Electron transport and detection of terahertz radiation in a GaN/AlGaN submicrometer field-effect transistor

Electron transport and photoresponse in the terahertz range in a GaN/AlGaN field-effect transistor with the submicrometer gate (0.25 μm) and two-dimensional electron gas in the channel (the electron concentration n _s = 5 × 10¹² cm^?2) were studied at 4.2 K. The charge-carrier mobility in the transistor’s channel μ = 3500 cm²/(V s) was determined from the dependence of the conductance on magnetic field. It is found that the dependence of photovoltage at the radiation frequency f = 574 GHz on the gate voltage (i.e., on the concentration of two-dimensional electrons) features a characteristic maximum, which is related to a resonance response of the subgate plasma in the transistor channel.     

Power switching transistors based on gallium nitride epitaxial heterostructures

The results of the development of power switching transistors based on epitaxial gallium nitride heterostructures to create an energy-efficient conversion technique are presented. The developed powerful GaN transistor operates in enrichment mode with unlocking threshold voltage V _th = +1.2 V and a maximum drain-source current I _ds = 0.15 A/mm at the drain-source voltage V _ds = +8 V. The drain-source breakdown voltage in the closed state is V _b = 300 V at the drain-source distance L _ds = 8.5 μm and drain-source voltage V _ds = 0 V.     

Effect of Temperature Variation on the Characteristics of Microwave Power AlGaN/GaN MODFET

The prime motivation for developing the proposed model of AlGaN/GaN microwave power device is to demonstrate its inherent ability to operate at much higher temperature. An investigation of temperature model of a 1 μm gate AlGaN/GaN enhancement mode n-type modulation-doped field effect transistor (MODFET) is presented. An analytical temperature model based on modified charge control equations is developed. The proposed model handles higher voltages and show stable operation at higher temperatures. The investigated temperature range is from 100 °K–600 °K. The critical parameters of the proposed device are the maximum drain current (I_Dmax), the threshold voltage (V_th), the peak dc trans-conductance (g_m), and unity current gain cut-off frequency (f_T). The calculated values of f_T (10–70 GHz) at elevated temperature suggest that the operation of the proposed device has sufficiently high current handling capacity. The temperature effect on saturation current, cutoff frequency, and trans-conductance behavior predict the device behavior at elevated temperatures. The analysis and simulation results on the transport characteristics of the MODFET structure is compared with the previously measured experimental data at room temperature. The calculated critical parameters suggest that the proposed device could survive in extreme environments.     

Analog/RF Study of Self-aligned In<Subscript>0.53</Subscript>Ga<Subscript>0.47</Subscript>As MOSFET with Scaled Gate Length

This study presents the impact of gate length scaling on analog and radio frequency (RF) performance of a self- aligned multi-gate n-type In_0.53Ga_0.47As metal oxide semiconductor field effect transistor. The device is fabricated using a self-aligned method, air-bridge technology, and 8 nm thickness of the Al₂O₃ oxide layer with different gate lengths. The transconductance-to-normalized drain current ratio (g _m/I _D) method is implemented to investigate analog parameters. Moreover, g _m and drain conductance (g _D) as key parameters in analog performance of the device are evaluated with g _m/I _D and gate length variation, where g _m and g _D are both showing enhancement due to scaling of the gate length. Early voltage (V _EA) and intrinsic voltage gain (A _V) value presents a decreasing trend by shrinking the gate length. In addition, the results of RF measurement for cut-off and maximum oscillation frequency for devices with different gate lengths are compared.     

Work Function Tuning and Doping Optimization of 22-nm HKMG Raised SiGe/SiC Source–Drain FinFETs

The basic requirements on process design of extremely scaled devices involve appropriate work function and tight doping control due to their significant effect on the threshold voltage as well as other critical electrical parameters such as drive current and leakage. This paper presents a simulation study of 22-nm fin field-effect transistor (FinFET) performance based on various process design considerations including metal gate work function (WF), halo doping (N _halo), source/drain doping (N _sd), and substrate doping (N _sub). The simulations suggest that the n-type FinFET (nFinFET) operates effectively with lower metal gate WF while the p-type FinFET (pFinFET) operates effectively with high metal gate WF in 22-nm strained technology. Further investigation shows that the leakage reduces with increasing N _halo, decreasing N _sd, and increasing N _sub. Taguchi and Pareto analysis-of-variance approaches are applied using an L₂₇ orthogonal array combined with signal-to-noise ratio analysis to determine the best doping concentration combination for 22-nm FinFETs in terms of threshold voltage (V _t), saturation current (I _on), and off-state current (I _off). Since there is a tradeoff between I _on and I _off, the design with the nominal-is-best V _t characteristic is proposed, achieving nominal V _t of 0.259 V for the nFinFET and ?0.528 V for the pFinFET. Pareto analysis revealed N _halo and N _sub to be the dominant factor for nFinFET and pFinFET performance, respectively.     

