZnO有关。     

低压高温退火对Ag掺杂ZnO薄膜性质的影响

采用电子束蒸发在n-Si(100)衬底上沉积Ag掺ZnO(ZnO:Ag)薄膜,随后在200 Pa的O<,2>气氛下分别在500、600、700和800℃退火4 h.用X射线衍射(XRD)仪、荧光光谱仪以及Van der Pauw方法测量ZnO:Ag薄膜的结构和光电学性质.结果表明,ZnO:Ag薄膜为多晶结构,且随着退火...     

Investigation of post-thermal annealing on material properties of Cu-In-Zn-Se thin films

The Cu-In-Zn-Se thin film was synthesized by changing the contribution of In in chalcopyrite CuInSe2 with Zn.The XRD spectra of the films showed the characteristic diffraction peaks in a good agreement with the quaternary Cu-In-Zn-Se compound.They were in the polycrystalline nature without any post-thermal process,and the main orientation was found to be in the (112) direction with tetragonal crystalline structure.With increasing annealing temperature,the peak intensities in preferred orientation became more pronounced and grain sizes were in increasing behavior from 6.0 to 25.0 nm.The samples had almost the same atomic composition of Cu0.5In0.5ZnSe2.However,EDS results of the deposited films indicated that there was Se re-evaporation and/or segregation with the annealing in the structure of the film.According to the optical analysis,the transmittance values of the films increased with the annealing temperature.The absorption coefficient of the films was calculated as around 105 cm-1 in the visible region.Moreover,optical band gap values were found to be changing in between 2.12 and 2.28 eV depending on annealing temperature.The temperature-dependent dark-and photo-conductivity measurements were carried out to investigate the electrical characteristics of the films.     

Effects of annealing of MgO buffer layer on structural quality of ZnO layers grown by P-MBE on c-sapphire

We have investigated effects of annealing of MgO buffer layer on structural quality of ZnO layers grown by plasma assisted molecular beam epitaxy on c-sapphire. ZnO layers were characterized by atomic force microscopy, high resolution X-ray diffraction (HRXRD) and cross sectional transmission electron microscopy (TEM). AFM images show that annealing of a low temperature (LT)-MgO buffer at high temperatures enhanced the surface migration of adatoms, leading to the formation of larger terraces and smoother surface morphology, as indicated by the reduction of rms values of roughness from 0.6 to 0.3 nm. HRXRD and TEM experiments reveal that the dislocation density of ZnO layers is reduced from 5.3×10⁹ to 1.9×10⁹ cm⁻² by annealing a LT-MgO buffer. All of those features indicate the structural quality of ZnO layers was improved by annealing a LT-MgO buffer layer.     

退火处理对纳米ZnO膜结构及气敏特性的影响

用X射线衍射和透射电镜表征了直接沉淀法制得的纳米ZnO粉体的晶型、晶格常数、粒径及形貌等。研究了退火对纳米ZnO粉体制成的膜气敏性质和微结构的影响。结果表明低温退火可以改善ZnO膜的微结构和气敏效应的稳定性。     

Microwave annealing effects on ZnO films deposited by atomic layer deposition

Zinc oxide thin films deposited on glass substrate at 150°C by atomic layer deposition were annealed by the microwave method at temperatures below 500 °C.The microwave annealing effects on the structural and luminescent properties of Zn O films have been investigated by X-ray diffraction and photoluminescence.The results show that the MWA process can increase the crystal quality of Zn O thin films with a lower annealing temperature than RTA and relatively decrease the green luminescence of Zn O films.The observed changes have demonstrated that MWA is a viable technique for improving the crystalline quality of Zn O thin film on glass.     

IWO缓冲层对MOCVD-ZnO:B薄膜性能的影响研究

金属有机化学气相沉积(MOCVD)技术生长的绒面ZnO透明导电(ZnO-TCO)薄膜应用于Si基薄膜太阳电池上能够形成"陷光结构",以提高薄膜太阳电池效率和稳定性。本文将电子束反应蒸发技术生长的掺W的In2O3(In2O3:W,(IWO)薄膜作为缓冲层,应用于MOCVD-ZnO:B薄膜与玻璃之间,可促进ZnO:B薄膜的生长,并且有效提升薄膜的光散射特性。当IWO缓冲层厚度为20nm时,获得的IWO/ZnO:B薄膜的电阻率为2.07×10-3Ω.cm,迁移率为20.9cm2.V-1.s-1,载流子浓度为1.44×1020 cm-3;同时,薄膜具有的透过率大于85%,且在550nm处绒度较ZnO:B薄膜提高了约9.5%,在800nm处绒度较ZnO:B薄膜提高了约4.5%。     

退火气氛对稀土Eu3+掺杂ZnO薄膜结构和发光性质的影响

采用脉冲激光沉积(PLD)法在Si(111)衬底上制备稀土Eu3+掺杂ZnO薄膜材料,分别在纯氧和真空气氛中进行退火处理。XRD图谱中仅观察到尖锐的ZnO(002)衍射峰,表明ZnO:Eu3+,Li+薄膜具有良好的c轴取向。薄膜的结构参数显示：在纯氧气氛中退火的样品具有较大的晶粒尺寸且应力较小,表明在纯氧中退火的样品具有较好的结晶质量。通过光致发光谱发现,在纯氧中退火的样品的IUV/IDL比值较大,说明在纯氧中退火的样品缺陷去除更充分,结晶质量更好。当用395nm光激发样品时,仅发现Eu3+位于595nm附近的5D0→7F1磁偶极跃迁峰。并没有发现Eu3+在613 nm附近的特征波长发射,表明掺杂的Eu3+占据了ZnO基质反演对称中心格位。     

ZnO films deposited on GaAs substrates with a SiO2 thin buffer layer

Sputter deposition of ZnO films on GaAs substrates has been investigated. ZnO films were radio frequency (rf)-magnetron sputter deposited on GaAs substrates with or without SiO₂ thin buffer layers. Deposition parameters such as rf power, substrate-target distance, and gas composition/pressure were optimized to obtain highly c-axis oriented and highly resistive films. Deposited films were characterized by x-ray diffraction, scanning electron microscopy (SEM), capacitance, and resistivity measurements. Thermal stability of sputter-deposited ZnO films (0.5–2.0 μm thick) was tested with a post-deposition heat treatment at 430°C for 10 min, which is similar to a standard ohmic contact alloying condition for GaAs. The ZnO/SiO₂/GaAs films tolerated the heat treatment well while the ZnO/GaAs films disintegrated. The resistivity (10¹¹ Ω-cm) of the ZnO films on SiO₂-buffered GaAs substrates remained high during the heat treatment. The post-deposition anneal treatment also enhances c-axis orientation of the ZnO films dramatically and relieves intrinsic stress almost completely. These improvements are attributed to a reduction of grain boundaries and voids with the anneal treatment as supported by SEM and x-ray diffraction measurement results.