High-voltage MIS-gated GaN transistors

Transistors with a high electron mobility based on AlGaN/GaN epitaxial heterostructures are promising component types for creating high-power electronic devices of the next generation. This is due both to a high charge-carrier mobility in the transistor channel and a high electric durability of the material making it possible to achieve high breakdown voltages. For use in power switching devices, normally off GaN transistors operating in the enrichment mode are required. To create normally off GaN transistors, the subgate region on the basis of p-GaN doped with magnesium is more often used. However, optimization of the p-GaN epitaxial-layer thickness and doping level makes it possible to achieve a threshold voltage close to V _th = +2 V for the on-mode of GaN transistors. In this study, it is shown that the use of a subgate MIS (metal–insulator–semiconductor) structure involved in p-GaN transistors results in an increase in the threshold voltage for the on-mode to V _th = +6.8 V, which depends on the subgate-insulator thickness in a wide range. In addition, it is established that the use of the MIS structure results in a decrease in the initial transistor current and the gate current in the on mode, which enables us to decrease the energy losses when controlling powerful GaN transistors.     

A new two-dimensional C-V model for prediction of maximum frequency of oscillation (fmax) of deep submicron AlGaN/GaN HEMT for microwave and millimeter wave applications

An analytical two-dimensional capacitance-voltage model for AlGaN/GaN high electron mobility transistor (HEMTs) is developed, which is valid from a linear to saturation region. The gate source and gate drain capacitances are calculated for 120 nm gate length including the effects of fringing field capacitances. We obtain a cut-off frequency (f_T) of 120 GHz and maximum frequency of oscillations (f_max) of 160 GHz. The model is very useful for microwave circuit design and analysis. Additionally, these devices allow a high operating voltage V_DS, which is demonstrated in the present analysis. These results show an excellent agreement when compared with the experimental data.     

Growth,structure, and properties of GaAs-based (GaAs)1–x–y (Ge2) x (ZnSe) y epitaxial films

The possibility of growing the (GaAs)_1–x–y (Ge₂) _x (ZnSe) _y alloy on GaAs substrates by the method of liquid-phase epitaxy from a tin solution–melt is shown. X-ray diffraction shows that the grown film is single-crystal with the (100) orientation and has the sphalerite structure. The crystal-lattice parameter of the film is a _f = 0.56697 nm. The features of the spectral dependence of the photosensitivity are caused by the formation of various complexes of charged components. It is established that the I–V characteristic of such structures is described by the exponential dependence I = I ₀exp(qV/ckT) at low voltages (no higher than 0.4 V) and by the power dependence J ~ V ^α, where the exponent α varies with increasing voltage at high voltages (V > 0.5 V). The results are treated within the framework of the theory of the drift mechanism of current transfer taking into account the possibility of the exchange of free carriers within the recombination complex.     

Electron transport in unipolar heterostructure transistors with quantum dots in strong electric fields

A model for the explaining specific features of the electron transport in strong electric fields in the quantum-dot unipolar heterostructure transistor (AlGaAs/GaAs/InAs/GaAs/InAs) is presented. It is shown that the two-step shape of the output current-voltage characteristic I _D (V _D ) and the anomalous dependence of the drain current I _D on the gate voltage V _G are caused by the ionization of quantum dots in the strong electric field at the drain gate edge. The ionization of quantum dots sets in at the drain voltage V _D that exceeds the V_D1 value, at which the I _D (V _D ) dependence is saturated (the first step of the I-V characteristic). With the subsequent increase in V _D , i.e., for V _D >V_D1, the I _D (V _D ) dependence has a second abrupt rise due to the ionization of quantum dots, and then, for V _D =V_D2>V_D1, the current I _D is saturated for the second time (the second step in the current-voltage characteristic). It is suggested to use this phenomenon for the determining the population of quantum dots with electrons. The model presented also describes the twice-repeated variation in the sign of transconductance g _m =dI _D /dV _G as a function of V _G .     

Increase the threshold voltage of high voltage GaN transistors by low temperature atomic hydrogen treatment

High-electron-mobility transistors (HEMTs) based on AlGaN/GaN epitaxial heterostructures are a promising element base for the fabrication of high voltage electronic devices of the next generation. This is caused by both the high mobility of charge carriers in the transistor channel and the high electric strength of the material, which makes it possible to attain high breakdown voltages. For use in high-power switches, normally off-mode GaN transistors operating under enhancement conditions are required. To fabricate normally off GaN transistors, one most frequently uses a subgate region based on magnesium-doped p-GaN. However, optimization of the p-GaN epitaxial-layer thickness and the doping level makes it possible to attain a threshold voltage of GaN transistors close to V _th = +2 V. In this study, it is shown that the use of low temperature treatment in an atomic hydrogen flow for the p-GaN-based subgate region before the deposition of gate-metallization layers makes it possible to increase the transistor threshold voltage to V _th = +3.5 V. The effects under observation can be caused by the formation of a dipole layer on the p-GaN surface induced by the effect of atomic hydrogen. The heat treatment of hydrogen-treated GaN transistors in a nitrogen environment at a temperature of T = 250°C for 12 h reveals no degradation of the transistor’s electrical parameters, which can be caused by the formation of a thermally stable dipole layer at the metal/p-GaN interface as a result of hydrogenation.     

Increase in the rate and discretization of the kinetics of isothermal surface generation of minority charge carriers in metal-insulator-semiconductor structures with a planar-inhomogeneous insulator

Surface generation of minority charge carriers in silicon metal-oxide-semiconductor (MOS) structures is efficient only at the initial recombinationless stage. Quasi-equilibrium between surface generation centers and the minority-carrier band is established in a time t ～ 10^?5 s. In the absence of other carrier generation channels, an equilibrium inversion state at 300 K would need t = t_∞ > 10³ years to become established. In fact, the time t ∞ is much shorter, due to excess-carrier generation via centers located at the SiO₂/Si interface over the gate periphery. This edge-related generation can easily be simulated in an MOS structure with a single gate insulated from Si by oxide layers of various thicknesses. At gate depleting voltages V _g , the role of the periphery is played by a shallow potential well under a thicker oxide, and the current-generation kinetics becomes unconventional: two discrete steps are observed in the dependences I(t), and the duration and height of these steps depend on V _g . An analysis of the I(t) curves allows determination of the electric characteristics of the Si surface in the states of initial depletion (t = 0) and equilibrium inversion (t = t_∞), as well as the parameters of surface lag centers, including their energy and spatial distributions. The functionally specialized planar inhomogeneity of a gate insulator is a promising basis for dynamic sensors with integrating and threshold properties.     

Microwave Dielectric Properties of BiCu<Subscript>2</Subscript>PO<Subscript>6</Subscript> Ceramics with Low Sintering Temperature

A BiCu₂PO₆ microwave dielectric ceramic was prepared using a solid-state reaction method. As the sintering temperature increased from 800°C to 880°C, the bulk density of BiCu₂PO₆ ceramic increased from 6.299 g/cm³ to 6.366 g/cm³; the optimal temperature was 860°C. The best microwave dielectric properties [permittivity (? _r ) = ～16, a quality factor (Q × f) = ～39,110 GHz and a temperature coefficient of resonant frequency (τ _f ) = ～?59 ppm/°C] were obtained in the ceramic sintered at 860°C for 2 h. Then, TiO₂ with a positive τ _f (～+400 ppm/°C) was added to compensate the τ _f value. The composite material was found to have a near-zero τ _f (+2.7 ppm/°C) and desirable microwave properties (? _r  = 19.9, Q × f = 24,885 GHz) when synthesized at a sintering temperature of 880°C. This system could potentially be used for low-temperature co-fired ceramics technology applications.     

InAs/AlSb HEMTs for cryogenic LNAs at ultra-low power dissipation

Properties of the InAs/AlSb high electron mobility transistor, essential for the design of a cryogenic low-noise amplifier (LNA) operating at low power dissipation, have been studied. Upon cooling from 300 K to 77 K, the dc transconductance g_m was enhanced by 30% at a drain-source voltage V_DS of 0.1 V. The gate current leakage showed a strong reduction of the Schottky current component at 77 K. Compared to 300 K, the cut-off frequency f_T and maximum oscillation frequency f_max showed a significant improvement at 77 K with a peak f_T (f_max) of 167 (142) GHz at V_DS = 0.2 V. The suitability of the Sb HEMT for a cryogenic LNA design up to 50 GHz, operating at low dc power dissipation, was investigated through the extraction of the NF_tot,min figure of merit. It was found that the best device performance in terms of noise and gain is achieved at a low V_DS of 0.16 V resulting in a minimum NF_tot,min of 0.6 dB for a frequency of 10 GHz when operating at 77 K. A benchmarking between the Sb HEMT and an InP HEMT has been conducted highlighting the device improvement in noise and gain required to reach today’s state-of-the-art cryogenic LNAs.     

Interaction Features of Stepped-Impedance Stripline Resonators in Comb Filters

Mixed coefficients of coupling between the closely spaced stepped-impedance resonators in comb filters of stripline design have been investigated. Transmission zeros at frequencies f _zi correspond to mixed coupling coefficients k _i . These zeros can be moved with respect to the filter passband central frequency f₀ by modifying the shape of resonators. It was proved that the reduction of gap between resonators made it possible to locate frequencies f _z and f₀ closer to one another. The existing restrictions on the minimal value of gap between resonators limit the degree of proximity between f _z and f₀. The N-resonator stripline comb filters with mixed coupling can have N?1 transmission zeros. The absence of cross-coupling links in stripline filters simplifies their construction. It has been established that the thickness of central conductors of stripline resonators affects the positive and negative mixed coupling coefficients. The paper presents measurement data of miniature stripline three-resonator comb filter having an enhanced selectivity at the expense of two transmission zeros. The central frequency of filter is f₀ = 1850 MHz, the bandwidth BW = 100 MHz. The filter having dimensions 5.8×4.2×2 mm was implemented by connecting two ceramic substrates having relative dielectric permittivity ε _r = 92 and the metallized patterns deposited on them.     

Performance characteristics of <Emphasis Type="Italic">p</Emphasis>-channel FinFETs with varied Si-fin extension lengths for source and drain contacts

The length of Source/Drain (S/D) extension (L_SDE) of nano-node p-channel FinFETs (pFinFETs) on SOI wafer influencing the device performance is exposed, especially in drive current and gate/S/D leakage. In observation, the longer L_SDEpFinFET provides a larger series resistance and degrades the drive current (I_DS), but the isolation capability between the S/D contacts and the gate electrode is increased. The shorter L_SDE plus the shorter channel length demonstrates a higher trans-conductance (G _m ) contributing to a higher drive current. Moreover, the subthreshold swing (S.S.) at longer channel length and longer L_SDE represents a higher value indicating the higher amount of the interface states which possibly deteriorate the channel mobility causing the lower drive current.     

Real-Time Determination of Absolute Frequency in Continuous-Wave Terahertz Radiation with a Photocarrier Terahertz Frequency Comb Induced by an Unstabilized Femtosecond Laser

A practical method for the absolute frequency measurement of continuous-wave terahertz (CW-THz) radiation uses a photocarrier terahertz frequency comb (PC-THz comb) because of its ability to realize real-time, precise measurement without the need for cryogenic cooling. However, the requirement for precise stabilization of the repetition frequency (f _rep) and/or use of dual femtosecond lasers hinders its practical use. In this article, based on the fact that an equal interval between PC-THz comb modes is always maintained regardless of the fluctuation in f _rep, the PC-THz comb induced by an unstabilized laser was used to determine the absolute frequency f _THz of CW-THz radiation. Using an f _rep-free-running PC-THz comb, the f _THz of the frequency-fixed or frequency-fluctuated active frequency multiplier chain CW-THz source was determined at a measurement rate of 10 Hz with a relative accuracy of 8.2?×?10^?13 and a relative precision of 8.8?×?10^?12 to a rubidium frequency standard. Furthermore, f _THz was correctly determined even when fluctuating over a range of 20 GHz. The proposed method enables the use of any commercial femtosecond laser for the absolute frequency measurement of CW-THz radiation.     

Conductivity of Ga<Subscript>2</Subscript>O<Subscript>3</Subscript>–GaAs Heterojunctions

The effect of annealing in argon at temperatures of T_an = 700–900°C on the I–V characteristics of metal–Ga₂O₃–GaAs structures is investigated. Samples are prepared by the thermal deposition of Ga₂O₃ powder onto GaAs wafers with a donor concentration of N _d = 2 × 10¹⁶ cm^–3. To measure theI–V characteristics, V/Ni metal electrodes are deposited: the upper electrode (gate) is formed on the Ga₂O₃ film through masks with an area of S _k = 1.04 × 10^–2 cm² and the lower electrode in the form of a continuous metallic film is deposited onto GaAs. After annealing in argon at T_an ≥ 700°C, the Ga₂O₃-n-GaAs structures acquire the properties of isotype n-heterojunctions. It is demonstrated that the conductivity of the structures at positive gate potentials is determined by the thermionic emission from GaAs to Ga₂O₃. Under negative biases, current growth with an increase in the voltage and temperature is caused by field-assisted thermal emission in gallium arsenide. In the range of high electric fields, electron phonon-assisted tunneling through the top of the potential barrier is dominant. High-temperature annealing does not change the electron density in the oxide film, but affects the energy density of surface states at the GaAs–Ga₂O₃ interface.     

Generation of ultra-wide and flat optical frequency comb based on electro absorption modulator

A novel technique is proposed for the generation of ultra-wide and flat optical frequency comb (OFC) based on serially cascading three stages of electro absorption modulators (EAMs) through sinusoidal radio frequency (RF) signals by setting frequencies at f GHz, f/2 GHz and f/4 GHz. Here, the first stage acts as subcarrier generator, the second stage acts as subcarrier doubler, and the third stage acts as subcarrier quadrupler. In addition, a higher number of subcarriers can easily be generated by adjusting the driving sinusoidal RF signal. In this paper, cascading three stages of EAMs driven by 50 GHz, 25 GHz and 12.5 GHz clock sources, we obtain 272 subcarriers with spacing of 2.5 GHz and power deviation within 1 dB. Theoretical analysis of serially cascaded EAMs for subcarrier generation is also investigated. Principal analysis and simulation of this technique are demonstrated.     

Analysis of a high frequency and wide bandwidth active polyphase filter based on CMOS inverters

An active polyphase filter capable of high frequency quadrature signal generation has been analyzed. The resistors of the classical passive polyphase filter have been replaced by transconductors, CMOS inverters (F. Tillman and H. Sjöland, Proceedings of the Norchip Conference (pp. 12–15), Nov. 2005; Analog Integrated Circuits and Signal Processing, 50(1) 7–12, 2007). A three-stage 0.13 μm CMOS active polyphase filter has been designed. Simulations with a differential input signal show a quadrature error less than 1° for the full stable input voltage range for frequencies from 6 GHz to 14 GHz. Phase errors in the differential input signal are suppressed at least three times at the output. Corner simulations at 10 GHz show a maximum phase error of 3° with both n- and pMOS slow, in all other cases the error is less than 0.75°. The three-stage filter consumes 34 mA from a 1.2 V supply. To investigate the robustness of the filter to changes in inverter delay, an inverter model was implemented in Verilog-A. Linear c _in and g _in were used, whereas g _m , c _out , and g _out were non-linear. It was found that the filter could tolerate substantial delays. Up to 40° phase shift resulted in less than 1.5° quadrature phase error at the output.     

RF power performance evaluation of surface channel diamond MESFETs

We experimentally investigate the large-signal radio frequency performances of surface-channel p-type diamond MESFETs fabricated on hydrogenated polycrystalline diamond. The devices under examination have a coplanar layout with two gate fingers, total gate periphery of 100 μm; in DC they exhibit a hole accumulation behavior with threshold voltage V_t ≈ 0-0.5 V and maximum drain current density of 120 mA/mm. The best small-signal radio frequency performances (maximum cutoff or transition frequency f_T and oscillation frequency f_max) were obtained close to the threshold and were of the order of 6 and 15 GHz, respectively. The power radio frequency response was characterized by driving the devices in class A at an operating frequency of 2 GHz and identifying through the active load-pull technique the optimum load for maximum power added efficiency. A power gain in linearity of 8 dB and an output power of approximately 0.2 W/mm with 22% power added efficiency were obtained on the optimum load impedance at a bias point V_DS = −14 V, V_GS = −1 V. To the best of our knowledge, these are the first large signal measurements ever reported for surface MESFET on polycrystalline diamond, and show the potential of such technology for the development of microwave power devices.